CN205648194U - High transmission frequency's circuit board - Google Patents
High transmission frequency's circuit board Download PDFInfo
- Publication number
- CN205648194U CN205648194U CN201620360837.1U CN201620360837U CN205648194U CN 205648194 U CN205648194 U CN 205648194U CN 201620360837 U CN201620360837 U CN 201620360837U CN 205648194 U CN205648194 U CN 205648194U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- substrate
- shrinkage pool
- transmission frequency
- base plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Structure Of Printed Boards (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model provides a high transmission frequency's circuit board, the insulating layer material of circuit board is ceramic material, and the base plate lateral wall of circuit board is provided with the metal level, be provided with the dark milling flutes of accuse on the base plate, control dark milling flutes inner wall and be provided with the metal level, be provided with the shrinkage pool on the base plate of circuit board, be equipped with on the insulating layer with the base plate on the supporting arch of shrinkage pool, the shrinkage pool inner wall is provided with the damping layer, and protruding surface is provided with the damping layer. The lateral wall of circuit board has carried out the metallization to be handled, and the electromagnetic interference that produces when being favorable to avoiding the high -speed signal transmission guarantees signal transmission's quality, can not the error code distortion, and the dark milling flutes of accuse has been carried out to high -frequency device installation region, imbeds this inslot during this device installation, controls dark milling flutes lateral wall and has carried out the metallization and handle, is favorable to avoiding the signal loss.
Description
Technical field
This utility model relates to PCB field, the circuit board of a kind of high-transmission frequency.
Background technology
The title of circuit board has: wiring board, pcb board, aluminium base, high frequency plate, thick copper coin,
Impedance plate, PCB, ultra-thin wiring board, ultrathin circuit board, prints (copper lithographic technique) circuit
Plate etc..Circuit board makes circuit miniaturization, intuitively changes, for the batch production of permanent circuit and excellent
Change electrical appliance layout to play an important role.Circuit board can be described as printed substrate or printed circuit board (PCB),
English name is PCB.
After electronic equipment uses circuit board, due to the concordance of homogeneous circuit plate, thus avoid
The mistake of artificial wiring, and can realize the automatic plug-in mounting of electronic devices and components or attachment, automatic tin soldering,
Automatically detection, it is ensured that the quality of electronic equipment, improves labor productivity, reduces cost,
And it is easy to maintenance.
Summary of the invention
This utility model mainly solves the technical problem that the electricity being to provide a kind of high-transmission frequency
Road plate.
This utility model is that the technical scheme solving the employing of above-mentioned technical problem is:
The circuit board of a kind of high-transmission frequency, the insulating barrier material of circuit board is ceramic material, electricity
The substrate sidewall of road plate is provided with metal level；Controlled depth milling groove it is provided with, in controlled depth milling groove on substrate
Wall is provided with metal level；
Being provided with shrinkage pool on the substrate of circuit board, insulating barrier is provided with supporting with the shrinkage pool on substrate
Projection；Shrinkage pool inwall is provided with damping layer, and convex surfaces is provided with damping layer.
Further, described substrate material is ceramic material.
Further, described damping layer material is silicone rubber.
Further, described substrate being provided with leakage detector, described leakage detector connects
There is siren.
The beneficial effects of the utility model are:
1., by using ceramic material, signal can be made to transmit the frequency reaching the highest, the soonest may be used
To arrive more than 10GHZ.
2. the sidewall of wiring board has carried out metalized, when being conducive to avoiding high speed transmission of signals
Produce electromagnetic interference, it is ensured that signal transmission quality, will not error code distortion, altofrequency device
Installation region has carried out controlled depth milling groove, and this device embeds in this groove when installing, controlled depth milling groove sidewall
Carry out metalized, be conducive to avoiding loss of signal.
3. by groove and the setting of projection, it is ensured that the connection between insulating barrier and substrate
Fixing.
Accompanying drawing explanation
Fig. 1 is the side view of a kind of detailed description of the invention of this utility model.
Fig. 2 is the generalized section of the controlled depth milling groove of altofrequency device mounting area.
In figure: 11 is substrate, 12 is substrate, and 21 is metal level, and 22 is metal level, and 3 are
Insulating barrier, 4 is protruding, and 5 is shrinkage pool, and 6 is controlled depth milling groove, and 7 is metal level.
Detailed description of the invention
Refer to Fig. 1, for this utility model one detailed description of the invention.
The circuit board of a kind of high-transmission frequency, the insulating barrier material of circuit board is ceramic material, electricity
Substrate 11 and substrate 12 sidewall of road plate are provided with metal level 21 and metal level 22；On substrate
Being provided with controlled depth milling groove 6, controlled depth milling groove inwall is provided with metal level 7；On the substrate of circuit board
Being provided with shrinkage pool, insulating barrier 3 is provided with the projection 4 supporting with the shrinkage pool 5 on substrate；Shrinkage pool
Inwall is provided with damping layer, and convex surfaces is provided with damping layer.
Substrate material is ceramic material.Damping layer material is silicone rubber.Electric leakage it is provided with on substrate
Detector, described leakage detector connects siren.
By using ceramic material, signal can be made to transmit the frequency reaching the highest, the most permissible
Arrive more than 10GHZ.
The sidewall of wiring board has carried out metalized, is conducive to avoiding producing during high speed transmission of signals
Raw electromagnetic interference, it is ensured that the quality of signal transmission, will not error code distortion, altofrequency device is pacified
Dress region has carried out controlled depth milling groove, and this device embeds in this groove when installing, and controlled depth milling groove sidewall enters
Go metalized, be conducive to avoiding loss of signal.
By groove and the setting of projection, it is ensured that the connection between insulating barrier and substrate is solid
Fixed.
Circuit board intermediate insulating material employs the epoxide resin material containing ceramics, its substrate-side
Wall has carried out metalized；
The circuit board work flow of high-transmission frequency of the present utility model
→ milling → deburring → metallization → figure transfer → graphic plating → control of holing is deep
Milling → outer layer etching.
Claims (4)
1. the circuit board of a high-transmission frequency, it is characterised in that: the insulating barrier of described circuit board
Material is ceramic material, and the substrate sidewall of described circuit board is provided with metal level；On described substrate
Being provided with controlled depth milling groove, described controlled depth milling groove inwall is provided with metal level；
Be provided with shrinkage pool on the substrate of described circuit board, described insulating barrier be provided with on substrate
The projection that shrinkage pool is supporting；Described shrinkage pool inwall is provided with damping layer, and described convex surfaces is provided with
Damping layer.
The circuit board of high-transmission frequency the most according to claim 1, it is characterised in that: institute
Stating substrate material is ceramic material.
The circuit board of high-transmission frequency the most according to claim 1, it is characterised in that: institute
Stating damping layer material is silicone rubber.
The circuit board of high-transmission frequency the most according to claim 1, it is characterised in that: institute
Stating and be provided with leakage detector on substrate, described leakage detector connects siren.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620360837.1U CN205648194U (en) | 2016-04-25 | 2016-04-25 | High transmission frequency's circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620360837.1U CN205648194U (en) | 2016-04-25 | 2016-04-25 | High transmission frequency's circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205648194U true CN205648194U (en) | 2016-10-12 |
Family
ID=57064044
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620360837.1U Expired - Fee Related CN205648194U (en) | 2016-04-25 | 2016-04-25 | High transmission frequency's circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205648194U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107318225A (en) * | 2017-08-02 | 2017-11-03 | 常熟东南相互电子有限公司 | Combined type multilayer circuit board |
| CN111225496A (en) * | 2020-01-10 | 2020-06-02 | 东莞市五株电子科技有限公司 | Metal half-clad structure, manufacturing process and PCB |
-
2016
- 2016-04-25 CN CN201620360837.1U patent/CN205648194U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107318225A (en) * | 2017-08-02 | 2017-11-03 | 常熟东南相互电子有限公司 | Combined type multilayer circuit board |
| CN107318225B (en) * | 2017-08-02 | 2019-12-17 | 常熟东南相互电子有限公司 | Composite multilayer circuit board |
| CN111225496A (en) * | 2020-01-10 | 2020-06-02 | 东莞市五株电子科技有限公司 | Metal half-clad structure, manufacturing process and PCB |
| CN111225496B (en) * | 2020-01-10 | 2023-03-10 | 东莞市五株电子科技有限公司 | Manufacturing process of metal semi-clad structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161012 Termination date: 20210425 |