CN205911282U - TEM sample grid and TEM sample placer - Google Patents
TEM sample grid and TEM sample placer Download PDFInfo
- Publication number
- CN205911282U CN205911282U CN201620852005.1U CN201620852005U CN205911282U CN 205911282 U CN205911282 U CN 205911282U CN 201620852005 U CN201620852005 U CN 201620852005U CN 205911282 U CN205911282 U CN 205911282U
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- China
- Prior art keywords
- tem sample
- tem
- sample
- grid
- substrate
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Abstract
The utility model provides a TEM sample grid and TEM sample placer, TEM sample grid includes at least: carrier body includes the basement and is located the outside stand that extends in basement one side, the stand is suitable for associated sample, the centre gripping lug is located the substrate surface is suitable for the centre gripping so that remove carrier body, the installation through -hole is located in the basement. The utility model discloses set up the centre gripping lug, easily TEM sample grid is got to the tweezers clamp, prevents mistake clamp sample and leads to the calamitous loss of sample, through design TEM sample placer, cooperate to install with TEM sample grid and fix, improve the efficiency of loading of sample, increase buffer, installation lug and lid, guaranteed that the sample transports the security of TEM's in -process from FIB system vacuum chamber, and then improved the quality of TEM sample.
Description
Technical field
This utility model is related to technical field of semiconductors, and dress placed by more particularly to a kind of tem sample grid and tem sample
Put.
Background technology
At present, tem (transmission electron micros cope, lens ultramicroscope) is increasing
For observing semiconductor device features, thus failure analysis is carried out to semiconductor device.The technology preparing tem sample can be related to
Rive, chemical polishing, mechanical polishing or wide beam, low energy ion milling, or carry out one or more in above-mentioned technology
Combination.The shortcoming of these technology is that they usually need for parent material to be divided into less and less piece, thus destroys big portion
Divide original workpiece.And it is referred to as " taking out/be lifted out (lift-out) " technology, using fib (focused ion bundle) from substrate or block
Cutting sample in body sample, so that it can be removed the peripheral part without destruction or damaged substrate.
The commonly used tem sample grid of prior art (or claim keeper) is carrying tem sample, and tem grid is usual
It is installed in tem sample apparatus for placing.Tem sample apparatus for placing can be by the tem grid with sample from fib system vacuum chamber
Transport tem to be used for checking.
Conventional tem sample bearing device includes metallic grid and upright post type grid, and sample must be sufficiently thin first to allow
Many electronics in level bundle carry out through sample and leave in opposite side.Because tem sample is thin and crisp, thickness generally exists
30nm, so be easy to broken and damaged, tem sample storing unit packaging is coarse at present in addition, multiple or even up to 100
Tem sample grid is stacked together and deposits, by mutually compressing and rubbing against it is easy to damaged and bending；By with sample
Tem grid transports during tem is used for checking from fib (focused ion bundle) system vacuum chamber, due to jolting and vibrating
Thin specimen breakdown, loss or bending will be made；Furthermore, in transportation, finally need directly to clamp tem sample with tweezers
Grid puts it into and carries out tem detection in specimen cup, but existing tem sample grid is not suitable to the projection gripping,
Lead to very inconvenient when being gripped with tweezers, also easily press from both sides sample place position by mistake, lead to catastrophic loss.
Utility model content
The shortcoming of prior art in view of the above, the purpose of this utility model be to provide a kind of tem sample grid and
Tem sample apparatus for placing, is difficult to grip for solving tem sample grid in prior art, tem sample packaging is simple, safety
The problem of sample rapid wear in low, transportation.
For achieving the above object, this utility model adopts a kind of below scheme: tem sample grid, at least includes: carries master
Body, the column stretch out including substrate and positioned at described substrate side, described column is suitable to attached sample；Clamping projection, position
In described substrate surface, it is suitable to clamping to move described arrying main body；Installation through-hole, in described substrate.
