CN205622972U - Multilayer soft board formula structure that changes - Google Patents
Multilayer soft board formula structure that changes Download PDFInfo
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- CN205622972U CN205622972U CN201620201753.3U CN201620201753U CN205622972U CN 205622972 U CN205622972 U CN 205622972U CN 201620201753 U CN201620201753 U CN 201620201753U CN 205622972 U CN205622972 U CN 205622972U
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- copper foil
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Abstract
The utility model discloses a multilayer soft board formula structure that changes, include copper foil layer, tectorial membrane layer and be used for bonding the copper foil layer with the pure glue film on tectorial membrane layer, the copper foil layer includes the first copper foil layer of the central core of multilayer soft board, second copper foil layer and third copper foil layer, the copper foil layer includes the substrate layer of the central core of copper foil layer and locating respectively the copper layer of substrate layer positive and negative, the second copper foil layer with in the no copper region on the third copper foil layer relative position the substrate layer with pure glue film directly bonds. The utility model discloses cancellation laser cutting and tear the process except that the waste material has realized the simplification production procedure, reduces the operating cost and because of cutting the improper short circuit that causes or the risk that opens circuit.
Description
Technical field
This utility model belongs to printed circuit technique field, and the multilamellar particularly relating to a kind of portable type scanner unit is soft
Plate stacked structure.
Background technology
Along with electronic product is to the development that becomes more meticulous, when design, the functional requirement to flexible board gets more and more,
The number of plies of plate is increasing, and thickness is increasing, but because of the needs of bending, it is desirable to local is done thin, in order to product group
During dress, it is easier to bending.Existing flexible board includes at least two-layer flex circuit plate, any two sheets of flexible
Pure glue-line and overlay film it is provided with between circuit board, pure glue-line simultaneously bonding flexible PCB, the bonding overlay film of another side,
Pure glue-line between flexible PCB and overlay film is provided with the seal area without pure glue, and the outer layer of flexible PCB sets
There is overlay film, thin owing to requiring local to do, cut need to be used, partly cut through to epoxy free package district, processing is torn
Except waste material, because being to use laser hemisect, the thickness of cutting, at below 0.1mm, has easily switched to active layer,
Causing product short circuit or the hidden danger of open circuit, furthermore remove waste material after partly cutting through and be difficult to, the face that easily removes is irregular,
Causing bad order, laser work cost is high in addition.
Utility model content
The purpose of this utility model is to solve above-mentioned technical problem, and provides a kind of multilamellar soft board stacked knot
Structure, thus realize simplifying production procedure, reduce operating cost and defective products produces.In order to achieve the above object,
Technical solutions of the utility model are as follows:
A kind of multilamellar soft board stacked structure, including copper foil layer, coating layer and for bonding described copper foil layer and institute
State the pure glue-line of coating layer；Described copper foil layer includes the first copper foil layer, the second copper foil layer and the 3rd copper foil layer；
Described coating layer includes the first coating layer with described first copper foil layer front pressing and described first copper foil layer
Second coating layer of reverse side pressing；Second copper foil layer described in the front pressing of described first coating layer, described
3rd copper foil layer described in the reverse side pressing of two coating layers；Described pure glue-line includes that bonding described first coating layer is anti-
Face and described first copper foil layer front and bonding described second coating layer front and described first copper foil layer reverse side
The first pure glue-line and bonding described first coating layer front and described second copper foil layer reverse side and bonding
Described second coating layer reverse side and the second pure glue-line in described 3rd copper foil layer front；Described copper foil layer includes institute
State the substrate layer of the central core of copper foil layer and be respectively arranged on the layers of copper of described substrate layer positive and negative, described second bronze medal
Layers of foil and described 3rd copper foil layer are provided with the region without copper without described layers of copper, described region without copper relative to position
In described substrate layer the most bonding with described second pure glue-line.
Concrete, described coating layer also include the front pressing with described second copper foil layer the 3rd coating layer,
And the 4th coating layer of the reverse side pressing with described 3rd copper foil layer.
Concrete, described pure glue-line also includes the 3rd pure glue-line, described 3rd pure glue-line the most bonding described the
Two copper foil layer fronts and described 3rd coating layer reverse side and bonding described 3rd copper foil layer reverse side and the described 4th
Coating layer front.
Concrete, described 3rd coating layer and described 4th coating layer are equipped with and communicate with described region without copper
Opening.
Concrete, described copper foil layer is any one in calendering copper and electrolytic copper foil.
Concrete, described pure glue-line uses epoxide-resin glue to make.
Concrete, described coating layer and described substrate layer all use polyimides to make.
Compared with prior art, the having the advantages that of this utility model multilamellar soft board stacked structure:
Change original repeatedly structure, need the waste material layer of excision, pure glue-line with substitutes bonding with pure glue-line of the PI layer in Copper Foil
All cover former epoxy free package district；After change repeatedly structure, cancel cut and remove the process of waste material, it is achieved
Simplification production procedure, reduces operating cost and because cutting the improper short circuit caused or open circuit risk.
Accompanying drawing explanation
Fig. 1 is the structural representation of this utility model embodiment；
In figure, numeral represents:
1 first copper foil layer, 10 substrate layers, 11 second copper foil layers, 12 the 3rd copper foil layers, 2 first coating layers,
21 second coating layers, 22 the 3rd coating layers, 23 the 4th coating layers, 3 first pure glue-lines, 31 second pure glue-lines,
32 the 3rd pure glue-lines.
Detailed description of the invention
Technical scheme in this utility model embodiment will be carried out clear, complete description below in conjunction with the accompanying drawings,
Obviously, described embodiment is only a part of embodiment of this utility model rather than whole embodiments.
Embodiment:
With reference to shown in Fig. 1, the present embodiment is a kind of multilamellar soft board stacked structure, including copper foil layer, coating layer
With the pure glue-line for bonding copper foil layer and coating layer；Copper foil layer includes the first bronze medal of the central core of multilamellar soft board
Layers of foil 1, the second copper foil layer 11 and the 3rd copper foil layer 12；Coating layer includes and the first copper foil layer 1 front pressure
The first coating layer 2 and the second coating layer 21 of the first copper foil layer 1 reverse side pressing closed；First coating layer 2
Front pressing the second copper foil layer 11, reverse side pressing the 3rd copper foil layer 12 of the second coating layer 21；Pure glue-line
Including bonding first coating layer 2 reverse side and the first copper foil layer 1 front and bonding second coating layer 21 front and
First pure glue-line 3 of the first copper foil layer 1 reverse side and bonding first coating layer 2 front and the second copper foil layer
11 reverse side and bonding second coating layer 21 reverse side and the second pure glue-line 31 in the 3rd copper foil layer 12 front；Copper
Layers of foil includes the substrate layer 10 of the central core of copper foil layer and is respectively arranged on the layers of copper of substrate layer 10 positive and negative, the
Two copper foil layers 11 offer without copper region on the 3rd relative position of copper foil layer 12, the second copper foil layer 11 and
Substrate layer 10 in three copper foil layers 12 is mutually bonding with the second pure glue-line 31.Coating layer also includes and the second Copper Foil
3rd coating layer 22 of the front pressing of layer 11 and the 4th overlay film of the reverse side pressing with the 3rd copper foil layer 12
Layer 23.Pure glue-line also includes bonding second copper foil layer 11 front and the 3rd coating layer 22 reverse side and bonding
3rd copper foil layer 12 reverse side and the 3rd pure glue-line 32 in the 4th coating layer 23 front.3rd coating layer 22 and
Four overlay films 23 layers are equipped with opening, opening and the second copper foil layer 11 and position, region without copper of the 3rd copper foil layer 12
Put and communicate.
In the present embodiment, copper foil layer is any one in calendering copper and electrolytic copper foil, and pure glue-line uses
Epoxide-resin glue is made, and coating layer and substrate layer 10 all use polyimides to make.By changing original multilamellar
The repeatedly structure of soft board, needs the waste material layer of excision, pure glue with substitute bonding with pure glue-line of the substrate layer in copper foil layer
Floor all covers former epoxy free package district；After directly the mechanical-moulded change of employing changes structure, cancel cut and tear
Process except waste material, it is achieved that simplify production procedure, reduces operating cost and because cutting the improper short circuit caused
Or open circuit risk.
Above-described is only embodiments more of the present utility model.For those of ordinary skill in the art
For, on the premise of creating design without departing from this utility model, it is also possible to make some deformation and improvement,
These broadly fall into protection domain of the present utility model.
Claims (7)
1. a multilamellar soft board stacked structure, it is characterised in that: include copper foil layer, coating layer and for bonding described
Copper foil layer and the pure glue-line of described coating layer；Described copper foil layer includes the first copper foil layer, the second copper foil layer and
3rd copper foil layer；Described coating layer includes the first coating layer with described first copper foil layer front pressing and institute
State the second coating layer of the first copper foil layer reverse side pressing；Second bronze medal described in the front pressing of described first coating layer
Layers of foil, the 3rd copper foil layer described in the reverse side pressing of described second coating layer；Described pure glue-line includes bonding described
First coating layer reverse side and described first copper foil layer front and bonding described second coating layer front and described
First pure glue-line of one copper foil layer reverse side and bonding described first coating layer front and described second copper foil layer
Reverse side and bonding described second coating layer reverse side and the second pure glue-line in described 3rd copper foil layer front；Described
Copper foil layer includes the substrate layer of the central core of described copper foil layer and is respectively arranged on the copper of described substrate layer positive and negative
Layer, described second copper foil layer and described 3rd copper foil layer are provided with the region without copper without described layers of copper relative to position,
Described substrate layer in described region without copper is the most bonding with described second pure glue-line.
Multilamellar soft board stacked structure the most according to claim 1, it is characterised in that: described coating layer also includes
3rd coating layer of the front pressing with described second copper foil layer and the reverse side pressing with described 3rd copper foil layer
The 4th coating layer.
Multilamellar soft board stacked structure the most according to claim 2, it is characterised in that: described pure glue-line also includes
3rd pure glue-line, described 3rd pure glue-line bonding described second copper foil layer front and described 3rd coating layer respectively
Reverse side and bonding described 3rd copper foil layer reverse side and described 4th coating layer front.
Multilamellar soft board stacked structure the most according to claim 2, it is characterised in that: described 3rd coating layer and
Described 4th coating layer is equipped with the opening communicated with described region without copper.
Multilamellar soft board stacked structure the most according to claim 1, it is characterised in that: described copper foil layer is calendering
Any one in copper and electrolytic copper foil.
Multilamellar soft board stacked structure the most according to claim 1, it is characterised in that: described pure glue-line uses ring
Epoxy resins glue is made.
Multilamellar soft board stacked structure the most according to claim 1, it is characterised in that: described coating layer and described
Substrate layer all uses polyimides to make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620201753.3U CN205622972U (en) | 2016-03-16 | 2016-03-16 | Multilayer soft board formula structure that changes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620201753.3U CN205622972U (en) | 2016-03-16 | 2016-03-16 | Multilayer soft board formula structure that changes |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205622972U true CN205622972U (en) | 2016-10-05 |
Family
ID=57030937
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620201753.3U Active CN205622972U (en) | 2016-03-16 | 2016-03-16 | Multilayer soft board formula structure that changes |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205622972U (en) |
-
2016
- 2016-03-16 CN CN201620201753.3U patent/CN205622972U/en active Active
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