CN205793598U - Replace the printed wiring board of embedded resistors design - Google Patents
Replace the printed wiring board of embedded resistors design Download PDFInfo
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- CN205793598U CN205793598U CN201620406725.5U CN201620406725U CN205793598U CN 205793598 U CN205793598 U CN 205793598U CN 201620406725 U CN201620406725 U CN 201620406725U CN 205793598 U CN205793598 U CN 205793598U
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- wiring board
- insulating barrier
- resistive layer
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- articulamentum
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Abstract
This utility model belongs to circuit board processing and manufacturing technical field, especially relates to a kind of printed wiring board replacing embedded resistors design.It solve the technical problem of existing embedded resistors printed wiring board poor stability.Including wiring board body, this wiring board body includes insulating barrier, some conductor layers being sequentially distributed setting it are directly connected on insulating barrier, it is covered with resistive layer on conductor layer, it is connected with insulating barrier by articulamentum in the middle part of resistive layer, and articulamentum is covered in insulating barrier upper surface, it is connected with conductor layer outside resistive layer.Advantage is: uses articulamentum, not only increases the adhesion of unit are, and add the bonded area of out-phase material, significantly improve the adhesion of out-phase storeroom so that products application reliability is higher, manufactures stability more preferable；Meanwhile, by exposed for the resistive layer outside at conductor layer, can accurately test and control resistance, make product electric property more stable.
Description
Technical field
This utility model belongs to circuit board processing and manufacturing technical field, especially relate to a kind of replace embedded resistors design
Printed wiring board.
Background technology
Along with the development of electronics and information industry, packaging density and volume mass to electronics and IT products are proposed higher
Requirement, and will in the middle of passive device potting to printed wiring board be a kind of very effective solution, naturally become printing
The focus of wiring board industry development.Wherein, embedded resistors becomes a kind of topmost line of production, and its advantage is to improve print
The attachment space of PCB surface processed, by using potting technology to make the component reliability of embedding more preferably, by cancelling paster
With plug-in unit encapsulate parasitic inductance and electric capacity, shortening transmission path and improve that Electro Magnetic Compatibility makes that signal transmits complete
Property is more preferable.
Prior art typically uses structure as shown in Figure 1 to design and produce the printed wiring board of embedded resistors, this design by
In the simple lamination using multilamellar out-phase material so that out-phase storeroom adhesion is poor, easily occur that the reliability that layering departs from is asked
Topic.Meanwhile, resistive layer 13 is in insulating barrier 11 and the centre of conductor layer 12 so that accurately measurement and the control of resistance become difficulty,
The fluctuation of product resistance value is big, and electric property is unstable.
Summary of the invention
The purpose of this utility model is for the problems referred to above, it is provided that a kind of energy replaces existing burying and hinders the reliability of design more
The printed wiring board replacing embedded resistors design that high, electric property is more stable.
For reaching above-mentioned purpose, this utility model have employed following technical proposal: the printing of this replacement embedded resistors design
Wiring board, including wiring board body, it is characterised in that this wiring board body includes insulating barrier, and described insulating barrier directly connects
It is connected to some conductor layers being sequentially distributed setting, described conductor layer is covered with resistive layer, passes through in the middle part of described resistive layer
Articulamentum is connected with insulating barrier, and described articulamentum is covered in insulating barrier upper surface, with conductor layer outside described resistive layer
It is connected.The most here insulating barrier and conductor layer directly link, and articulamentum can only cover at surface of insulating layer, then cover upper resistance
Layer.
In the above-mentioned printed wiring board replacing embedded resistors design, described articulamentum both sides extend out to respectively
Between resistive layer and conductor layer, described resistive layer is connected with conductor layer by articulamentum, and described articulamentum is covered each by
In insulating barrier upper surface and conductor layer upper surface.The most here articulamentum can cover at conductor layer and surface of insulating layer, then covers
Cover resistive layer.
In the above-mentioned printed wiring board replacing embedded resistors design, described insulating barrier by insulating polymeric material or
Ceramic insulating material is made, and described insulating barrier is by homogeneous material, composite diphase material and any one material system in composite
Become.
In the above-mentioned printed wiring board replacing embedded resistors design, described articulamentum by use chemical plating mode,
Printing coating method, sputtering coating method combine make with any one modes in vapour deposition mode or various ways.
In the above-mentioned printed wiring board replacing embedded resistors design, described resistive layer is by metal material, pottery material
Expect to make with any one in macromolecule polymer material, and described resistive layer by use plating mode, chemical plating mode,
Printing coating method, sputtering coating method, vapour deposition mode and any one mode or various ways in physics pressing mode
Combine and make, and described resistive layer is single layer structure or double-decker or multiple structure.Preferably, described resistance here
Layer can be internal layer, it is also possible to being outer layer, described wiring board body can be rigid plate, can be flexible board, it is also possible to be firm
Soft board.
Compared with prior art, the advantage of the printed wiring board of this replacement embedded resistors design is: use articulamentum,
Not only increase the adhesion of unit are, and add the bonded area of out-phase material, significantly improve out-phase storeroom
Adhesion so that products application reliability is higher, manufacture stability more preferable；Meanwhile, by exposed for resistive layer outside conductor layer
Face, can accurately test and control resistance, makes product electric property more stable.
Accompanying drawing explanation
Fig. 1 is the structural representation of the printed wiring board of existing embedded resistors.
Fig. 2 is the structural representation of this utility model embodiment one.
Fig. 3 is the structural representation of this utility model embodiment two.
In figure, wiring board body 1, insulating barrier 11, conductor layer 12, resistive layer 13, articulamentum 14.
The utility model is described in more detail with detailed description of the invention below in conjunction with the accompanying drawings.
Detailed description of the invention
Embodiment one
As in figure 2 it is shown, the printed wiring board of this replacement embedded resistors design, including wiring board body 1, this wiring board body
1 includes insulating barrier 11, and described insulating barrier 11 is directly connected to some conductor layers 12 being sequentially distributed setting, described conductor
It is covered with resistive layer 13 on layer 12, is connected with insulating barrier 11 by articulamentum 14 in the middle part of described resistive layer 13, and described company
Connect layer 14 and be covered in insulating barrier 11 upper surface, be connected with conductor layer 12 outside described resistive layer 13, insulating barrier 11 the most here
Directly linking with conductor layer 12, articulamentum 14 can only cover on insulating barrier 11 surface, then covers top resistive layer 13.
Specifically, the insulating barrier 11 in the present embodiment is made up of insulating polymeric material or ceramic insulating material, and described
Insulating barrier 11 be made up with any one material in composite of homogeneous material, composite diphase material.Wherein, articulamentum 14 is by using
Chemical plating mode, printing coating method, sputtering coating method and any one mode in vapour deposition mode or various ways phase
In conjunction with making.
Resistive layer 13 in the present embodiment is by any one in metal material, ceramic material and macromolecule polymer material
Make, and described resistive layer 13 is by using plating mode, chemical plating mode, printing coating method, sputtering coating method, gas phase
Depositional mode combines make with any one mode in physics pressing mode or various ways, and described resistive layer 13 is single
Rotating fields or double-decker or multiple structure, it is preferable that described resistive layer 13 here can be internal layer, it is also possible to be outer layer,
Described wiring board body 1 can be rigid plate, can be flexible board, it is also possible to be rigid flexible system plate.
The printed wiring board fabrication method of this replacement embedded resistors design, comprises the steps: 1, makes internal layer sheet material, bag
Include preparation insulating barrier 11 and at insulating barrier 11 surface pressing conductor layer 12；2, make conductor line, be included on conductor layer 12 patch
Cover photoresist layer, then advance to few single exposure, at least one times development, at least one times etching, at least one times matting resistance；3, make
Articulamentum 14, is included in insulating barrier 11 surface or insulating barrier 11 and conductor layer 12 surface one layer of articulamentum 14 of deposition thus forms line
The semi-finished product of road plate body 1；4, make protective layer, be included in the semi-finished product that need not make the wiring board body 1 of resistive layer 13
Surface makes layer protective layer and prevents resistive layer 13 from depositing；5, make resistance pattern, be included in the semi-finished product table of wiring board body 1
Look unfamiliar and grow required resistive layer 13；6, decorporate protective layer, be included in after resistive layer 13 completes with physically or chemically side
Method is decorporated protective layer；7, resistive layer 13 is checked, including using the optics automatic checkout equipment horizontal plane defect to resistive layer 13
Check and use special designs tool that the vertical plane thickness of resistive layer 13 is checked.When the embedded resistors of wiring board body 1 is
Also comprise the steps: 8 during internal layer, lamination pressing, the surface of semi-finished of wiring board body 1 is carried out brown process, then uses
Process for pressing covers insulating barrier 11 and conductor layer 12 in the surface of semi-finished of wiring board body 1.
Wherein, conductor layer 12 is preferably Copper Foil in step 1；Photoresist layer uses wet film coating method or dry in step 2
Mould covers mode；Exposure uses film Exposure mode or uses radium-shine direct imaging to expose the most at least one times；In step
In 2, etching uses the acid etching of HCl and NaClO3 system at least one times.The material of articulamentum 14 is for conducting electricity in step 3
Nonmetallic substance, including any one or more combination in conducting polymer, graphite and white carbon black, described articulamentum 14 is thick
Degree is that 0.20 μm is to 5.00 μm；In step 4 protective layer for graphic plating dry film；The making of resistive layer 13 in steps of 5
For the selective electroplating technique of amorphous metal, including Ni-P, Ni-S, Ni-B, Ni-Mo, Ni-Zn, Ni-W, Co-W, Co-S,
The amorphous alloy system of any one or more combination in Co-Mo, Co-Ti, Al-Mn and Bi-S, also include Co-Ni-P,
The ternary non-crystaline amorphous metal system of any one or more combination in Co-Zn-P, Co-W-B, Ni-Cr-P；Described resistive layer 13 is thick
Degree is that 0.02 μm is to 6.00 μm.Insulating barrier 11 in step 8 is the prepreg of epoxy resin, and described conductor layer 12 is copper
Paper tinsel.
Embodiment two
As it is shown on figure 3, the structure of the present embodiment, principle and enforcement step are similar with embodiment one, different places exists
In, articulamentum 14 both sides here extend out between resistive layer 13 and conductor layer 12 respectively, and described resistive layer 13 passes through
Articulamentum 14 is connected with conductor layer 12, and described articulamentum 14 is covered each by table on insulating barrier 11 upper surface and conductor layer 12
Face, connection the most here, 14 can cover on conductor layer 12 and insulating barrier 11 surface, then cover top resistive layer 13.
Specific embodiment described herein is only to this utility model spirit explanation for example.This utility model institute
Belong to those skilled in the art described specific embodiment to make various amendment or supplement or use similar
Mode substitute, but without departing from spirit of the present utility model or surmount scope defined in appended claims.
Although the most more employing wiring board body 1, insulating barrier 11, conductor layer 12, resistive layer 13, articulamentum 14 etc.
Term, but it is not precluded from using the probability of other term.Use these terms to be only used to more easily to describe and explain
Essence of the present utility model；It is all contrary with this utility model spirit for being construed as any additional restriction.
Claims (5)
1. replace a printed wiring board for embedded resistors design, including wiring board body (1), it is characterised in that this wiring board
Body (1) includes insulating barrier (11), and described insulating barrier (11) is directly connected to some conductor layers being sequentially distributed setting
(12), described conductor layer (12) is covered with resistive layer (13), described resistive layer (13) middle part by articulamentum (14) with
Insulating barrier (11) is connected, and described articulamentum (14) is covered in insulating barrier (11) upper surface, described resistive layer (13) outside
It is connected with conductor layer (12).
The printed wiring board of replacement embedded resistors the most according to claim 1 design, it is characterised in that described articulamentum
(14) both sides extend out between resistive layer (13) and conductor layer (12) respectively, and described resistive layer (13) passes through articulamentum
(14) it is connected with conductor layer (12), and described articulamentum (14) is covered each by insulating barrier (11) upper surface and conductor layer (12)
Upper surface.
The printed wiring board of replacement embedded resistors the most according to claim 1 and 2 design, it is characterised in that described is exhausted
Edge layer (11) is made up of insulating polymeric material or ceramic insulating material, and described insulating barrier (11) is by homogeneous material, complex phase
Material is made with any one material in composite.
The printed wiring board of replacement embedded resistors the most according to claim 3 design, it is characterised in that described articulamentum
(14) by use in chemical plating mode, printing coating method, sputtering coating method and vapour deposition mode any one mode or
Various ways combines and makes.
The printed wiring board of replacement embedded resistors the most according to claim 3 design, it is characterised in that described resistive layer
(13) it is made up with any one in macromolecule polymer material of metal material, ceramic material, and described resistive layer (13)
By using plating mode, chemical plating mode, printing coating method, sputtering coating method, vapour deposition mode and physics pressing side
In formula, any one mode or various ways combine and make, and described resistive layer (13) be single layer structure or double-decker or
Multiple structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620406725.5U CN205793598U (en) | 2016-05-06 | 2016-05-06 | Replace the printed wiring board of embedded resistors design |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620406725.5U CN205793598U (en) | 2016-05-06 | 2016-05-06 | Replace the printed wiring board of embedded resistors design |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205793598U true CN205793598U (en) | 2016-12-07 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201620406725.5U Active CN205793598U (en) | 2016-05-06 | 2016-05-06 | Replace the printed wiring board of embedded resistors design |
Country Status (1)
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105848408A (en) * | 2016-05-06 | 2016-08-10 | 衢州顺络电子有限公司 | Printed circuit board for replacing embedded resistor design and manufacturing method thereof |
-
2016
- 2016-05-06 CN CN201620406725.5U patent/CN205793598U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105848408A (en) * | 2016-05-06 | 2016-08-10 | 衢州顺络电子有限公司 | Printed circuit board for replacing embedded resistor design and manufacturing method thereof |
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