In this utility model one embodiment, described clamping projection bent after cutting out by a part for described substrate and
Become, and the perpendicular of described clamping projection and described substrate.
In this utility model one embodiment, the described surface clamping weld tabs or being plugged in described substrate, and with
The perpendicular of described substrate.
In this utility model one embodiment, the quantity of described column is multiple, and multiple described columns are along described substrate
Sides aligned parallel spaced apart.
In this utility model one embodiment, the top of described column is provided with identification mark.
This utility model also provides a kind of tem sample apparatus for placing, comprising: at least one tem sample grid described above；
Base, described base is divided at least one and is suitable to place the placement region of described tem sample grid, described placement region surface
Position corresponding to described installation through-hole is provided with installation projection, and described placement region correspond to described column position be provided with recessed
Groove；Lid, is adapted with described base, and is buckled on the periphery of described base.
In this utility model one embodiment, the quantity of described tem sample grid and the quantity of described placement region are equal
For multiple, and the quantity of described tem sample grid is identical with the quantity of described placement region.
In this utility model one embodiment, the buffering that described base includes body and is located at described body upper surface
Layer, described installation projection top is run through described cushion and is protruded from the upper surface of described cushion, and described groove is located at described
In cushion.
In this utility model one embodiment, described cushion is layer of silica gel.
As described above, tem sample grid of the present utility model and tem sample apparatus for placing, have the advantages that
1st, pass through setting clamping projection it is easy to tweezers grip tem sample grid, prevent from pressing from both sides sample on sample grid by mistake and
Lead to catastrophic loss.
2nd, pass through to design tem sample apparatus for placing, the installation that matched with tem sample grid is fixed, and improves the loading of sample
Efficiency.
3rd, increase buffer unit, projection and lid be installed it is ensured that sample transports tem's from fib system vacuum chamber
During safety.
4th, improve the quality of tem sample while improving the safety in sample transportation.
Brief description
Fig. 1 is shown as the top view of tem sample grid in embodiment one for this utility model.
Fig. 2 is shown as the front view of tem sample grid in embodiment one for this utility model.
Fig. 3 is shown as the top view of tem sample apparatus for placing in embodiment three for this utility model.
Fig. 4 is shown as the partial front view of tem sample apparatus for placing in embodiment three for this utility model.
Component label instructions
1 arrying main body
11 substrates
12 columns
2 clamping projections
3 installation through-holes
4 apparatus for placing
41 bases
42 lids
43 installation projections
44 cushions
45 grooves
46 placement regions
5 tweezers
Specific embodiment
Below by way of specific instantiation, embodiment of the present utility model is described, those skilled in the art can be by this theory
Content disclosed by bright book understands other advantages of the present utility model and effect easily.This utility model can also be by addition
Different specific embodiments is carried out or applies, and the every details in this specification based on different viewpoints and can also be answered
With carrying out various modifications and changes under without departing from spirit of the present utility model.It should be noted that, in situation about not conflicting
Under, the feature in following examples and embodiment can be mutually combined.
It should be noted that the diagram provided in following examples only illustrate in a schematic way of the present utility model basic
Conception, though only show the assembly relevant with this utility model rather than according to component count during actual enforcement, shape in diagram
And size drafting, during its actual enforcement, the kenel of each assembly, quantity and ratio can be a kind of random change, and its assembly layout
Kenel is likely to increasingly complex.
Embodiment one
Refer to Fig. 1 and Fig. 2, this utility model provides a kind of tem sample grid, at least includes:
Arrying main body 1, described arrying main body 1 includes substrate 11 and the column stretching out positioned at described substrate 11 side
12, described column 12 is suitable to attached sample；Clamping projection 2, described clamping projection 2 is located at described substrate 11 surface, is suitable to clamp
To move described arrying main body 1；And installation through-hole 3, described installation through-hole 3 is in described substrate 11.
Due to sample for tem sample grid very little, therefore in accompanying drawing and not specifically illustrated sample.
