CN205621708U - A supporting component for bearing weight of wafer - Google Patents
A supporting component for bearing weight of wafer Download PDFInfo
- Publication number
- CN205621708U CN205621708U CN201620389263.0U CN201620389263U CN205621708U CN 205621708 U CN205621708 U CN 205621708U CN 201620389263 U CN201620389263 U CN 201620389263U CN 205621708 U CN205621708 U CN 205621708U
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- CN
- China
- Prior art keywords
- peel ply
- glue
- carrier band
- support component
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a supporting component for bearing weight of wafer, include: a support piece, support piece include a stainless steel layer and a glue film, and the glue film sets up in the lower surface on stainless steel layer for bind the wafer, one peels off the piece, laminates in support piece below, peels off including a peel ply and sets up in a carrier band of peel ply below, and peel ply strippably laminates in the below of glue film, and the carrier band has a bonding coat and binds mutually with the peel ply, and the area of bonding coat is greater than or equals the area of peel ply. The utility model discloses owing to add the one deck peel ply between glue film and the carrier band, therefore the glue film can not stick the carrier band, improves from this and misprints and deformations problems. In addition, because the area of bonding coat is greater than or equals the area of peel ply, the position that need not accurate counterpoint support piece sets up the bonding coat of small size, when guaranteeing that peel ply and carrier band well bind, can simplify manufacturing process.
Description
Technical field
This utility model relates to a kind of support component, refers in particular to an a kind of support component for bearing wafer.
Background technology
Wafer refers to the silicon wafer used by the making of silicon semiconductor IC, owing to it is generally circular in shape, therefore referred to as wafer.
Some little wafers are cut in wafer segmentation, and different wafers is combined encapsulation can manufacture various circuit component structure, and
Become the IC product having certain electric sexual function.
Be currently used for supporting these little wafers a support component its generally include supporter and be arranged at supporting body surface
Glue-line, this support component is made by following technique: ribbon supporting body surface is coated with one layer of glue, then by above-mentioned overall patch
It is bonded on banded carrier band, utilizes half clicking technique, by support body layer and glue-line according to multiple of the die-cut formation of preliminary dimension
Support member (product), and carry and do not cut off, and unnecessary waste material (including support body layer and glue-line) is peeled off eliminating from carrier band.?
Before bonded wafer or when being transferred in particular bearer dish, utilize sucker support member is adsorbed with by support member (product) from
Peel off on carrier band.
Owing to glue-line has certain mobility, it can overflow when being squeezed.Spilling part increases product and load
The contact area of interband, and overflow part and easily fitted with carrier band by the directly extruding of mould, form extruding land, squeeze
The absorption affinity of pressure land is more higher than other fit areas, therefore, is unfavorable for that support member is adsorbed by sucker: work as sucker suction
When power is the least, product can not inhaled；If increase absorption affinity, product can deform or folding line, have a strong impact on product quality.This
Outward, owing to the ductility of glue-line is strong, situation about not completely cutting through likely occurs during hemisection, time serious, easily make product with useless
Expect inter-adhesive, cause product to be together stripped when waste discharge.
Therefore, it is necessary to design a kind of new support component for bearing wafer, to overcome the problems referred to above.Summary of the invention
Creation purpose of the present utility model is to provide an a kind of support component for bearing wafer, when it can reduce stripping
Absorption affinity and reduction misprint rate.
In order to achieve the above object, this utility model adopts the following technical scheme that a kind of support group for bearing wafer
Part, including: a support member, described support member includes a stainless steel layer and a glue-line, and described glue-line is arranged at described rustless steel
The lower surface of layer, is used for binding wafer；One release member, fits in below described support member, and described release member includes a peel ply
And it being arranged at the carrier band below described peel ply, described peel ply strippingly fits in the lower section of described glue-line, described
Carrier band has a bonding coat and binds mutually with described peel ply, and the area of described bonding coat is more than or equal to described peel ply
Area.
Further, described stainless steel layer and the area equation of described peel ply and completely overlapped.Preferably, described carrier band bag
Including a basement membrane, described bonding coat is covered with the whole upper surface of described basement membrane.Described carrier band is one side glue.Described support member is square
Shape, and the length of described carrier band is more than the length of described support member.The upper surface of described stainless steel layer is exposed.
As preferred embodiment, the cohesive force between described peel ply and described bonding coat more than described peel ply with
Cohesive force between described glue-line.The protective layer that is also sticked above described bonding coat is positioned at around described peel ply, and protects
Between sheath and described peel ply, there is gap.Described protective layer is upwards less than described peel ply.Described protective layer is with described
Peel ply is mould release membrance.
Compared with prior art, this utility model is owing to being additionally arranged one layer of peel ply between glue-line and carrier band, thus glue-line
Carrier band will not be bonded to, thus improve and misprint and problem on deformation.Additionally, due to the area of bonding coat is more than or equal to peel ply
Area, it is not necessary to the position of exactitude position support member arranges the bonding coat of little area, binds ensureing that peel ply and carrier band are good
While, manufacturing process can be simplified.
[accompanying drawing explanation]
Fig. 1 is the axonometric chart of this utility model first embodiment；
Fig. 2 is the schematic diagram after this utility model first embodiment is punched out；
Fig. 3 is the schematic diagram that in Fig. 2, structure carries out waste discharge；
Fig. 4 is the schematic diagram of this utility model the second embodiment.
The drawing reference numeral explanation of detailed description of the invention:
| Support member | 100 | Release member | 200 | Stainless steel layer | 11 |
| Glue-line | 12 | Carrier band | 21 | Basement membrane | 21a |
| Bonding coat | 21b | Peel ply | 22 | Protective layer | 23 |
[detailed description of the invention]
For ease of being better understood from the purpose of this utility model, structure, feature and effect etc., in conjunction with accompanying drawing with concrete
The utility model is described in further detail for embodiment.
Fig. 1 to Fig. 3 is first embodiment of the present utility model.This utility model is for the support of bearing wafer (not shown)
Assembly, including support member 100 with fit in the release member 200 below support member 100.
Such as Fig. 1, described support member 100 is rectangular, and it includes stainless steel layer 11 and glue-line 12.The upper surface of stainless steel layer 11
Exposed, lower surface is then provided with glue-line 12, and described glue-line 12 is used for binding wafer (not shown).
Described release member 200 includes the carrier band 21 in strip and multiple separate peel ply 22.The present embodiment
Middle employing one side glue does carrier band 21, and described carrier band 21 includes a basement membrane 21a and the bonding coat 21b being arranged on basement membrane 21a.Institute
State the length of carrier band 21 more than the length of described support member 100, thus multiple support member 100 and multiple can be set on carrier band 21
Peel ply 22.
Described peel ply 22 be a whole piece mould release membrance through being die-cut into multiple rectangle, the upper surface of peel ply 22 is release
(bright finish), lower surface is then adhesive faces (asperities).The upper surface of described peel ply 22 strippingly fits in described glue-line 12
Lower section, the lower surface of described peel ply 22 then binds fixing by bonding coat 21b with carrier band 21 phase.Described peel ply 22 is with described
Cohesive force between bonding coat 21b, more than the cohesive force between described peel ply 22 and described glue-line 12, so can conveniently be peeled off
Layer 22 separates with glue-line 12, guarantees that peel ply 22 firmly binds so that being shelled both as an entirety with carrier band 21 simultaneously
From.
The area of described bonding coat 21b is more than or equal to the area of described peel ply 22.In the present embodiment, due to carrier band
21 is one side glue, and described bonding coat 21b is covered with the whole upper surface of basement membrane 21a, so can simplify manufacturing process, it is simple to use half
Clicking technique makes, it is not necessary to the position of exactitude position support member 100 arranges bonding coat 21b.By half clicking technique by stainless
Steel layer 11, glue-line 12 and peel ply 22 cut off, and obtain completely overlapped stainless steel layer 11 and peel ply 22, and stainless steel layer 11
With the area equation of peel ply 22, and glue-line 12 size can be basically identical with peel ply 22 size, thus glue-line 12 will not stick
Peel ply 22.
During use, only support member 100 i.e. stainless steel layer 11 and glue-line 12 need to be peeled off from release member 200 and can support
Bonded wafer on part 100.
As shown in Figure 2 to Figure 3, the manufacturing process of the present embodiment is as follows:
First, the stainless steel materials lower surface at strip is coated with one layer of glue and forms glue-line 12；It is sticked below glue-line 12
Mould release membrance is as peel ply 22 so that the bright finish of mould release membrance binds with glue-line 12；One side glue laminating is made at mould release membrance lower surface
For carrier band 21 so that the asperities of mould release membrance binds with the bonding coat 21b phase of one side glue.
Then, carry out half die-cut, stainless steel layer 11, glue-line 12 and mould release membrance are die-cut into multiple square according to preliminary dimension
Shape, and carry 21 holding coherent state.
Finally, being peeled off by the waste material beyond predetermined rectangle and get rid of from carrier band 21, described waste material includes three layers: stainless steel layer
11, glue-line 12 and mould release membrance.
This utility model first embodiment, by arranging peel ply 22 below glue-line 12, further will carrier band 21 patch
It is combined in below peel ply 22, by half clicking technique, stainless steel layer 11, glue-line 12 and peel ply 22 is cut off, glue can be prevented effectively from
The situation that layer 12 does not cuts off occurs, reduces the probability that support member 100 is misprinted.
Additionally, due to the peel ply 22 below glue-line 12 is also turned off, thus the spilling part of glue-line 12 will not be formed crowded
Pressure land, the glue-line 12 edge adhesion of support member 100 can decline, even if the glue that overflows also will not produce edge absorption affinity and become big
Situation, it is possible to decrease peel off strength.
Being illustrated in figure 4 the second embodiment of the present utility model, it is with the difference of first embodiment: release member 200
Also include that a protective layer 23 is sticked above described bonding coat 21b and is positioned at around described peel ply 22, protective layer 23 and institute
State, between peel ply 22, there is gap.Described protective layer 23 is upwards less than described peel ply 22.Described protective layer 23 is with described
Peel ply 22 is mould release membrance.
The manufacturing process of the present embodiment is as follows:
First, the stainless steel materials lower surface at strip is coated with one layer of glue and forms glue-line 12；It is sticked below glue-line 12
Mould release membrance so that the bright finish of mould release membrance binds with glue-line 12；Using one side glue laminating mould release membrance lower surface as carrier band 21 so that
The asperities of mould release membrance binds with the bonding coat 21b phase of one side glue.
Then, carry out half die-cut, stainless steel layer 11, glue-line 12 and mould release membrance are die-cut into multiple square according to preliminary dimension
Shape, and carry 21 holding coherent state.
Finally, being peeled off by the waste material beyond predetermined rectangle and get rid of from carrier band 21, described waste material includes two-layer: stainless steel layer
11 and glue-line 12.Through above-mentioned steps, mould release membrance is at support member 100 peel ply formed below 22, and beyond support member 100
Region (peel ply 22 is around) is then described protective layer 23, and protective layer 23 is separated from each other with peel ply 22.
Stainless steel layer 11, glue-line 12 and peel ply 22 are cut off by this utility model the second embodiment by half clicking technique,
Probability and reduction stripping strength that support member 100 is misprinted can be reduced equally.Simultaneously as the bonding coat 21b on carrier band 21 surfaces
It is positioned at the region beyond support member 100 to be covered by described protective layer 23, when drawing support member 100 with sucker, sucker can be avoided
Position deviation and be bonded to bonding coat 21b.
This utility model is due to the one layer of peel ply 22 that be spaced of glue-line 12 with carrier band 21, thus glue-line 12 will not bond to carry
Band 21, thus improves and misprints and problem on deformation.
Detailed description above is only the explanation of the preferred embodiment of this utility model, and non-therefore limitation this utility model is specially
Profit scope, so, all utilization this creation description and the equivalence techniques change for it of diagramatic content institute, it is both contained in this creation specially
In the range of profit.
Claims (10)
1. the support component for bearing wafer, it is characterised in that including:
One support member, described support member includes a stainless steel layer and a glue-line, and described glue-line is arranged at described stainless steel layer
Lower surface, is used for binding wafer；
One release member, fits in below described support member, and described release member includes a peel ply and is arranged at described peel ply
One carrier band of lower section,
Described peel ply strippingly fits in the lower section of described glue-line, and described carrier band has a bonding coat and described peel ply phase
Bind, and the area of described bonding coat is more than or equal to the area of described peel ply.
2. the support component for bearing wafer as claimed in claim 1, it is characterised in that: described stainless steel layer and described stripping
The area equation of absciss layer and completely overlapped.
3. the support component for bearing wafer as claimed in claim 1, it is characterised in that: described carrier band includes a basement membrane,
Described bonding coat is covered with the whole upper surface of described basement membrane.
4. the support component for bearing wafer as claimed in claim 1, it is characterised in that: described carrier band is one side glue.
5. the support component for bearing wafer as claimed in claim 1, it is characterised in that: described peel ply and described bonding
Cohesive force between Ceng is more than the cohesive force between described peel ply and described glue-line.
6. the support component for bearing wafer as claimed in claim 1, it is characterised in that: also it is sticked above described bonding coat
There is a protective layer to be positioned at around described peel ply, and between protective layer and described peel ply, there is gap.
7. the support component for bearing wafer as claimed in claim 6, it is characterised in that: described protective layer is upwards less than
Described peel ply.
8. the support component for bearing wafer as claimed in claim 6, it is characterised in that: described protective layer and described stripping
Layer is mould release membrance.
9. the support component for bearing wafer as claimed in claim 1, it is characterised in that: described support member is rectangular, and
The length of described carrier band is more than the length of described support member.
10. the support component for bearing wafer as claimed in claim 1, it is characterised in that: the upper table of described stainless steel layer
Face is exposed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620389263.0U CN205621708U (en) | 2016-05-04 | 2016-05-04 | A supporting component for bearing weight of wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620389263.0U CN205621708U (en) | 2016-05-04 | 2016-05-04 | A supporting component for bearing weight of wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205621708U true CN205621708U (en) | 2016-10-05 |
Family
ID=57025145
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620389263.0U Expired - Fee Related CN205621708U (en) | 2016-05-04 | 2016-05-04 | A supporting component for bearing weight of wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205621708U (en) |
-
2016
- 2016-05-04 CN CN201620389263.0U patent/CN205621708U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161005 Termination date: 20170504 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |