CN205748663U - A kind of Multifunction infrared thermal imagery instrument - Google Patents
A kind of Multifunction infrared thermal imagery instrument Download PDFInfo
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Abstract
This utility model provides a kind of Multifunction infrared thermal imagery instrument, has power circuit and the infrared sensor being electrically connected mutually with power circuit, analog-digital converter, FPGA programmable gate circuit, data transmission interface circuit and DSP；Infrared sensor is connected with analog-digital converter；Analog-digital converter is connected with FPGA programmable gate circuit；FPGA programmable gate circuit is connected with digital signal processor；Data transmission interface circuit is connected with FPGA programmable gate circuit；DSP is connected with FPGA programmable gate circuit, infrared sensor respectively.This utility model can realize thermal imaging system image and the quick reading of video data, the real-time teletransmission of infrared data, real-time touch-control editor's remarks of Infrared Image Information, change the functions such as video frame frequency, adds the application scenarios of thermal imaging system and the motility of data transmission and real-time.
Description
Technical Field
The utility model relates to an integrated circuit technical field, concretely relates to multi-functional thermal infrared imager.
Background
Thermal infrared imagers are devices that convert the invisible infrared energy emitted by an object being measured into a visible thermal image that is provided to a user. Along with the rapid development of the infrared imaging technology, the portable thermal infrared imager is applied to occasions such as power transmission lines, power generation equipment, electronic manufacturing and fire fighting rescue increasingly widely, but the existing portable thermal infrared imager device still has the following problems:
firstly, the frame frequency of an image of the thermal infrared imager is fixed, a data transmission interface circuit is single, and the application scene is limited;
secondly, the quantity of images and video data of the thermal infrared imager is large, and the reading and transmission speed is slow;
secondly, the real-time performance of transmitting the infrared image and the video data to the PC is poor during outdoor detection;
therefore, it is necessary to improve the problems of fixed frame frequency of the infrared thermal imager, single data transmission interface circuit, large amount of image and video data, and relatively slow reading and transmission speed, and the problem of poor real-time performance of transmitting the infrared image and video data to the PC during outdoor and remote detection.
SUMMERY OF THE UTILITY MODEL
In order to overcome the above problems, the utility model aims at providing a multi-functional thermal infrared imager.
In order to achieve the above object, the utility model provides a multifunctional thermal infrared imager, which comprises a power circuit and an infrared sensor electrically connected with the power circuit, wherein the infrared sensor is used for converting the detected optical signal of the object to be measured into an analog electrical signal; it still includes: the digital-to-analog converter, the FPGA programmable gate circuit, the data transmission interface circuit, the DSP digital signal processor and the audio and video circuit which is electrically connected with the digital signal processor; the power circuit is respectively and electrically connected with the infrared sensor, the analog-to-digital converter, the FPGA programmable gate circuit, the data transmission interface circuit and the DSP; wherein,
the infrared sensor is connected with the analog-to-digital converter and outputs the analog electric signal to the analog-to-digital converter;
the analog-to-digital converter is connected with the FPGA programmable gate circuit and converts the analog electric signal into a digital signal and outputs the digital signal to the FPGA programmable gate circuit;
the FPGA programmable gate circuit is connected with the digital signal processor; the FPGA programmable gate circuit performs logic processing on the digital signals and generates different frame frequency data;
The data transmission interface circuit is connected with the FPGA programmable gate circuit and reads the frame frequency data from the FPGA programmable gate circuit or transmits external data to the FPGA programmable gate circuit;
the DSP is respectively connected with the FPGA programmable gate circuit and the infrared sensor; the DSP digital signal processor controls the infrared sensor to output analog electric signals to the analog-to-digital converter according to a time sequence; and the DSP reads different frame frequency data from the FPGA programmable gate circuit, performs operation processing on the read different frame frequency data, and sends the processed data to the FPGA programmable gate circuit.
Preferably, the DSP is further connected with a touch screen and a circuit thereof, and human-computer interaction is realized through the touch screen.
Preferably, the DSP digital signal processor is further connected with a wireless communication circuit; and the DSP digital signal processor sends information to the outside through the wireless communication circuit.
Preferably, the wireless communication circuit is provided with a signal detection module, a GPRS communication module and a 3G communication module; the signal detection module detects whether the type of a network covered by the area where the thermal infrared imager is located is GPRS or 3G, and the DSP selects to send information to the outside through GPRS or 3G according to the detected type of the network.
Preferably, the DSP digital signal processor is further connected to a voice memo circuit, and voice data is input to the DSP digital signal processor through the voice memo circuit, and the DSP digital signal processor inserts the voice data into the frame frequency data in the DSP digital signal processor.
