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Application filed by Advanced Semiconductor EngfiledCriticalAdvanced Semiconductor Eng
Priority to TW94106001ApriorityCriticalpatent/TWI248652B/en
Application grantedgrantedCritical
Publication of TWI248652BpublicationCriticalpatent/TWI248652B/en
Publication of TW200633082ApublicationCriticalpatent/TW200633082A/en
A chip bonding process including following steps is provided. First, a chip having an active surface and a back surface corresponding to the active surface is provided. Then, the chip is disposed onto a bonding surface of a substrate through an adhesion layer, wherein the back surface faces toward the substrate. After that, a post bonding process is performed to enhance the adhesion between the chip and the substrate. Next, the adhesion layer is cured. Furthermore, after the chip is bonded on the substrate through the adhesion layer and before the post bond process is performed, a protecting film can further be disposed on the chip for applying a predetermined force to the chip through the protecting film.
TW94106001A2005-03-012005-03-01Chip bonding process
TWI248652B
(en)
Pressure-sensitive adhesive, pressure-sensitive adhesive sheet, multilayered pressure-sensitive adhesive sheet, and process for producing electronic part