CN205939812U - Temperature controller - Google Patents
Temperature controller Download PDFInfo
- Publication number
- CN205939812U CN205939812U CN201620960285.8U CN201620960285U CN205939812U CN 205939812 U CN205939812 U CN 205939812U CN 201620960285 U CN201620960285 U CN 201620960285U CN 205939812 U CN205939812 U CN 205939812U
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- Prior art keywords
- pipe clamp
- heat
- conducting glue
- hole
- ceramic substrate
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model belongs to single -photon detection and quantum secret communication field, in particular to temperature controller, including the pipe clamp that is used for fixed avalanche diode to and be used for carrying out the semiconductor cooler that lowers the temperature to the pipe clamp, semiconductor cooler's huyashi -chuuka (cold chinese -style noodles) is equipped with the ceramic substrate, the position department of being close to the bottom surface on the pipe clamp sets up the perforating hole that is on a parallel with the bottom surface, and it is fixed to bond through the heat -conducting glue between the bottom surface of ceramic substrate and pipe clamp, be close to on the lateral wall of pipe clamp the regional of bottom surface and in the equal submergence heat -conducting glue of perforating hole, and the perforating hole is fully filling by the heat -conducting glue. Adopt heat -conducting glue bonding modal alteration tradition tin welding's connected mode, solve the oxidation obscission that traditional tin welding mode easily produced, the pipe clamp lower part increases by two little circular hole structure down, and cooperation bonding technology improves product stability, reliability greatly.
Description
Technical field
The utility model belongs to single photon detection and field of quantum secure communication, particularly to a kind of attemperating unit.
Background technology
In single photon detection and Quantum Secure Communication field, to control frequently with semiconductor heating refrigerator (TEC)
The temperature of avalanche diode processed, avalanche diode is placed on pipe clamp, and TEC first passes through ceramic substrate and conducts heat to pipe clamp,
Then again avalanche diode is conducted heat to by pipe clamp, in prior art, pipe clamp and ceramic substrate are split-type structural, pipe
Folder is made up of metal material.Faying face between pipe clamp and ceramic substrate is typically fixed by the way of soldering, this connection
The defect of mode is：Avalanche diode need to work in the environment of -40 DEG C or -50 DEG C, and can not remove inside working environment
The moisture of in the air, this low temperature environment easily causes condensation to bear water, and traditional tin welding is oxidizable under low temperature and moisture environment
Come off, after work a period of time, the ceramic substrate metalized portion of TEC upper surface can aoxidize with pipe scolding tin weld, and pipe clamp will
Come off, lead to product cannot be continuing with.In addition, product is reprocessed need to dismantle to soldering high temperature hot melt, and high temperature can be to TEC performance
Damage.
Utility model content
The purpose of this utility model is to provide a kind of pipe clamp and the reliable attemperating unit of refrigerator attachment structure.
For achieving the above object, the utility model provides technical scheme below：A kind of attemperating unit, including for fixing
The pipe clamp of avalanche diode, and the semiconductor cooler for being lowered the temperature to pipe clamp, the huyashi-chuuka (cold chinese-style noodles) of described semiconductor cooler
It is provided with ceramic substrate, described pipe clamp offers at the position of bottom surface through hole, ceramic substrate and pipe parallel to bottom surface
It is adhesively fixed by heat-conducting glue between the bottom surface of folder, equal near the region of bottom surface and described through hole on the side wall of described pipe clamp
In submergence heat-conducting glue, and through hole is filled up completely with by heat-conducting glue.
It is used for fixing the diameter parallel of the tube seat of avalanche diode on the axis of described through hole and pipe clamp.
Described pipe clamp top is provided with two tube seats for accommodating avalanche diode, and described pipe clamp is provided with two insertions altogether
Hole, two through holes are located at the both sides of two tube seats.
Described pipe clamp top is provided with two tube seats for accommodating avalanche diode, and described pipe clamp is provided with three insertions altogether
Hole, three through holes are located between two tube seats and both sides respectively.
Of the present utility model have technical effect that：Change the connected mode of traditional tin welding using heat-conducting glue bonding way,
Solve the oxidation obscission that traditional tin welding mode is also easy to produce；Lower tube clip bottom increases by two roundlet pore structures, coordinates bonding
Technique, greatly improves product stability, reliability；Faster, and refrigeration is more preferable for the mode refrigerating speed of heat-conducting glue bonding；
The mode of heat-conducting glue bonding convenient disassembly when product is reprocessed, and because of high temperature, TEC will not be damaged.
Brief description
Fig. 1 is the perspective view that embodiment 1 of the present utility model is provided；
Fig. 2 is the front view that embodiment 1 of the present utility model is provided；
Fig. 3 is the A-A sectional view of Fig. 2；
Fig. 4 is the front view that embodiment 2 of the present utility model is provided.
Specific embodiment
Below in conjunction with accompanying drawing, the utility model is described in detail.