Preferably, the DSP is electrically connected with the voice memo circuit through an SPI interface circuit.
Preferably, the DSP digital signal processor is electrically connected to the infrared sensor through an SPI interface circuit.
Preferably, the FPGA programmable gate circuit is provided with a clock, and the clock controls the infrared sensor to synchronously transmit with the analog-to-digital converter.
Preferably, the data transmission interface circuit comprises one or more of a USB interface circuit, an HDMI interface circuit, and an SD card interface circuit.
Preferably, the FPGA programmable gate circuit is further connected to a buffer circuit, and is used for storing dynamic frame frequency data of the FPGA programmable gate circuit.
The utility model discloses a multi-functional thermal infrared imager can realize thermal imager image and video data's quick reading, infrared data's real-time teletransmission, infrared image information's real-time touch-control editing remark, change functions such as video frame frequency, has increased thermal imager's application scene and data transmission's flexibility and real-time.
Drawings
FIG. 1 is a schematic view showing the connection relationship between each part of the multifunctional thermal infrared imager according to a preferred embodiment of the present invention
Detailed Description
In order to make the contents of the present invention clearer and more understandable, the contents of the present invention are further explained below with reference to the drawings of the specification. Of course, the invention is not limited to this specific embodiment, and general alternatives known to those skilled in the art are also within the scope of the invention.
The present invention will be described in further detail with reference to fig. 1 and the following detailed description of the preferred embodiments. It should be noted that the drawings are in a simplified form and are not to precise scale, and are only used for conveniently and clearly achieving the purpose of assisting in describing the embodiment.
Referring to fig. 1, in this embodiment, the multifunctional thermal infrared imager includes a power circuit, an infrared sensor, an analog-to-digital converter (ADC), an FPGA programmable gate circuit, and a data transmission interface circuit (a USB interface circuit, an HDMI interface circuit, and an SD card interface circuit) and a cache circuit (DDR) electrically connected to the FPGA programmable gate circuit, and the DSP digital signal processor may further include: the LCD touch screen circuit, the wireless communication circuit and the voice memo circuit are electrically connected with the DSP; the power circuit is electrically connected with the infrared sensor, the analog-to-digital converter (ADC), the FPGA programmable gate circuit, the data transmission interface circuit, the DSP digital signal processor, the LCD touch screen circuit, the wireless communication circuit and the voice memo circuit; the multifunctional thermal infrared imager is connected with the remote management server, detected data, images and the like can be sent to the remote management server, and then the data, the images and the like are displayed through the display terminal connected with the remote management server, so that a remote user can conveniently check the data, the images and the like.
The infrared sensor is connected with the analog-to-digital converter (ADC) and used for detecting an object to be detected and converting a detected optical signal of the object to be detected into an analog electric signal; the infrared sensor outputs the analog electric signal to an analog-to-digital converter (ADC); here, the infrared sensor is an infrared focal plane image sensor which is an uncooled infrared focal plane array, the image sensor is internally provided with a photosensitive element array, the resolution is 160 × 120, 19200 temperature measuring points are provided in total, and the requirement of the portable multifunctional thermal imager can be met. When an object is detected, infrared rays emitted by the surface of the object are imaged on a photosensitive element through an optical system in an infrared focal plane image sensor, and then a digital signal processor controls the infrared focal plane image sensor to convert received optical signals into analog electric signals according to time sequence through an SPI interface circuit control mode and output the analog electric signals to an analog-to-digital converter (ADC); here, the analog electrical signal may be a voltage signal;
the analog-to-digital converter (ADC) is connected with the FPGA programmable gate circuit and converts the analog electric signal into a digital signal and outputs the digital signal to the FPGA programmable gate circuit; the analog-to-digital converter (ADC) can be 12 bits, for example, 12 bits ADC LTC2225, the sampling frequency is 10M from high, and the analog-to-digital converter (ADC) synchronously converts the analog electrical signal into 12 bits of parallel digital signals to be sent to an FPGA programmable gate circuit (FPGA);
The FPGA programmable gate circuit is connected with the DSP digital signal processor; the FPGA programmable gate circuit performs logic processing on the digital signals and generates different frame frequency data; meanwhile, the FPGA programmable gate circuit is provided with a clock which controls the synchronous transmission of the infrared sensor and an analog-to-digital converter (ADC); the FPGA programmable gate circuit is internally provided with a logic processing unit which has parallel processing capability to process parallel digital signals sent by an analog-to-digital converter (ADC); meanwhile, according to external needs, a programmable logic algorithm can be adopted to generate different frame frequency data in real time, for example, the default output is 50Hz, and then the generated different frame frequency data are output to a data transmission interface circuit, a cache circuit (DDR), a DSP (digital signal processor) and the like; the FPGA programmable gate circuit can adopt an EP4CE40F23C6 main chip.
And the data transmission interface circuit is connected with the FPGA programmable gate circuit, reads frame frequency data from the FPGA programmable gate circuit, and can transmit external data to the FPGA programmable gate circuit. The data transmission interface circuit can comprise one or more of a USB interface circuit, an HDMI interface circuit and an SD card interface circuit, and the USB interface circuit can comprise a standard USB2.0 interface circuit and a USB3.0 interface circuit; the USB interface circuit is provided with a control driving circuit and an interface circuit, the control driving circuit controls the interface circuit to transmit frame frequency data to the outside in an online or offline mode, the control driving circuit of the USB interface circuit is low in power consumption, an SRAM is attached to the control driving circuit, the maximum data bit width is supported to be 32 bits, the frequency is 100MHz, the maximum transmission speed is large 625MB/S, and the frame frequency data can be quickly transmitted to a computer or other equipment in an online or offline mode through the USB interface circuit. The control driver circuit of the USB3.0 interface circuit can adopt FX3CYUSB3014 of CYPRESS, and an SRAM of 512KB is attached inside.
The HDMI interface circuit is a high-definition multimedia interface circuit, can simultaneously transmit audio and video data, has the highest data transmission speed of 4.5GB/S, and can meet various application occasions. The memory of the SD card interface circuit is 32G-64G, frame frequency data can be stored continuously and can be read out through a card reader.
And the cache circuit (DDR) is used for storing dynamic data of the FPGA programmable gate circuit, and the dynamic data can comprise dynamic data output to each data transmission interface circuit by the FPGA programmable gate circuit, dynamic data between the FPGA programmable gate circuit and the DSP digital signal processor, or dynamic data input to the FPGA programmable gate circuit by the data transmission interface circuit. The main chip of the DDR buffer circuit can adopt MT47H128M16, which is a DDR2 SDRAM.
The DSP is electrically connected with the FPGA programmable gate circuit and the infrared sensor; the DSP is electrically connected with the infrared sensor through the SPI interface circuit and controls the infrared sensor to output an analog electric signal to an analog-to-digital converter (ADC) according to a time sequence; the main chip of the digital signal processor can be selected from a DaVinci processor TMS320DM 6467.
The DSP reads different frame frequency data from the FPGA programmable gate circuit, performs operation processing on the read different frame frequency data, and sends the processed data to the FPGA programmable gate circuit;
The DSP is respectively connected with one or more of the voice memo circuit, the touch screen circuit and the wireless communication circuit;
the voice memo circuit inputs voice data to the DSP digital signal processor, and the DSP digital signal processor inserts the voice data into corresponding processed data in the DSP digital signal processor so as to record memo information of the data; the voice memo circuit can be internally provided with a 16M memory, the DSP is electrically connected with the voice memo circuit through the SPI interface circuit for communication, for example, a user records a section of voice to memo a certain infrared picture or video at a certain moment, the DSP outputs frame frequency data inserted with the voice data to the FPGA programmable gate circuit, and the frame frequency data is transmitted to the outside through the data transmission interface circuit, for example, an outside computer, so that the user can know related information of the infrared picture or video, such as time, place or problems of objects on the picture, and the like. The core chip of the voice memo circuit may adopt a WT588C16 series chip.
The DSP digital signal processing circuit is connected with the touch screen and the circuit thereof, and human-computer interaction is realized through the touch screen. A user sends a processing action to the DSP through the touch screen, and the DSP sends related data to the touch screen circuit according to the processing action; the touch screen can be an LCD touch screen, a circuit of the LCD touch screen can also be provided with a key circuit, a Digital Signal Processor (DSP) sends processed data to the LCD touch screen circuit in real time, an infrared image or video is displayed on the touch screen connected with the LCD touch screen circuit in real time, the infrared image or video can be edited in real time through the touch screen, for example, remark information is added, and at the moment, the DSP digital signal processing circuit inserts the added remark information into corresponding data; the highest temperature point and the lowest temperature point of an object to be observed can be displayed in real time through the touch screen, the temperature details of the detected object are analyzed through point analysis, line analysis, area analysis and the like selected through the touch screen, various gestures are performed on the touch screen in real time or functional keys displayed on the touch screen are clicked, for example, the key interface is provided with upper, lower, left, right, confirmation, exit and other functional keys, the actions are sent to the digital signal processor through the LCD touch screen circuit, the digital signal processor processes data in the LCD touch screen circuit according to the actions, and therefore the detected object is observed and analyzed through the touch screen; the LCD touch screen can adopt a 3.5 inch color touch screen. The LCD touch screen circuit is further connected with a key circuit, and the key circuit is connected with a key, and sends a processing action to the DSP digital signal processing circuit through key input.
The DSP can also switch the GPRS or 3G communication module according to the external network environment to complete the communication between the thermal infrared imager and the outside; specifically, the wireless communication circuit is provided with a signal detection module, a GPRS communication module and a 3G communication module; the signal detection module detects whether the type of a network covered by the area where the thermal infrared imager is located is GPRS or 3G, and the DSP selects to send information to the outside through GPRS or 3G according to the detected type of the network. When the thermal infrared imager is used for outdoor detection, if data such as infrared temperature images detected by the thermal infrared imager are required to be sent to the management server in time, the DSP automatically selects a communication module according to a network environment, for example, if the position is not covered by a 3G network, the DSP controls the wireless communication circuit to send information to switch the communication mode to the GPRS module for communication, and the wireless communication circuit transmits the data to the management server through the GPRS communication module; if the position is not covered by GRPS but covered by the 3G network, the DSP digital signal processor controls the wireless communication circuit to switch the communication mode to the 3G network by sending information, and the wireless communication circuit transmits data to the management server through the 3G communication module, so that the function of timely wireless transmission of indoor and outdoor infrared images is completed, and various application occasions are met.
It should be noted that the analog-to-digital converter (ADC) is composed of an analog-to-digital conversion circuit chip and its peripheral circuit, the FPGA programmable gate circuit is composed of a programmable logic circuit chip and its peripheral circuit, and the DSP digital signal processor is composed of a digital signal processing circuit chip and its peripheral circuit.
Although the present invention has been described with reference to the preferred embodiments, which are given by way of illustration only, and not by way of limitation, it will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (10)
1. A multifunctional thermal infrared imager is provided with a power circuit and an infrared sensor electrically connected with the power circuit, wherein the infrared sensor is used for converting a detected optical signal of an object to be detected into an analog electric signal; it is characterized by also comprising: the system comprises an analog-to-digital converter, an FPGA programmable gate circuit, a data transmission interface circuit and a DSP digital signal processor; the power circuit is respectively and electrically connected with the infrared sensor, the analog-to-digital converter, the FPGA programmable gate circuit, the data transmission interface circuit and the DSP; wherein,
the infrared sensor is connected with the analog-to-digital converter and outputs the analog electric signal to the analog-to-digital converter;
the analog-to-digital converter is connected with the FPGA programmable gate circuit and converts the analog electric signal into a digital signal and outputs the digital signal to the FPGA programmable gate circuit;
the FPGA programmable gate circuit is connected with the digital signal processor; the FPGA programmable gate circuit performs logic processing on the digital signals and generates different frame frequency data;
the data transmission interface circuit is connected with the FPGA programmable gate circuit and reads the frame frequency data from the FPGA programmable gate circuit or transmits external data to the FPGA programmable gate circuit;
The DSP is respectively connected with the FPGA programmable gate circuit and the infrared sensor; the DSP digital signal processor controls the infrared sensor to output analog electric signals to the analog-to-digital converter according to a time sequence; and the DSP reads different frame frequency data from the FPGA programmable gate circuit, performs operation processing on the read different frame frequency data, and sends the processed data to the FPGA programmable gate circuit.
2. The multifunctional thermal infrared imager of claim 1, wherein the DSP is further connected with a touch screen and a circuit thereof, and human-computer interaction is realized through the touch screen.
3. The multifunctional thermal infrared imager of claim 1, wherein the DSP digital signal processor is further connected to a wireless communication circuit; and the DSP digital signal processor sends information to the outside through the wireless communication circuit.
4. The multifunctional thermal infrared imager of claim 3, wherein the wireless communication circuit has a signal detection module, a GPRS communication module and a 3G communication module; the signal detection module detects whether the type of a network covered by the area where the thermal infrared imager is located is GPRS or 3G, and the DSP selects to send information to the outside through GPRS or 3G according to the detected type of the network.
5. The multifunctional thermal infrared imager of claim 1, wherein the DSP digital signal processor is further connected to a voice memo circuit, and voice data is input to the DSP digital signal processor through the voice memo circuit, and the DSP digital signal processor inserts the voice data into frame frequency data in the DSP digital signal processor.
6. The multifunctional thermal infrared imager of claim 5, wherein the DSP digital signal processor is electrically connected to the voice memo circuit through an SPI interface circuit.
7. The multifunctional thermal infrared imager of claim 1, wherein the DSP digital signal processor is electrically connected to the infrared sensor through an SPI interface circuit.
8. The multifunctional thermal infrared imager of claim 1, wherein the FPGA programmable gate circuit has a clock for controlling the infrared sensor to transmit synchronously with the analog-to-digital converter.
9. The multifunctional thermal infrared imager of claim 1, wherein the data transmission interface circuit comprises one or more of a USB interface circuit, an HDMI interface circuit, and an SD card interface circuit.
10. The multifunctional thermal infrared imager of claim 1, wherein the FPGA programmable gate circuit is further connected with a cache circuit for storing dynamic frame rate data of the FPGA programmable gate circuit.
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106603936A (en) * | 2016-12-29 | 2017-04-26 | 中国科学院西安光学精密机械研究所 | Low frame frequency imaging system and image output method thereof |
| CN107196231A (en) * | 2017-06-23 | 2017-09-22 | 上海集成电路研发中心有限公司 | A kind of inspection system based on radio communication |
| CN107347133A (en) * | 2017-08-25 | 2017-11-14 | 合肥芯福传感器技术有限公司 | A kind of dual sensor camera |
| CN109271077A (en) * | 2018-09-14 | 2019-01-25 | 北京遥感设备研究所 | A kind of thermal infrared imager man-machine interaction method based on FPGA |
| CN109347479A (en) * | 2018-11-07 | 2019-02-15 | 成都福森元光电科技有限公司 | A kind of infrared focal plane detector analog-to-digital conversion process method |
| CN109470362A (en) * | 2018-11-21 | 2019-03-15 | 中国科学院上海技术物理研究所 | A kind of infrared interference signal acquiring system and data processing method |
| CN109489822A (en) * | 2018-11-05 | 2019-03-19 | 郑州海威光电科技有限公司 | A kind of Multifunction infrared thermal imaging system |
| CN109752095A (en) * | 2017-11-03 | 2019-05-14 | 国家电网公司 | A kind of the infrared imaging temperature measuring sensor and infrared imaging temperature measuring system of plug and play |
| CN110602422A (en) * | 2018-05-23 | 2019-12-20 | 杭州海康威视数字技术股份有限公司 | Handheld thermal imager and rapid production method thereof |
| CN111397737A (en) * | 2020-03-23 | 2020-07-10 | 重庆邮电大学 | DSP + FPGA's infrared imaging signal real-time processing system |
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- 2016-06-14 CN CN201620570195.8U patent/CN205748663U/en active Active
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106603936A (en) * | 2016-12-29 | 2017-04-26 | 中国科学院西安光学精密机械研究所 | Low frame frequency imaging system and image output method thereof |
| CN107196231A (en) * | 2017-06-23 | 2017-09-22 | 上海集成电路研发中心有限公司 | A kind of inspection system based on radio communication |
| CN107347133A (en) * | 2017-08-25 | 2017-11-14 | 合肥芯福传感器技术有限公司 | A kind of dual sensor camera |
| CN109752095A (en) * | 2017-11-03 | 2019-05-14 | 国家电网公司 | A kind of the infrared imaging temperature measuring sensor and infrared imaging temperature measuring system of plug and play |
| CN110602422A (en) * | 2018-05-23 | 2019-12-20 | 杭州海康威视数字技术股份有限公司 | Handheld thermal imager and rapid production method thereof |
| CN110602422B (en) * | 2018-05-23 | 2022-02-15 | 杭州海康微影传感科技有限公司 | Handheld thermal imager and rapid production method thereof |
| CN109271077A (en) * | 2018-09-14 | 2019-01-25 | 北京遥感设备研究所 | A kind of thermal infrared imager man-machine interaction method based on FPGA |
| CN109271077B (en) * | 2018-09-14 | 2021-08-13 | 北京遥感设备研究所 | Thermal infrared imager man-machine interaction method based on FPGA |
| CN109489822A (en) * | 2018-11-05 | 2019-03-19 | 郑州海威光电科技有限公司 | A kind of Multifunction infrared thermal imaging system |
| CN109347479A (en) * | 2018-11-07 | 2019-02-15 | 成都福森元光电科技有限公司 | A kind of infrared focal plane detector analog-to-digital conversion process method |
| CN109470362A (en) * | 2018-11-21 | 2019-03-15 | 中国科学院上海技术物理研究所 | A kind of infrared interference signal acquiring system and data processing method |
| CN111397737A (en) * | 2020-03-23 | 2020-07-10 | 重庆邮电大学 | DSP + FPGA's infrared imaging signal real-time processing system |
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