CN205681700U - Hot pressing pressure head for flexible circuit board bonding - Google Patents
Hot pressing pressure head for flexible circuit board bonding Download PDFInfo
- Publication number
- CN205681700U CN205681700U CN201620536751.XU CN201620536751U CN205681700U CN 205681700 U CN205681700 U CN 205681700U CN 201620536751 U CN201620536751 U CN 201620536751U CN 205681700 U CN205681700 U CN 205681700U
- Authority
- CN
- China
- Prior art keywords
- pressure head
- plane
- conducting film
- hot pressing
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
nullThe utility model discloses a kind of hot pressing pressure head for flexible circuit board bonding，Including an ITO conducting film (1)、Second conducting film (2)、Work platforms (4)、Hot pressing pressure head (5) and the liquid-crystalline glasses (6) being positioned on work platforms (4)，A described ITO conducting film (1) and the laminating of the 2nd ITO conducting film (2)，It is provided with OCA optical cement layer (3) between a described ITO conducting film (1) and the second conducting film (2)，Described the second conducting film (2) is positioned on liquid-crystalline glasses (6)，Described hot pressing pressure head (5) is positioned at the top of the second conducting film (2) and liquid-crystalline glasses (6) stick portion，A described ITO conducting film (1) includes the first plane (7) and the second plane (8)，Described the first plane (7) level height is less than the second plane (8) level height，This utility model provides a kind of simple to operate、Low cost、Efficiency is high and connects reliably for the hot pressing pressure head of flexible circuit board bonding.
Description
Technical field
This utility model belongs to flexible PCB field, particularly relates to a kind of hot pressing pressure for flexible circuit board bonding
Head.
Background technology
Flexible circuit board bonding refers to be bonded by anisotropic conductive film, and under certain temperature, pressure and time
Hot pressing and realize a kind of processing mode that liquid-crystalline glasses and flexible circuit board are mechanically connected and electrical equipment turns on, flexible PCB sets
Being equipped with ITO conducting film and OCA optical cement, two-layer ITO conducting film is fixed on flexible PCB, and OCA optical cement is located at two-layer ITO
Between conducting film, ITO conducting film is connected the bonding realizing flexible circuit board, ITO conducting film and liquid-crystalline glasses with liquid-crystalline glasses
The segment thickness of contact is inconsistent, has height to have low, according to prior art, needs to be respectively provided with during flexible circuit board bonding
Two different pressure heads, pressure head pressure ITO conducting film is thin, one side of another pressure head pressure ITO conduction thickness, and
Must press at twice, operation complexity, cost is high, and efficiency is low, and the when of pressure head pressure, another side can tilt simultaneously, and bonding can not
Lean on.
Utility model content
Technical problem to be solved in the utility model is: overcome the defect of above prior art, it is provided that a kind of operation letter
List, low cost, efficiency are high and connect reliably for the hot pressing pressure head of flexible circuit board bonding.
Technical solution adopted in the utility model is: a kind of hot pressing pressure head for flexible circuit board bonding, including
One ITO conducting film, the second conducting film, work platforms, hot pressing pressure head and the liquid-crystalline glasses being positioned on work platforms, described first
ITO conducting film and the laminating of the 2nd ITO conducting film, be provided with OCA optical cement between a described ITO conducting film and the second conducting film
Layer, the second described conducting film is positioned on liquid-crystalline glasses, and described hot pressing pressure head is positioned at the second conducting film and bonds with liquid-crystalline glasses
The top of part, a described ITO conduction includes that the first plane and the second plane, the first described planar horizontal height are less than
Second planar horizontal height, described hot pressing pressure head includes that the first pressure head and the second pressure head, the second described pressure head are fixed on
The one side of one pressure head, the distance of the first described pressure head to the first plane is equal to the distance of the second pressure head to the second plane.
After using above structure, this utility model compared with prior art has the advantage that and arranges the first pressure head and
Two pressure heads, the first pressure head and the second pressure head are together simultaneously, and the first pressure head is used for pressure second for pressure the first plane, the second pressure head
Plane, the first pressure head and the second pressure head are simultaneously toward an ITO conduction mould, it is only necessary to once-through operation just can realize flexible circuitry
The bonding of plate, simple to operate, low cost, efficiency is high, and owing to the first pressure head and the second pressure head are down pressed simultaneously, flexible circuit board is not
Can tilt, bonding is reliable.
As preferably, the symmetrical plane of the first described pressure head and the symmetrical plane of the second pressure head are at same plane, in pressure
During the first pressure head and the second pressure head will not press partially, the first pressure head and the second pressure head uniform force simultaneously.
As preferably, the width of the first described pressure head and the width of the second pressure head are equal, flat to the first plane and second
The pressure in face is equal, and flexible circuit board nation is effective.
As preferably, the first described pressure head and the second press head group synthesize an entirety, one-body molded, low cost.
As preferably, the first described pressure head is the most overlapping with the second plane in the projection of an ITO conducting film, it is ensured that first
Pressure head will not be pressed onto the second plane, and reliability is high.
As preferably, it is flat with second that the plane at the place, side of nearly second pressure head of the first described pressure head is positioned at the first plane
On the vertical plane of face contact simultaneously, it is ensured that the first pressure head is fully pressed against in the first plane and also ensures that the second pressure head is fully pressed against the
In two planes, reliability is high.
As preferably, the one side of the nearly ITO conducting film of the first described pressure head is provided with chamfering inclined-plane, the second described pressure
The one side of a nearly ITO conducting film is provided with chamfering inclined-plane, chamfering inclined-plane be exactly the excircle rounding of pressure head form oblique
Face, pressure head stress concentration, reliability is high.
Accompanying drawing explanation
Fig. 1 is this utility model front view for the hot pressing pressure head of flexible circuit board bonding.
Wherein, the 1, the oneth ITO conducting film, the 2, the 2nd ITO conducting film, 3, OCA optical cement layer, 4, work platforms, 5, hot pressing
Pressure head, 6, liquid-crystalline glasses, the 7, first plane, the 8, second plane, the 9, first pressure head, the 10, second pressure head.
Detailed description of the invention
The utility model is described in further detail with detailed description of the invention below in conjunction with the accompanying drawings.
As it can be seen, this utility model provides a kind of hot pressing pressure head for flexible circuit board bonding, lead including an ITO
Electrolemma the 1, second conducting film 2, work platforms 4, hot pressing pressure head 5 and the liquid-crystalline glasses 6 being positioned on work platforms 4, described first
ITO conducting film 1 and the 2nd ITO conducting film 2 are fitted, and are provided with OCA light between a described ITO conducting film 1 and the second conducting film 2
Learning glue-line 3, the second described conducting film 2 is positioned on liquid-crystalline glasses 6, and described hot pressing pressure head 5 is positioned at the second conducting film 2 and liquid crystal
The top of glass 6 stick portion, a described ITO conducting film 1 includes the first plane 7 and the second plane 8, and described first is flat
Face 7 level height is less than the second plane 8 level height, and described hot pressing pressure head 5 includes the first pressure head 9 and the second pressure head 10, institute
The second pressure head 10 stated is fixed on the one side of the first pressure head 9, and the distance of first described pressure head the 9 to the first plane 7 is equal to the
The distance of two pressure head the 10 to the second planes 8, the utility model has the advantages that and arrange the first pressure head 9 and the second pressure head 10, simultaneously
One pressure head 9 is together with the second pressure head 10, and the first pressure head 9 is used for pressure the second plane 8 for pressure the first plane 7, the second pressure head 10,
First pressure head 9 and the second pressure head 10 are pressed toward an ITO conducting film 1 simultaneously, it is only necessary to once-through operation just can realize flexible circuitry
The bonding of plate, simple to operate, low cost, efficiency is high, owing to the first pressure head 9 and the second pressure head 10 are down pressed simultaneously, flexible circuitry
Plate will not tilt, and bonding is reliable.
The symmetrical plane of the first described pressure head 9 and the symmetrical plane of the second pressure head 10 are at same plane, in the process of pressure
In the first pressure head 9 and the second pressure head 10 will not press partially, the first pressure head 9 and the second pressure head 10 uniform force simultaneously.
The width of the first described pressure head 9 and the width of the second pressure head 10 are equal, to the first plane 7 and the second plane 8
Pressure is equal, and flexible circuit board nation is effective.
The first described pressure head 9 and the second pressure head 10 are combined into an entirety, one-body molded, low cost.
The first described pressure head 9 is the most overlapping with the second plane 8 in the projection of an ITO conducting film 1, it is ensured that the first pressure head 9
Will not be pressed onto the second plane 8, reliability is high.
The plane at the place, side of nearly second pressure head 10 of the first described pressure head 9 is positioned at the first plane 7 and connects with the second plane 8
On the vertical plane touched simultaneously, it is ensured that the first pressure head 9 is fully pressed against in the first plane 7 and also ensures that the second pressure head 10 is fully pressed against the
In two planes 8, reliability is high.
The one side of the first described nearly ITO conducting film 1 of pressure head 9 is provided with chamfering inclined-plane, and the second described pressure head 10 is near
The one side of the oneth ITO conducting film 1 is provided with chamfering inclined-plane, and chamfering inclined-plane is exactly the inclined-plane of the excircle rounding composition at pressure head,
Pressure head stress is concentrated, and reliability is high.
Specifically, principle of the present utility model is to arrange the first pressure head 9 and the second pressure head 10, simultaneously the first pressure head 9 He
Together, the first pressure head 9 is for pressure the first plane 7, and the second pressure head 10 is for pressure the second plane 8, the first pressure head 9 for second pressure head 10
Press toward an ITO conducting film 1 with the second pressure head 10, it is only necessary to once-through operation just can realize the bonding of flexible circuit board simultaneously,
Simple to operate, low cost, efficiency is high, and owing to the first pressure head 9 and the second pressure head 10 are down pressed simultaneously, flexible circuit board will not be stuck up
Rising, bonding is reliable.
Above this utility model preferred embodiment is described, but is not to be construed as limitations on claims,
This utility model is not only limited to above example, and its concrete structure allows to change, all in this utility model demand for independence
The various changes made in protection domain are all in protection domain of the present utility model.
Claims (7)
1. for a hot pressing pressure head for flexible circuit board bonding, including an ITO conducting film (1), the second conducting film (2), work
Make platform (4), hot pressing pressure head (5) and the liquid-crystalline glasses (6) being positioned on work platforms (4), a described ITO conducting film (1)
With the 2nd ITO conducting film (2) laminating, between a described ITO conducting film (1) and the second conducting film (2), it is provided with OCA optical cement
Layer (3), described the second conducting film (2) is positioned on liquid-crystalline glasses (6), and described hot pressing pressure head (5) is positioned at the second conducting film (2)
With the top of liquid-crystalline glasses (6) stick portion, a described ITO conducting film (1) includes the first plane (7) and the second plane
(8), described the first plane (7) level height is less than the second plane (8) level height, it is characterised in that: described hot pressing pressure
Head (5) includes that the first pressure head (9) and the second pressure head (10), described the second pressure head (10) are fixed on the side of the first pressure head (9)
Face, the distance of described the first pressure head (9) to the first plane (7) is equal to the distance of the second pressure head (10) to the second plane (8).
Hot pressing pressure head for flexible circuit board bonding the most according to claim 1, it is characterised in that: the first described pressure
The symmetrical plane of head (9) and the symmetrical plane of the second pressure head (10) are at same plane.
Hot pressing pressure head for flexible circuit board bonding the most according to claim 2, it is characterised in that: the first described pressure
The width of head (9) and the width of the second pressure head (10) are equal.
Hot pressing pressure head for flexible circuit board bonding the most according to claim 1, it is characterised in that: the first described pressure
Head (9) and the second pressure head (10) are combined into an entirety.
Hot pressing pressure head for flexible circuit board bonding the most according to claim 1, it is characterised in that: the first described pressure
Head (9) is the most overlapping with the second plane (8) in the projection of an ITO conducting film (1).
Hot pressing pressure head for flexible circuit board bonding the most according to claim 5, it is characterised in that: the first described pressure
The plane at the place, side of head (9) nearly second pressure head (10) is positioned at the vertical plane that the first plane (7) contacts with the second plane (8)
On.
Hot pressing pressure head for flexible circuit board bonding the most according to claim 1, it is characterised in that: the first described pressure
The one side of head (9) nearly ITO conducting film (1) is provided with chamfering inclined-plane, the described nearly ITO conducting film of the second pressure head (10)
(1) one side is provided with chamfering inclined-plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620536751.XU CN205681700U (en) | 2016-06-03 | 2016-06-03 | Hot pressing pressure head for flexible circuit board bonding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620536751.XU CN205681700U (en) | 2016-06-03 | 2016-06-03 | Hot pressing pressure head for flexible circuit board bonding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205681700U true CN205681700U (en) | 2016-11-09 |
Family
ID=57434656
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620536751.XU Expired - Fee Related CN205681700U (en) | 2016-06-03 | 2016-06-03 | Hot pressing pressure head for flexible circuit board bonding |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205681700U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112333930A (en) * | 2020-10-30 | 2021-02-05 | 霸州市云谷电子科技有限公司 | Flexible pressure head |
-
2016
- 2016-06-03 CN CN201620536751.XU patent/CN205681700U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112333930A (en) * | 2020-10-30 | 2021-02-05 | 霸州市云谷电子科技有限公司 | Flexible pressure head |
| CN112333930B (en) * | 2020-10-30 | 2022-03-25 | 霸州市云谷电子科技有限公司 | Flexible pressure head |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161109 |