CN107347133A - A kind of dual sensor camera - Google Patents
A kind of dual sensor camera Download PDFInfo
- Publication number
- CN107347133A CN107347133A CN201710738790.7A CN201710738790A CN107347133A CN 107347133 A CN107347133 A CN 107347133A CN 201710738790 A CN201710738790 A CN 201710738790A CN 107347133 A CN107347133 A CN 107347133A
- Authority
- CN
- China
- Prior art keywords
- sensor
- thermal imaging
- microlens array
- sensitive image
- spectroscope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000009977 dual effect Effects 0.000 title claims abstract description 21
- 238000001931 thermography Methods 0.000 claims abstract description 66
- 238000003384 imaging method Methods 0.000 claims abstract description 28
- 238000000034 method Methods 0.000 claims description 9
- 238000004891 communication Methods 0.000 claims description 6
- 229910052732 germanium Inorganic materials 0.000 claims description 4
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 claims description 2
- 230000010354 integration Effects 0.000 claims description 2
- 230000005611 electricity Effects 0.000 claims 1
- 230000003287 optical effect Effects 0.000 abstract description 4
- 230000008569 process Effects 0.000 description 5
- 238000012805 post-processing Methods 0.000 description 3
- 238000001914 filtration Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000011835 investigation Methods 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000686 essence Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 244000045947 parasite Species 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000035807 sensation Effects 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/45—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/95—Computational photography systems, e.g. light-field imaging systems
- H04N23/951—Computational photography systems, e.g. light-field imaging systems by using two or more images to influence resolution, frame rate or aspect ratio
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Computing Systems (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Studio Devices (AREA)
Abstract
The present invention discloses a kind of dual sensor camera, including the main lens being imaged for obtaining picture signal and picture signal to acquisition, for the incident ray through main lens being split into the spectroscope of the reflected beams and transmitted light beam, for obtaining the sensitive image sensor of visible images, for obtaining the thermal imaging sensor of graphic images, the microprocessor of visible images or graphic images is handled based on user selection mode, display module based on user selection mode display output image, the reflected beams are directed to sensitive image sensor or thermal imaging sensor, transmitted light beam is directed to thermal imaging sensor or sensitive image sensor, sensitive image sensor, thermal imaging sensor and display module are connected with microprocessor.The present invention realizes optical field imaging while the imaging of traditional camera is realized, can obtain visible images and graphic images simultaneously, and the depth data of target scene is superimposed on image.
Description
Technical field
The invention belongs to camera apparatus technical field, and in particular to a kind of dual sensor camera.
Background technology
Because infrared ray has stronger penetration power, transmission imaging is carried out available for wide-long shot or to biological tissue,
Also it can be used for forest, Marine Pollution Survey or carry out judicial expertise etc..In modern society, infrared camera is in military, business, industry
All played an important role with civilian aspect.For example thermal sensation weapon sight, maritime affairs thermal imaging can be used as in military aspect
System；It can be used for searching and rescuing victim in fire-fighting task or help to detect the condition of a fire；It can be used in traffic control system
Traffic system, track, pavement and vcehicular tunnel are monitored, investigates accident or anomaly in time；It can industrially help
Heavy construction circuit is detected with the presence or absence of abnormal conditions such as short circuits.In daily life, infrared camera can help to judge in family
Whether door and window, which has, is leaked out, and whether heat-insulated bad situation, metope is invaded by moisture or parasite, can also be used as night
Safety-protection system in family uses.
Visible Light Camera is utilized in various imaging applications, to catch colored or monochrome image.For example, typically with can
Light camera is seen, for applying in the daytime under ambient light.
Main camera product is Visible Light Camera or infrared camera in the market, and Visible Light Camera or infrared phase
Machine uses focal plane arrays (FPA) such as CCD or CMOS as core sensor mostly, can not also obtain the depth data of scene.
The content of the invention
The invention aims to overcome the deficiencies in the prior art, there is provided a kind of sensitive image sensor and thermal imaging pass
The dual sensor camera that sensor is combined, can either obtain visible images can export graphic images again.As the present invention
Improvement, the technical problem that further solves of the present invention is while visible images and graphic images are obtained, and obtains field
The depth data of scape.
