CN205620542U

CN205620542U - Miniaturized altimeter signal processing of high performance and control SIP module

Info

Publication number: CN205620542U
Application number: CN201620441192.4U
Authority: CN
Inventors: 江飞; 杨兵; 何颖; 张晖
Original assignee: CETC 58 Research Institute
Current assignee: CETC 58 Research Institute
Priority date: 2016-05-13
Filing date: 2016-05-13
Publication date: 2016-10-05
Anticipated expiration: 2026-05-13

Abstract

The utility model relates to a miniaturized altimeter signal processing of high performance and control SIP module, signal processing includes shaping circuit with control SIP module, digital signal processing unit, high calculation and the control unit, digit communication interface and the triangle generator who takes digital potentiometer, shaping circuit's output is connected with digital signal processing unit's input, digital signal processing unit's output and high calculation and the control unit's input are connected, high calculation be connected with the digital potentiometer control end among the triangle generator with the control unit's output and with digital communication interface both way junction, digit communication interface both way junction arrives outside terminal computer, triangle generator's output is connected to the receiving and dispatching front end of altimeter, signal processing and control SIP mould block base in LTCC base plate, adoption unpacked chip stromatolite, FC flip -chip, SIP ceramic cartridge integrally packaged mode. Through above -mentioned mode, the module volume is littleer, the good reliability, and weight is lighter.

Description

A kind of high performance mini altimeter signal processes and controls SIP module

Technical field

This utility model relates to a kind of SIP module, and especially a kind of high performance mini altimeter signal processes and controls SIP mould Block.

Background technology

Altimeter is a kind of measurement with instruction aircraft away from height above sea level face or the instrument of ground vertical dimension, divides from its operation principle, Pressure altimeter and radio altimeter two kinds can be divided into.Radio altimeter is a kind of height finding radar (commonly referred to half radar), It is using the earth as reflecting surface, and radio wave sends from launching antenna, arrives ground back reflection and returns to reception antenna, measures nothing The two-way time of line electric wave, so that it may accurately measure aircraft actual height overhead.Radio altimeter volume is little, measure essence Degree height, and do not affected by meteorological condition and aerodrome elevation, can directly measure the actual height on aircraft distance ground, Thus be one of requisite radio navigation device on various aircraft.Application to aircraft now requires more and more higher (miniaturization, portable, multi-functional, digitized and high reliability, high-performance aspect), it is achieved function get more and more, increase Function means to increase more device or increase function and the performance of device, so certainly will cause overall plan volume, weight Increase, how reducing these is the work studied for a long period of time.

Conventional height table signal processing typically uses based on integrated circuit and the multilayered printed plate structure of discrete device with controlling part. Based on FR4 baseplate material placement-and-routing, making by hand or reflow soldering electronic devices and components, external interface uses adapter to connect. This structural manufacturing process is simple, it is achieved low cost, but overall structure volume is big, installs complexity, can not meet system small-sized Change and modular demand.Under product usefulness and miniaturization and modular demand drive, define phase in electronic industry now The two big main flows closed: system level chip (System on Chip, SOC) and system in package (System in a Package, SIP). SOC is that the angle standing in design is set out, it is therefore intended that by the component integration needed for a system to chip piece；SIP is then It is by the position encapsulated, the chip of difference in functionality is integrated in an electronic structure body.

The most how with the system of this relative functional independence of control circuit, altimeter signal process is realized SIP to be packaged in system It it is a research direction.

Utility model content

The technical problems to be solved in the utility model is to overcome existing defect, it is provided that at a kind of high performance mini altimeter signal Reason and control SIP module, based on ltcc substrate, bare dies stacking, FC upside-down mounting, ceramic cartridge integrative packaging technology realizes Altimeter signal processes and controls the encapsulation of part SIP, and the volume making module is less, weight is lighter.

In order to solve above-mentioned technical problem, this utility model provides following technical scheme:

This utility model one high performance mini altimeter signal processes and controls SIP module, signal processing and control SIP mould Block includes shaping circuit, digital signal processing unit, high computational and control unit, digital communication interface and band digital regulation resistance Triangular-wave generator, the outfan of shaping circuit is connected with the input of digital signal processing unit, digital signal processing unit Outfan be connected with the input of control unit with high computational, the outfan of high computational and control unit occurs with triangular wave Digital regulation resistance in device controls end and connects and be bi-directionally connected with digital communication interface, and digital communication interface is bidirectionally coupled to outside whole End computer, the outfan of triangular-wave generator is connected to the receiving and transmitting front end of altimeter；Signal processing with control SIP module based on Ltcc substrate, uses bare dies stacking, FC upside-down mounting, SIP ceramic cartridge integrative packaging mode.

Further, digital signal processing unit uses DSP to be kernel processor chip, and high computational uses FPGA with control unit For kernel processor chip, digital signal processing unit uses fpga logic to realize, and high computational and control unit use DSP to calculate Method realizes, and triangular-wave generator uses discrete device to realize, and digital communication interface uses RS232 and the RS422 cause for gossip of DSP Now communication and information with host computer exchange.

Further, the fpga chip stacking of the dsp chip of digital signal processing unit and high computational and control unit is placed, Fpga chip under uses FC face-down bonding, and dsp chip is bonded in above fpga chip, and dsp chip is bonded to LTCC The bonding point of substrate, ltcc substrate internal layer embedded components, plant BGA pad bottom ltcc substrate, make module become an envelope Dress entirety.

The beneficial effects of the utility model: this signal processing uses FPGA FPGA device and numeral with controlling SIP module Signal processor DSP is kernel processor chip, coordinates shaping circuit and triangular wave generator circuit, carries out signal processing and control SIP module designs.This signal processing and control SIP module, based on ltcc substrate, use bare dies stacking, FC upside-down mounting, SIP Ceramic cartridge integrative packaging mode, makes module volume less, and highly reliable, weight is lighter.

Accompanying drawing explanation

Fig. 1 is the theory diagram that a kind of high performance mini altimeter signal processes and controls SIP module；

Fig. 2 is that ltcc substrate and encapsulation that a kind of high performance mini altimeter signal processes with control SIP module are bonded signal Figure；

Fig. 3 is that a kind of high performance mini altimeter signal processes and controls SIP module integrated case package schematic diagram.

Detailed description of the invention

Embodiment cited by this utility model, is only intended to help and understands this utility model, should not be construed as this utility model The restriction of protection domain, for those skilled in the art, on the premise of without departing from this utility model thought, Can also make improvements and modifications this utility model, these improve and modify the model also falling into the protection of this utility model claim In enclosing.

As it is shown in figure 1, be the theory diagram of signal processing and control SIP module, including shaping circuit 1, Digital Signal Processing Unit, high computational and control unit, digital communication interface and the triangular-wave generator of band digital regulation resistance (not shown) 2；The outfan of shaping circuit 1 is connected with the input of digital signal processing unit (DSP is kernel processor chip), this numeral The outfan of signal processing unit is connected with the input of high computational with control unit (FPGA is kernel processor chip), high The outfan that degree calculates with control unit is connected also with the digital regulation resistance (not shown) control end in triangular-wave generator 2 Being bi-directionally connected with digital communication interface by data/address bus, digital communication interface is bidirectionally coupled to exterior terminal computer, triangular wave The outfan of generator 2 is connected to the receiving and transmitting front end (VCO) of altimeter, the input of high computational and control unit also with clock The outfan of 6 connects.Digital signal processing unit uses fpga logic to realize, and high computational and control unit use DSP to calculate Method realizes, and triangular-wave generator 2 uses discrete device to realize, and digital communication interface uses RS232, RS422 and SPI of DSP Cause for gossip is existing to be exchanged with the communication of host computer and information.

Fig. 2 is that signal processing is bonded schematic diagram with the ltcc substrate controlling SIP module and encapsulation, designs according to LTCC technology Principle, by passive device embedment ltcc substrate 3 internal layers such as low-capacitance electric capacity, resistance, other active device, as FPGA is naked Chip, DSP bare chip, diode and audion (discrete device) etc. are then placed on ltcc substrate 3 surface.Because of LTCC Substrate 3 has that the interconnection number of plies is many, and integration density is big, the excellent feature of electric property, can meet the wiring of FPGA, DSP level of confidentiality Requirement.

This utility model uses the main bare chip of FPGA, DSP and part discrete device, based on ltcc substrate, uses naked core Sheet lamination, FC upside-down mounting, SIP ceramic cartridge integrative packaging mode, make module volume less, weight is lighter.LTCC technology By various passive devices, in the device such as electric capacity, resistance embedment multilayer ceramic substrate, form three-dimensional space and non-interfering height Integrated circuits, with run-in index printing coating manufacturing process sintering, forms integrated form ceramic component, can be small-sized by circuit further Change and high integration, decrease the quantity of surface mounted passives, the boundary of the different materials that attachment and electric interconnection are caused Face quantity is greatly decreased.Use bare chip FC upside-down mounting and 3D lamination bonding techniques, greatly reduce FPGA, DSP etc. original Encapsulation volume shared by finished circuit, the integrated level of the module improved greatly, make packaging density and reliability increase substantially.

Fig. 3 is signal processing and control SIP module integrated case package schematic diagram, this signal processing and control SIP module one Body base plate for packaging shell, fills including ltcc substrate 3, BGA pad 5, surface, directly plants bottom ltcc substrate 3 BGA pad 5, makes module become an encapsulation entirety.Module volume 40mm*40mm*5.0mm, weight 20g.

This utility model is in order to reduce the volume of module as far as possible, in design of the present utility model, by 2 main bare chip circuit Carry out stacking placement, under FPGA bare chip use FC face-down bonding, after having welded, DSP bare chip is bonded in Above FPGA bare chip, then DSP bare chip is bonded to the bonding point of ltcc substrate 3.Meanwhile, at ltcc substrate 3 In wiring process, resistance, the electric capacity of part are embedded in ltcc substrate 3 internal layer (built-in device 4), so can be with maximum limit That spends reduces ltcc substrate 3 surface mask placement device quantity, beneficially distributing, reduces module volume.

Claims

1. high performance mini altimeter signal processes and controls a SIP module, described signal processing and control SIP module bag Include shaping circuit (1), digital signal processing unit, high computational and control unit, digital communication interface and band digital regulation resistance Triangular-wave generator (2), the outfan of shaping circuit (1) is connected with the input of digital signal processing unit, digital signal The outfan of processing unit is connected with the input of control unit with high computational, high computational and the outfan and three of control unit Digital regulation resistance in angle wave producer (2) controls end and connects and be bi-directionally connected with digital communication interface, and digital communication interface is two-way Being connected to exterior terminal computer, the outfan of triangular-wave generator (2) is connected to the receiving and transmitting front end of altimeter；At described signal Reason and control SIP module, based on ltcc substrate (3), use bare dies stacking, FC upside-down mounting, and SIP ceramic cartridge integration is sealed Dress mode.

High performance mini altimeter signal the most according to claim 1 processes and controls SIP module, it is characterised in that: Described digital signal processing unit uses DSP to be kernel processor chip, and high computational and control unit use FPGA to be at core Reason chip, digital signal processing unit uses fpga logic to realize, and high computational and control unit use DSP algorithm to realize, Triangular-wave generator (2) uses discrete device to realize, digital communication interface use RS232 and the RS422 cause for gossip of DSP existing with The communication of host computer and information exchange.

High performance mini altimeter signal the most according to claim 1 processes and controls SIP module, it is characterised in that: The fpga chip stacking of the dsp chip of described digital signal processing unit and high computational and control unit is placed, under Fpga chip uses FC face-down bonding, and dsp chip is bonded in above fpga chip, and dsp chip is bonded to LTCC base The bonding point of plate (3), ltcc substrate (3) internal layer embedded components (4), plant BGA pad (5) bottom ltcc substrate (3), Module is made to become an encapsulation entirety.