CN109830467A - A kind of diode pipe clamp and temperature control device applied to quantum communications equipment - Google Patents
A kind of diode pipe clamp and temperature control device applied to quantum communications equipment Download PDFInfo
- Publication number
- CN109830467A CN109830467A CN201711178829.0A CN201711178829A CN109830467A CN 109830467 A CN109830467 A CN 109830467A CN 201711178829 A CN201711178829 A CN 201711178829A CN 109830467 A CN109830467 A CN 109830467A
- Authority
- CN
- China
- Prior art keywords
- pipe clamp
- fomale
- male
- communications equipment
- ontology
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004891 communication Methods 0.000 title claims abstract description 21
- 239000003292 glue Substances 0.000 claims abstract description 21
- 239000000919 ceramic Substances 0.000 claims abstract description 18
- 239000000758 substrate Substances 0.000 claims abstract description 17
- 239000004065 semiconductor Substances 0.000 claims abstract description 14
- 239000000463 material Substances 0.000 claims abstract description 5
- 238000005520 cutting process Methods 0.000 claims description 3
- 235000012149 noodles Nutrition 0.000 claims description 3
- 229920000297 Rayon Polymers 0.000 abstract description 4
- 238000005057 refrigeration Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000003362 replicative effect Effects 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention is applied to temperature control device and structure inside recipient's detector refrigeration module of field of quantum secure communication, including diode pipe clamp, diode pipe clamp includes ontology made of Heat Conduction Material, the ontology is equipped with the arc groove for accommodating avalanche diode, the side opposite with arc groove is equipped with male and fomale(M&F) on the ontology, which is used for glued with the ceramic substrate on semiconductor cooler surface.Heat-conducting glue is filled in the sunk area of male and fomale(M&F), and the heat-conducting glue increased between lower tube clip and TEC is thick, can reach maximum bonding force；Male and fomale(M&F) also adds lower tube clip and TEC viscose glue contact area, further improves bonding force, efficiently solve lower tube clip and TEC because bonding force it is insufficient caused by unsticking phenomenon.
Description
Technical field
The present invention is applied to temperature control device and structure inside recipient's detector refrigeration module of field of quantum secure communication.
Background technique
Quantum secret communication is important application of the Technique on Quantum Communication in terms of cryptographic communication, it by transmission single photon or
Person's entangled photon pairs realize the transmitting of quantum state to complete secret communication.Based on single photon realize Technique on Quantum Communication,
Commonly known as quantum key distribution (QKD) technology.The technology is based on quantum-mechanical " Heisenberg uncertainty principle " and " quantum
Can not replicating principle ", guarantee that key caused by QKD process has theoretic Unconditional security.Avalanche diode (APD)
One of the common components in quantum communications equipment, the reverse bias of general photodiode at tens volts hereinafter, and APD it is reverse-biased
Pressure is generally in a few hectovolt magnitudes, close to breakdown reverse voltage.When APD works under high bias, the electric field in barrier region is very strong,
Electrons and holes are made to obtain very big kinetic energy when drift motion in barrier region.They collide with the lattice atoms in barrier region and produce
Raw ionization excites the secondary electron of generation and hole to obtain accelerating collision again to generate new electron-hole pair under the electric field, such as
This continues, and forms avalanche multiplication effect.Avalanche diode cools down during the work time, and semiconductor cooler
It (TEC) is relatively conventional electronic cooling element.Avalanche diode generally passes through pipe clamp and is bonded or welded with TEC, to realize snow
Collapse the conduction cooling between diode and TEC.
Existing lower tube clip and TEC technique for sticking viscose glue thickness are insufficient, contact area is small causes lower tube clip and TEC in the presence of de-
Fall phenomenon.The best adhesive thickness of heat-conducting glue is 0.1-0.3mm, and existing structure viscose glue is with a thickness of 0.04mm；Another heat-conducting glue bonding force
It is directly proportional to contact area, but increase lower tube clip width will increase thermally conductive load and operating temperature be not achieved so as to cause APD pipe.
When being connected using welding procedure, the silver-plated rear surface roughness of lower tube clip is smaller, and the adhesive force of heat-conducting glue not enough causes
Lower tube clip is easy to fall off.
Summary of the invention
The object of the present invention is to provide a kind of diode pipe clamps that can be improved pipe clamp Yu semiconductor cooler adhesive strength
And temperature control device.
To achieve the above object, the present invention provides following technical schemes: a kind of two poles applied to quantum communications equipment
Pipe pipe clamp, including ontology made of Heat Conduction Material, the ontology are equipped with arc groove for accommodating avalanche diode, and described
The side opposite with arc groove is equipped with male and fomale(M&F) on body, and the male and fomale(M&F) is for the ceramic substrate glue with semiconductor cooler surface
It closes.
Preferably, the male and fomale(M&F) is corrugated surface, or the multiple pits or stud that are arranged by array in plane form.
Preferably, the drop between the recess portion and protrusion of the male and fomale(M&F) is 0.1~0.3mm.
Preferably, the side on the pipe clamp where male and fomale(M&F) is equipped with a card slot, the width and semiconductor system of the card slot
The ceramic substrate width on cooler surface is suitable, enables the part-structure of ceramic substrate in card slot, the male and fomale(M&F) setting
On the bottom surface of card slot.
Preferably, the depth of the card slot is 0.4~0.6mm.
Further, a big wave crest, the big wave are equipped at interval of a distance along wavelength direction on the corrugated surface
The height at peak is greater than the height of remaining wave crest on corrugated surface.
Further, the wavelength direction of the corrugated surface and the width direction of card slot are parallel, and the corrugated surface and card slot are adopted
It is processed and formed at one time with wire cutting technology.
Preferably, the side on the ontology where arc groove offers the threaded hole for connecting upper half pipe clamp, institute
Stating threaded hole is at least two two sides for being placed in arc groove.
Preferably, the side wall of the ontology, which is equipped with, is used for temperature sensor mounted mounting hole, the hole of the mounting hole
Mouth is equipped with the extension tube affixed with ontology.
A kind of temperature control device, including the diode pipe clamp and semiconductor heating refrigerator, the diode pipe clamp
Male and fomale(M&F) be adhesively fixed by the huyashi-chuuka (cold chinese-style noodles) ceramic substrate of heat-conducting glue and semiconductor heating refrigerator, heat-conducting glue with a thickness of 0.1
~0.3mm.
The technical effects of the invention are that: heat-conducting glue is filled in the sunk area of male and fomale(M&F), increases lower tube clip and TEC
Between heat-conducting glue it is thick, maximum bonding force can be reached；Male and fomale(M&F) also adds lower tube clip and TEC viscose glue contact area,
Further improve bonding force, efficiently solve lower tube clip and TEC because bonding force it is insufficient caused by unsticking phenomenon.
Detailed description of the invention
Fig. 1 is the schematic perspective view of diode pipe clamp provided by the embodiment of the present invention 1；
Fig. 2 is the schematic perspective view of diode pipe clamp provided by the embodiment of the present invention 2；
Fig. 3 is the schematic perspective view of diode pipe clamp provided by the embodiment of the present invention 3；
Fig. 4 is the schematic perspective view of diode pipe clamp provided by the embodiment of the present invention 4；
Fig. 5 is the schematic perspective view of temperature control device provided by the embodiment of the present invention 5；
Fig. 6 is the main view of temperature control device provided by the embodiment of the present invention 5.
Specific embodiment
The present invention is described in detail below in conjunction with attached drawing.
The diode pipe clamp applied to quantum communications equipment in the present invention includes Heat Conduction Material (such as aluminium alloy, stainless steel
The equal nonmetallic materials such as metal materials or thermal conductive ceramic) made of ontology 10, the ontology 10 is equipped with for accommodating snowslide two
The arc groove 11 of pole pipe, the side opposite with arc groove 11 is equipped with male and fomale(M&F) 12 on the ontology 10, the male and fomale(M&F) 12 be used for
The ceramic substrate 21 on 20 surface of semiconductor cooler is glued.
Specifically, the present invention provides following embodiments:
Embodiment 1
As shown in Figure 1, the male and fomale(M&F) 12 is corrugated surface 121, the drop of 121 wave crest of corrugated surface to trough for 0.1~
0.3mm, preferably 0.2mm.Side on the pipe clamp where male and fomale(M&F) 12 is equipped with a card slot 16, the width of the card slot 16 and half
21 width of ceramic substrate on 20 surface of conductor refrigerator is suitable, enables the part-structure of ceramic substrate 21 in card slot 16,
The male and fomale(M&F) 12 is arranged on the bottom surface of card slot 16.The depth of the card slot 16 is 0.4~0.6mm, preferably 0.5mm.It is described
The wavelength direction of corrugated surface 121 is parallel with the width direction of card slot 16, and the corrugated surface 121 and card slot 16 use wire cutting technology
It is processed and formed at one time.Side on the ontology 10 where arc groove 11 offers the threaded hole for connecting upper half pipe clamp
15, the threaded hole 15 is at least two two sides for being placed in arc groove 11.The side wall of the ontology 10 is equipped with for installing
The aperture of the mounting hole 13 of temperature sensor, the mounting hole 13 is equipped with the extension tube 14 affixed with ontology 10.When diode pipe
Folder is when being bonded on the ceramic substrate 21 of semiconductor cooler 20, the wave trough position of corrugated surface 121 and ceramic substrate 21 at a distance of compared with
Far, 30 thickness of heat-conducting glue herein can guarantee between 0.1~0.3mm, to ensure that heat-conducting glue 30 reaches maximum bonding force.