To achieve these goals, the technical solution adopted by the present invention is：
A kind of dual sensor camera, including：
Main lens, for obtaining picture signal and picture signal to acquisition is imaged；
Spectroscope, for the incident ray through main lens to be split into the reflected beams and transmitted light beam, the reflected beams are directed
It is imaged to sensitive image sensor or thermal imaging sensor, transmitted light beam is directed to thermal imaging sensor or bearing member, image sensing
Device is imaged；
Sensitive image sensor, for obtaining visible images；
Thermal imaging sensor, for obtaining graphic images；
Microprocessor, visible images and graphic images are handled based on user selection mode；
Display module, based on user selection mode display output image；
Sensitive image sensor, thermal imaging sensor and display module are connected with microprocessor.
Further, dual sensor camera also includes microlens array, and the microlens array is arranged on spectroscope and sense
Between optical image sensor or between spectroscope and thermal imaging sensor.
Further, thermal imaging sensor includes pel array, the reading circuit for reading picture signal, for by mould
Intend signal and be converted to the adc circuit of data signal and the digital signal processor DSP for being analyzed and processed to data signal,
Pel array, reading circuit, adc circuit and the digital signal processor DSP one on silicon wafer substrate using integrated technique
Change is made, and is got up between each other by three-dimensional IC circuits interconnection architecture configuration.
Preferably, sensitive image sensor is ccd sensor or cmos sensor.
Preferably, microlens array is arranged between spectroscope and sensitive image sensor, sensitive image sensor with it is micro-
The distance of lens array be equal to microlens array focal length, the reflected beams or the transmitted light beam re-imaging on microlens array,
The pixel for carrying different-waveband information is formed, the image that re-imaging is formed is incident upon on sensitive image sensor, thermal imaging
Sensor is symmetrical on spectroscope with microlens array.
Preferably, microlens array is arranged between spectroscope and thermal imaging sensor, thermal imaging sensor and lenticule
The distance of array is equal to the focal length of microlens array, the reflected beams or the transmitted light beam re-imaging on microlens array, is formed
The pixel of different-waveband information is carried, the image that re-imaging is formed is incident upon on thermal imaging sensor, bearing member, image sensing
Device is symmetrical on spectroscope with microlens array.
Preferably, thermal imaging sensor has germanium window, for passing through infrared ray and filtering out visible ray.
Further, dual sensor camera also includes the memory of the power supply and storage photographed data for powering, storage
Device is connected with microprocessor.
Further, dual sensor camera also includes communication module, and communication module is connected with microprocessor, for the external world
Transmit image and data.
Preferably, memory is dismountable storage card.
Compared with prior art, beneficial effects of the present invention：
（1）The structure that the present invention is combined using sensitive image sensor and thermal imaging sensor, obtaining visible images
Meanwhile also obtain graphic images；
（2）The present invention realizes optical field imaging while realizing traditional camera imaging, can be in visible images or graphic images
The depth data of upper superposition target scene, i.e., only need to pass through a capture, you can scene depth data and thermal imaging data are obtained,
, can be according to demand to the picture of shooting zoom at any time in post-processing.
Brief description of the drawings
Fig. 1 is the principle schematic of the embodiment of the present invention 1；
Fig. 2 is the principle schematic of the embodiment of the present invention 2；
Fig. 3 is the principle schematic of the embodiment of the present invention 3；
Fig. 4 is the principle schematic of the embodiment of the present invention 2；
Fig. 5 is the principle schematic of thermal imaging sensor of the present invention；
Fig. 6 is traditional visible images of output display in the embodiment of the present invention 1 and embodiment 3；
Fig. 7 is the thermal imaging output image of output display in the embodiment of the present invention 1 and embodiment 3；
Fig. 8 is the scene depth output image of output display in the embodiment of the present invention 1 and embodiment 3；
Fig. 9 is traditional graphic images of output display in the embodiment of the present invention 2 and embodiment 4；
Figure 10 is the visible images for being loaded with depth information of output display in the embodiment of the present invention 2 and embodiment 4；
Figure 11 is the scene depth output image of output display in the embodiment of the present invention 2 and embodiment 4.
Embodiment
With reference to Fig. 1 to Figure 11, embodiments of the present invention and specific operating process are elaborated, but this hair
Bright protection domain is not limited to following embodiments.
