CN205920966U - 组合型引线框架 - Google Patents

组合型引线框架 Download PDF

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CN205920966U
CN205920966U CN201620979658.6U CN201620979658U CN205920966U CN 205920966 U CN205920966 U CN 205920966U CN 201620979658 U CN201620979658 U CN 201620979658U CN 205920966 U CN205920966 U CN 205920966U
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pin
unit
wire jumper
tablet
integrated
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陈孝龙
李靖
袁浩旭
李宏伟
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NINGBO HUALONG ELECTRONICS CO Ltd
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NINGBO HUALONG ELECTRONICS CO Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401Disposition
    • H01L2224/40151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/40245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8534Bonding interfaces of the connector
    • H01L2224/85345Shape, e.g. interlocking features
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93Batch processes
    • H01L2224/95Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

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  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

本实用新型公开了一种通过集成跳线的上料片与集成引脚单元的下料片的配合以加快生产速度的组合型引线框架,包括上料片和下料片,所述上料片由多个跳线集成单元连续纵向连接而成,所述下料片由多个引脚集成单元连续横向连接而成;所述引脚集成单元包括中部的基带,基带两侧都连接有等间隔分布的四个引脚单元,两侧的引脚单元以引脚集成单元的中心旋转对称;所述跳线集成单元包括两组以跳线集成单元中心旋转对称的跳线单元和两边的框架边带,所述跳线单元以双排双列为一组,所述跳线单元与引脚单元匹配,所述跳线单元与框架边带通过加强筋连接。

Description

组合型引线框架
技术领域
本实用新型涉及一种组合型引线框架。
背景技术
整流桥堆通常由四个二极管通过引脚单元和跳线连接构成,其个体较小,线路简单,具有应用范围广、需求量大的特点。但是单个整流桥堆生产的效率太低,难以降低成本和满足需求,因此需要对引脚单元和跳线的结构进行改进。
实用新型内容
本实用新型所要解决的技术问题是提供一种通过集成跳线的上料片与集成引脚单元的下料片的配合以加快生产速度的组合型引线框架。
本实用新型解决上述技术问题所采用的技术方案为:一种组合型引线框架,包括上料片和下料片,所述上料片由多个跳线集成单元连续纵向连接而成,所述下料片由多个引脚集成单元连续横向连接而成;所述引脚集成单元包括中部的基带,基带两侧都连接有等间隔分布的四个引脚单元,两侧的引脚单元以引脚集成单元的中心旋转对称;所述跳线集成单元包括两组以跳线集成单元中心旋转对称的跳线单元和两边的框架边带,所述跳线单元以双排双列为一组,所述跳线单元与引脚单元匹配,所述跳线单元与框架边带通过加强筋连接。
作为优选,所述引脚单元包括设有两个下焊点的第一引脚,都设有一个下载片区及一个下焊点的第二引脚和第三引脚,设有两个下载片区的第四引脚;所述第三引脚设置在第二引脚远离基带的一侧,所述第一引脚、第二引脚、第三引脚、第四引脚与基带的连接筋等间隔分布;所述连接筋上均设有防水槽。
作为优选,所述防水槽有三条,可有效防水冲入。
作为优选,所述跳线单元包括双排双列的上单元体,所述上单元体由上焊点与上载片区通过折线连接构成。
作为优选,每排上单元体的间距相同。
与现有技术相比,本实用新型的优点在于设置上料片用于纵向集成跳线集成单元,设置下聊片用于横向集成引脚集成单元,并使纵向设置的跳线集成单元与横向设置的引脚集成单元相配合,只需要两次焊接就能获得八块整流桥堆,极大的提高了生产效率。
附图说明
图1为本实用新型上料片的部分平面截图。
图2为本实用新型下料片的部分平面截图。
图3为本实用新型单次焊接后的整流桥堆的平面示意图(省却二极管)。
图4为本实用新型整流桥堆的侧视结构示意图。
图5为本实用新型防水槽截面的放大示意图。
具体实施方式
以下结合附图实施例对本实用新型作进一步详细描述。
本优选实施例如图1至5所示为一种组合型引线框架,包括上料片1和下料片2。其中,下料片2由多个引脚集成单元21连续横向连接而成,引脚集成单元21包括中部的基带211,基带211两侧都连接有等间隔分布的四个引脚单元212,两侧的引脚单元212以引脚集成单元21的中心旋转对称;引脚单元212包括设有两个下焊点的第一引脚2121,都设有一个下载片区及一个下焊点的第二引脚2122和第三引脚2123,设有两个下载片区的第四引脚2124;第三引脚2123设置在第二引脚2122远离基带211的一侧;第一引脚2121、第二引脚2122、第三引脚2123、第四引脚2124与基带211的连接筋等间隔分布,连接筋上均设有防水槽2125,防水槽2125有三条。第一引脚2121和第四引脚2124的中部都设有一通孔,中间的防水槽2125中部设有一通孔,这些通孔能够用于加强塑封效果。
其中,上料片1由多个跳线集成单元11连续纵向连接而成,跳线集成单元11包括两组以跳线集成单元11中心旋转对称的跳线单元111和两边的框架边带112,跳线单元111以双排双列为一组,跳线单元111与引脚单元212匹配,跳线单元111与框架边带112通过加强筋113连接。跳线单元111包括双排双列的上单元体1111,上单元体1111由上焊点与上载片区通过折线连接构成,折线处设有用于加强塑封效果的方孔。
另外,在整个上料片1中,每排上单元体1111的间距相同;而且,相间隔的跳线单元111之间的距离,与不同侧引脚单元212之间的垂直距离相同。

Claims (5)

1.一种组合型引线框架,其特征在于:包括上料片(1)和下料片(2),所述上料片(1)由多个跳线集成单元(11)连续纵向连接而成,所述下料片(2)由多个引脚集成单元(21)连续横向连接而成;所述引脚集成单元(21)包括中部的基带(211),基带(211)两侧都连接有等间隔分布的四个引脚单元(212),两侧的引脚单元(212)以引脚集成单元(21)的中心旋转对称;所述跳线集成单元(11)包括两组以跳线集成单元(11)中心旋转对称的跳线单元(111)和两边的框架边带(112),所述跳线单元(111)以双排双列为一组,所述跳线单元(111)与引脚单元(212)匹配,所述跳线单元(111)与框架边带(112)通过加强筋(113)连接。
2.根据权利要求1所述的组合型引线框架,其特征在于:所述引脚单元(212)包括设有两个下焊点的第一引脚(2121),都设有一个下载片区及一个下焊点的第二引脚(2122)和第三引脚(2123),设有两个下载片区的第四引脚(2124);所述第三引脚(2123)设置在第二引脚(2122)远离基带(211)的一侧,所述第一引脚(2121)、第二引脚(2122)、第三引脚(2123)、第四引脚(2124)与基带(211)的连接筋等间隔分布;所述连接筋上均设有防水槽(2125)。
3.根据权利要求2所述的组合型引线框架,其特征在于:所述防水槽(2125)有三条。
4.根据权利要求2所述的组合型引线框架,其特征在于:所述跳线单元(111)包括双排双列的上单元体(1111),所述上单元体(1111)由上焊点与上载片区通过折线连接构成。
5.根据权利要求4所述的组合型引线框架,其特征在于:每排上单元体(1111)的间距相同。
CN201620979658.6U 2016-08-29 2016-08-29 组合型引线框架 Active CN205920966U (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110098128A (zh) * 2019-05-16 2019-08-06 强茂电子(无锡)有限公司 半导体桥式整流器的制作方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110098128A (zh) * 2019-05-16 2019-08-06 强茂电子(无锡)有限公司 半导体桥式整流器的制作方法

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