Embodiment 2
As shown in Fig. 2, the difference of the present embodiment and embodiment 1 is only are as follows: on the corrugated surface 121 along wavelength direction at interval of
A distance is equipped with one big wave crest 124, and the height of the big wave crest 124 is greater than the height of remaining wave crest on corrugated surface 121.Institute
The big wave crest 124 stated can position the spacing between male and fomale(M&F) 12 and ceramic substrate 21, make the other parts of male and fomale(M&F) 12
To keep biggish spacing with ceramic substrate 21, so that the thickness for making the heat-conducting glue 30 in bigger region meet 0.1~0.3mm, recessed
Other regions of the convex surface 12 in addition to big wave crest 124 can be improved the contact area between pipe clamp and heat-conducting glue 30, further mention
High bonding force.
Embodiment 3
As shown in figure 3, the difference of the present embodiment and embodiment 1 is only are as follows: the male and fomale(M&F) 12 is arranged by array in plane
Multiple pits 122 form,.
Embodiment 4
As shown in figure 4, the difference of the present embodiment and embodiment 1 is only are as follows: the male and fomale(M&F) 12 is arranged by array in plane
Multiple studs 123 form.
Embodiment 5
As shown in Figure 5,6, a kind of temperature control device is present embodiments provided, including the diode pipe clamp, and is partly led
Chiller 20, the male and fomale(M&F) 12 of the diode pipe clamp pass through the huyashi-chuuka (cold chinese-style noodles) ceramic substrate of heat-conducting glue 30 and semiconductor cooler 20
21 are adhesively fixed, heat-conducting glue 30 with a thickness of 0.1~0.3mm, preferably 0.3mm.
Claims (10)
1. a kind of diode pipe clamp applied to quantum communications equipment, including ontology made of Heat Conduction Material (10), the ontology
(10) it is equipped with arc groove (11) for accommodating avalanche diode, it is characterised in that: on the ontology (10) and arc groove
(11) opposite side is equipped with male and fomale(M&F) (12), and the male and fomale(M&F) (12) is for the ceramic substrate with semiconductor cooler (20) surface
(21) glued.
2. the diode pipe clamp according to claim 1 applied to quantum communications equipment, it is characterised in that: the male and fomale(M&F)
(12) it is corrugated surface (121).
3. the diode pipe clamp according to claim 1 applied to quantum communications equipment, it is characterised in that: the male and fomale(M&F)
(12) the multiple pits (122) or stud (123) being arranged by array in plane form.
4. the diode pipe clamp according to claim 2 applied to quantum communications equipment, it is characterised in that: on the pipe clamp
Side where male and fomale(M&F) (12) is equipped with a card slot (16), width and semiconductor cooler (20) surface of the card slot (16)
Ceramic substrate (21) width is suitable, enables the part-structure of ceramic substrate (21) in card slot (16), the male and fomale(M&F)
(12) it is arranged on the bottom surface of card slot (16).
5. the diode pipe clamp according to claim 4 applied to quantum communications equipment, it is characterised in that: the male and fomale(M&F)
(12) drop between recess portion and protrusion is 0.1~0.3mm；The depth of the card slot (16) is 0.4~0.6mm.
6. the diode pipe clamp according to claim 2 applied to quantum communications equipment, it is characterised in that: the corrugated surface
(121) it is equipped with one big wave crest (124) at interval of a distance along wavelength direction on, the height of the big wave crest (124) is greater than
The height of remaining wave crest on corrugated surface (121).
7. the diode pipe clamp according to claim 4 applied to quantum communications equipment, it is characterised in that: the corrugated surface
(121) wavelength direction is parallel with the width direction of card slot (16), and the corrugated surface (121) and card slot (16) use wire cutting work
Skill is processed and formed at one time.
8. the diode pipe clamp according to claim 1 applied to quantum communications equipment, it is characterised in that: the ontology
(10) side on where arc groove (11) offers the threaded hole (15) for connecting upper half pipe clamp, the threaded hole (15)
The two sides for being placed in arc groove (11) at least two.
9. according to claim 1 to the diode pipe clamp for being applied to quantum communications equipment described in 8 any one, feature exists
In: the side wall of the ontology (10), which is equipped with, is used for temperature sensor mounted mounting hole (13), the hole of the mounting hole (13)
Mouth is equipped with the extension tube (14) affixed with ontology (10).