As an example, described clamping projection 2 is bent after cutting out by a part for described substrate 11 and forms, and described clamping
Projection 2 and the perpendicular of described substrate 11, that is, described projection 2 is a part for described substrate 11.Described clamping projection 2 with
The angle that the surface setting of described substrate 11 is certain is to grip tem sample grid for ease of tweezers 5, prevents from pressing from both sides tem sample by mistake
Sample on grid and lead to the catastrophic loss of sample.
As an example, the quantity of described column 12 is multiple, and multiple described columns 12 are along the sides aligned parallel of described substrate 11
Spaced apart.
As an example, the top of described column 12 is provided with identification mark (not shown).Quantity due to column 12 has
Multiple, the both sides of column 12 can attach sample, in order to distinguish the sample of each observation, needs setting identification on column 12
Labelling.Described identification mark is robot or the readable identification mark of people, and identification mark is the alphabetic character or geometric form simplifying
Shape is combined, but not limited to this.
Embodiment two
This utility model also provides a kind of tem sample grid, the structure of described tem sample grid in the present embodiment and reality
The structure applying the tem sample grid described in example one is roughly the same, and the difference of the two is: in embodiment one, described clamping is convex
Block 2 is bent after cutting out by a part for described substrate 11 and forms；And in the present embodiment, described clamping projection 2 welds or grafting
In the surface of described substrate 11, and the perpendicular with described substrate 11.
As an example, described clamping projection 2 material can identical with the material of described substrate 11 it is also possible to described base
The material at bottom 11 is different.
The other structures of the described tem sample grid in the present embodiment all with the tem sample grid described in embodiment one
Structure identical, specifically refer to embodiment one, be not repeated herein.
Embodiment three
Refer to Fig. 3 and Fig. 4, this utility model also provides a kind of tem sample apparatus for placing 4, comprising: at least one is strictly according to the facts
Apply the tem sample grid described in example one；Base 41, described base 41 is divided at least one and is suitable to place described tem sample lattice
The placement region 46 of grid, the position that described placement region 46 surface corresponds to described installation through-hole 3 is provided with installation projection 43, and institute
The position stating placement region 46 corresponding to described column 12 is provided with groove 45；The lid 42 being adapted with described base 41, described
Lid 42 is buckled on the periphery of described base 41, is beneficial to the safety ensureing described tem sample；Described tem sample grid is located at
In described placement region 46.
As shown in figure 4, described base 41 includes body and the cushion 44 positioned at described body upper surface, described installation is convex
Block 43 top is run through described cushion 44 and is protruded from the upper surface of described cushion 44, and described groove 45 is located at described cushion
In 44.The column 12 (mainly sample) that described groove 45 avoids on described tem sample grid contacts described cushion 44, uses
To protect sample.
As shown in figure 3, the described quantity of tem sample grid and the quantity of described placement region 46 be multiple and described
The quantity of tem sample grid is identical with the quantity of described placement region 46.
As an example, described cushion 44 is layer of silica gel.Cushion 44 has shockproof effect it is ensured that sample is from fib system
System vacuum chamber transports the safety during tem.
Example IV
This utility model also provides a kind of tem sample apparatus for placing, the tem sample apparatus for placing described in the present embodiment
Structure is roughly the same with the structure of the tem sample apparatus for placing described in embodiment three, and the difference of the two is: in embodiment three
Described tem sample apparatus for placing includes at least one tem sample grid as described in embodiment one, and described in the present embodiment
Tem sample apparatus for placing include at least one tem sample grid as described in embodiment two.Described tem in the present embodiment
The other structures of sample apparatus for placing are all identical with the structure of the tem sample apparatus for placing described in embodiment three, specifically please join
Read embodiment one, be not repeated herein.