As shown in figures 1-4, a kind of attemperating unit, including the pipe clamp 10 for fixing avalanche diode, and for pipe
The semiconductor cooler 20 that folder 10 is lowered the temperature, the huyashi-chuuka (cold chinese-style noodles) of described semiconductor cooler 20 is provided with ceramic substrate 21, described pipe clamp
Offer the through hole 12 parallel to bottom surface at the position of bottom surface on 10, logical between the bottom surface of ceramic substrate 21 and pipe clamp 10
Cross heat-conducting glue 13 to be adhesively fixed, region and the equal submergence heat conduction of described through hole 12 near bottom surface on the side wall of described pipe clamp 10
In glue 13, and through hole 12 is filled up completely with by heat-conducting glue 13, and in bonding, heat-conducting glue 13 penetrates in two through holes 12, is formed similar
The effect of brace rod, forms pulling force to pipe clamp 10, greatly improves bonding stability.It should be noted that the utility model is retouched
The pipe clamp 10 stated is only the lower half structure of pipe clamp, and when actually used, this lower half pipe clamp 10 also needs to one and its structure
Symmetrical first half pipe clamp uses cooperatively.
Preferably, the axis of described through hole 12 and pipe clamp 10 are put down for fixing the axis of the tube seat 11 of avalanche diode
OK, it is to avoid through hole 12 is interfered with tube seat 11.
Embodiment 1
Preferably, as shown in Figure 1, 2, described pipe clamp 10 top is provided with two tube seats 11 for accommodating avalanche diode,
Two through holes 12 are provided with described pipe clamp 10, two through holes 12 are located at the both sides of two tube seats 11 altogether.
Embodiment 2
As shown in figure 4, described pipe clamp 10 top is provided with two tube seats 11 for accommodating avalanche diode, described pipe clamp 10
On be provided with three through holes 12 altogether, three through holes 12 are located between two tube seats 11 and both sides respectively.
The utility model adopts heat-conducting glue bonding way to change the connected mode of traditional tin welding, solves traditional tin welding side
The oxidation obscission that formula is also easy to produce；Lower tube clip 10 bottom increases by two through hole 12 structures, coordinates technique for sticking, greatly improves
Product stability, reliability；Faster, and refrigeration is more preferable for the mode refrigerating speed of heat-conducting glue bonding；Heat-conducting glue bonding
Mode convenient disassembly when product is reprocessed, and because of high temperature, TEC will not be damaged.
The foregoing is only preferred embodiment of the present utility model, not in order to limit the utility model, all this
Any modification, equivalent and improvement made within the spirit of utility model and principle etc., should be included in the utility model
Protection domain within.
Claims (4)
1. a kind of attemperating unit it is characterised in that：Including the pipe clamp for fixing avalanche diode, and for carrying out to pipe clamp
The semiconductor cooler of cooling, the huyashi-chuuka (cold chinese-style noodles) of described semiconductor cooler is provided with ceramic substrate, near the position of bottom surface on described pipe clamp
The place of putting offers the through hole parallel to bottom surface, is adhesively fixed by heat-conducting glue between ceramic substrate and the bottom surface of pipe clamp, described
On the side wall of pipe clamp in the region of bottom surface and described through hole equal submergence heat-conducting glue, and through hole is filled out completely by heat-conducting glue
Fill.
2. attemperating unit according to claim 1 it is characterised in that：It is used for fixing on the axis of described through hole and pipe clamp
The diameter parallel of the tube seat of avalanche diode.
3. attemperating unit according to claim 2 it is characterised in that：Described pipe clamp top is provided with two and is used for accommodating snowslide
The tube seat of diode, described pipe clamp is provided with two through holes altogether, and two through holes are located at the both sides of two tube seats.
4. attemperating unit according to claim 2 it is characterised in that：Described pipe clamp top is provided with two and is used for accommodating snowslide
The tube seat of diode, described pipe clamp is provided with three through holes altogether, and three through holes are located between two tube seats and both sides respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620960285.8U CN205939812U (en) | 2016-08-26 | 2016-08-26 | Temperature controller |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620960285.8U CN205939812U (en) | 2016-08-26 | 2016-08-26 | Temperature controller |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205939812U true CN205939812U (en) | 2017-02-08 |
Family
ID=57954219
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620960285.8U Active CN205939812U (en) | 2016-08-26 | 2016-08-26 | Temperature controller |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205939812U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109830467A (en) * | 2017-11-23 | 2019-05-31 | 科大国盾量子技术股份有限公司 | A kind of diode pipe clamp and temperature control device applied to quantum communications equipment |
-
2016
- 2016-08-26 CN CN201620960285.8U patent/CN205939812U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109830467A (en) * | 2017-11-23 | 2019-05-31 | 科大国盾量子技术股份有限公司 | A kind of diode pipe clamp and temperature control device applied to quantum communications equipment |
| CN109830467B (en) * | 2017-11-23 | 2024-03-29 | 科大国盾量子技术股份有限公司 | Diode pipe clamp and temperature control device applied to quantum communication equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |