CN205945494U - Intelligence power module and contain its converter - Google Patents

Abstract

The utility model discloses an intelligence power module and contain its converter, intelligence power module includes: drive control device, construction package, at least one switching element, cooling system, sensor and cooling system situation evaluation device, the drive control device respectively the electrical property be coupled in the switching element with cooling system situation evaluation device, the sensor is gathered the switching element with at least one parameter of cooling system, cooling system situation evaluation device receives the parameter is used for judging cooling system situation and cooling system failure cause. The utility model discloses a method and device can carry out the aassessment of power module cooling system situation, tentatively judge fault location and reason simultaneously that is used for the cooling system situation of power module to evaluate .

Description

SPM and the converter comprising it

Technical field

The disclosure relates in general to electronic circuit technology field and in particular to a kind of SPM and the frequency conversion comprising it Device.

Background technology

In high-power electric and electronic product, by switching device (including but not limited to insulated gate bipolar transistor, gold Genus-oxide semiconductor field effect transistor etc.) power model that formed be product core, power model (power Module performance) and design specification substantially determine the main performance index of high-power electric and electronic product.

In traditional high power electronic equipment being made up of inverter, the equipment such as converter or current transformer occupies relatively Big proportion, and the core component of this kind of power electronic equipment is exactly the three-phase inverter being made up of switching device.Powerful In the environment of inverter is operated in high-voltage great-current, how there is very high requirement to the reliabilty and availability of converter system Design is easy to safeguard, reliability is high, has the power model of superelevation availability, is most important class in power electronics design Topic.

At present in the power module design scheme of main flow, only excess temperature is carried out to the temperature of certain point around switching device and sentence Disconnected, scheme schematic diagram is as shown in figure 1, by detecting in transistor on the temperature of critesistor or radiator near transistor position The temperature spot put, the temperature value sampling is compared with a fixed value, when sample temperature value is higher than a certain fixed value When, power model quits work immediately and reports excess temperature fault.But the reason report excess temperature fault is a lot, comprises overpower defeated Go out, ambient temperature is higher, radiator dust stratification, heat radiator fin is bad or cooling liquid flowing channel blocks, and heat-conducting silicone grease is bad, sampling Protection circuit is interfered or damages and leads to protect by mistake, and analysis personnel are difficult to judge to be out of order from this point of excess temperature fault Concrete reason, need power model is removed from machine detection, being dismounted for multiple times test just can ascertain the reason, and substantially reduces The overhaul efficiency of module.

Therefore, for the cooling system condition evaluation of power model, need a kind of new power model.

Disclosed in described background section, above- mentioned information is only used for strengthening the understanding of background of this disclosure, therefore It can include not constituting the information to prior art known to persons of ordinary skill in the art.

Utility model content

The disclosure provides a kind of SPM and the converter comprising it, can carry out fault pre-alarming and preliminary judgement Abort situation.

Other characteristics of the disclosure and advantage will be apparent from by detailed description below, or partially by the disclosure Practice and acquistion.

According to an aspect of this disclosure, provide a kind of SPM, including：Drive dynamic control device, at least one Switching device, cooling system, sensor and cooling system condition evaluation device,

At least one parameter of power model described in described sensor acquisition；

Described cooling system condition evaluation device receives described parameter, in order to judge described cooling system situation and radiating system System failure cause；

Described drive dynamic control device is electrically coupled to described switching device and described cooling system condition evaluation device respectively, Control described switching device.

In a kind of exemplary embodiment of the disclosure, described cooling system condition evaluation device includes：Signal condition electricity Road, analog to digital conversion circuit, calculating process chip,

Described signal conditioning circuit receives the signal of described sensor acquisition；

Analog-digital conversion circuit as described receives the signal of described signal conditioning circuit output；

The described process chip that calculates receives the signal of analog-digital conversion circuit as described output and the signal of external communication.

In a kind of exemplary embodiment of the disclosure, described calculating process chip is microprocessor chip or integrated circuit Chip.

In a kind of exemplary embodiment of the disclosure, described cooling system includes air-cooled cooling system and/or water-cooled Formula cooling system.

In a kind of exemplary embodiment of the disclosure, described air-cooled cooling system includes cooling down assembly and radiation air Fan；Described water-cooled cooling system includes cooling down assembly and circulating pump.

In a kind of exemplary embodiment of the disclosure, described parameter includes the voltage of DC master row, described intelligent power The output current of module, the ambient temperature residing for described SPM, the entrance temperature of the cooling assembly of described cooling system Degree, the cooling outlet temperature of assembly of described cooling system and the switch of described switching device internal temperature and described switching device One or more of signal frequency.

