CN205792466U - A kind of water-cooled solid-state power amplifier - Google Patents
A kind of water-cooled solid-state power amplifier Download PDFInfo
- Publication number
- CN205792466U CN205792466U CN201620462561.8U CN201620462561U CN205792466U CN 205792466 U CN205792466 U CN 205792466U CN 201620462561 U CN201620462561 U CN 201620462561U CN 205792466 U CN205792466 U CN 205792466U
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- China
- Prior art keywords
- power amplifier
- water
- heat dissipation
- dissipation chamber
- shower plate
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Abstract
The utility model discloses a kind of water-cooled solid-state power amplifier, including housing and heat sink, enclosure interior is divided into operating room and heat dissipation chamber by heat sink, power amplifier module it is provided with in operating room, blast pipe is had above power amplifier module, blast pipe connects radiator fan, top, operating room arranges some exhaust outlets, shower plate is set inside heat dissipation chamber, some fountain heads equidistantly it are provided with on shower plate, water pipe connection within fountain head is arranged on the water main within shower plate, water main connects water inlet pipe, water inlet pipe connects micro pump, micro pump is connected by water pipe cooler, the outlet pipe being positioned at below shower plate it is provided with outside heat dissipation chamber, outlet pipe is positioned at the plane of symmetry of side, water inlet pipe place, outlet pipe connection heat dissipation chamber and cooler.This utility model carries out temperature with high efficiency to the power amplifier module in solid-state power amplifier by the way of water-cooled so that the work efficiency of High-power amplifier module is improved, and improves the room for improvement of solid-state power amplifier.
Description
Technical field
This utility model relates to a kind of solid-state power amplifier, is specifically related to a kind of water-cooled solid-state power amplifier.
Background technology
Along with the progress of technology, equip the operating frequency in field military and civilian such as observing and controlling, satellite communication, radar, electronic warfare system, high-tension electricity line walkings at present and reached millimeter wave frequency band.It is positioned at that to launch the high power solid-state power amplifier of channel end most important to systematic function, the aspects such as Measure Precision, communication quality, operating radius and the capacity of resisting disturbance of system are played an important role.The Main Function of solid-state power amplifier is the signal sent will to be needed to be amplified to certain power level, then is wirelessly transmitted to space through antenna, and the key technical indexes includes output, bandwidth of operation and standing-wave ratio etc..Comparing travelling-wave tube amplifier, solid-state power amplifier has obvious advantage, so its application in systems receives the favor of people at aspects such as running voltage, reliability and adaptives capacity to environment.
In frequency is positioned at the phased-array radar of X-band, solid-state power amplifier directly determines the technical parameter of T/R assembly as the afterbody of T/R assembly, its quality.Along with updating of the application systems such as radar, the solid-state power amplifier module developing high-power, high efficiency, high reliability and miniaturization becomes the eager problem needing to solve.But, using chip scale power synthesis, circuit-level power combing or the high power solid state power amplifier module of space power synthesis fabrication techniques further, not only volume and weight is restricted, and its heat stability is also by strict test, in actual applications, requiring very strict to the work efficiency of solid state power amplifier module, the height of its operating temperature will affect the work efficiency of solid state power amplifier module.
Its power amplifier module carried is dispelled the heat by traditional X-band solid-state power amplifier only with air-cooled mode, but there is the shortcomings such as the heat conductivity of air dielectric is low, area of dissipation is little in air-cooled heat radiation, its radiating effect is bad, the operating temperature of power amplifier module cannot be reduced efficiently, so limiting the further development of high power solid state power amplifier.
Utility model content
Technical problem to be solved in the utility model is the defect for conventional solid-state power amplifier, purpose is to provide a kind of water-cooled solid-state power amplifier, solves traditional solid-state power amplifier and only uses air-cooled mode that its power amplifier module carried carries out heat radiation to cause cannot cooling down the ineffective problem of power amplifier module produced by power amplifier module efficiently.
nullThis utility model is achieved through the following technical solutions: a kind of water-cooled solid-state power amplifier，Including housing，Heat sink it has been horizontally disposed with in housing，Enclosure interior is divided into two parts by heat sink，Heat sink is arranged above operating room，It it is heat dissipation chamber below heat sink，The power amplifier module being positioned on heat sink it is provided with in operating room，Temperature sensor it is provided with on power amplifier module，Power amplifier module is provided above blast pipe，Blast pipe is just to power amplifier module，Blast pipe runs through the connection of top, operating room radiator fan，Top, operating room is provided with some exhaust outlets，It is provided with shower plate on side within heat dissipation chamber，Shower plate connects two sides adjacent with its side, place，Some fountain heads equidistantly it are provided with on shower plate，The nozzle of fountain head is straight up，Water pipe within fountain head connects the water main being arranged within shower plate，Water main runs through heat dissipation chamber's side connection water inlet pipe，Water inlet pipe connects micro pump，Micro pump is connected by water pipe cooler，The outlet pipe being positioned at below shower plate it is provided with outside heat dissipation chamber，Outlet pipe is positioned at the plane of symmetry of side, water inlet pipe place，Outlet pipe connection heat dissipation chamber and cooler.In prior art, traditional solid-state power amplifier only uses air-cooled mode to lower the temperature power amplifier module, it is to avoid its operating temperature is too high affects work efficiency.But, when using traditional radiator fan to dispel the heat, the problem such as the heat conductivity that can run into air dielectric is low, area of dissipation is little, so air-cooled radiating effect is the best, the operating temperature of power amplifier module can not be reduced efficiently, limit the further development of high power solid state power amplifier.In order to solve the problems referred to above, this utility model provides a kind of main employing water-cooled, the solid-state power amplifier of auxiliary employing wind cooling temperature lowering.Being provided with heat sink in the housing of solid-state power amplifier, described heat sink uses the metal that thermal conductivity is high, such as silver, aluminum etc..The enclosure interior of solid-state power amplifier is divided into operating room and heat dissipation chamber by heat sink, the electronic devices such as power amplifier module, electric capacity, resistance are placed in operating room, power amplifier module is prior art, power amplifier module is provided above blast pipe, blast pipe is just to power amplifier module, and blast pipe runs through top, operating room and connects on radiator fan, and power amplifier module is provided with temperature sensor, when temperature exceedes the temperature alarm of setting, radiator fan can automatically turn on；Being provided with shower plate on side within heat dissipation chamber, shower plate is also connected with the part that two sides adjacent with its side, place, i.e. water above shower plate are not in contact with by shower plate and heat dissipation chamber inwall and flows into below shower plate.Several fountain heads it are provided with on shower plate, nozzle on fountain head faces the bottom of heat sink straight up, shower plate is internally provided with water main, water main is connected with the water pipe within fountain head, water main connects water inlet pipe through heat dissipation chamber side, water inlet pipe is sequentially connected with micro pump and cooler, and cooler connects outlet pipe.Micro pump and cooler are prior art, all have the advantage that volume is little, noise is low, can commercially be obtained by purchase, additionally, integral type water collecting pump, integral type water collecting pump can also be used to contain water pump, storage tank and cooler, and Highgrade integration saves space.During work, run micro pump so that water flows out and pass sequentially through water inlet pipe, water main, fountain head, heat dissipation chamber, outlet pipe, cooler from micro pump, is eventually returned in micro pump, form water circulation.Electronic device and heat sink overlying contact, by heat sink, the high temperature on electronic device is reached below heat sink, water is when flowing through heat dissipation chamber, it is sprayed onto bottom heat sink by fountain head, heat sink is lowered the temperature, after temperature reaches current, current fall bottom heat dissipation chamber and finally flow to cooler cool down from outlet pipe, enter heat dissipation chamber through micro pump from water inlet pipe again after cooling；When the operating temperature of the temperature sensor monitors on power amplifier module to power amplifier module exceedes design temperature, would automatically turn on radiator fan and promptly lower the temperature, leave operator's time enough for and accelerate water circulating speed, thus reduce the operating temperature of power amplifier module.By said structure and principle, it is possible to the electronic device in operating room is lowered the temperature efficiently.The strong reason crossing air cooling system of water-cooling system heat-sinking capability, one heat absorption being because water and heat conductivility are more a lot of than air, two to be because total area of dissipation of water-cooling system also much larger than air cooling system, by lowering the temperature efficiently, so that the work efficiency of High-power amplifier module is improved, improve the room for improvement of solid-state power amplifier.Water-cooling system also has the feature that noise is little so that solid-state power amplifier can be flexibly applied in military field.It addition, by air cooling system intermittent auxiliary water cooling system, not only ensure the operating temperature of power amplifier module less than warning temperature, moreover it is possible to carrying out dust removal operation in operating room.
Further, blast pipe is near the side at water inlet pipe place, and exhaust outlet is near the side at outlet place.So arrange to allow, from radiator fan, the electronic device of whole operating room is carried out wind cooling temperature lowering, moreover it is possible to the dust in operating room is discharged from exhaust outlet, reach the dual purpose of cooling and dedusting.
Further, shower plate is 2 to 5 ° with the angle of heat sink, and shower plate distance bottom one end of water inlet pipe with heat dissipation chamber is more than the distance bottom one end of outlet pipe with heat dissipation chamber.By being obliquely installed shower plate, on the one hand make sluggish flow flow near one end of water inlet pipe from shower plate part that shower plate is not in contact with heat dissipation chamber inwall and enter below shower plate, finally from outlet pipe discharge；On the other hand, fountain head near water inlet pipe one end is closer to heat sink, its cooling effect is more preferable, and electronic component most crucial in power amplifier module such as monolithic integrated microwave circuit chip can be placed on the purpose that position corresponding above heat sink reaches preferably to lower the temperature core electron element.
Further, thermal grease it is provided with between heat sink and power amplifier module.Thermal grease has the feature of low thermal resistance, high thermal conductivity, because power amplifier module is critical piece, between itself and heat sink, scribble thermal grease can reduce friction between the two, make both be fully contacted thus improve pyroconductivity so that the heat of power amplifier module is effectively transmitted to heat sink.
Further, water main is made up of polymeric material.Cause water circulating effect poor to prevent water main from getting rusty, water main uses polymeric material such as politef to make, and not only ensure that the intensity of water main, will not get rusty, and lightweight, reduces the gross weight of solid-state power amplifier.
Further, nozzle is provided with nozzle cover, nozzle cover is provided with some through holes.By above-mentioned setting, so that the spray of uniform fluid flow is bottom heat sink, without only spraying the local location bottom heat sink, cause radiating effect poor.
Further, water inlet pipe is provided with ball valve.By arranging ball valve on water inlet pipe, inflow can be adjusted, control water circulating speed so that operator can control the temperature in heat dissipation chamber.
Further, outlet pipe is bottom heat dissipation chamber.So arranging makes current will not pile up bottom heat dissipation chamber.
This utility model compared with prior art, has such advantages as and beneficial effect:
1, this utility model uses water-cooling system auxiliary by the way of using air cooling system to lower the temperature the power amplifier module in solid-state power amplifier by main, because the heat absorption of water and heat conductivility are also more much larger than air cooling system than air well a lot of and water-cooling system total area of dissipations, so good cooling effect, so that the work efficiency of High-power amplifier module is improved, improve the room for improvement of solid-state power amplifier；
2, this utility model mainly uses the mode of water-cooled to lower the temperature, and has the advantages that noise is little so that solid-state power amplifier can be flexibly applied to military field；
3, this use is novel is provided with temperature sensor on power amplifier module, when the operating temperature of temperature sensor monitors to power amplifier module exceedes design temperature, would automatically turn on radiator fan promptly to lower the temperature, leave operator's time enough for and accelerate water circulating speed, thus reduce the operating temperature of power amplifier module；
4, the novel auxiliary of this use uses air cooling system, can remove in operating room the dust of residual on electronic device；
5, this utility model uses water main to use politef to make, and not only ensure that the intensity of water main but also will not get rusty, and its weight relatively metal is light, reduces the gross weight of solid-state power amplifier.
Accompanying drawing explanation
Accompanying drawing described herein is used for providing being further appreciated by this utility model embodiment, constitutes the part of the application, is not intended that the restriction to this utility model embodiment.In the accompanying drawings:
Fig. 1 is this utility model cross-sectional view.
The parts title of labelling and correspondence in accompanying drawing:
1-housing, 2-heat sink, 3-shower plate, 4-fountain head, 5-water inlet pipe, 6-outlet pipe, 7-power amplifier module, 8-radiator fan, 9-exhaust outlet, 10-blast pipe.
Detailed description of the invention
For making the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with embodiment and accompanying drawing, the utility model is described in further detail, exemplary embodiment of the present utility model and explanation thereof are only used for explaining this utility model, are not intended as restriction of the present utility model.
Embodiment
nullAs shown in Figure 1，This utility model is a kind of water-cooled solid-state power amplifier，Including housing 1，Heat sink 2 it has been horizontally disposed with in housing 1，Heat sink 2 is divided into two parts by internal for housing 1，Heat sink 2 is arranged above operating room，It it is heat dissipation chamber below heat sink 2，The power amplifier module 7 being positioned on heat sink 2 it is provided with in operating room，It is provided with temperature sensor on power amplifier module 7，Power amplifier module 7 is provided above blast pipe 10，Blast pipe 10 is just to power amplifier module 7，Blast pipe 10 runs through the connection of top, operating room radiator fan 8，Top, operating room is provided with some exhaust outlets 9，Shower plate 3 it is provided with on side within heat dissipation chamber，Shower plate 3 connects two sides adjacent with its side, place，Some fountain heads 4 equidistantly it are provided with on shower plate 3，The nozzle of fountain head 4 is straight up，Water pipe within fountain head 4 connects the water main being arranged within shower plate 3，Water main runs through heat dissipation chamber's side connection water inlet pipe 5，Water inlet pipe 5 connects micro pump，Micro pump is connected by water pipe cooler，The outlet pipe 6 being positioned at below shower plate 3 it is provided with outside heat dissipation chamber，Outlet pipe 6 is positioned at the plane of symmetry of side, water inlet pipe 5 place，Outlet pipe 6 connects heat dissipation chamber and cooler.Blast pipe 10 is near the side at water inlet pipe 5 place, and exhaust outlet 9 is near the side at outlet 6 place.Shower plate 3 is 2 to 5 ° with the angle of heat sink 2, and the shower plate 3 distance bottom one end of water inlet pipe 5 with heat dissipation chamber is more than the distance bottom one end of outlet pipe 6 with heat dissipation chamber.It is provided with thermal grease between heat sink 2 and power amplifier module 7.Water main is made up of polymeric material.It is provided with nozzle cover on nozzle, nozzle cover is provided with some through holes.It is provided with ball valve on water inlet pipe 5.Outlet pipe 6 is bottom heat dissipation chamber.When using this device, first turn on micro pump, current enter into water main from water inlet pipe 5, it is sprayed to below heat sink 2 by fountain head 4, heat on power amplifier module 7 and other electronic devices reaches below heat sink 2 above heat sink 2, after current take away the temperature below heat sink 2 by spray, drop down onto on shower plate 3, and the angle tilted along shower plate 3 flows into below shower plate 3, enter in cooler finally by outlet pipe 6, after current are lowered the temperature by cooler, current enter in micro pump, and be again delivered in water inlet pipe 5, complete water circulation；When the operating temperature of the temperature sensor monitors on power amplifier module 7 to power amplifier module 7 exceedes design temperature, would automatically turn on radiator fan 8 promptly to lower the temperature, leave operator's time enough for and accelerate water circulating speed, thus reduce the operating temperature of power amplifier module 7.Because the heat absorption of water and heat conductivility are also more much larger than air cooling system than air well a lot of and water-cooling system total area of dissipations, so the good cooling effect of water-cooling pattern, so that the work efficiency of High-power amplifier module is improved, improve the room for improvement of solid-state power amplifier.
Above-described detailed description of the invention; the purpose of this utility model, technical scheme and beneficial effect are further described; it is it should be understood that; the foregoing is only detailed description of the invention of the present utility model; it is not used to limit protection domain of the present utility model; all within spirit of the present utility model and principle, any modification, equivalent substitution and improvement etc. done, within should be included in protection domain of the present utility model.
Claims (8)
- null1. a water-cooled solid-state power amplifier，Including housing (1)，It is characterized in that，Heat sink (2) it has been horizontally disposed with in described housing (1)，Enclosure interior (1) is divided into two parts by described heat sink (2)，Heat sink (2) is arranged above operating room，Heat sink (2) lower section is heat dissipation chamber，The power amplifier module (7) being positioned on heat sink (2) it is provided with in described operating room，Described power amplifier module is provided with temperature sensor on (7)，Power amplifier module (7) is provided above blast pipe (10)，Described blast pipe (10) is just to power amplifier module (7)，Blast pipe (10) runs through the connection of top, operating room radiator fan (8)，Top, operating room is provided with some exhaust outlets (9)，Shower plate (3) it is provided with on side within described heat dissipation chamber，Described shower plate (3) connects two sides adjacent with its side, place，Some fountain heads (4) equidistantly it are provided with on described shower plate (3)，The nozzle of described fountain head (4) is straight up，The water pipe of fountain head (4) inside connects the water main being arranged on shower plate (3) inside，Described water main runs through heat dissipation chamber's side connection water inlet pipe (5)，Described water inlet pipe (5) connects micro pump，Described micro pump is connected by water pipe cooler，The outlet pipe (6) being positioned at shower plate (3) lower section it is provided with outside heat dissipation chamber，Described outlet pipe (6) is positioned at the plane of symmetry of water inlet pipe (5) side, place，Outlet pipe (6) connection heat dissipation chamber and cooler.
- A kind of water-cooled solid-state power amplifier the most according to claim 1, it is characterised in that described blast pipe (10) is near the side at water inlet pipe (5) place, and exhaust outlet (9) is near the side at outlet (6) place.
- A kind of water-cooled solid-state power amplifier the most according to claim 1, it is characterized in that, described shower plate (3) is 2 to 5 ° with the angle of heat sink (2), and the shower plate (3) distance bottom one end of water inlet pipe (5) with heat dissipation chamber is more than the distance bottom one end of outlet pipe (6) with heat dissipation chamber.
- A kind of water-cooled solid-state power amplifier the most according to claim 1, it is characterised in that be provided with thermal grease between described heat sink (2) and power amplifier module (7).
- A kind of water-cooled solid-state power amplifier the most according to claim 1, it is characterised in that described water main is made up of polymeric material.
- A kind of water-cooled solid-state power amplifier the most according to claim 1, it is characterised in that be provided with nozzle cover on described nozzle, nozzle cover is provided with some through holes.
- A kind of water-cooled solid-state power amplifier the most according to claim 1, it is characterised in that described water inlet pipe is provided with ball valve on (5).
- A kind of water-cooled solid-state power amplifier the most according to claim 1, it is characterised in that described outlet pipe (6) is bottom heat dissipation chamber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620462561.8U CN205792466U (en) | 2016-05-20 | 2016-05-20 | A kind of water-cooled solid-state power amplifier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620462561.8U CN205792466U (en) | 2016-05-20 | 2016-05-20 | A kind of water-cooled solid-state power amplifier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205792466U true CN205792466U (en) | 2016-12-07 |
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ID=58116709
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620462561.8U Expired - Fee Related CN205792466U (en) | 2016-05-20 | 2016-05-20 | A kind of water-cooled solid-state power amplifier |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205792466U (en) |
-
2016
- 2016-05-20 CN CN201620462561.8U patent/CN205792466U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161207 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |