CN205723502U - A kind of IC chip of odt circuit common pin - Google Patents
A kind of IC chip of odt circuit common pin Download PDFInfo
- Publication number
- CN205723502U CN205723502U CN201620357155.5U CN201620357155U CN205723502U CN 205723502 U CN205723502 U CN 205723502U CN 201620357155 U CN201620357155 U CN 201620357155U CN 205723502 U CN205723502 U CN 205723502U
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Abstract
The utility model discloses the IC chip of a kind of odt circuit common pin, including lower house, fluid sealant, upper shell, plastic substrate, lower house is provided above upper shell, therebetween fluid sealant is scribbled, plastic substrate it is provided with inside lower house, plastic substrate center of inside is provided with semi-conductor silicon chip, semi-conductor silicon chip both side surface is provided with chip mount point, chip mount point is connected externally to signal lead, signal lead packet is connected to signal and concentrates conductive block, signal is concentrated and is provided with pin outside conductive block, chip package resin it is provided with outside semi-conductor silicon chip, it is filled with sealing compound between chip package resin and semi-conductor silicon chip, chip package resin outer is provided with heat sink, have the beneficial effects that: two kinds of control signals can be simultaneously emitted by one chip, save the space of device interior.
Description
Technical field
This utility model belongs to chip and optimizes design field, is specifically related to the IC chip of a kind of odt circuit common pin.
Background technology
Integrated circuit is a kind of microelectronic device or parts, use certain technique, together with the elements such as transistor, diode, resistance, electric capacity and inductance required in a circuit and wiring interconnection, it is produced on a fritter or a few fritter semiconductor wafer or dielectric substrate, it is then encapsulated in a shell, becomes the microstructure with required circuit function.The most all elements form a whole the most, make electronic component stride forward major step towards microminaturization, low-power consumption and high reliability aspect, and the application of current semi-conductor industry great majority is integrated circuit based on silicon.In some equipment needing periodically control or circuit, needing two kinds of control signals alternately to work, this is accomplished by two control chips, but under the pressure of the restriction of volume, it is impossible to blackout simultaneously two chip block.
Utility model content
The purpose of this utility model is that the IC chip providing a kind of odt circuit common pin in order to solve the problems referred to above.
This utility model is achieved through the following technical solutions above-mentioned purpose:
A kind of IC chip of odt circuit common pin, including lower house, fluid sealant, upper shell, plastic substrate, lower house is provided above upper shell, therebetween fluid sealant is scribbled, plastic substrate it is provided with inside lower house, plastic substrate center of inside is provided with semi-conductor silicon chip, semi-conductor silicon chip both side surface is provided with chip mount point, chip mount point is connected externally to signal lead, signal lead packet is connected to signal and concentrates conductive block, signal is concentrated and is provided with pin outside conductive block, chip package resin it is provided with outside semi-conductor silicon chip, it is filled with sealing compound between chip package resin and semi-conductor silicon chip, chip package resin outer is provided with heat sink.
In said structure, semi-conductor silicon chip is fixed in lower house by plastic substrate, after upper shell being sealed with fluid sealant in chip is linked into circuit, when wherein the control signal of side works, control signal is sent by chip internal control circuit through the chip mount point of this side, and the signal lead through this side conducts to signal concentration conductive block, then conducts to external circuit through pin, the control signal of opposite side is identical with this principle when working, and heat distributes through chip package resin and heat sink.
In order to realize integral bidirectional control, the justified margin of upper shell and lower house is installed and is cemented by fluid sealant, and plastic substrate is close to clamping inside lower house and is installed.
In order to realize integral bidirectional control, semi-conductor silicon chip is arranged in the internal draw-in groove of plastic substrate, the mode of chip mount point employing welding is uniform is arranged on semi-conductor silicon chip both side surface, the top of signal lead is welded on outside the chip mount point at edge, signal lead corresponding to both sides finally collects and is welded on a block signal and concentrates in conductive block, and pin and signal concentrate the outer integrated design of conductive block.
In order to realize integral bidirectional control, chip package resin is pasted by sealing compound with semi-conductor silicon chip, and heat sink is pasted onto chip package resin outer by heat-conducting glue.
Have the beneficial effects that: two kinds of control signals can be simultaneously emitted by one chip, saved the space of device interior.
Accompanying drawing explanation
Fig. 1 is the external perspective view of the IC chip of a kind of odt circuit common pin described in the utility model；
Fig. 2 is the inside three-dimensional view of the IC chip of a kind of odt circuit common pin described in the utility model；
Fig. 3 is semi-conductor silicon chip and the front perspective view of attached circuit thereof of the IC chip of a kind of odt circuit common pin described in the utility model；
Fig. 4 is semi-conductor silicon chip and the back side three-dimensional view of attached circuit thereof of the IC chip of a kind of odt circuit common pin described in the utility model；
Fig. 5 is the three-dimensional view of the semi-conductor silicon chip of the IC chip of a kind of odt circuit common pin described in the utility model.
1, lower house；2, fluid sealant；3, upper shell；4, plastic substrate；5, semi-conductor silicon chip；6, chip package resin；7, sealing compound；8, heat sink；9, chip mount point；10, signal lead；11, signal concentrates conductive block；12, pin.
Detailed description of the invention
The utility model is described in further detail below in conjunction with the accompanying drawings:
As Figure 1-Figure 5, a kind of IC chip of odt circuit common pin 12, including lower house 1, fluid sealant 2, upper shell 3, plastic substrate 4, lower house 1 is provided above upper shell 3, therebetween fluid sealant 2 is scribbled, plastic substrate 4 it is provided with inside lower house 1, plastic substrate 4 center of inside is provided with semi-conductor silicon chip 5, semi-conductor silicon chip 5 both side surface is provided with chip mount point 9, chip mount point 9 is connected externally to signal lead 10, signal lead 10 packet is connected to signal and concentrates conductive block 11, signal is concentrated and is provided with pin 12 outside conductive block 11, chip package resin 6 it is provided with outside semi-conductor silicon chip 5, sealing compound 7 it is filled with between chip package resin 6 and semi-conductor silicon chip 5, heat sink 8 it is provided with outside chip package resin 6.
In said structure, semi-conductor silicon chip 5 is fixed in lower house 1 by plastic substrate 4, after upper shell 3 being sealed with fluid sealant 2 in chip is linked into circuit, when wherein the control signal of side works, control signal is sent by chip internal control circuit through the chip mount point 9 of this side, signal lead 10 through this side conducts to signal concentration conductive block 11, conduct to external circuit through pin 12 again, the control signal of opposite side is identical with this principle when working, and heat distributes through chip package resin 6 and heat sink 8.
In order to realize integral bidirectional control, the justified margin of upper shell 3 and lower house 1 is installed and is passed through fluid sealant 2 and cements, plastic substrate 4 is close to clamping inside lower house 1 and is installed, semi-conductor silicon chip 5 is arranged in the internal draw-in groove of plastic substrate 4, the mode of chip mount point 9 employing welding is uniform is arranged on semi-conductor silicon chip 5 both side surface, the chip mount point 9 that the top of signal lead 10 is welded on edge is outside, signal lead 10 corresponding to both sides finally collects and is welded on a block signal and concentrates in conductive block 11, pin 12 concentrates the outer integrated design of conductive block 11 with signal, chip package resin 6 is pasted by sealing compound 7 with semi-conductor silicon chip 5, heat sink 8 is pasted onto outside chip package resin 6 by heat-conducting glue.
Of the present utility model ultimate principle, principal character and advantage have more than been shown and described.Skilled person will appreciate that of the industry; this utility model is not restricted to the described embodiments; described in above-described embodiment and description, principle of the present utility model is simply described; on the premise of without departing from this utility model spirit and scope; this utility model also has various changes and modifications, in the range of these changes and improvements both fall within claimed this utility model.This utility model claims scope and is defined by appending claims and effect thing thereof.
Claims (4)
1. the IC chip of an odt circuit common pin, it is characterized in that: include lower house, fluid sealant, upper shell, plastic substrate, lower house is provided above upper shell, therebetween fluid sealant is scribbled, plastic substrate it is provided with inside lower house, plastic substrate center of inside is provided with semi-conductor silicon chip, semi-conductor silicon chip both side surface is provided with chip mount point, chip mount point is connected externally to signal lead, signal lead packet is connected to signal and concentrates conductive block, signal is concentrated and is provided with pin outside conductive block, chip package resin it is provided with outside semi-conductor silicon chip, it is filled with sealing compound between chip package resin and semi-conductor silicon chip, chip package resin outer is provided with heat sink.
The IC chip of a kind of odt circuit common pin the most according to claim 1, it is characterised in that: the justified margin of upper shell and lower house is installed and is cemented by fluid sealant, and plastic substrate is close to clamping inside lower house and is installed.
The IC chip of a kind of odt circuit common pin the most according to claim 1, it is characterized in that: semi-conductor silicon chip is arranged in the internal draw-in groove of plastic substrate, the mode of chip mount point employing welding is uniform is arranged on semi-conductor silicon chip both side surface, the top of signal lead is welded on outside the chip mount point at edge, signal lead corresponding to both sides finally collects and is welded on a block signal and concentrates in conductive block, and pin and signal concentrate the outer integrated design of conductive block.
The IC chip of a kind of odt circuit common pin the most according to claim 1, it is characterised in that: chip package resin is pasted by sealing compound with semi-conductor silicon chip, and heat sink is pasted onto chip package resin outer by heat-conducting glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620357155.5U CN205723502U (en) | 2016-04-26 | 2016-04-26 | A kind of IC chip of odt circuit common pin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620357155.5U CN205723502U (en) | 2016-04-26 | 2016-04-26 | A kind of IC chip of odt circuit common pin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205723502U true CN205723502U (en) | 2016-11-23 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620357155.5U Active CN205723502U (en) | 2016-04-26 | 2016-04-26 | A kind of IC chip of odt circuit common pin |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205723502U (en) |
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2016
- 2016-04-26 CN CN201620357155.5U patent/CN205723502U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| CB03 | Change of inventor or designer information |
Inventor after: Yuan Xiaoming Inventor before: Wang Jiubin |
|
| COR | Change of bibliographic data | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170125 Address after: Jianye District of Nanjing City, Jiangsu province 210000 Jiqingmen Street North, West, Yanshan Road on the eastern side of River Road, Fuyuan Street on the south side of Wanda Plaza West Block 16 room 1208. Patentee after: Nanjing Jiang Zhi Technology Co., Ltd. Address before: 518034 Futian District, Guangdong, Xiang Mei Road, Huatai District, No. 1026, 7-461 Patentee before: Wang Jiubin |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: IC chip of double -deck circuit sharing pin Effective date of registration: 20180726 Granted publication date: 20161123 Pledgee: Bank of China, Limited by Share Ltd, Nanjing Hexi sub branch Pledgor: Nanjing Jiang Zhi Technology Co., Ltd. Registration number: 2018320000112 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20210730 Granted publication date: 20161123 Pledgee: Bank of China Limited by Share Ltd. Nanjing Hexi sub branch Pledgor: NANJING JIANGZHI TECHNOLOGY Co.,Ltd. Registration number: 2018320000112 |