CN205648324U - Ku wave band solid -state power amplifier module carrying device - Google Patents
Ku wave band solid -state power amplifier module carrying device Download PDFInfo
- Publication number
- CN205648324U CN205648324U CN201620462558.6U CN201620462558U CN205648324U CN 205648324 U CN205648324 U CN 205648324U CN 201620462558 U CN201620462558 U CN 201620462558U CN 205648324 U CN205648324 U CN 205648324U
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- China
- Prior art keywords
- power amplifier
- state power
- wave band
- amplifier module
- baffle plate
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Abstract
The utility model discloses a ku wave band solid -state power amplifier module carrying device, including casing and heating panel, the heating panel top is the studio, the below is the heat dissipation room, there is the baffle in the studio, baffle contact ku wave band solid -state power amplifier module, the baffle runs through heating panel to the room bottom of dispelling the heat, it has shower plate to dispel the heat indoor, shower plate is last to have the sprinkler bead, the nozzle of sprinkler bead is vertical upwards, the inside water piping connection of sprinkler bead has the setting at the inside main water pipe of shower plate, main water pipe runs through heat dissipation room side and is connected with the inlet tube, it has miniature pump to advance water piping connection, miniature pump leads to pipe and is connected with the cooler, the inlet tube below is provided with the outlet pipe, outlet pipe intercommunication heat dissipation room and cooler. The utility model discloses a high efficiency cooling is carried out to ku wave band solid -state power amplifier module in the solid -state power amplifier of water -cooled mode for the work efficiency of ku wave band solid -state power amplifier module obtains improving, has promoted solid -state power amplifier's improvement space.
Description
Technical field
This utility model relates to a kind of solid-state power amplifier, is specifically related to a kind of Ku wave band solid state power amplifier module loading device.
Background technology
Along with the progress of technology, equip the operating frequency in field military and civilian such as observing and controlling, satellite communication, radar, electronic warfare system, high-tension electricity line walkings at present and reached millimeter wave frequency band.It is positioned at that to launch the high power solid-state power amplifier of channel end most important to systematic function, the aspects such as Measure Precision, communication quality, operating radius and the capacity of resisting disturbance of system are played an important role.The Main Function of solid-state power amplifier is the signal sent will to be needed to be amplified to certain power level, then is wirelessly transmitted to space through antenna, and the key technical indexes includes output, bandwidth of operation and standing-wave ratio etc..Comparing travelling-wave tube amplifier, solid-state power amplifier has obvious advantage, so its application in systems receives the favor of people at aspects such as running voltage, reliability and adaptives capacity to environment.
According to IEEE521-2002 standard, Ku wave band refers to the frequency radio waveband at 12-18GHz, at space field, Ku wave band can be used as the communication band between satellite, such as the tracking communicated between international space station and space shuttle, in satellite broadcasting field, Ku wave band is also a conventional wave band.Compared with C-band, although Ku wave band covering region is little, but its signal is strong.
Use chip scale power synthesis, circuit-level power combing or the high power solid state power amplifier module of space power synthesis fabrication techniques further, not only volume and weight is restricted, and its heat stability is also by strict test, in actual applications, requiring very strict to the work efficiency of solid state power amplifier module, the height of its operating temperature will affect the work efficiency of solid state power amplifier module.
Traditional solid-state power amplifier uses air-cooled mode to dispel the heat its power amplifier module carried, but there is the shortcomings such as the heat conductivity of air dielectric is low, area of dissipation is little in air-cooled heat radiation, its radiating effect is bad, the operating temperature of Ku wave band solid state power amplifier module cannot be reduced efficiently, so limiting the further development in space and satellite broadcasting field of the Ku wave band solid-state power amplifier.
Utility model content
Technical problem to be solved in the utility model is the defect for conventional solid-state power amplifier, purpose is to provide a kind of Ku wave band solid state power amplifier module loading device, solves traditional solid-state power amplifier and uses air-cooled mode that its power amplifier module carried carries out heat radiation to cause cannot cooling down the ineffective problem of power amplifier module produced by power amplifier module efficiently.
nullThis utility model is achieved through the following technical solutions: a kind of Ku wave band solid state power amplifier module loading device，Including housing，Heat sink it has been horizontally disposed with in housing，Enclosure interior is divided into two parts by heat sink，Heat sink is arranged above operating room，It it is heat dissipation chamber below heat sink，In operating room, spaced set has some baffle plates being perpendicular to heat sink，On baffle plate, contact has the Ku wave band solid state power amplifier module being positioned at above heat sink，Baffle plate is parallel to the side that operating room's length is shorter，Baffle plate only one of which side is connected with the side of operating room，Position relationship between baffle plate is configured to，The same side of the connection operating room, side of alternate baffle plate，Two sides that the side of adjacent screen is parallel to each other in connecting operating room respectively，Baffle plate runs through heat sink and connects bottom heat dissipation chamber，It is provided with shower plate on side within heat dissipation chamber，Shower plate connects two sides adjacent with its side, place，Some fountain heads equidistantly it are provided with on shower plate，Fountain head is between adjacent baffle plate，The nozzle of fountain head is straight up，Water pipe within fountain head connects the water main being arranged within shower plate，Water main runs through heat dissipation chamber's side connection water inlet pipe，Water inlet pipe connects micro pump，Micro pump is connected by water pipe cooler，Outlet pipe it is provided with below water inlet pipe，Outlet pipe connection heat dissipation chamber and cooler.In prior art, traditional solid-state power amplifier mainly uses air-cooled mode to lower the temperature power amplifier module, it is to avoid its operating temperature is too high affects work efficiency.But, when using traditional radiator fan to dispel the heat, the problem such as the heat conductivity that can run into air dielectric is low, area of dissipation is little, so air-cooled radiating effect is the best, the operating temperature of power amplifier module can not be reduced efficiently, limit development further and the application of high power solid state power amplifier.In order to solve the problems referred to above, this utility model provides a kind of solid-state power amplifier using water-cooled cooling.In the housing of solid-state power amplifier, it is provided with heat sink, heat sink is provided with baffle plate, heat sink and baffle plate and all uses the metal that thermal conductivity is high, such as silver, aluminum etc..All shorter with the operating room's length one side of baffle plate is parallel, baffle plate only one of which side is connected with working chamber side, position relationship between baffle plate is, two sides that adjacent baffle plate is parallel to each other in connecting operating room respectively, alternate baffle plate connects same side, baffle plate runs through heat sink and is connected with bottom heat dissipation chamber, and therefore, the inner space of operating room and heat dissipation chamber has all been divided into S-shaped by baffle plate.Connecting on baffle plate and have Ku wave band solid state power amplifier module and other electronic components such as electric capacity, resistance etc., the Ku wave band solid state power amplifier module applied here is prior art；Being provided with shower plate on side within heat dissipation chamber, shower plate is also connected with two sides adjacent with its side, place, i.e. water above shower plate and can be flowed into below shower plate by the part that shower plate and heat dissipation chamber inwall are not in contact with.Several fountain heads it are provided with on shower plate, nozzle on fountain head faces the bottom of heat sink straight up, and shower plate is internally provided with water main, and water main connects water inlet pipe through heat dissipation chamber side, water inlet pipe is sequentially connected with micro pump and cooler, and cooler connects outlet pipe.Micro pump and cooler are prior art, all have the advantage that volume is little, noise is low, can commercially be obtained by purchase, additionally, integral type water collecting pump, integral type water collecting pump can also be used to contain water pump, storage tank and cooler, and Highgrade integration saves space.During work, running micro pump, water flows out and passes sequentially through water inlet pipe, water main, fountain head, heat dissipation chamber, outlet pipe, cooler from micro pump, is eventually returned in micro pump, forms water circulation.nullKu wave band solid state power amplifier module contacts with heat sink and baffle plate，By heat sink and baffle plate, the high temperature in Ku wave band solid state power amplifier module is reached below heat sink and on baffle plate，Water is when flowing through heat dissipation chamber，It is sprayed onto bottom heat sink by fountain head，Heat sink is lowered the temperature，Water drops down onto and flows through the S-shaped runner that baffle plate is divided on shower plate afterwards，Current enter below shower plate afterwards，Continue below shower plate, walk S-shaped runner，By arranging S-shaped runner，Not only allow the water to fully absorb Ku wave band solid state power amplifier module by heat sink and the heat of baffle plate transmission，Contact area enough between baffle plate can also be passed water through，Refrigerated baffle，Thus the Ku wave band solid state power amplifier module in operating room is cooled down further，Final current flow to cooler cool down from outlet pipe，Heat dissipation chamber is entered through micro pump from water inlet pipe again after cooling.By said structure and principle, it is possible to the electronic device in operating room is lowered the temperature efficiently.The strong reason crossing air cooling system of water-cooling system heat-sinking capability, one heat absorption being because water and heat conductivility are more a lot of than air, two to be because total area of dissipation of water-cooling system also much larger than air cooling system, this device not only uses heat sink to cool down electronic component, also uses baffle plate, adds heat transfer area, improve cooling efficiency, by lowering the temperature efficiently so that the work efficiency of High-power amplifier module is improved, improve room for improvement and the range of application of solid-state power amplifier.It addition, water-cooling system also has the advantage that noise is little so that solid-state power amplifier can be flexibly applied in space and satellite broadcasting field.
Further, shower plate is 2 to 5 ° with the angle of heat sink, and shower plate distance bottom one end of water inlet pipe with heat dissipation chamber is more than the distance bottom the other end and heat dissipation chamber.By being obliquely installed shower plate, on the one hand make sluggish flow flow to the other end of shower plate from shower plate near one end of water inlet pipe along the runner on shower plate, and enter the runner below shower plate；On the other hand, fountain head near water inlet pipe one end is closer to heat sink, its cooling effect is more preferable, and electronic component most crucial in power amplifier module such as monolithic integrated microwave circuit chip can be placed on the purpose that position corresponding above heat sink reaches preferably to lower the temperature core electron element.
Further, it is provided with thermal grease between heat sink, baffle plate and Ku wave band solid state power amplifier module.Thermal grease has the feature of low thermal resistance, high thermal conductivity, because Ku wave band solid state power amplifier module is critical piece, between itself and heat sink, baffle plate, scribble thermal grease can reduce friction, make Ku wave band solid state power amplifier module and heat sink, baffle plate be fully contacted thus improve pyroconductivity so that the heat of Ku wave band solid state power amplifier module is more effectively transferred to heat sink and baffle plate.
Further, water main is made up of polymeric material.Cause water circulating effect poor to prevent water main from getting rusty, water main uses polymeric material such as politef to make, and not only ensure that the intensity of water main, will not get rusty, and lightweight, reduces the gross weight of solid-state power amplifier.
Further, nozzle is provided with nozzle cover, nozzle cover is provided with some through holes.By above-mentioned setting, so that the spray of uniform fluid flow is bottom heat sink, without only spraying the local location bottom heat sink, cause radiating effect poor.
Further, water inlet pipe is provided with ball valve.By arranging ball valve on water inlet pipe, inflow can be adjusted, control water circulating speed so that operator can control the temperature in heat dissipation chamber.
Further, outlet pipe is bottom heat dissipation chamber.So arranging makes current will not pile up bottom heat dissipation chamber.
Further, it is positioned on the baffle plate of operating room and is provided with some through holes.Through hole is set on the baffle plate in operating room and is conducive to the connection between each electronic component, facilitate designer more reasonably to design and the layout of planning indoor electronic element.
This utility model compared with prior art, has such advantages as and beneficial effect:
1, the Ku wave band solid state power amplifier module in solid-state power amplifier is lowered the temperature by the way of water-cooled by this utility model, because the heat absorption of water and heat conductivility are also more much larger than air cooling system than air well a lot of and water-cooling system total area of dissipations, so good cooling effect, so that the work efficiency of high-power Ku wave band solid state power amplifier module is improved, add room for improvement and the range of application of solid-state power amplifier；
2, this utility model uses the mode of water-cooled to lower the temperature, and has the advantages that noise is little so that solid-state power amplifier can be more suitable for space, satellite broadcasting and military field；
3, this utility model employs baffle plate, adds area of dissipation, improves radiating efficiency, makes the work efficiency of Ku wave band solid state power amplifier module improve further；
4, this utility model uses water main to use politef to make, and not only ensure that the intensity of water main but also will not get rusty, and its weight relatively metal is light, reduces the gross weight of solid-state power amplifier.
Accompanying drawing explanation
Accompanying drawing described herein is used for providing being further appreciated by this utility model embodiment, constitutes the part of the application, is not intended that the restriction to this utility model embodiment.In the accompanying drawings:
Fig. 1 is this utility model cross-sectional view；
Fig. 2 is the generalized section in A-A face in Fig. 1.
The parts title of labelling and correspondence in accompanying drawing:
1-housing, 2-heat sink, 3-shower plate, 4-fountain head, 5-water inlet pipe, 6-outlet pipe, 7-Ku wave band solid state power amplifier module, 8-baffle plate.
Detailed description of the invention
For making the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with embodiment and accompanying drawing, the utility model is described in further detail, exemplary embodiment of the present utility model and explanation thereof are only used for explaining this utility model, are not intended as restriction of the present utility model.
Embodiment
nullAs shown in Figure 1，This utility model is a kind of Ku wave band solid state power amplifier module loading device，Including housing 1，Heat sink 2 it has been horizontally disposed with in housing 1，Heat sink 2 is divided into two parts by internal for housing 1，Heat sink 2 is arranged above operating room，It it is heat dissipation chamber below heat sink 2，In operating room, spaced set has some baffle plates 8 being perpendicular to heat sink 2，On baffle plate 8, contact has the Ku wave band solid state power amplifier module 7 being positioned at above heat sink 2，Baffle plate 8 is parallel to the side that operating room's length is shorter，Baffle plate 8 only one of which side is connected with the side of operating room，Position relationship between baffle plate 8 is configured to，The same side of the connection operating room, side of alternate baffle plate 8，Two sides that the side of adjacent screen 8 is parallel to each other in connecting operating room respectively，Baffle plate 8 runs through heat sink 2 and connects bottom heat dissipation chamber，Shower plate 3 it is provided with on side within heat dissipation chamber，Shower plate 3 connects two sides adjacent with its side, place，Some fountain heads 4 equidistantly it are provided with on shower plate 3，Fountain head 4 is between adjacent baffle plate 8，The nozzle of fountain head 4 is straight up，Water pipe within fountain head 4 connects the water main being arranged within shower plate 3，Water main runs through heat dissipation chamber's side connection water inlet pipe 5，Water inlet pipe 5 connects micro pump，Micro pump is connected by water pipe cooler，Outlet pipe 6 it is provided with below water inlet pipe 5，Outlet pipe 6 connects heat dissipation chamber and cooler.Shower plate 3 is 2 to 5 ° with the angle of heat sink 2, and the shower plate 3 distance bottom one end of water inlet pipe 5 with heat dissipation chamber is more than the distance bottom the other end and heat dissipation chamber.It is provided with thermal grease between heat sink 2, baffle plate 8 and Ku wave band solid state power amplifier module 7.Water main is made up of polymeric material.It is provided with nozzle cover on nozzle, nozzle cover is provided with some through holes.It is provided with ball valve on water inlet pipe 5.Outlet pipe 6 is bottom heat dissipation chamber.It is positioned on the baffle plate 8 of operating room and is provided with some through holes.When using this device, first turn on micro pump, current enter into water main from water inlet pipe 5, it is sprayed to below heat sink 2 by fountain head 4, transfer heat in current by heat sink 2 and baffle plate 8 in Ku wave band solid state power amplifier module 7 and other electronic components, current are along the runner above shower plate 3 and the flow passage below shower plate 3, and in flow process, baffle plate 8 is carried out the heat of transmission in cooling absorbing curtain 8, enter in cooler eventually through outlet pipe 6, after current are lowered the temperature by cooler, current enter in micro pump, and be again delivered in water inlet pipe 5, complete water circulation.Because the heat absorption of water and heat conductivility are also more much larger than air cooling system than air well a lot of and water-cooling system total area of dissipations, so the good cooling effect of water-cooling pattern, so that the work efficiency of high-power Ku solid state power amplifier module is improved, improve the room for improvement of solid-state power amplifier.
Above-described detailed description of the invention; the purpose of this utility model, technical scheme and beneficial effect are further described; it is it should be understood that; the foregoing is only detailed description of the invention of the present utility model; it is not used to limit protection domain of the present utility model; all within spirit of the present utility model and principle, any modification, equivalent substitution and improvement etc. done, within should be included in protection domain of the present utility model.
Claims (8)
- null1. a Ku wave band solid state power amplifier module loading device，Including housing (1)，It is characterized in that，Heat sink (2) it has been horizontally disposed with in described housing (1)，Described heat sink (2) is divided into two parts by internal for housing (1)，Heat sink (2) is arranged above operating room，Heat sink (2) lower section is heat dissipation chamber，In described operating room, spaced set has some baffle plates (8) being perpendicular to heat sink (2)，The upper contact of described baffle plate (8) has Ku wave band solid state power amplifier module (7) being positioned at heat sink (2) top，Baffle plate (8) is parallel to the side that operating room's length is shorter，Baffle plate (8) only one of which side is connected with the side of operating room，Position relationship between baffle plate (8) is configured to，The same side of the connection operating room, side of alternate baffle plate (8)，Two sides that the side of adjacent screen (8) is parallel to each other in connecting operating room respectively，Baffle plate (8) runs through heat sink (2) and connects bottom heat dissipation chamber，Shower plate (3) it is provided with on side within heat dissipation chamber，Described shower plate (3) connects two sides adjacent with its side, place，Some fountain heads (4) equidistantly it are provided with on described shower plate (3)，Described fountain head (4) is positioned between adjacent baffle plate (8)，The nozzle of fountain head (4) is straight up，The water pipe of fountain head (4) inside connects the water main being arranged on shower plate (3) inside，Described water main runs through heat dissipation chamber's side connection water inlet pipe (5)，Described water inlet pipe (5) connects micro pump，Described micro pump is connected by water pipe cooler，Water inlet pipe (5) lower section is provided with outlet pipe (6)，Described outlet pipe (6) connection heat dissipation chamber and cooler.
- A kind of Ku wave band solid state power amplifier module loading device the most according to claim 1, it is characterized in that, described shower plate (3) is 2 to 5 ° with the angle of heat sink (2), and the shower plate (3) distance bottom one end of water inlet pipe (5) with heat dissipation chamber is more than the distance bottom the other end and heat dissipation chamber.
- A kind of Ku wave band solid state power amplifier module loading device the most according to claim 1, it is characterised in that be provided with thermal grease between described heat sink (2), baffle plate (8) and Ku wave band solid state power amplifier module (7).
- A kind of Ku wave band solid state power amplifier module loading device the most according to claim 1, it is characterised in that described water main is made up of polymeric material.
- A kind of Ku wave band solid state power amplifier module loading device the most according to claim 1, it is characterised in that be provided with nozzle cover on described nozzle, nozzle cover is provided with some through holes.
- A kind of Ku wave band solid state power amplifier module loading device the most according to claim 1, it is characterised in that described water inlet pipe is provided with ball valve on (5).
- A kind of Ku wave band solid state power amplifier module loading device the most according to claim 1, it is characterised in that described outlet pipe (6) is bottom heat dissipation chamber.
- A kind of Ku wave band solid state power amplifier module loading device the most according to claim 1, it is characterised in that be positioned on the baffle plate (8) of operating room and be provided with some through holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620462558.6U CN205648324U (en) | 2016-05-20 | 2016-05-20 | Ku wave band solid -state power amplifier module carrying device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620462558.6U CN205648324U (en) | 2016-05-20 | 2016-05-20 | Ku wave band solid -state power amplifier module carrying device |
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| Publication Number | Publication Date |
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| CN205648324U true CN205648324U (en) | 2016-10-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201620462558.6U Expired - Fee Related CN205648324U (en) | 2016-05-20 | 2016-05-20 | Ku wave band solid -state power amplifier module carrying device |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105828582A (en) * | 2016-05-20 | 2016-08-03 | 四川汇英光电科技有限公司 | Device carrying Ku-band solid-state power amplifier module |
| CN105828583A (en) * | 2016-05-20 | 2016-08-03 | 四川汇英光电科技有限公司 | Power amplifier module carrying device in satellite communication system |
| CN105897187A (en) * | 2016-05-20 | 2016-08-24 | 四川汇英光电科技有限公司 | Improved solid state power amplifier for radar guidance system |
| CN105958949A (en) * | 2016-05-20 | 2016-09-21 | 四川汇英光电科技有限公司 | Improved structure of X-band solid-state power amplifier |
| CN105958950A (en) * | 2016-05-20 | 2016-09-21 | 四川汇英光电科技有限公司 | Strong-heat-dissipation type solid-state power amplifier |
| CN106026931A (en) * | 2016-05-20 | 2016-10-12 | 四川汇英光电科技有限公司 | Device carrying third-generation semiconductor material power amplifier module |
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2016
- 2016-05-20 CN CN201620462558.6U patent/CN205648324U/en not_active Expired - Fee Related
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105828582A (en) * | 2016-05-20 | 2016-08-03 | 四川汇英光电科技有限公司 | Device carrying Ku-band solid-state power amplifier module |
| CN105828583A (en) * | 2016-05-20 | 2016-08-03 | 四川汇英光电科技有限公司 | Power amplifier module carrying device in satellite communication system |
| CN105897187A (en) * | 2016-05-20 | 2016-08-24 | 四川汇英光电科技有限公司 | Improved solid state power amplifier for radar guidance system |
| CN105958949A (en) * | 2016-05-20 | 2016-09-21 | 四川汇英光电科技有限公司 | Improved structure of X-band solid-state power amplifier |
| CN105958950A (en) * | 2016-05-20 | 2016-09-21 | 四川汇英光电科技有限公司 | Strong-heat-dissipation type solid-state power amplifier |
| CN106026931A (en) * | 2016-05-20 | 2016-10-12 | 四川汇英光电科技有限公司 | Device carrying third-generation semiconductor material power amplifier module |
| CN105828582B (en) * | 2016-05-20 | 2018-07-27 | 四川汇英光电科技有限公司 | A kind of device equipped with Ku wave band solid state power amplifier modules |
| CN105828583B (en) * | 2016-05-20 | 2018-07-27 | 四川汇英光电科技有限公司 | A kind of power amplifier module loading device in satellite communication system |
| CN105958950B (en) * | 2016-05-20 | 2018-09-11 | 四川汇英光电科技有限公司 | A kind of strong heat dissipation type solid-state power amplifier |
| CN106026931B (en) * | 2016-05-20 | 2018-09-11 | 四川汇英光电科技有限公司 | A kind of device equipped with third generation semi-conducting material power amplifier module |
| CN105897187B (en) * | 2016-05-20 | 2018-09-11 | 四川汇英光电科技有限公司 | A kind of modified solid-state power amplifier for radar guidance system |
| CN105958949B (en) * | 2016-05-20 | 2018-09-11 | 四川汇英光电科技有限公司 | A kind of improved structure of X-band solid-state power amplifier |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161012 |