Embodiment 1
A kind of dual sensor camera, as shown in figure 1, including for obtaining picture signal and picture signal to acquisition is imaged
Main lens 1, for the incident ray through main lens to be split into the spectroscope 2 of the reflected beams and transmitted light beam, for obtaining
The sensitive image sensor 3 of visible images is taken, for obtaining the thermal imaging sensor 4 of graphic images, is selected based on user
The microprocessor of mode treatment visible images and graphic images, the display group based on user selection mode display output image
Part, the reflected beams are directed to sensitive image sensor 3 and are imaged, and transmitted light beam is directed to thermal imaging sensor 4 and is imaged.Double biographies
Sensor also includes microlens array 5, and microlens array 5 is arranged between spectroscope 2 and thermal imaging sensor 4, thermal imaging sensing
The distance of device 4 and microlens array 5 is equal to the focal length of microlens array 5, transmitted light beam re-imaging on microlens array 5,
The pixel for carrying different-waveband information is formed, the image that re-imaging is formed is incident upon on thermal imaging sensor 4, bearing member, image
Sensor 3 is symmetrical on spectroscope 2 with microlens array 5, to ensure that transmitted light beam and the reflected beams have identical image planes position
Put.Sensitive image sensor 3, thermal imaging sensor 4 and display module are connected with microprocessor.
Thermal imaging sensor 4 includes pel array, the reading circuit for reading picture signal, for inciting somebody to action in the present invention
Analog signal is converted to the adc circuit of data signal and the digital signal processor for being analyzed and processed to data signal
DSP, pel array, reading circuit, adc circuit and digital signal processor DSP are using integrated technique on silicon wafer substrate
Integration is made, and is got up between each other by three-dimensional IC circuits interconnection architecture configuration.The principle signal of thermal imaging sensor
Figure is as shown in Figure 5.Thermal imaging sensor 4 also has germanium window, for passing through infrared ray and filtering out visible ray.Using integrated technique one
Bodyization makes thermal imaging sensor, can be substantially reduced sensor bulk and power consumption, compared to traditional product, signal stabilization is more
By force, resolution ratio and accuracy of detection are significantly improved.
Carry different-waveband information target scene incident ray be incident upon on main lens 1, obtain picture signal and
It is imaged on main lens 1, the light through main lens 1 is split into the reflected beams and transmitted light in the presence of spectroscope 2
Beam, the reflected beams are directed on sensitive image sensor 3, realize the imaging of traditional camera；Transmitted light beam is in microlens array 5
Upper re-imaging, forms the pixel for carrying different-waveband information, and the image that re-imaging is formed is incident upon thermal imaging sensor 4
On, because thermal imaging has germanium window, visible ray can be filtered out and pass through infrared light, therefore be incident upon on thermal imaging sensor 3
Image only there is thermal imaging related data, without possessing visible ray related data.
Transmitted light beam re-imaging on microlens array 5, therefore, the thermal imaging sensor picture being placed at lenticule focal length
Although element only have recorded the strength information of light, the direction of light is have recorded because of its position relative to some lenticule
Information, that is, four-dimensional image is have recorded during being imaged, so in post-processing, it is only necessary to which light is followed the trail of again to be completed
The focusing again of graphic images.
In the present embodiment, microlens array 5 is arranged between spectroscope 2 and thermal imaging sensor 4, and thermal imaging senses
The distance of device 4 and microlens array 5 is equal to the focal length of microlens array 5, and thermal imaging sensor 4 is obtaining the same of thermal imaging data
When also obtain the depth data of scene image, thermal imaging data and picture depth data are transferred to micro- place by thermal imaging sensor 4
Manage device, microprocessor processes thermal imaging data and picture depth data and be overlapped thermal imaging data and picture depth data
The thermal imaging output image or scene depth output image of combination are generated, user selects thermal imaging output image or field according to demand
Depth of field degree output image is shown on display module, and display module can be liquid crystal display or other types of in the present invention
Known display device.
When the output display pattern of user's selection is traditional visible images, microprocessor sends instruction, it will be seen that light
Image is shown on display module, and image is as shown in Figure 6；When the output display pattern of user's selection is thermal imaging output image
When, the thermal imaging data and picture depth data of target scene are overlapped generation thermal imaging output image by microprocessor, this
Image is loaded with the depth information of the target scene, when it should be understood that during the depth information of certain in target scene, herein
Depth information shows that image is as shown in Figure 7 with the data mode of relative distance；When the output display pattern of user's selection is scene
During depth output image, the thermal imaging data and picture depth data of target scene are overlapped generation scene depth by microprocessor
Spend output image, this image is loaded with the thermal imaging data of the target scene, when it should be understood that in target scene certain heat
During imaging data, thermal imaging data show that image is as shown in Figure 8 in the form of temperature data.
In addition, according to the general configuration of usual camera, dual sensor camera also includes the power supply for power supply, storage shooting
The memory of data, the communication module for transmitting image and data with the external world.Memory can select dismountable memory card,
But it is not limited only to this type of memory.Communication module can be in bluetooth module, WIFI module or usb interface module
One or more combination, but it is also not limited to this three kinds of modules or combinations thereof.
In the present invention, sensitive image sensor 3 is ccd sensor or cmos sensor.
Embodiment 2
As shown in Fig. 2 the present embodiment and the difference of embodiment 1 are, microlens array is arranged on spectroscope 2 and passed with bearing member, image
Between sensor 3, the distance of sensitive image sensor 3 and microlens array 5 is equal to the focal length of microlens array 5.Transmitted light beam quilt
On guiding to thermal imaging sensor 4, the imaging of traditional infrared camera is realized.The reflected beams re-imaging on microlens array 5,
The pixel for carrying different-waveband information is formed, the image that re-imaging is formed is incident upon on sensitive image sensor 3.
The reflected beams re-imaging on microlens array 5, therefore, the sensitive image sensor being placed at lenticule focal length
Although pixel only have recorded the strength information of light, the side of light is have recorded because of its position relative to some lenticule
To information, that is, four-dimensional image is have recorded during being imaged, so in post-processing, it is only necessary to which light is followed the trail of again can be complete
Into the focusing again of visible images.
In the present embodiment, microlens array 5 is arranged between spectroscope 2 and sensitive image sensor 4, and bearing member, image
The distance of sensor 4 and microlens array 5 is equal to the focal length of microlens array 5, therefore sensitive image sensor 4 obtains scene graph
Picture depth data are transferred to microprocessor, microprocessor processes picture depth by the depth data of picture, sensitive image sensor 4
Data and by data investigation on visible images.
When user selection output display pattern for traditional graphic images when, microprocessor 5 sends instruction, by thermograph
As being shown on display module, image is as shown in Figure 9；When user selection output display pattern for visible images when, micro- place
Device is managed the picture depth data investigation of target scene on visible images, this image is loaded with the depth letter of target scene
Breath, when it should be understood that during the depth information of certain in target scene, depth information herein is with the data mode of relative distance
It has been shown that, image are as shown in Figure 10；When user selection output display pattern for scene depth output image when, microprocessor is sent
Instruction, handles the picture depth data of target scene and generates scene depth output image and be shown on display module, and image is such as
Shown in Figure 11.
Embodiment 3
As shown in figure 3, the present embodiment and the difference of embodiment 1 are, transmitted light beam be directed to sensitive image sensor 3 into
Picture, the reflected beams are directed to microlens array 5, and microlens array 5 is arranged between spectroscope 2 and thermal imaging sensor 4, heat
The distance of imaging sensor 4 and microlens array 5 is equal to the focal length of microlens array 5.The imaging process of the present embodiment is as implemented
Described in example 1, here is omitted.
Embodiment 4
As shown in figure 4, the present embodiment and the difference of embodiment 1 are that transmitted light beam is directed to thermal imaging sensor 4 and is imaged,
The reflected beams are directed to microlens array 5, and microlens array 5 is arranged between spectroscope 2 and sensitive image sensor 3, sense
The distance of optical image sensor 3 and microlens array 5 is equal to the focal length of microlens array 5.The imaging process of the present embodiment is strictly according to the facts
Apply described in example 2, here is omitted.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
All any modification, equivalent and improvement made within refreshing and principle etc. should be included in the scope of the protection.
Claims (10)
- A kind of 1. dual sensor camera, it is characterised in that including：Main lens, for obtaining picture signal and picture signal to acquisition is imaged；Spectroscope, for the incident ray through main lens to be split into the reflected beams and transmitted light beam, the reflected beams are directed It is imaged to sensitive image sensor or thermal imaging sensor, transmitted light beam is directed to thermal imaging sensor or bearing member, image sensing Device is imaged；Sensitive image sensor, for obtaining visible images；Thermal imaging sensor, for obtaining graphic images；Microprocessor, visible images and graphic images are handled based on user selection mode；Display module, based on user selection mode display output image；Sensitive image sensor, thermal imaging sensor and display module are connected with microprocessor.
- 2. dual sensor camera according to claim 1, it is characterised in that also including microlens array, the lenticule Array be arranged between spectroscope and sensitive image sensor or spectroscope and thermal imaging sensor between.