As described above, tem sample grid of the present utility model and tem sample apparatus for placing, projection is clamped by setting, easily
Grip tem sample grid in tweezers, prevent from pressing from both sides sample by mistake and lead to the catastrophic damage of sample；Placed by designing tem sample
Device, the installation that matched with tem sample grid is fixed, and improves the efficiency of loading of sample；Increase buffer unit, projection and lid are installed
Body is it is ensured that sample transports the safety during tem from fib system vacuum chamber, and then improves the matter of tem sample
Amount.
Above-described embodiment only illustrative principle of the present utility model and its effect are new not for limiting this practicality
Type.Any person skilled in the art all can be carried out to above-described embodiment without prejudice under spirit and the scope of the present utility model
Modifications and changes.Therefore, such as those of ordinary skill in the art without departing from the essence disclosed in this utility model
All equivalent modifications being completed under god and technological thought or change, must be covered by claim of the present utility model.
Claims (9)
1. a kind of tem sample grid is it is characterised in that at least include:
Arrying main body, the column stretch out including substrate and positioned at described substrate side, described column is suitable to attached sample；
Clamping projection, positioned at described substrate surface, is suitable to clamping to move described arrying main body；
Installation through-hole, in described substrate.
2. tem sample grid according to claim 1 is it is characterised in that described clamping projection is by one of described substrate
Lease making bends after cutting out and forms, and the perpendicular of described clamping projection and described substrate.
3. tem sample grid according to claim 1 is it is characterised in that described clamping weld tabs or be plugged in described
The surface of substrate, and the perpendicular with described substrate.
4. tem sample grid according to claim 1 is it is characterised in that the quantity of described column is multiple, multiple described
Column is spaced apart along the sides aligned parallel of described substrate.
5. tem sample grid according to claim 1 is it is characterised in that the top of described column is provided with identification mark.
6. a kind of tem sample apparatus for placing is it is characterised in that include:
At least one tem sample grid as described in any one of claim 1 to 5；
Base, described base is divided at least one and is suitable to place the placement region of described tem sample grid, described placement region
The position that surface corresponds to described installation through-hole is provided with installation projection, and described placement region sets corresponding to the position of described column
Fluted；
Lid, is adapted with described base, and is buckled on the periphery of described base.
7. tem sample apparatus for placing according to claim 6 is it is characterised in that the quantity of described tem sample grid and institute
The quantity stating placement region is multiple, and the quantity of described tem sample grid is identical with the quantity of described placement region.
8. tem sample apparatus for placing according to claim 6 is it is characterised in that described base includes body and is located at institute
State the cushion of body upper surface, described installation projection top is run through described cushion and protruded from the upper table of described cushion
Face, described groove is located in described cushion.
9. tem sample apparatus for placing according to claim 8 is it is characterised in that described cushion is layer of silica gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620852005.1U CN205911282U (en) | 2016-08-08 | 2016-08-08 | TEM sample grid and TEM sample placer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620852005.1U CN205911282U (en) | 2016-08-08 | 2016-08-08 | TEM sample grid and TEM sample placer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205911282U true CN205911282U (en) | 2017-01-25 |
Family
ID=57802976
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620852005.1U Expired - Fee Related CN205911282U (en) | 2016-08-08 | 2016-08-08 | TEM sample grid and TEM sample placer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205911282U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114464516A (en) * | 2020-10-21 | 2022-05-10 | 长鑫存储技术有限公司 | Grid (C) |
| TWI811653B (en) * | 2021-03-30 | 2023-08-11 | 台灣積體電路製造股份有限公司 | Sample holder and system and method for sample modification |
-
2016
- 2016-08-08 CN CN201620852005.1U patent/CN205911282U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114464516A (en) * | 2020-10-21 | 2022-05-10 | 长鑫存储技术有限公司 | Grid (C) |
| US11830702B2 (en) | 2020-10-21 | 2023-11-28 | Changxin Memory Technologies, Inc. | Grid structure |
| TWI811653B (en) * | 2021-03-30 | 2023-08-11 | 台灣積體電路製造股份有限公司 | Sample holder and system and method for sample modification |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170125 Termination date: 20190808 |