CN107046772A - A kind of manufacture method of bare chip embedded circuit board - Google Patents
A kind of manufacture method of bare chip embedded circuit board Download PDFInfo
- Publication number
- CN107046772A CN107046772A CN201710394877.7A CN201710394877A CN107046772A CN 107046772 A CN107046772 A CN 107046772A CN 201710394877 A CN201710394877 A CN 201710394877A CN 107046772 A CN107046772 A CN 107046772A
- Authority
- CN
- China
- Prior art keywords
- copper
- layers
- aluminium
- bare chip
- blind hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
Abstract
The present invention relates to a kind of manufacture method of bare chip embedded circuit board, including：Blind hole is opened up in core, conducting resinl is set in blind hole；Bare chip is placed in blind hole；Wherein, the one side of bare chip has aluminium electrode, and another side is non-aluminium electrode；Aluminium electrode at least includes three-layer metal layer：Aluminium lamination, layers of copper, aluminium lamination, layers of copper are located at intermediate layer；And make the surface mount with non-aluminium electrode of bare chip on conducting resinl；Dielectric, fixed electronic component are filled in gap of the side of bare chip with the side of blind hole；The aluminium lamination on aluminium electrode surface is removed, layers of copper is spilt, in 2 two sides copper facing of core；Make the circuit on core two sides.Before bare chip enters board production technique, addition layers of copper, aluminium lamination on aluminium electrode layer, the aluminium lamination on layers of copper surface is in circuit-board processes processing, it can be removed by pre-treatment, spill layers of copper, layers of copper can adapt to the technological process of production of circuit, and the electronic component with aluminium electrode can be made compatible with the manufacture craft of circuit board.
Description
Technical field
The present invention relates to circuit board production techniques field, and in particular to a kind of manufacturer of bare chip embedded circuit board
Method.
Background technology
In conventional power electronic modules, power source semiconductor chip, such as MOSFET or igbt chip generally use lead
Bonding pattern and substrate connection.However, due to its longer interconnection dimensions, easily produced in Switching Power Supply larger stress and
Larger electromagnetic interference (EMI) noise.In addition, with the fast development of power electronics semiconductor device, switching frequency is increasingly
Height, device volume further reduces, and influence of the parasitic parameter to power source performance and reliability is also more and more significant, the power consumption of device
Also it is increasing.Power supply chip is directly embedded to printed wire intralamellar part, problem above can be effectively solved.
But, power supply chip generally comprises the electrode (hereinafter referred to as aluminium electrode) of aluminium material, and the chemical property of aluminium is determined
Aluminium electrode can not be compatible with the manufacture craft of circuit board, and such as aluminium electrode surface can not use processing blind hole by laser, and aluminium electrode exist
It can be damaged in the techniques such as etching by chemicals attack.
The content of the invention
The technical problem to be solved in the present invention is：The embodiment of the present invention provides a kind of manufacture of bare chip embedded circuit board
Method, can make the electronic component with aluminium electrode compatible with the manufacture craft of circuit board.
A kind of manufacture method of bare chip embedded circuit board, including：A. blind hole is opened up in the core of circuit board, in blind hole
Interior setting conducting resinl；B. bare chip is placed in blind hole；Wherein, the one side of bare chip has aluminium electrode, and another side is non-aluminum electricity
Pole；Aluminium electrode at least includes three-layer metal layer：Aluminium lamination, layers of copper, aluminium lamination, layers of copper are located at intermediate layer, the thickness of layers of copper 5um with
On；And make the surface mount with non-aluminium electrode of bare chip on conducting resinl；C. in the side of bare chip and the side of blind hole
Gap in fill dielectric, fixed electronic component；D. pre-electroplating treatment, removes the aluminium lamination on aluminium electrode surface, spills layers of copper,
In 2 two sides copper facing of core；E. the circuit on core two sides is made.
It is preferred that, after step E, in addition to：
F. by the core for having made circuit and other copper-clad plate pressing, drilling, plating for having made circuit, make conductive
Hole and surface line.
It is preferred that, step C includes：C1：Photosensitive resin is printed in the one side of the core of embedment electronic component；C2：By exposing
Photodevelopment solidifies the side of electronic component with the photosensitive resin in the gap of the side of blind hole, removes the photosensitive tree at other positions
Fat, spills aluminium electrode.
It is preferred that, also include before step A：A1：Etch the layers of copper on blind hole two sides and blind hole periphery；Also wrapped after step C2
Include：C3：Photosensitive resin is ground to concordant with the layers of copper of core.
It is preferred that, the another side of bare chip is copper electrode, gold electrode, silver electrode or NiPdAu electrode.
It is preferred that, the interface of layers of copper and bottom aluminium lamination and upper strata aluminium lamination is provided with the pit that camber is 1~2um and convex
Rise, the aluminium of aluminium lamination and the copper of layers of copper, which interlock, fills and leads up pit and projection.
The beneficial effects of the invention are as follows：A kind of manufacture method of bare chip embedded circuit board, including：A. in circuit board
Core opens up blind hole, and conducting resinl is set in blind hole；B. bare chip is placed in blind hole；Wherein, the one side of bare chip has aluminium
Electrode, another side is non-aluminium electrode；Aluminium electrode at least includes three-layer metal layer：Aluminium lamination, layers of copper, aluminium lamination, layers of copper are located at intermediate layer,
The thickness of layers of copper is in more than 5um；And make the surface mount with non-aluminium electrode of bare chip on conducting resinl；C. in bare chip
Side is with filling dielectric, fixed electronic component in the gap of the side of blind hole；D. pre-electroplating treatment, removes aluminium electrode surface
Aluminium lamination, layers of copper is spilt, in 2 two sides copper facing of core；E. the circuit on core two sides is made.Enter board production in bare chip
Before technique, increase in the production process of aluminium electrode, layers of copper is added on aluminium electrode layer, while in order to widely adapt to
Property, add aluminium lamination again in layers of copper, the aluminium lamination on layers of copper surface can be removed in circuit-board processes processing by pre-treatment, leak
Go out layers of copper, layers of copper can adapt to the technological process of production of circuit, the system of electronic component and circuit board with aluminium electrode can be made
Make process compatible.
Brief description of the drawings
The manufacture method to the bare chip embedded circuit board of the present invention is described further below in conjunction with the accompanying drawings.
Fig. 1 is a kind of flow chart of the manufacture method of bare chip embedded circuit board of the invention.
Embodiment
A kind of manufacture method of bare chip embedded circuit board of 1 couple of present invention is described further below in conjunction with the accompanying drawings.
A kind of manufacture method of bare chip embedded circuit board, including：A. blind hole is opened up in the core of circuit board, in blind hole
Interior setting conducting resinl；B. bare chip is placed in blind hole；Wherein, the one side of bare chip has aluminium electrode, and another side is non-aluminum electricity
Pole；Aluminium electrode at least includes three-layer metal layer：Aluminium lamination, layers of copper, aluminium lamination, layers of copper are located at intermediate layer, the thickness of layers of copper 5um with
On；And make the surface mount with non-aluminium electrode of bare chip on conducting resinl；C. in the side of bare chip and the side of blind hole
Gap in fill dielectric, fixed electronic component；D. pre-electroplating treatment, removes the aluminium lamination on aluminium electrode surface, spills layers of copper,
In 2 two sides copper facing of core；E. the circuit on core two sides is made.
Before bare chip enters board production technique, increase in the production process of aluminium electrode, in aluminium electrode layer
Upper addition layers of copper, while for extensive adaptability, adding aluminium lamination again in layers of copper, the aluminium lamination on layers of copper surface is in circuit-board processes
It in processing, can be removed by pre-treatment, spill layers of copper, layers of copper can adapt to the technological process of production of circuit, can make to carry
The electronic component of aluminium electrode is compatible with the manufacture craft of circuit board.
It is preferred that, after step E, in addition to：
F. by the core for having made circuit and other copper-clad plate pressing, drilling, plating for having made circuit, make conductive
Hole and surface line.
It is preferred that, step C includes：C1：Photosensitive resin is printed in the one side of the core of embedment electronic component；C2：By exposing
Photodevelopment solidifies the side of electronic component with the photosensitive resin in the gap of the side of blind hole, removes the photosensitive tree at other positions
Fat, spills aluminium electrode.
It is preferred that, also include before step A：A1：Etch the layers of copper on blind hole two sides and blind hole periphery；Also wrapped after step C2
Include：C3：Photosensitive resin is ground to concordant with the layers of copper of core.
It is preferred that, the another side of bare chip is copper electrode, gold electrode, silver electrode or NiPdAu electrode.
It is preferred that, the interface of layers of copper and bottom aluminium lamination and upper strata aluminium lamination is provided with the pit that camber is 1~2um and convex
Rise, the aluminium of aluminium lamination and the copper of layers of copper, which interlock, fills and leads up pit and projection.
The present invention's is not limited to above-described embodiment, and the technical scheme of each above-mentioned embodiment of the invention can be handed over each other
Fork combination forms new technical scheme, and the technical scheme of all use equivalent substitution formation, all falls within the guarantor of application claims in addition
In the range of shield.
Claims (6)
1. a kind of manufacture method of bare chip embedded circuit board, it is characterised in that including：
A. blind hole is opened up in the core of circuit board, conducting resinl is set in the blind hole；
B. bare chip is placed in the blind hole；
Wherein, the one side of bare chip has aluminium electrode, and another side is non-aluminium electrode；The aluminium electrode at least includes three-layer metal
Layer：Aluminium lamination, layers of copper, aluminium lamination, the layers of copper are located at intermediate layer, and the thickness of the layers of copper is in more than 5um；
And make the surface mount with non-aluminium electrode of the bare chip on the conducting resinl；
C. dielectric, the fixed electronics member are filled in gap of the side of the bare chip with the side of the blind hole
Part；
D. pre-electroplating treatment, removes the aluminium lamination on the aluminium electrode surface, layers of copper is spilt, in 2 two sides copper facing of the core；
E. the circuit on core two sides is made.
2. manufacture method according to claim 1, it is characterised in that after the step E, in addition to：
F. by the core for having made circuit and other copper-clad plate pressing, drilling, plating for having made circuit, make conductive
Hole and surface line.
3. manufacture method according to claim 1, it is characterised in that the step C includes：
C1：Photosensitive resin is printed in the one side of the core of embedment electronic component；
C2：The side of the electronic component is consolidated with the photosensitive resin in the gap of the side of the blind hole by exposure imaging
Change, remove the photosensitive resin at other positions, spill aluminium electrode.
4. manufacture method according to claim 3, it is characterised in that also include before the step A：
A1：Etch the layers of copper on the blind hole two sides and blind hole periphery；
Also include after the step C2：
C3：The photosensitive resin is ground to concordant with the layers of copper of core.
5. manufacture method according to claim 1, it is characterised in that the another side of the bare chip is copper electrode, gold electricity
Pole, silver electrode or NiPdAu electrode.
6. manufacture method according to claim 1, it is characterised in that the layers of copper and the friendship of bottom aluminium lamination and upper strata aluminium lamination
Interface is provided with the pit and projection that camber is 1~2um, the aluminium of the aluminium lamination and the copper of layers of copper interlock fill and lead up the pit and
It is raised.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710394877.7A CN107046772A (en) | 2017-05-30 | 2017-05-30 | A kind of manufacture method of bare chip embedded circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710394877.7A CN107046772A (en) | 2017-05-30 | 2017-05-30 | A kind of manufacture method of bare chip embedded circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107046772A true CN107046772A (en) | 2017-08-15 |
Family
ID=59547295
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710394877.7A Pending CN107046772A (en) | 2017-05-30 | 2017-05-30 | A kind of manufacture method of bare chip embedded circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107046772A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112509933A (en) * | 2021-02-04 | 2021-03-16 | 广东科翔电子科技股份有限公司 | Process method for fully embedding components on IC carrier plate |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102300417A (en) * | 2011-08-10 | 2011-12-28 | 深南电路有限公司 | Electronic component embedded type circuit board and manufacture method thereof |
| CN102348328A (en) * | 2011-09-15 | 2012-02-08 | 深南电路有限公司 | Chip embedding method and chip-embedded circuit board |
| US9508905B2 (en) * | 2010-12-22 | 2016-11-29 | Linxens Holding | Circuit for a light emitting component and method of manufacturing the same |
-
2017
- 2017-05-30 CN CN201710394877.7A patent/CN107046772A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9508905B2 (en) * | 2010-12-22 | 2016-11-29 | Linxens Holding | Circuit for a light emitting component and method of manufacturing the same |
| CN102300417A (en) * | 2011-08-10 | 2011-12-28 | 深南电路有限公司 | Electronic component embedded type circuit board and manufacture method thereof |
| CN102348328A (en) * | 2011-09-15 | 2012-02-08 | 深南电路有限公司 | Chip embedding method and chip-embedded circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112509933A (en) * | 2021-02-04 | 2021-03-16 | 广东科翔电子科技股份有限公司 | Process method for fully embedding components on IC carrier plate |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170815 |
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| WD01 | Invention patent application deemed withdrawn after publication |