- 3. dual sensor camera according to claim 1 or 2, it is characterised in that the thermal imaging sensor includes pixel Array, the reading circuit for reading picture signal, the adc circuit for converting analog signals into data signal and for pair The digital signal processor DSP that data signal is analyzed and processed, at pel array, reading circuit, adc circuit and data signal Reason device DSP is made using integrated technique integration on silicon wafer substrate, is interconnected between each other by three-dimensional IC circuits Structural configuration is got up.
- 4. dual sensor camera according to claim 1 or 2, it is characterised in that sensitive image sensor is ccd sensor Or cmos sensor.
- 5. dual sensor camera according to claim 2, it is characterised in that the microlens array be arranged on spectroscope with Between sensitive image sensor, the distance of sensitive image sensor and microlens array is equal to the focal length of microlens array, reflection Light beam or the transmitted light beam re-imaging on microlens array, form the pixel for carrying different-waveband information, re-imaging shape Into image be incident upon on sensitive image sensor, thermal imaging sensor is symmetrical on spectroscope with microlens array.
- 6. dual sensor camera according to claim 2, it is characterised in that the microlens array be arranged on spectroscope with Between thermal imaging sensor, the distance of thermal imaging sensor and microlens array is equal to the focal length of microlens array, the reflected beams Or transmitted light beam re-imaging on microlens array, the pixel for carrying different-waveband information is formed, what re-imaging was formed Image is incident upon on thermal imaging sensor, and sensitive image sensor is symmetrical on spectroscope with microlens array.
- 7. dual sensor camera according to claim 3, it is characterised in that the thermal imaging sensor has germanium window, uses In transmission infrared ray and filter out visible ray.
- 8. the dual sensor camera according to any one of claim 5 to 7, it is characterised in that also include the electricity for powering Source and the memory of storage photographed data, memory are connected with microprocessor.
- 9. dual sensor camera according to claim 8, it is characterised in that also including communication module, communication module with it is micro- Processor connects, for transmitting image and data with the external world.
- 10. dual sensor camera according to claim 8, it is characterised in that the memory is dismountable storage card.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710738790.7A CN107347133A (en) | 2017-08-25 | 2017-08-25 | A kind of dual sensor camera |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710738790.7A CN107347133A (en) | 2017-08-25 | 2017-08-25 | A kind of dual sensor camera |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107347133A true CN107347133A (en) | 2017-11-14 |
Family
ID=60257614
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710738790.7A Pending CN107347133A (en) | 2017-08-25 | 2017-08-25 | A kind of dual sensor camera |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107347133A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108924388A (en) * | 2018-06-21 | 2018-11-30 | 殷创科技（上海）有限公司 | Sense fusing device and the camera including sensing fusing device |
| CN110913098A (en) * | 2019-10-28 | 2020-03-24 | 香港理工大学深圳研究院 | High-definition depth information acquisition system, system preparation method and system ranging method |
| WO2022252367A1 (en) * | 2021-06-03 | 2022-12-08 | 奥比中光科技集团股份有限公司 | Multispectral image sensor and imaging module thereof |
| WO2023123095A1 (en) * | 2021-12-29 | 2023-07-06 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Camera system including multiple lenses and multiple image sensors, method for controlling the same, and electronic deivice |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101510007A (en) * | 2009-03-20 | 2009-08-19 | 北京科技大学 | Real time shooting and self-adapting fusing device for infrared light image and visible light image |
| CN102095502A (en) * | 2010-12-07 | 2011-06-15 | 西安工业大学 | Liquid crystal rotation effect-based non-electrical readout thermal imaging detection method |
| CN102650547A (en) * | 2011-12-13 | 2012-08-29 | 北京理工大学 | Optical reading method for micro lens array of non-refrigeration infrared imaging system |
| CN203101791U (en) * | 2012-12-26 | 2013-07-31 | 山东省科学院海洋仪器仪表研究所 | Infrared-zoom light-field camera |
| CN103323113A (en) * | 2013-05-30 | 2013-09-25 | 中国科学院长春光学精密机械与物理研究所 | Multispectral imager based on light fieldd imaging technique |
| CN103471715A (en) * | 2013-09-02 | 2013-12-25 | 北京航空航天大学 | Common optical path combined optical field spectral imaging method and device |
| JP2014167530A (en) * | 2013-02-28 | 2014-09-11 | Nikon Corp | Image capturing device |
| CN205748663U (en) * | 2016-06-14 | 2016-11-30 | 上海集成电路研发中心有限公司 | A kind of Multifunction infrared thermal imagery instrument |
| CN207099194U (en) * | 2017-08-25 | 2018-03-13 | 合肥芯福传感器技术有限公司 | A kind of dual sensor camera |
-
2017
- 2017-08-25 CN CN201710738790.7A patent/CN107347133A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101510007A (en) * | 2009-03-20 | 2009-08-19 | 北京科技大学 | Real time shooting and self-adapting fusing device for infrared light image and visible light image |
| CN102095502A (en) * | 2010-12-07 | 2011-06-15 | 西安工业大学 | Liquid crystal rotation effect-based non-electrical readout thermal imaging detection method |
| CN102650547A (en) * | 2011-12-13 | 2012-08-29 | 北京理工大学 | Optical reading method for micro lens array of non-refrigeration infrared imaging system |
| CN203101791U (en) * | 2012-12-26 | 2013-07-31 | 山东省科学院海洋仪器仪表研究所 | Infrared-zoom light-field camera |
| JP2014167530A (en) * | 2013-02-28 | 2014-09-11 | Nikon Corp | Image capturing device |
| CN103323113A (en) * | 2013-05-30 | 2013-09-25 | 中国科学院长春光学精密机械与物理研究所 | Multispectral imager based on light fieldd imaging technique |
| CN103471715A (en) * | 2013-09-02 | 2013-12-25 | 北京航空航天大学 | Common optical path combined optical field spectral imaging method and device |
| CN205748663U (en) * | 2016-06-14 | 2016-11-30 | 上海集成电路研发中心有限公司 | A kind of Multifunction infrared thermal imagery instrument |
| CN207099194U (en) * | 2017-08-25 | 2018-03-13 | 合肥芯福传感器技术有限公司 | A kind of dual sensor camera |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108924388A (en) * | 2018-06-21 | 2018-11-30 | 殷创科技（上海）有限公司 | Sense fusing device and the camera including sensing fusing device |
| CN110913098A (en) * | 2019-10-28 | 2020-03-24 | 香港理工大学深圳研究院 | High-definition depth information acquisition system, system preparation method and system ranging method |
| WO2022252367A1 (en) * | 2021-06-03 | 2022-12-08 | 奥比中光科技集团股份有限公司 | Multispectral image sensor and imaging module thereof |
| WO2023123095A1 (en) * | 2021-12-29 | 2023-07-06 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Camera system including multiple lenses and multiple image sensors, method for controlling the same, and electronic deivice |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107347133A (en) | A kind of dual sensor camera | |
| US7193214B1 (en) | Sensor having differential polarization and a network comprised of several such sensors | |
| US9906718B2 (en) | Biomimetic integrated optical sensor (BIOS) system | |
| US4515443A (en) | Passive optical system for background suppression in starring imagers | |
| JP2011080976A (en) | Single-axis lens module for thermal imaging camera | |
| US20190295264A1 (en) | Trajectory detection devices and methods | |
| CN208240087U (en) | A kind of infrared and visible light emerging system and image fusion device | |
| Coffey | Multispectral imaging moves into the mainstream | |
| KR102668750B1 (en) | Spatial information recognition device | |
| CN105763783A (en) | Infrared dual-light shooting system for unmanned aerial vehicle | |
| CN104967769B (en) | A kind of vehicle bottom scanning system and method | |
| US10298858B2 (en) | Methods to combine radiation-based temperature sensor and inertial sensor and/or camera output in a handheld/mobile device | |
| CN106254796A (en) | A kind of iraser laser spot detection imaging device based on iconoscope and method | |
| CN207099194U (en) | A kind of dual sensor camera | |
| WO2016125602A1 (en) | Solid-state imaging element and electronic device | |
| CN116137902A (en) | Computer vision camera for infrared light detection | |
| US7491935B2 (en) | Thermally-directed optical processing | |
| CN107347132A (en) | A kind of light field thermal imaging camera | |
| WO2018136732A1 (en) | Multiple band multiple polarizer optical device | |
| CN106597422B (en) | Miniaturization photo-electricity passive ranging device | |
| US9413989B2 (en) | Dual band imager | |
| WO2003107649A2 (en) | Ingaas image intensification camera | |
| CN106019536A (en) | Device for extending depth of field of array image sensors | |
| CN207099195U (en) | A kind of light field thermal imaging camera | |
| CN106534812B (en) | One kind monitoring sight device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20171114 |
|
| WD01 | Invention patent application deemed withdrawn after publication |