CN205647448U - Solid -state power amplifier of X wave band - Google Patents
Solid -state power amplifier of X wave band Download PDFInfo
- Publication number
- CN205647448U CN205647448U CN201620462556.7U CN201620462556U CN205647448U CN 205647448 U CN205647448 U CN 205647448U CN 201620462556 U CN201620462556 U CN 201620462556U CN 205647448 U CN205647448 U CN 205647448U
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- CN
- China
- Prior art keywords
- power amplifier
- heat dissipation
- state power
- solid
- heat sink
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- Expired - Fee Related
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Abstract
The utility model discloses a solid -state power amplifier of X wave band, which comprises a housin, the level is provided with the heating panel in the casing, the heating panel divide into studio and heat dissipation room with the casing, be provided with X wave band power amplifier module in the studio, it is provided with the main water pipe that is on a parallel with the heating panel to dispel the heat indoor, equidistantly on the main water pipe be provided with a plurality of sprinkler beads, main water pipe one end runs through heat dissipation room side and is connected with the inlet tube, it has the integral type pump that catchments to advance water piping connection, the integral type is catchmented the pump and is led to pipe and be connected with the cooler, it is indoor that the main water pipe other end is located the heat dissipation, the outdoor side of dispelling the heat is provided with the outlet pipe that is located main water pipe below, the outlet pipe lies in inlet tube plane of symmetry laterally, outlet pipe intercommunication heat dissipation room and cooler. The utility model discloses a X wave band power amplifier module of water -cooled mode in to solid -state power amplifier of X wave band carries out the high efficiency cooling for high -power X wave band power amplifier module's work efficiency obtains improving, has promoted solid -state power amplifier of X wave band's improvement space.
Description
Technical field
This utility model relates to a kind of solid-state power amplifier, is specifically related to a kind of X-band solid-state power amplifier.
Background technology
Along with the progress of technology, equip the operating frequency in field military and civilian such as observing and controlling, satellite communication, radar, electronic warfare system, high-tension electricity line walkings at present and reached millimeter wave frequency band.It is positioned at that to launch the high power solid-state power amplifier of channel end most important to systematic function, the aspects such as Measure Precision, communication quality, operating radius and the capacity of resisting disturbance of system are played an important role.The Main Function of solid-state power amplifier is the signal sent will to be needed to be amplified to certain power level, then is wirelessly transmitted to space through antenna, and the key technical indexes includes output, bandwidth of operation and standing-wave ratio etc..Comparing travelling-wave tube amplifier, solid-state power amplifier has obvious advantage, so its application in systems receives the favor of people at aspects such as running voltage, reliability and adaptives capacity to environment.
In frequency is positioned at the phased-array radar of X-band, solid-state power amplifier directly determines the technical parameter of T/R assembly as the afterbody of T/R assembly, its quality.Along with updating of the application systems such as radar, the solid-state power amplifier module developing high-power, high efficiency, high reliability and miniaturization becomes the eager problem needing to solve.But, using chip scale power synthesis, circuit-level power combing or the high power solid state power amplifier module of space power synthesis fabrication techniques further, not only volume and weight is restricted, and its heat stability is also by strict test, in actual applications, requiring very strict to the work efficiency of solid state power amplifier module, the height of its operating temperature will affect the work efficiency of solid state power amplifier module.
Traditional X-band solid-state power amplifier uses air-cooled mode to dispel the heat its power amplifier module carried, but there is the shortcomings such as the heat conductivity of air dielectric is low, area of dissipation is little in air-cooled heat radiation, its radiating effect is bad, the operating temperature of power amplifier module cannot be reduced efficiently, so limiting the further development of high-power X-band solid-state power amplifier.
Utility model content
Technical problem to be solved in the utility model is the defect for traditional X-ray wave band solid-state power amplifier, purpose is to provide a kind of X-band solid-state power amplifier, solves traditional X-band solid-state power amplifier and uses air-cooled mode that its power amplifier module carried carries out heat radiation to cause cannot cooling down the ineffective problem of power amplifier module produced by power amplifier module efficiently.
nullThis utility model is achieved through the following technical solutions: a kind of X-band solid-state power amplifier，Including housing，Heat sink it has been horizontally disposed with in housing，Enclosure interior is divided into two parts by heat sink，Heat sink is arranged above operating room，It it is heat dissipation chamber below heat sink，The X-band power amplifier module being positioned on heat sink it is provided with in operating room，Described heat dissipation chamber is internally provided with the water main being parallel to heat sink，Some fountain heads equidistantly it are provided with on described water main，The nozzle of described fountain head is straight up，Heat dissipation chamber's side connection is run through in water main one end water inlet pipe，Described water inlet pipe connects micropump，Described micropump is connected by water pipe cooler，The water main other end is positioned at heat dissipation chamber，The outlet pipe being positioned at below water main it is provided with outside heat dissipation chamber，Described outlet pipe is positioned at the plane of symmetry of side, water inlet pipe place，Outlet pipe connection heat dissipation chamber and cooler.In prior art, traditional X-band solid-state power amplifier mainly uses air-cooled mode to lower the temperature X-band power amplifier module, it is to avoid its operating temperature is too high affects work efficiency.But, when using traditional radiator fan to dispel the heat, the problem such as the heat conductivity that can run into air dielectric is low, area of dissipation is little, so air-cooled radiating effect is the best, the operating temperature of power amplifier module can not be reduced efficiently, limit the further development of high-power X-band solid-state power amplifier.In order to solve the problems referred to above, this utility model provides a kind of X-band solid-state power amplifier using water-cooled cooling.Being provided with heat sink in the housing of X-band solid-state power amplifier, described heat sink uses the metal that thermal conductivity is high, such as silver, aluminum etc..Heat sink is divided into operating room and heat dissipation chamber by the housing of X-band solid-state power amplifier, places electronic device such as X-band power amplifier module, electric capacity, resistance etc. in operating room, and X-band power amplifier module is prior art；Being provided with water main in heat dissipation chamber, water main is provided with several fountain heads, the nozzle on fountain head faces the bottom of heat sink straight up, and water main connects water inlet pipe, and water inlet pipe is sequentially connected with integral type water collecting pump and cooler, and cooler connects outlet pipe.Micropump and cooler are prior art, all there is the advantage that volume is little, noise is low, can commercially be obtained by purchase, it is possible to use integral type water collecting pump, integral type water collecting pump contains water pump, storage tank and cooler, and Highgrade integration saves space.During work, run micropump so that water flows out and pass sequentially through water inlet pipe, heat dissipation chamber, outlet pipe, cooler from micropump, is eventually returned in micropump, form water circulation.Electronic device and heat sink overlying contact, by heat sink, the high temperature on electronic device is reached below heat sink, water is when flowing through heat dissipation chamber, it is sprayed onto bottom heat sink by fountain head, heat sink is lowered the temperature, after temperature reaches current, current fall bottom heat dissipation chamber and finally flow to cooler cool down from outlet pipe, enter heat dissipation chamber through micropump from water inlet pipe again after cooling.By said structure and principle, it is possible to the electronic device in operating room is lowered the temperature efficiently.The strong reason crossing air cooling system of water-cooling system heat-sinking capability, one heat absorption being because water and heat conductivility are more a lot of than air, two to be because total area of dissipation of water-cooling system also much larger than air cooling system, by lowering the temperature efficiently, so that the work efficiency of high-power X-band power amplifier module is improved, improve the room for improvement of X-band solid-state power amplifier.It addition, water-cooling system also has the feature that noise is little so that X-band solid-state power amplifier can be flexibly applied to military field.
Further, it is provided with thermal grease between heat sink and X-band power amplifier module.Thermal grease has the feature of low thermal resistance, high thermal conductivity, because X-band power amplifier module is critical piece, between itself and heat sink, scribble thermal grease can reduce friction between the two, make both be fully contacted thus improve pyroconductivity so that the heat of X-band power amplifier module is effectively transmitted to heat sink.
Further, water main is made up of polymeric material.Cause water circulating effect poor to prevent water main from getting rusty, water main uses polymeric material such as politef to make, and not only ensure that the intensity of water main, will not get rusty, and lightweight, reduces the gross weight of X-band solid-state power amplifier.
Further, nozzle is provided with nozzle cover, nozzle cover is provided with some through holes.By above-mentioned setting, so that the spray of uniform fluid flow is bottom heat sink, without only spraying the local location bottom heat sink, cause radiating effect poor.
Further, water inlet pipe is provided with ball valve.By arranging ball valve on water inlet pipe, inflow can be adjusted, control water circulating speed so that operator can control the temperature in heat dissipation chamber.
Further, outlet pipe is bottom heat dissipation chamber.So arranging makes current will not pile up bottom heat dissipation chamber.
This utility model compared with prior art, has such advantages as and beneficial effect:
1, the X-band power amplifier module in X-band solid-state power amplifier is lowered the temperature by the way of water-cooled by this utility model, because the heat absorption of water and heat conductivility are also more much larger than air cooling system than air well a lot of and water-cooling system total area of dissipations, so good cooling effect, so that the work efficiency of high-power X-band power amplifier module is improved, improve the room for improvement of X-band solid-state power amplifier；
2, this utility model uses the mode of water-cooled to lower the temperature, and has the advantages that noise is little so that X-band solid-state power amplifier can be flexibly applied to military field；
3, this utility model uses water main to use politef to make, and not only ensure that the intensity of water main but also will not get rusty, and its weight relatively metal is light, reduces the gross weight of X-band solid-state power amplifier.
Accompanying drawing explanation
Accompanying drawing described herein is used for providing being further appreciated by this utility model embodiment, constitutes the part of the application, is not intended that the restriction to this utility model embodiment.In the accompanying drawings:
Fig. 1 is this utility model cross-sectional view.
The parts title of labelling and correspondence in accompanying drawing:
1-housing, 2-heat sink, 3-water main, 4-fountain head, 5-water inlet pipe, 6-outlet pipe, 7-X wave band power amplifier module.
Detailed description of the invention
For making the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with embodiment and accompanying drawing, the utility model is described in further detail, exemplary embodiment of the present utility model and explanation thereof are only used for explaining this utility model, are not intended as restriction of the present utility model.
Embodiment
nullAs shown in Figure 1，This utility model is a kind of X-band solid-state power amplifier，Including housing 1，Heat sink 2 it has been horizontally disposed with in housing 1，Heat sink 2 is divided into two parts by internal for housing 1，Heat sink 2 is arranged above operating room，It it is heat dissipation chamber below heat sink 2，The X-band power amplifier module 7 being positioned on heat sink 2 it is provided with in operating room，Heat dissipation chamber is internally provided with the water main 3 being parallel to heat sink 2，Some fountain heads 4 equidistantly it are provided with on water main 3，The nozzle of fountain head 4 is straight up，Heat dissipation chamber's side connection is run through in water main 3 one end water inlet pipe 5，Water inlet pipe 5 connects micropump，Micropump is connected by water pipe cooler，Water main 3 other end is positioned at heat dissipation chamber，The outlet pipe 6 being positioned at below water main 3 it is provided with outside heat dissipation chamber，Outlet pipe 6 is positioned at the plane of symmetry of side, water inlet pipe 5 place，Outlet pipe 6 connects heat dissipation chamber and cooler.It is provided with thermal grease between heat sink 2 and X-band power amplifier module 7.Water main 3 is made up of polymeric material.It is provided with nozzle cover on nozzle, nozzle cover is provided with some through holes.It is provided with ball valve on water inlet pipe 5.Outlet pipe 6 is bottom heat dissipation chamber.When using this device, first turn on micropump, current enter into water main 3 from water inlet pipe 5, are sprayed to below heat sink 2 by fountain head 4, and the heat on X-band power amplifier module 7 and other electronic devices reaches below heat sink 2 above heat sink 2, after current take away the temperature below heat sink 2 by spray, entering into cooler from outlet pipe 6, after current are lowered the temperature by cooler, current enter in micropump, and be again delivered in water inlet pipe 5, thus complete water circulation.Because the heat absorption of water and heat conductivility are also more much larger than air cooling system than air well a lot of and water-cooling system total area of dissipations, so the good cooling effect of water-cooling pattern, so that the work efficiency of high-power X-band power amplifier module is improved, improve the room for improvement of X-band solid-state power amplifier.
Above-described detailed description of the invention; the purpose of this utility model, technical scheme and beneficial effect are further described; it is it should be understood that; the foregoing is only detailed description of the invention of the present utility model; it is not used to limit protection domain of the present utility model; all within spirit of the present utility model and principle, any modification, equivalent substitution and improvement etc. done, within should be included in protection domain of the present utility model.
Claims (6)
- null1. an X-band solid-state power amplifier，Including housing (1)，It is characterized in that，Heat sink (2) it has been horizontally disposed with in described housing (1)，Described heat sink (2) is divided into two parts by internal for housing (1)，Heat sink (2) is arranged above operating room，Heat sink (2) lower section is heat dissipation chamber，The X-band power amplifier module (7) being positioned on heat sink (2) it is provided with in described operating room，Described heat dissipation chamber is internally provided with the water main (3) being parallel to heat sink (2)，Some fountain heads (4) equidistantly it are provided with on described water main (3)，The nozzle of described fountain head (4) is straight up，Heat dissipation chamber's side connection is run through in water main (3) one end water inlet pipe (5)，Described water inlet pipe (5) connects micropump，Described micropump is connected by water pipe cooler，Water main (3) other end is positioned at heat dissipation chamber，The outlet pipe (6) being positioned at water main (3) lower section it is provided with outside heat dissipation chamber，Described outlet pipe (6) is positioned at the plane of symmetry of water inlet pipe (5) side, place，Outlet pipe (6) connection heat dissipation chamber and cooler.
- A kind of X-band solid-state power amplifier the most according to claim 1, it is characterised in that be provided with thermal grease between described heat sink (2) and X-band power amplifier module (7).
- A kind of X-band solid-state power amplifier the most according to claim 1, it is characterised in that described water main (3) is made up of polymeric material.
- A kind of X-band solid-state power amplifier the most according to claim 1, it is characterised in that be provided with nozzle cover on described nozzle, nozzle cover is provided with some through holes.
- A kind of X-band solid-state power amplifier the most according to claim 1, it is characterised in that described water inlet pipe is provided with ball valve on (5).
- A kind of X-band solid-state power amplifier the most according to claim 1, it is characterised in that described outlet pipe (6) is bottom heat dissipation chamber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620462556.7U CN205647448U (en) | 2016-05-20 | 2016-05-20 | Solid -state power amplifier of X wave band |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620462556.7U CN205647448U (en) | 2016-05-20 | 2016-05-20 | Solid -state power amplifier of X wave band |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205647448U true CN205647448U (en) | 2016-10-12 |
Family
ID=57054727
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620462556.7U Expired - Fee Related CN205647448U (en) | 2016-05-20 | 2016-05-20 | Solid -state power amplifier of X wave band |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205647448U (en) |
-
2016
- 2016-05-20 CN CN201620462556.7U patent/CN205647448U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161012 |