CN205755230U - A kind of helical flow path water-cooling heat radiating device - Google Patents
A kind of helical flow path water-cooling heat radiating device Download PDFInfo
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- CN205755230U CN205755230U CN201620542286.0U CN201620542286U CN205755230U CN 205755230 U CN205755230 U CN 205755230U CN 201620542286 U CN201620542286 U CN 201620542286U CN 205755230 U CN205755230 U CN 205755230U
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- main body
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Abstract
The utility model discloses a kind of helical flow path water-cooling heat radiating device.It includes main body and cover plate, water cavity and the most symmetrical it is equipped with on the leading flank of main body and trailing flank, the shape of cover plate and the mating shapes of water cavity, some helical flow path holes it are provided with between leading flank and the trailing flank of main body, the two ends in helical flow path hole connect with the water cavity of main body leading flank and the water cavity of main body trailing flank respectively, some resistor rod holes it are provided with between left surface and the right flank of main body, resistor rod hole extends through left surface and the right flank of main body, heat radiation table top it is equipped with on the upper surface of main body and lower surface, main body is provided with flow inlet hole and water export hole, flow inlet hole connects with the water cavity of main body leading flank, water export hole connects with the water cavity of main body trailing flank.The beneficial effects of the utility model are: effectively strengthen area of dissipation and eddy current effect, thermal resistance is greatly lowered；It is effectively improved product heat dispersion；Eliminate internal stress, improve product reliability.
Description
Technical field
This utility model relates to radiator correlative technology field, refers in particular to a kind of helical flow path water-cooling heat radiating device.
Background technology
Reliability requirement, performance indications, power density etc. are required to improve further by modern electronic equipment, electronic equipment
Thermal design is more and more important.Power device is the Primary Component in most electronic equipment, the quality of its duty directly shadow
Ring whole aircraft reliability, safety and service life.The heat sink conception of power device, can in addition to effectively dissipating heat
By property also it is critical that.
When thyristor device operationally can produce substantial amounts of power-consumption heat, it is therefore desirable to install cooling device and dissipate
Heat, to reduce the junction temperature of power device, it is ensured that thyristor device is normal, reliability service at a temperature of allowing.Power device at present
The type of cooling mainly have air-cooled, water-cooled and heat pipe etc., along with the further raising of device performance requirements and power density, to dissipating
Heat request is more and more harsh, considers from big power consumption and reliability, typically selects the water-filled radiator that radiating efficiency is high to power
Device cools down, and owing to low discharge small size high power consumption becomes a kind of trend, and the straight hole flow passage structure of routine is difficult to
High power density cooling requirement, needs to use strengthening heat dissipation technology.
Traditional water-filled radiator is by opening straight trough in water-cooled main body, then water-cooled main body and cover plate press from both sides one in centre
Layer solder sheet is welded together by vacuum brazing, installs electronic device in cover plate face, and the cover plate of employing mostly is thin-walled plate structures
To reduce radiator thermal-conduction resistance requirement.Visible existing cooled plate runner is simple, and heat dispersion is low and cover plate face mounting related components
Time exist and leak risk.
Utility model content
This utility model is to there is above-mentioned deficiency in prior art to overcome, it is provided that a kind of heat dispersion is high and can
By the helical flow path water-cooling heat radiating device that performance is high.
To achieve these goals, this utility model is by the following technical solutions:
A kind of helical flow path water-cooling heat radiating device, including main body and cover plate, on the leading flank of described main body and trailing flank all
Be provided with water cavity and the most symmetrical, the shape of described cover plate and the mating shapes of water cavity, the leading flank of described main body and after
Be provided with some helical flow path holes between side, the two ends in described helical flow path hole respectively with the water cavity of main body leading flank and main body after
The water cavity connection of side, is provided with some resistor rod holes between left surface and the right flank of described main body, described resistor rod hole is divided
Do not run through left surface and the right flank of main body, the upper surface of described main body and lower surface are equipped with heat radiation table top, described master
Body is provided with flow inlet hole and water export hole, and described flow inlet hole connects with the water cavity of main body leading flank, described
Water export hole connects with the water cavity of main body trailing flank.
First coolant enters directly into inside the side water cavity of main body from flow inlet hole, the most again through several spiral shells
Hole, eddy flow road, collects from the opposite side water cavity of main body afterwards, finally flows out from water export hole, thus main body is dispelled the heat on table top
Heat take away；Wherein: effectively strengthen area of dissipation and eddy current effect by the design in helical flow path hole, use the most two-sided
Heat radiation table top dispels the heat, and thermal resistance is greatly lowered and meets high power device cooling requirements.
As preferably, described cover plate passes through temper technique and main body after first passing through the welding procedure that agitating friction welds
Connect.So it is designed to eliminate the internal stress between main body and cover plate, prevents workpiece deformation, cracking, improve product reliability.
As preferably, the shape in described helical flow path hole in the shape of a spiral, after described helical flow path hole is uniformly divided into two rows
It is respectively placed in above and below resistor rod hole and is interspersed.The structure in helical flow path hole is designed to further enhance
Area of dissipation and eddy current effect, be greatly lowered thermal resistance and meet high power device radiating requirements.
As preferably, described flow inlet hole is placed on left surface or the right flank of main body, described flow inlet hole
At grade and being parallel to each other with resistor rod hole, described water export hole is placed on left surface or the right flank of main body,
Described water export hole at grade and is parallel to each other with resistor rod hole.Flow inlet hole and the structure in water export hole
Design, it is possible to further heat radiation table top is dispelled the heat, be effectively improved product heat dispersion.
The beneficial effects of the utility model are: use the structure design in helical flow path hole, effectively strengthen area of dissipation and whirlpool
Stream effect, is greatly lowered thermal resistance and meets high power device radiating requirements；The heat radiation table top of upper and lower surface is set, is effectively improved product
Product heat dispersion；Use agitating friction weldering welding procedure postwelding to do temper technique, eliminate internal stress, prevent workpiece from becoming
Shape, cracking, improve product reliability.
Accompanying drawing explanation
Fig. 1 is detonation configuration schematic diagram of the present utility model；
Fig. 2 is cut-away section structural representation of the present utility model.
In figure: 1. main body, 2. cover plate, 3. water cavity, 4. helical flow path hole, 5. resistor rod hole, 6. heat radiation table top, 7. water flows into
Oral pore, 8. water export hole.
Detailed description of the invention
With detailed description of the invention, this utility model is further described below in conjunction with the accompanying drawings.
In embodiment as described in Figure 1, a kind of helical flow path water-cooling heat radiating device, including main body 1 and cover plate 2, main body 1
Water cavity 3 and the most symmetrical it is equipped with on leading flank and trailing flank, the mating shapes of the shape of cover plate 2 and water cavity 3, main body
Be provided with some helical flow path holes 4 between leading flank and the trailing flank of 1, the two ends in helical flow path hole 4 respectively with main body 1 leading flank
Water cavity 3 connects with the water cavity 3 of main body 1 trailing flank, is provided with some resistor rod holes 5, resistance between left surface and the right flank of main body 1
Rod hole 5 extends through left surface and the right flank of main body 1, and the upper surface of main body 1 and lower surface are equipped with heat radiation table top 6, main
Body 1 is provided with flow inlet hole 7 and water export hole 8, and flow inlet hole 7 connects with the water cavity 3 of main body 1 leading flank, and water flows out
Oral pore 8 connects with the water cavity 3 of main body 1 trailing flank.Wherein: cover plate 2 passes through tempering after first passing through the welding procedure that agitating friction welds
Hardening and tempering process is connected with main body 1.As in figure 2 it is shown, the shape in helical flow path hole 4 is in the shape of a spiral, helical flow path hole 4 is uniformly divided into two
It is respectively placed in after row above and below resistor rod hole 5 and is interspersed.Flow inlet hole 7 is placed in left surface or the right side of main body 1
On side, flow inlet hole 7 at grade and is parallel to each other with resistor rod hole 5, and water export hole 8 is placed in a left side for main body 1
On side or right flank, water export hole 8 at grade and is parallel to each other with resistor rod hole 5.
First, use agitating friction postwelding to use temper technique again between main body 1 and cover plate 2, eliminate internal stress, prevent
Workpiece deformation, cracking, improve product reliability high；Then, coolant is entered directly into before main body 1 from flow inlet hole 7
Water cavity 3 on side is internal, through several helical flow path holes 4, effectively strengthens area of dissipation by the design in helical flow path hole 4
And eddy current effect；Finally, collect inside the water cavity 3 on the trailing flank of main body 1, flow out from water export hole 8, main body will be located at
The heat on heat radiation table top 6 on the upper surface of 1 and lower surface is taken away, and is effectively improved product heat dispersion, heat is greatly lowered
Resistance, meets high power device cooling requirements.
Claims (4)
1. a helical flow path water-cooling heat radiating device, is characterized in that, including main body (1) and cover plate (2), before described main body (1)
Water cavity (3) and the most symmetrical it is equipped with, the shape phase of the shape of described cover plate (2) and water cavity (3) on side and trailing flank
Coupling, is provided with some helical flow path holes (4) between leading flank and the trailing flank of described main body (1), described helical flow path hole (4)
Two ends connect with the water cavity (3) of main body (1) leading flank and the water cavity (3) of main body (1) trailing flank respectively, a left side for described main body (1)
Being provided with some resistor rod holes (5) between side and right flank, described resistor rod hole (5) extends through the left surface of main body (1)
And right flank, the upper surface of described main body (1) and lower surface are equipped with heat radiation table top (6), described main body (1) is provided with water
Inlet bore (7) and water export hole (8), described flow inlet hole (7) connects with the water cavity (3) of main body (1) leading flank, institute
The water export hole (8) stated connects with the water cavity (3) of main body (1) trailing flank.
A kind of helical flow path water-cooling heat radiating device the most according to claim 1, is characterized in that, described cover plate (2) first leads to
It is connected with main body (1) by temper technique after crossing the welding procedure of agitating friction weldering.
A kind of helical flow path water-cooling heat radiating device the most according to claim 1 and 2, is characterized in that, described helical flow path hole
(4) in the shape of a spiral, described helical flow path hole (4) is respectively placed in the top of resistor rod hole (5) to shape after being uniformly divided into two rows
With lower section and being interspersed.
A kind of helical flow path water-cooling heat radiating device the most according to claim 1 and 2, is characterized in that, described flow inlet
Hole (7) is placed on left surface or the right flank of main body (1), and described flow inlet hole (7) and resistor rod hole (5) are at same plane
Going up and be parallel to each other, described water export hole (8) is placed on left surface or the right flank of main body (1), described water export
Hole (8) at grade and is parallel to each other with resistor rod hole (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620542286.0U CN205755230U (en) | 2016-06-03 | 2016-06-03 | A kind of helical flow path water-cooling heat radiating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620542286.0U CN205755230U (en) | 2016-06-03 | 2016-06-03 | A kind of helical flow path water-cooling heat radiating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205755230U true CN205755230U (en) | 2016-11-30 |
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ID=57359735
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620542286.0U Active CN205755230U (en) | 2016-06-03 | 2016-06-03 | A kind of helical flow path water-cooling heat radiating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205755230U (en) |
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2016
- 2016-06-03 CN CN201620542286.0U patent/CN205755230U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP03 | Change of name, title or address |
Address after: Xiaoshan District of Hangzhou City, Zhejiang province 311220 Xiaoshan Economic Development Zone Huarui Center 1 building 23 layer Patentee after: Hangzhou Bo Bo heat transfer Polytron Technologies Inc Address before: Hangzhou City, Zhejiang province 311220 Xiaoshan Economic Development Zone Huarui Center No. 1 building 23 layer Patentee before: Hangzhou Xiangbo Electric Co., Ltd. |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Spiral flowing channel water -cooling heat -radiating devices Effective date of registration: 20170728 Granted publication date: 20161130 Pledgee: Bank of Beijing, Limited by Share Ltd, Hangzhou, Xiaoshan branch Pledgor: Hangzhou Bo Bo heat transfer Polytron Technologies Inc Registration number: 2017330000076 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20180828 Granted publication date: 20161130 Pledgee: Bank of Beijing, Limited by Share Ltd, Hangzhou, Xiaoshan branch Pledgor: Hangzhou Bo Bo heat transfer Polytron Technologies Inc Registration number: 2017330000076 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| CP03 | Change of name, title or address |
Address after: Room 702, building 3, no.371, Mingxing Road, Xiaoshan Economic and Technological Development Zone, Hangzhou, Zhejiang 311200 Patentee after: Xiangbo heat transfer technology Co.,Ltd. Address before: Xiaoshan District of Hangzhou City, Zhejiang province 311220 Xiaoshan Economic Development Zone Huarui Center 1 building 23 layer Patentee before: XENBO (HANGZHOU) HEAT TRANSFER SCIENCE & TECHNOLOGY Co.,Ltd. |
|
| CP03 | Change of name, title or address |