In a kind of exemplary embodiment of the disclosure, described cooling system condition evaluation device, for according to described ginseng Number calculates the thermal resistance between the node of described switching device and environment, and described thermal resistance is compared with the first preset value, according to Comparative result judges described cooling system situation.

In a kind of exemplary embodiment of the disclosure, described cooling system condition evaluation device, for when described thermal resistance During less than described first preset value, judge described cooling system in order；When described thermal resistance is more than described first preset value, Send early warning signal.

In a kind of exemplary embodiment of the disclosure, described cooling system condition evaluation device, for by described thermal resistance It is compared with the second preset value, when described thermal resistance exceedes described second preset value, send disorderly closedown signal.

In a kind of exemplary embodiment of the disclosure, described cooling system condition evaluation device, for opening described in calculating Close device inside junction temperature, when the internal junction temperature of described switching device is more than three preset values, send excess temperature early warning signal, when described When the internal junction temperature of switching device is more than four preset values, send excess temperature fault-signal.

In a kind of exemplary embodiment of the disclosure, described cooling system condition evaluation device, for calculating described dissipating The cooling fluid flow of hot systems, according to the change failure judgement reason of described thermal resistance and described flow.

In a kind of exemplary embodiment of the disclosure, the quantity of described switching device is multiple, using single-phase topology knot Structure, two-phase topological structure or three-phase topological structure.

In a kind of exemplary embodiment of the disclosure, described SPM also includes：

DC master row, described DC master row includes positive direct-current busbar and negative DC master row, is electrically coupled to described intelligence respectively The direct current anode and cathode terminals of energy power model；

Alternating current bus bar, described alternating current bus bar is electrically coupled to the ac terminal of described SPM；

DC support electric capacity, the direct current that described DC support electric capacity is electrically coupled to described SPM is positive and negative extreme Son.

In a kind of exemplary embodiment of the disclosure, described sensor includes following one or more：It is electrically coupled to The voltage sensor of the direct current anode and cathode terminals of described SPM, is series at the current sense on described alternating current bus bar Device, the first temperature sensor of measuring environment temperature, measure multiple second temperature sensors of the plurality of switching device temperature, Measure the three-temperature sensor of the cooling module inlet of described cooling system, measure the cooling module outlet of described cooling system The 4th temperature sensor.

According to an aspect of this disclosure, provide a kind of converter, including：At least one structure is any of the above-described described SPM.

SPM of the present utility model, can carry out power model cooling system condition evaluation, provide overall commenting Estimate fraction.Simultaneously can also tentatively failure judgement position and reason, including radiator dust stratification and pipeline obstruction early warning, cooling system Radiator fan or circulating pump abnormity early warning, other abnormity early warnings of radiator, such as radiating fin comes off, hot channel is impaired Seriously shut down Deng, radiator dust stratification and pipeline obstruction, switching device excess temperature early warning, excess temperature error protection.

It should be appreciated that above general description and detailed description hereinafter are only exemplary, can not be limited this Open.

Brief description

Describe its example embodiment by referring to accompanying drawing in detail, above and other target of the disclosure, feature and advantage will Become more fully apparent.

Fig. 1 illustrates the schematic diagram of power model breakdown judge in prior art.

Fig. 2 illustrates that the topological structure of the power model according to disclosure example embodiment and parameter sampling point are illustrated Figure.

Fig. 3 illustrates the schematic diagram of three kinds of topological structure of power model.

Fig. 4 illustrates the schematic diagram of the air-cooled cooling system according to disclosure example embodiment.

Fig. 5 illustrates the schematic diagram of the water-cooled cooling system according to disclosure example embodiment.

Fig. 6 illustrates this utility model mentality of designing schematic diagram.

Fig. 7 illustrate according to disclosure example embodiment one be used for power model cooling system condition evaluation device Block diagram.

Fig. 8 illustrate according to disclosure example embodiment one be used for power model cooling system condition evaluation method Flow chart.

Fig. 9 illustrates the cooling system condition evaluation score curve according to disclosure example embodiment.

Figure 10 illustrates internal junction temperature Tj of switching device and power model output according to disclosure example embodiment P, the graph of a relation of ambient temperature Ta.

Specific embodiment

It is described more fully with example embodiment referring now to accompanying drawing.However, example embodiment can be with multiple shapes Formula is implemented, and is not understood as limited to example set forth herein；On the contrary, these embodiments are provided so that the disclosure will more Fully and completely, and by the design of example embodiment comprehensively convey to those skilled in the art.Accompanying drawing is only the disclosure Schematic illustrations, be not necessarily drawn to scale.In figure identical reference represents same or similar part, thus Repetition thereof will be omitted.

Additionally, described feature, structure or characteristic can combine in one or more enforcements in any suitable manner In mode.In the following description, many details are provided thus providing fully understanding of embodiment of this disclosure.So And, it will be appreciated by persons skilled in the art that the technical scheme of the disclosure can be put into practice and omits one of described specific detail Or more, or other methods, constituent element, step etc. can be adopted.In other cases, it is not shown in detail or describe known knot Structure, method, realization or operation with avoid that a presumptuous guest usurps the role of the host and so that each side of the disclosure thicken.

Some block diagrams shown in accompanying drawing are functional entitys, not necessarily must be with physically or logically independent entity phase Corresponding.These functional entitys can be realized using software form, or real in one or more hardware modules or integrated circuit These functional entitys existing, or it is real to realize these functions in heterogeneous networks and/or processor device and/or microcontroller device Body.

Fig. 2 illustrates that the topological structure of the power model according to disclosure example embodiment and parameter sampling point are illustrated Figure.As shown in Fig. 2 power model 200 comprises switching device 201, switching device cooling assembly 202 (comprises water-cooled cooling group Part and/or air-cooled cooling assembly), alternating current bus bar 203, DC master row 204, DC support electric capacity 205, drive dynamic control device 206th, various kinds of sensors and cooling system condition evaluation device 207.Wherein sensor comprises measurement module output current parameter Current sensor 208, the voltage sensor 209 of measurement DC master row both end voltage, the temperature of measurement switching device internal temperature Sensor 210, the temperature sensor 211 of measurement switching device chiller inlet temperature, measure switching device chiller The temperature sensor 212 of outlet temperature, the temperature sensor 213 of measuring environment temperature.

Fig. 3 illustrates the schematic diagram of three kinds of topological structure of power model.As shown in figure 3, power model can be divided into list by the number of phases Phase module, two-phase module and three-phase module, two-phase module and three-phase module are all to derive to obtain on the basis of monomial module, are Two or three single-phase modules parallel connection, common DC Support Capacitor and its associated components.

Power model 200 as the power output module of current transformer (converter) system, in switching device 201 output While will necessarily produce loss, these losses are converted into heat, when these heats are not timely taken away, will directly Lead to the rising of switching device 201 internal temperature, if worked under switching device 201 hot soak condition, it will significantly Reduce the working life of switching device 201, after switching device 201 internal temperature is higher than a ultimate value, will result directly in it Lost efficacy.The heat that power model 200 breaker in middle device 201 produces relies primarily on switching device cooling assembly 202 by these heats Take away, so that switching device 201 is under a good working environment, improve operation stability and the longevity of switching device 201 Life.The assembly 202 of switching device cooling at present is divided into air-cooled cooling assembly and water-cooled cooling assembly.As shown in figure 4, in system Radiator fan 401 forms air-cooled cooling system with air-cooled cooling assembly, and air-cooled cooling assembly comprises heat-conducting silicone grease 402 He Air-cooled radiator 403, air-cooled radiator 403 has air intake vent 404 and air outlet 405, and switching device 201 is arranged at wind-cooling heat dissipating On the heat-conducting silicone grease 402 of device 403.As shown in figure 5, water circulating pump 501 and water-cooled cooling assembly form water-cooled in system Cooling system, water-cooled cooling assembly comprises heat-conducting silicone grease 502 and cooled plate 503, and cooled plate 503 has water inlet 504 and goes out The mouth of a river 505, switching device 201 is arranged on the heat-conducting silicone grease 502 of cooled plate 503.

Water cooling system is due to long-play or in the case of environment is relatively more severe (many dust, the environment such as dust storm) Running, leading to the air quantity flowing through to reduce dust stratification in air-cooled radiator 403, thus reducing the heat-sinking capability of cooling system.Water-cooled Due to reasons such as water quality, galvano-cautery, time length easily makes the hot channel to block, thus reducing water-cooling system to cooling system The heat-sinking capability of system.Air-cooled radiator 403 dust stratification or hot channel block the radiating that all can have a strong impact on switching device 201, So that switching device 201 is in the higher environment of relative temperature for a long time working, substantially reduce making of switching device 201 Use the life-span.Even when power model 200 output P than larger when, due to the reduction of cooling system heat-sinking capability, lead to Switching device 201 temperature is too high, thus overheat protector, power model 200 can only be carried out with maintenance down or load shedding fortune OK, greatly reduce the utilization rate of power model 200.

This utility model combines previous experience, based on the complexity of power model cooling system failure cause, considers High-power inverter power model intelligentized design demand, proposes a kind of side of the cooling system condition evaluation for power model Method and device, mentality of designing is as shown in Figure 6.On the basis of the temperature at collection each position of power model 200, in conjunction with power mould The real-time parameter that block 200 runs, the voltage of such as DC master row, output current etc., crucial by calculating, analyzing, compare each Parameter, draws cooling system situation comprehensive grading.When this comprehensive grading is less than a predetermined value, cooling system condition evaluation fills Put 207 and send subhealth state early warning information to system, under alert status, power model 200 needs suitable load shedding to run.Work as synthesis When scoring is less than a ultimate value, cooling system condition evaluation device 207 sends abnormal signal to system, power model simultaneously 200 actively shut down.When characteristic parameter a certain in every index is outside limit gauge, for example, internal junction temperature T of switching device_j During more than a predetermined value, power model 200 can actively be shut down and be reported corresponding fault-signal.System is receiving power model After 200 early warning, attendant has time enough that it is safeguarded to be prepared, when power model 200 occurs protection to shut down, can By information such as previous early warning, to determine or to exclude the problem of cooling system, improve overhaul efficiency.

Fig. 7 illustrate according to disclosure example embodiment one be used for power model cooling system condition evaluation device Block diagram, in conjunction with Fig. 6 and Fig. 7, cooling system condition evaluation device 207 is located in power model 200, including：Acquisition module 702, for the voltage by the DC master row 204 of sensor acquisition power model 200, the output current of power model 200, work( Ambient temperature T residing for rate module 200_a, cooling module inlet temperature T of power model 200_in, the cooling group of power model 200 Part outlet temperature T_out, switching device 201 internal certain put thermistor temp T_ntcDeng.The signal collecting is through signal condition electricity Lu Hou, sends the signal collecting to processing module by analog-to-digital conversion module.Processing module 704 can adopt micro-control unit (Microcontroller Unit；) or custom-designed integrated circuit (Application Specific MCU Integrated Circuit；ASIC).Power model switching signal is provided and is transmitted by power model 200 place system To processing module.Processing module can store multiple parameters, different according to the switching device cooling assembly being adopted, can be to part Parameter is adjusted.By way of external communication, the parameter needing adjustment can be adjusted, adjustable parameter comprises work( Thermal resistance R between critesistor for the rate module switch device inside node_jn, cooling fluid specific heat capacitance C, conduction correction factor λ, cooling system comprehensive grading early warning value, cooling system comprehensive grading protection shutdown value and overheat protector shutdown value.Cooling system Condition evaluation device 207 passes through the voltage of DC master row collecting and output current calculates the output work of power model in real time Rate P；Calculate the loss power of switching device by the voltage of DC master row, output current and switching signal in real time P_loss；By the loss power P of switching device_loss, the internal thermistor temp T of switching device_ntcWith thermal resistance R_jnCalculate switch Device junction temperature T_j；According to thermal resistance R between switching device internal node to critesistor_jn, switching device loss power P_loss、 The internal thermistor temp T of switching device_ntcWith ambient temperature T_aCalculate the heat between power model switching device node and environment Resistance R_ja；Deviation delta T, switching device loss power P according to switching device cooling module outlet and inlet temperature_loss, cooling stream Specific heat capacity C of body, conduction corrected parameter λ estimate cooling fluid flow Q.Judge module 706, for by the node of switching device Thermal resistance R and environment between_jaIt is compared with the first preset value, when cooling system situation is judged according to comparative result；According to opening Close thermal resistance R between the node of device and environment_jaAnd the change failure judgement reason of cooling fluid flow Q.In one embodiment, Judge module 706 is additionally operable to thermal resistance R between switching device node and environment_jaIt is compared with the second preset value, when described When thermal resistance exceedes described second preset value, send disorderly closedown signal.

Fig. 8 illustrate according to disclosure example embodiment one be used for power model cooling system condition evaluation method Flow chart.

As shown in figure 8, the method for the cooling system condition evaluation for power model, the method is based on above-mentioned power model 200 structure, including step S802～S812：

Ambient temperature T in step S802, residing for collection power model 200_a, the internal thermistor temp of switching device T_ntc, the output current of power model, the switching frequency of switching device, the voltage of DC master row, the cooling assembly of cooling system Inlet temperature T_inAnd outlet temperature T of the cooling assembly of cooling system_out.

Cooling system condition evaluation device 207 passes through ambient temperature T residing for sensor acquisition power model 200_a, switch Device inside thermistor temp T_ntc, the output current of power model, the voltage of DC master row, the cooling assembly of cooling system Inlet temperature T_inAnd outlet temperature T of the cooling assembly of cooling system_out.

In step S804, according to the switch letter of the voltage of DC master row, the output current of power model and switching device Number frequency calculates the loss power P of switching device_loss.

Be located be according to the voltage of the DC master row collecting, the output current of power model 200 with by power model 200 The switching signal of the power model switching device 201 that system provides calculates the loss power P of switching device_loss.Prior art Middle calculating loss power P_lossMethod have a lot, this utility model is not limited with specific computational methods.

Ambient temperature T in step S806, according to residing for power model_a, the internal thermistor temp of switching device T_ntc, loss power P_lossAnd thermal resistance R between critesistor for the switching device internal node_jnCalculate switching device node with Thermal resistance R between environment_ja.

Ambient temperature T according to residing for the power model collecting_a, the internal thermistor temp T of switching device_ntc, loss Power P_lossAnd thermal resistance R between critesistor for the switching device internal node_jnCalculate between node and the environment of switching device Thermal resistance R_ja, wherein specific computational methods can have many kinds, illustrate, can using following formula calculate the node of switching device with Thermal resistance R between environment_ja,

$R_{ja}=R_{jn}+\frac{T_{ntc}-T_a}{P_{loss}}.$

In step S808, inlet temperature T of the cooling assembly according to cooling system_in, the cooling assembly of cooling system Outlet temperature T_out, loss power P_lossAnd cooling fluid specific heat capacity C, conduction corrected parameter λ estimation cooling fluid flow Q.

Inlet temperature T of the cooling assembly according to cooling system_in, cooling system cooling assembly outlet temperature T_out, damage Consumption power P_lossAnd cooling fluid specific heat capacity C, conduction corrected parameter λ calculate cooling fluid flow Q, wherein specific computational methods Can there are many kinds, illustrate, cooling fluid flow Q can be calculated using following formula,

$Q=\frac{P_{loss}}{\mathrm{\λ}*(T_{out}-T_{in})*C}.$

In step S810, by thermal resistance R between the node of switching device and environment_jaIt is compared with the first preset value, When cooling system situation is judged according to comparative result.

By thermal resistance R between the node of switching device and environment_jaBe compared with the first preset value, if less than this first Preset value, then in order, if greater than this first preset value, then cooling system is abnormal, sends early warning signal for cooling system. This first preset value can be for during power model 200 full-load run, residing ambient temperature T_aWith switching device junction temperature T_jFor preferable shape Thermal resistance between switching device node under state and environment.

Can also be by thermal resistance R between switching device node and environment_jaIt is compared with the second preset value, when thermal resistance R_ja During more than the second preset value, send disorderly closedown signal.First preset value and the second preset value can be according to the situation of system and use The real needs sets itself at family and modification.

Thermal resistance R in step S812, between node according to switching device and environment_jaAnd the change of cooling fluid flow Q Change failure judgement reason.

Calculate thermal resistance R between the node of switching device and environment_jaAnd after cooling fluid flow Q, can according to this two The situation of change of individual parameter, tentatively judges position or the reason breaking down.

In said method, the evaluation index of cooling system situation is between power model switching device node and environment Thermal resistance R_jaBased on.Cooling system condition evaluation score curve as shown in figure 9, in theory power model have the standard hot of design Resistance R_{ja_s}, when actual thermal resistance R_jaLess than standard thermal resistance R_{ja_s}When it may be possible to because heat sink part is normal in cooling system, and dissipate Hot-air fan rotating speed becomes greatly or water circulating pump current quantitative change is big, actual thermal resistance R in this case_jaCan be than standard thermal resistance R_{ja_s}It is little, But no matter how little, all think that cooling system is perfect condition, be now judged to that cooling system condition score D is 100.Work as reality Thermal resistance R_jaMore than standard thermal resistance R_{ja_s}When it is believed that cooling system hydraulic performance decline, with actual thermal resistance R_jaIt is worth increasing, shape Fraction D is more and more lower for condition, when actual thermal resistance R_jaReach maximum R_jamaxWhen, condition score D is 0.

In the ideal situation, that is, whole cooling system is under standard state, internal junction temperature T of switching device_jWith thermal resistance R_ja Between relation beWherein ξ is the power attenuation under power model 200 full-load run state.Real one Apply in example, under the conditions of full-load run, when ambient temperature is 50 DEG C, internal junction temperature T of switching device_jIdeal temperature be 125 DEG C, corresponding thermal resistance R_jaFor standard thermal resistance R_{ja_s}.When internal junction temperature T of switching device_jWhen reaching 135 DEG C, corresponding heat Resistance R_jaFor standard thermal resistance R_{ja_w}, condition score D of power model 200 is 60.When internal junction temperature T of switching device_jReach 150 DEG C When, condition score D of power model is 0.Condition score D of power model 200 and thermal resistance R_jaRelevant, with outside environment temperature It doesn't matter for degree.When carrying out the calculating of cooling system condition evaluation, it is with thermal resistance R_jaFor basis, when thermal resistance R_jaIt is less than Equal to standard thermal resistance R_{ja_s}When, whole cooling system is in a more satisfactory working condition；When thermal resistance R_jaMore than standard hot Resistance R_{ja_s}When, judge that different degrees of exception in whole cooling system, now power model 200 can send subhealth state to system Early warning, condition score D is lower, abnormal more serious, when thermal resistance R_jaIncrease to value R_{ja_w}When, now cooling system condition score D is 60 points, i.e. internal junction temperature T of switching device_jDuring more than 135 DEG C, judge that cooling system anomaly ratio is more serious, carry out autonomous shutdown.? In one embodiment, can be standard thermal resistance R_{ja_s}It is set to first predetermined value, carries out early warning when reaching first predetermined value, value R_{ja_w}It is set to second predetermined value, carry out stoppage protection it is also possible to be arranged as required to into other when reaching second predetermined value Value.The cooling system condition evaluation of power model 200 is according to the radiator in cooling system, heat-conducting silicone grease, cooling medium stream The comprehensive grading of the factors such as amount, cooling medium quality, the final impact of these factors is all thermal resistance R_ja, so power model shape Condition assessment is according to thermal resistance R calculated_jaTo carry out scoring.Thermal resistance R between impact switching device node and environment_ja's Factor has two big class：First factor is runner factor, and the runner of water cooling system is the passage of radiating air circulation, water The runner of cold cooling system is the passage of cooling liquid recycle stream warp, after power model 200 is in long-play, wind-cooling heat dissipating system The runner of system can lead to runner to narrow due to the problems such as dust stratification or foreign body invade, or air-cooled radiator 403 due to dust stratification or Person's problem of aging leads to the flow of blow out air from air-cooled radiator 403 to tail off, and both of these case will result directly in and flows through wind The air mass flow of cold heat sink 403 tails off, thus causing thermal resistance R between switching device node and environment_jaBecome big.Water-cooling , there is electrochemical corrosion phenomenon in device, such as cooled plate 503, after long-play, the impact of electrochemistry adds up, and leads to water-cooled Plate 503 inner flow passage diminishes.Fine particle after electrochemical corrosion is entrained in coolant, and the coolant quality that user uses is not The problems such as up to standard, or water-cooling system water circulating pump extremely leads to flow through the flow of cooled plate 503 and reduces, and these three situations can be led Cause thermal resistance R between switching device node and environment_jaBecome big.Second factor is radiator or heat-conducting silicone grease is abnormal, air-cooled scattered , because the problem of manufacturing process is it is possible that the problems such as radiating fin loosens or comes off, water-filled radiator may for hot device 403 The problems such as failure welding occurs, the heat-sinking capability of radiator all can be made to decline, thus affecting thermal resistance R_ja.In water cooling system With all can use heat-conducting silicone grease in water-cooling heat radiating system, the coating of heat-conducting silicone grease is too thick or too thin all can lead to conducting effect not Good, thus affecting thermal resistance R_ja.Meanwhile, As time goes on heat-conducting silicone grease occurs the phenomenon of exsiccation, and because the earth's core is drawn The effect of power, heat-conducting silicone grease slowly can flow to ground level end, and this flowing can make switching device 201 bottom heat-conducting silicone grease Skewness, these situations all can lead to thermal resistance R_jaBecome big.

In the judge process of cooling system abnormal failure, it is with thermal resistance R_ja, estimate two parameters of cooling fluid flow Q and make For basis for estimation.

According to law of conservation of energy, once cooling system reaches thermally equilibrated, the temperature of power model 200 interior point Degree all reaches equilibrium point, and each point temperature remains unchanged, now the loss power P of switching device 201_lossShould be with cooling system Dissipated power is equal, and the dissipated power of cooling system is exactly the heat that cooling fluid was taken away within the unit interval, is knowing cooling Fluid can estimate the flow Q locating now cooling fluid, in one embodiment, Ke Yitong with the temperature rise of outlet at radiator inlet Cross following formula to be calculated：

$Q=\frac{P_{loss}}{\mathrm{\λ}*(T_{out}-T_{in})*C}$

If thermal resistance R is detected_jaBecome big, cooling fluid flow Q diminishes simultaneously, in this case there may be two kinds former Cause：The first is the internal dust stratification of radiator or obstruction, and this situation can make the radiating effect of radiator be deteriorated, lead to thermal resistance R_ja Become big, simultaneously as the reason dust stratification or obstruction, the flow resistance within radiator can become big, and this can lead to the stream of cooling fluid Amount Q diminishes；Second be cooling system radiator fan wind speed diminish or circulating pump speed reduce lead to cooling fluid Flow Q diminishes, and this also results in thermal resistance R_jaBecome big.In both of these case any one the occurrence of, power model 200 can be to being System sends cooling system abnormity early warning, and system can be according to being that multiple modules report cooling system abnormity early warning or individual module Report cooling system abnormity early warning, to judge asking of radiator dust stratification or obstructing problem or radiator fan or circulating pump Topic.If system receives multiple modules and reports cooling system abnormity early warning, then explanation is multiple power moulds in this system The common problem that block occurs, should be that the general character part of power model radiating goes wrong in this case, then can determine that to be scattered Hot-air fan or circulating pump are abnormal；If system receives single power model and reports cooling system abnormity early warning, then explanation is The individual sex chromosome mosaicism of this power model, then can determine that is the radiator dust stratification of this power model or obstruction is abnormal.

If thermal resistance R is detected_jaBecome big, the situation that cooling fluid flow Q is basically unchanged simultaneously, then in explanation cooling system Fluid flow normal, then exception in itself for radiator in situation about being likely to occur, and this kind of exception can also be divided into two kinds： Heat-conducting silicone grease exception or radiator are abnormal, this radiator be extremely heat spreader structures abnormal it may be possible to radiating fin loosen or Person's water-filled radiator runner is abnormal.Both cannot be differentiated to it extremely in detail, so a class that both is playbacked extremely.

If thermal resistance R is detected_jaConstant, cooling fluid flow Q substantially becomes big situation, also thermal conductive silicon to be judged to simultaneously Fat exception or radiator are abnormal, because R_jaCriterion value be to calculate on the basis of knowing cooling fluid flow Q-value Arrive, if cooling fluid flow Q becomes big, thermal resistance R in theory_jaDiminish, and now thermal resistance R_jaIt is basically unchanged with standard value, real Thermal resistance R on border_jaHave been above the computational theory value of reality, it is determined that result and thermal resistance R_jaBecome big, cooling fluid flow simultaneously The situation that Q is basically unchanged is consistent.

The method of the cooling system condition evaluation for power model of present embodiment, can carry out power model radiating System status are assessed, and provide total evaluation fraction.Simultaneously can also tentatively failure judgement position and reason, amass including radiator Ash and pipeline obstruction early warning, cooling system radiator fan or circulating pump abnormity early warning, other abnormity early warnings of radiator are for example scattered Hot fin comes off, hot channel is impaired etc., and radiator dust stratification and pipeline obstruction are seriously shut down.

The power model 200 with cooling system condition evaluation device 207 is except dividing to system transfers cooling system situation Beyond number D, also there is the functions such as excess temperature early warning, overheat protector, and by the communication protocol specified by these information transfers to being System.

Excess temperature early warning of the present utility model and overheat protector are with switching device inside junction temperature T_jAs reference frame, one In embodiment, internal junction temperature T of switching device_jComputing formula be T_j=P_loss*R_ja+T_a, internal junction temperature T of switching device_jNot only with Thermal resistance R_jaRelevant, also with now power model 200 power attenuation P_loss, residing ambient temperature T_aRelevant.Power model 200 Switching loss P_lossApproximate with output P it is directly proportional, in R_jaIdeally, when power model 200 output P surpasses When crossing rated power, switching device 201 is lost and also becomes big, thus leading in ambient temperature T_aWhen comparing high, switching device Internal junction temperature T_j125 DEG C will be exceeded, now be accomplished by sending excess temperature early warning.In ambient temperature T_aIn the case of relatively low, power The suitable overpower of module 200 will not send excess temperature early warning, in R_jaIdeally, internal junction temperature T of switching device_jWith power Module output P, ambient temperature T_aGraph of a relation as shown in Figure 10.In power model 200 actual moving process, Ke Nengcun In thermal resistance R_jaRatio is larger, but because ambient temperature is lower than relatively low or circulation liquid temp, so that in switching device Portion's junction temperature T_jIt is not very big or even also lower than preferable junction temperature, power model 200 still can normally be transported in this case OK, but due to thermal resistance R_jaRatio is larger, has been described above cooling system and goes wrong, so it is pre- to need power model to send to system Alert.In one embodiment, when detection calculates junction temperature T in switching device_jExceed during excess temperature early warning value it should to send excess temperature pre- Police, system for prompting or attendant safeguard to power model 200, now power model 200 still can normally run, Automatic shutdown protection will not be carried out.When internal junction temperature T of switching device_jWhen exceeding overheat protector value, power model 200 can be to system Send excess temperature fault-signal, oneself actively shuts down simultaneously.

Allow attendant have sufficient administrative time using method of the present utility model, when greatly reducing shutdown simultaneously Between, increased operational efficiency.After receiving early warning signal, when attendant can send early warning signal by reading, exist Operating heat radiation system parameter in storage device, to judge being that in power model cooling system, which link concrete occurs extremely, Thus using different maintenance measures.

With regard to the device in above-mentioned embodiment, the wherein concrete mode of modules execution operation is somebody's turn to do relevant It has been described in detail in the embodiment of method, explanation will be not set forth in detail herein.

More than it is particularly shown and described the illustrative embodiments of the disclosure.It should be appreciated that the disclosure does not limit In detailed construction described herein, set-up mode or implementation method；On the contrary, the disclosure is intended to cover be included in claims Spirit and scope in various modifications and equivalence setting.

Claims (15)

1. a kind of SPM is it is characterised in that include：Drive dynamic control device, at least one switching device, radiating system System, sensor and cooling system condition evaluation device,

At least one parameter of power model described in described sensor acquisition；

Described cooling system condition evaluation device receives described parameter, in order to judge described cooling system situation and cooling system event Barrier reason；

Described drive dynamic control device is electrically coupled to described switching device and described cooling system condition evaluation device respectively, controls Described switching device.

2. SPM as claimed in claim 1 is it is characterised in that described cooling system condition evaluation device includes： Signal conditioning circuit, analog to digital conversion circuit, calculating process chip,

Described signal conditioning circuit receives the signal of described sensor acquisition；

Analog-digital conversion circuit as described receives the signal of described signal conditioning circuit output；

The described process chip that calculates receives the signal of analog-digital conversion circuit as described output and the signal of external communication.

3. SPM as claimed in claim 2 is it is characterised in that described calculating process chip is microprocessor chip Or IC chip.

4. SPM as claimed in claim 1 is it is characterised in that described cooling system includes air-cooled cooling system And/or water-cooled cooling system.

5. SPM as claimed in claim 4 is it is characterised in that described air-cooled cooling system includes cooling down assembly And radiator fan；Described water-cooled cooling system includes cooling down assembly and circulating pump.

6. SPM as claimed in claim 1 is it is characterised in that described parameter includes the voltage of DC master row, institute State the output current of SPM, the ambient temperature residing for described SPM, the cooling group of described cooling system The inlet temperature of part, the outlet temperature of cooling assembly of described cooling system and described switching device internal temperature and described switch One or more of switching signal of device.

7. SPM as claimed in claim 1, it is characterised in that described cooling system condition evaluation device, is used for Thermal resistance between the node of described switching device and environment is calculated according to described parameter, described thermal resistance is carried out with the first preset value Relatively, described cooling system situation is judged according to comparative result.

8. SPM as claimed in claim 7, it is characterised in that described cooling system condition evaluation device, is used for When described thermal resistance is less than described first preset value, judge described cooling system in order；When described thermal resistance is more than described the During one preset value, send early warning signal.

9. SPM as claimed in claim 7, it is characterised in that described cooling system condition evaluation device, is used for Described thermal resistance is compared with the second preset value, when described thermal resistance exceedes described second preset value, sends disorderly closedown letter Number.

10. SPM as claimed in claim 1, it is characterised in that described cooling system condition evaluation device, is used for Calculate the internal junction temperature of described switching device, when the internal junction temperature of described switching device is more than three preset values, send excess temperature early warning Signal, when the internal junction temperature of described switching device is more than four preset values, sends excess temperature fault-signal.

11. SPMs as claimed in claim 7, it is characterised in that described cooling system condition evaluation device, are used for Calculate the cooling fluid flow of described cooling system, according to the change failure judgement reason of described thermal resistance and described flow.

12. SPMs as claimed in claim 1, it is characterised in that the quantity of described switching device is multiple, adopt Single-phase topological structure, two-phase topological structure or three-phase topological structure.

13. SPMs as claimed in claim 1 are it is characterised in that described SPM also includes：

DC master row, described DC master row includes positive direct-current busbar and negative DC master row, is electrically coupled to described intelligent work(respectively The direct current anode and cathode terminals of rate module；

Alternating current bus bar, described alternating current bus bar is electrically coupled to the ac terminal of described SPM；

DC support electric capacity, described DC support electric capacity is electrically coupled to the direct current anode and cathode terminals of described SPM.

14. SPMs as claimed in claim 13 are it is characterised in that described sensor is included with next or many Individual：It is electrically coupled to the voltage sensor of the direct current anode and cathode terminals of described SPM, be series at described alternating current bus bar On current sensor, the first temperature sensor of measuring environment temperature, measure multiple the of the plurality of switching device temperature Two temperature sensors, measure the three-temperature sensor of the cooling module inlet of described cooling system, measure described cooling system Cooling module outlet the 4th temperature sensor.

A kind of 15. converters are it is characterised in that include：At least one structure is arbitrary described intelligence in claim 1-14 Power model.