CN205897913U - Heat dissipation device - Google Patents
Heat dissipation device Download PDFInfo
- Publication number
- CN205897913U CN205897913U CN201620768275.4U CN201620768275U CN205897913U CN 205897913 U CN205897913 U CN 205897913U CN 201620768275 U CN201620768275 U CN 201620768275U CN 205897913 U CN205897913 U CN 205897913U
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- CN
- China
- Prior art keywords
- heat
- double
- deck
- hollow
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to a heat dissipation device in the hot transfer technique field, including hollow double -deck heat pipe, double -deck heat pipe surface is provided with a plurality of heating panels, the heating panel is hollow structure, and hollow heating panel is linked together with hollow double -deck heat pipe, and has filled working medium. Because working medium's existence, the absorption heat that working medium is rapid reduce the the local temperature of heat source, simultaneously working medium can be fast with heat transfer to the heating panel, again because the existence of heating panel, the heat can be discharged through the heating panel surface to reach the mesh of local heat dissipation cooling. The device can regard as heat dissipation device to use, and it uses safe and reliable.
Description
Technical field
The utility model is related to a kind of heat-transfer arrangement, particularly to a kind of heat abstractor.
Background technology
A kind of temperature-uniforming plate heat-pipe radiator is disclosed, its number of patent application is in existing Chinese patent database:
201420280692.5, the applying date is: 2014.05.28, and notification number is: cn203980975u, and the day for announcing is: 2014.12.03,
Its structure includes: include pedestal and some heat pipes being radiated are located on pedestal it is characterised in that: in described pedestal
It is provided with and be used for the temperature-uniforming plate of thermal source is installed with heat pipe directly contact.It is disadvantageous in that: due to substantial amounts of pipe in this device
Part needs to weld, and therefore technique is excessively complicated, and this device is merely only to be radiated using heat pipe simultaneously, and heat pipe two ends connect
At the two ends of temperature-uniforming plate, thus the heat in temperature-uniforming plate centre position is difficult to reduce, easily form temperature-uniforming plate localized hyperthermia.
Utility model content
The technical problem that the utility model solves is: on the basis of drawing and absorbing existing heat abstractor technology, provides
A kind of new heat abstractor, the heat of this heat abstractor rapid uniform pickup near heating sources, it is to avoid the situation of localized hyperthermia occurs,
Ensure that heat abstractor works effectively.
In order to realize the purpose of above-mentioned utility model, technical solution adopted in the utility model:
A kind of heat abstractor, includes the double-deck heat pipe of hollow, and described bilayer heat conduction tube outer surface is provided with some dissipating
Hot plate, described heat sink is hollow structure, and the heat sink of hollow is connected with the double-deck heat pipe of hollow, and is perfused with work Jie
Matter.
During utility model works, double-deck heat pipe is sleeved on thermal source, and heat passes to through double-deck heat conduction pipe internal surface
Working media, then working media heat is delivered to rapidly on heat sink, the outer surface of last heat sink and double-deck heat pipe
Heat is discharged.Compared with prior art, the beneficial effects of the utility model are: due to the presence of working media, working media
Rapidly absorb the local temperature that heat reduces thermal source, working media can rapidly transfer heat on heat sink simultaneously,
Again due to the presence of heat sink, heat can be discharged by heat sink outer surface, thus reaching the purpose of local radiating and cooling.Should
Device can use as heat abstractor, and it is safe and reliable.
In order to accelerate radiating rate, described heat sink is arranged along the outer surface circumference of double-deck heat pipe in radioactivity,
And leave gap between two adjacent heat sinks.
In order to accelerate radiating rate, described heat sink is in circular, and heat sink radially lead in bilayer by horizontal set
On heat pipe outer surface.
Absorbed by double-deck heat conduction pipe internal surface for the ease of heat, be easy to heat from double-deck heat conduction tube outer surface and heat sink
Outer surface is discharged, and described bilayer heat conduction pipe internal surface is fixed with high infiltration copper powder, double-deck heat conduction tube outer surface by sintering processing
With heat sink outer surface, crude metal powder is fixed with by sintering processing.
Brief description
Fig. 1 is structural representation of the present utility model.
Fig. 2 is top view of the present utility model.
Fig. 3 is the sectional view along a-a for the utility model.
Wherein, 1 double-deck heat pipe, 2 heat sinks, 3 double-deck heat conduction tube outer surfaces, 4 double-deck heat conduction pipe internal surfaces, 5 high infiltrations
Copper powder.
Specific embodiment
The utility model is not limited to embodiment, on the basis of technical scheme disclosed in the utility model, this area
Technical staff according to disclosed technology contents it is not necessary to performing creative labour just can be made to some of which technical characteristic
Go out some to replace and deform, these are replaced and deformation is all in protection domain of the present utility model.
As Figure 1-3, a kind of heat abstractor, includes the double-deck heat pipe 1 of hollow, and double-deck heat conduction tube outer surface 3 sets
It is equipped with some heat sinks 2, in order to accelerate radiating rate, heat sink 2 is in radioactivity along the outer surface circumference of double-deck heat pipe 1
Setting, and leaves gap between two adjacent heat sinks 2, and heat sink 2 is hollow structure, the heat sink 2 of hollow and hollow
Double-deck heat pipe 1 is connected, and is perfused with working media, is absorbed by double-deck heat conduction pipe internal surface 4 for the ease of heat, is easy to heat
Amount is discharged from double-deck heat conduction tube outer surface 3 and heat sink 2 outer surface, and double-deck heat conduction pipe internal surface 4 is fixed with by sintering processing
High infiltration copper powder 5, double-deck heat conduction tube outer surface 3 and heat sink 2 outer surface are fixed with crude metal powder by sintering processing.
During work, double-deck heat pipe 1 is sleeved on thermal source, and the high infiltration copper powder 5 through double-deck heat conduction pipe internal surface 4 for the heat passes
Pass working media, then heat is delivered to rapidly on heat sink 2 by working media, last heat sink 2 and double-deck heat pipe 1
Heat is discharged by the crude metal powder on outer surface.
Claims (4)
1. a kind of heat abstractor, include the double-deck heat pipe of hollow it is characterised in that: described bilayer heat conduction tube outer surface setting
There are some heat sinks, described heat sink is hollow structure, the heat sink of hollow is connected with the double-deck heat pipe of hollow, and irrigates
There is working media.
2. a kind of heat abstractor according to claim 1 it is characterised in that: described heat sink is along the appearance of double-deck heat pipe
The setting in radioactivity of face circumference, and leave gap between two adjacent heat sinks.
3. a kind of heat abstractor according to claim 1 it is characterised in that: described heat sink be in circular, heat sink edge
Radial level is sleeved on double-deck heat conduction tube outer surface.
4. a kind of heat abstractor according to claim 1 it is characterised in that: described bilayer heat conduction pipe internal surface pass through sintering
Mode is fixed with high infiltration copper powder, and double-deck heat conduction tube outer surface and heat sink outer surface are fixed with crude metal by sintering processing
Powder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620768275.4U CN205897913U (en) | 2016-07-20 | 2016-07-20 | Heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620768275.4U CN205897913U (en) | 2016-07-20 | 2016-07-20 | Heat dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205897913U true CN205897913U (en) | 2017-01-18 |
Family
ID=57773166
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620768275.4U Expired - Fee Related CN205897913U (en) | 2016-07-20 | 2016-07-20 | Heat dissipation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205897913U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109378552A (en) * | 2018-11-23 | 2019-02-22 | 清华大学 | Chiasma type flat-plate heat pipe |
-
2016
- 2016-07-20 CN CN201620768275.4U patent/CN205897913U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109378552A (en) * | 2018-11-23 | 2019-02-22 | 清华大学 | Chiasma type flat-plate heat pipe |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170118 Termination date: 20210720 |