10. a kind of temperature control device, it is characterised in that: including diode pipe clamp described in claim 1 to 9 any one, and
The male and fomale(M&F) (12) of semiconductor cooler (20), the diode pipe clamp passes through heat-conducting glue (30) and semiconductor cooler (20)
Huyashi-chuuka (cold chinese-style noodles) ceramic substrate (21) is adhesively fixed, heat-conducting glue (30) with a thickness of 0.1~0.3mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711178829.0A CN109830467B (en) | 2017-11-23 | 2017-11-23 | Diode pipe clamp and temperature control device applied to quantum communication equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711178829.0A CN109830467B (en) | 2017-11-23 | 2017-11-23 | Diode pipe clamp and temperature control device applied to quantum communication equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109830467A true CN109830467A (en) | 2019-05-31 |
| CN109830467B CN109830467B (en) | 2024-03-29 |
Family
ID=66858327
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711178829.0A Active CN109830467B (en) | 2017-11-23 | 2017-11-23 | Diode pipe clamp and temperature control device applied to quantum communication equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109830467B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000260929A (en) * | 1999-03-10 | 2000-09-22 | Mitsui High Tec Inc | Thin package for surface mounting |
| KR20060059575A (en) * | 2004-11-29 | 2006-06-02 | 삼성전자주식회사 | Semiconductor package with minute protrusion on die pad |
| CN101777589A (en) * | 2010-01-01 | 2010-07-14 | 威海北洋电气集团股份有限公司 | APD (avalanche photo diode) temperature control device |
| CN102655715A (en) * | 2011-03-02 | 2012-09-05 | 三星半导体(中国)研究开发有限公司 | Flexible printed circuit board (PCB) and manufacturing method thereof |
| CN205939812U (en) * | 2016-08-26 | 2017-02-08 | 科大国盾量子技术股份有限公司 | Temperature controller |
| CN207458923U (en) * | 2017-11-23 | 2018-06-05 | 科大国盾量子技术股份有限公司 | A kind of diode pipe clamp and temperature control device applied to quantum communications equipment |
-
2017
- 2017-11-23 CN CN201711178829.0A patent/CN109830467B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000260929A (en) * | 1999-03-10 | 2000-09-22 | Mitsui High Tec Inc | Thin package for surface mounting |
| KR20060059575A (en) * | 2004-11-29 | 2006-06-02 | 삼성전자주식회사 | Semiconductor package with minute protrusion on die pad |
| CN101777589A (en) * | 2010-01-01 | 2010-07-14 | 威海北洋电气集团股份有限公司 | APD (avalanche photo diode) temperature control device |
| CN102655715A (en) * | 2011-03-02 | 2012-09-05 | 三星半导体(中国)研究开发有限公司 | Flexible printed circuit board (PCB) and manufacturing method thereof |
| CN205939812U (en) * | 2016-08-26 | 2017-02-08 | 科大国盾量子技术股份有限公司 | Temperature controller |
| CN207458923U (en) * | 2017-11-23 | 2018-06-05 | 科大国盾量子技术股份有限公司 | A kind of diode pipe clamp and temperature control device applied to quantum communications equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109830467B (en) | 2024-03-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9142749B2 (en) | Thermoelectric conversion module | |
| US20060048807A1 (en) | Thin film thermoelectric module | |
| CN207458923U (en) | A kind of diode pipe clamp and temperature control device applied to quantum communications equipment | |
| KR20120038347A (en) | Radiant heat structure of solar cell for photovoltaic power generation | |
| KR20200131794A (en) | Thermoelectric element | |
| KR20120011625A (en) | Cooling and Heating Water System Using Thermoelectric Module, Method for Manufacturing the same | |
| KR20230141663A (en) | Thermo electric element | |
| KR101237235B1 (en) | Manufacturing Method of Thermoelectric Film | |
| EP3745480A1 (en) | Thermoelectric module | |
| KR20190093516A (en) | Thermoelectric device | |
| O'Dwyer et al. | Efficiency in nanometre gap vacuum thermionic refrigerators | |
| CN102446878A (en) | Semiconductor refrigerating device | |
| CN105444461A (en) | Thermoelectric refrigerating unit and method for improving refrigerating efficiency of thermoelectric refrigerating unit | |
| CN109830467A (en) | A kind of diode pipe clamp and temperature control device applied to quantum communications equipment | |
| CN110429866A (en) | A kind of superficial underground heat temperature difference electricity generation device | |
| KR102469943B1 (en) | Thermoelectric element | |
| Bar-Cohen | Thermal management of on-chip hot spots and 3D chip stacks | |
| KR102434260B1 (en) | Thermoelectric element | |
| KR101981629B1 (en) | Thermoelectric element and method of preparating the same | |
| KR102405457B1 (en) | Thermoelectric device module | |
| US20220020910A1 (en) | Thermoelectric module | |
| KR102310806B1 (en) | Thermo electric element | |
| KR20210028493A (en) | Thermo electric module | |
| KR102055428B1 (en) | Thermo electric element | |
| EP4362118A1 (en) | Thermoelectric device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |