CN113271514A - Novel miniaturized bluetooth headset based on LTCC technique - Google Patents
Novel miniaturized bluetooth headset based on LTCC technique Download PDFInfo
- Publication number
- CN113271514A CN113271514A CN202110544518.1A CN202110544518A CN113271514A CN 113271514 A CN113271514 A CN 113271514A CN 202110544518 A CN202110544518 A CN 202110544518A CN 113271514 A CN113271514 A CN 113271514A
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- CN
- China
- Prior art keywords
- ltcc
- headset
- bluetooth
- earphone
- bluetooth headset
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 6
- 230000001133 acceleration Effects 0.000 claims abstract description 18
- 230000003287 optical effect Effects 0.000 claims abstract description 17
- 238000005516 engineering process Methods 0.000 claims abstract description 15
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910052744 lithium Inorganic materials 0.000 claims abstract description 11
- 238000006243 chemical reaction Methods 0.000 claims abstract description 9
- 238000004806 packaging method and process Methods 0.000 claims abstract description 8
- 238000001514 detection method Methods 0.000 claims abstract description 6
- 238000009434 installation Methods 0.000 claims description 14
- 241000463219 Epitheca Species 0.000 claims description 10
- 238000007789 sealing Methods 0.000 claims description 4
- 229920000742 Cotton Polymers 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 claims description 2
- 230000007958 sleep Effects 0.000 claims description 2
- 239000000758 substrate Substances 0.000 abstract description 6
- 230000005059 dormancy Effects 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010079 rubber tapping Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
- H04R1/1041—Mechanical or electronic switches, or control elements
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
- H04R1/1091—Details not provided for in groups H04R1/1008 - H04R1/1083
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2420/00—Details of connection covered by H04R, not provided for in its groups
- H04R2420/07—Applications of wireless loudspeakers or wireless microphones
Abstract
The invention discloses a novel miniaturized Bluetooth headset based on LTCC technology, which comprises a Bluetooth headset body, wherein the Bluetooth headset body consists of a headset shell and earplugs, the headset shell comprises an upper headset shell and a lower headset shell, the upper headset shell and the lower headset shell are closed to form a cavity for mounting a lithium battery, an LTCC device and a loudspeaker, the cavity comprises a mounting cavity and a sound cavity, the LTCC device comprises an LTCC element, an LTCC functional device, an LTCC packaging substrate and an LTCC module substrate, the lithium battery is welded on the LTCC module substrate, the LTCC functional device is a packaging piece which integrates a voice recognition acceleration sensor, a motion acceleration sensor, an optical sensor, a contact sensor, a Bluetooth chip, a signal processing circuit, a volume adjusting circuit, an R-V conversion circuit, an ADC conversion circuit, an electric quantity detection circuit and a main control PCB board into a whole through LTCC technology, the mounting cavity is smaller due to the miniaturization of the LTCC device, correspondingly, the volume of the sound cavity is larger, so that a loudspeaker with larger volume can be placed.
Description
Technical Field
The invention relates to the technical field of Bluetooth earphones, in particular to a novel miniaturized Bluetooth earphone based on an LTCC technology.
Background
The Bluetooth earphone applies the Bluetooth technology to a hands-free earphone, so that a user can avoid the trouble of wires and easily talk freely in various modes;
however, most of bluetooth headsets in the conventional technology are formed by welding various functional devices on a circuit board, so that the bluetooth headset is controlled, but the processing method can lead to the overlarge cavity for installing the circuit board, influence the expansion of a sound cavity and further influence a loudspeaker, and meanwhile, the size and the weight of the bluetooth headset are overlarge, so that the miniaturization development of the bluetooth headset cannot be embodied.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention provides a novel miniaturized Bluetooth headset based on the LTCC technology.
The technical scheme adopted by the invention for solving the technical problems is as follows: the utility model provides a novel bluetooth headset of miniaturization based on LTCC technique, includes bluetooth headset body and its box that charges, and bluetooth headset body is connected with cell phone terminal bluetooth, bluetooth headset body comprises earphone shell and earplug, the earphone shell includes earphone epitheca and earphone inferior valve, the earphone epitheca forms a cavity that is used for installing lithium cell, LTCC device and speaker with the earphone inferior valve closure, the cavity is including installation cavity and sound chamber, the LTCC device includes LTCC component, LTCC function device, LTCC encapsulation base plate and LTCC module base plate, the lithium cell welding is on LTCC module base plate, LTCC function device is one kind through LTCC technique with speech recognition acceleration sensor, motion acceleration sensor, optical sensor, contact sensor, bluetooth chip, signal processing circuit, volume control circuit, R-V converting circuit, ADC converting circuit, The electric quantity detection circuit and the main control PCB are integrated into an integrated packaging piece, the miniaturization of the LTCC device enables the installation cavity to be smaller, and correspondingly, the volume of the sound cavity is larger, so that a loudspeaker with larger volume can be placed in the LTCC device;
the earphone upper shell is provided with a micro touch control board connected with a contact sensor, the contact sensor is electrically connected with the main control PCB through a signal processing circuit, and the Bluetooth earphone body is subjected to functional operation by touching the micro touch control board;
the optical sensor is arranged at the lower shell of the earphone and close to the position of a human face, the optical sensor is electrically connected with the main control PCB through the signal processing circuit, and when the Bluetooth earphone body is taken down, the main control PCB sends a sleep signal.
Preferably, the earphone upper shell and the earphone lower shell are both provided with at least three tone adjusting holes, and the tone adjusting holes are distributed at equal intervals in a linear array.
Preferably, the earphone inferior valve is equipped with the lug with earphone epitheca fixed connection, the junction of earphone epitheca and earphone inferior valve is equipped with the sealing washer, and seamless connection is realized through the point gluing after earphone epitheca and the equipment of earphone inferior valve.
Preferably, the installation cavity is provided with an installation support for fixing the LTCC device, the installation support is provided with cushion cotton contacted with the LTCC device, and a gap convenient for heat dissipation is arranged between the bottom of the LTCC device and the inner wall of the installation cavity.
Preferably, the earplug cover is established in the sound hole position of earphone shell, the box that charges has the charging groove that supplies the bluetooth headset body to charge, and a pair of bluetooth headset body can be placed and charge in the charging groove.
Preferably, the lithium battery is electrically connected with the voice recognition acceleration sensor, the motion acceleration sensor, the optical sensor, the contact sensor, the bluetooth chip and the main control PCB respectively.
Compared with the prior art, the invention has the beneficial effects that:
the voice recognition acceleration sensor, the motion acceleration sensor, the optical sensor, the contact sensor, the Bluetooth chip, the signal processing circuit, the volume adjusting circuit, the R-V conversion circuit, the ADC conversion circuit, the electric quantity detection circuit and the main control PCB are integrated into an integrated packaging piece through the LTCC technology, the miniaturization of the LTCC device enables the installation cavity to be smaller, correspondingly, the volume of the sound cavity is larger, and therefore a loudspeaker with larger volume can be placed in the sound cavity, the sound quality of the Bluetooth headset is further improved while the functionality of the Bluetooth headset is not influenced, meanwhile, the Bluetooth headset is lighter and smaller, the contact sensor is electrically connected with the main control PCB through the signal processing circuit, the Bluetooth headset is functionally operated in a continuous tapping mode or a long-time micro touch control board mode, and the optical sensor is electrically connected with the main control PCB through the signal processing circuit, when the Bluetooth headset body is taken down, the main control PCB board sends out dormancy signal, and the practicality is strong.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic structural diagram of a Bluetooth headset according to the present invention;
FIG. 3 is a schematic structural diagram of an LTCC functional device of the present invention;
fig. 4 is a schematic view of another structure of the LTCC functional device of the present invention.
Reference numbers in the figures:
the bluetooth headset comprises a bluetooth headset body 1, a charging box 2, a headset upper shell 3, a headset lower shell 4, a convex block 5, earplugs 6, a tone adjusting hole 7, a sealing ring 8 and a micro touch pad 9.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in figures 1-4, the invention provides a novel miniaturized Bluetooth headset based on LTCC technology, which comprises a Bluetooth headset body 1 and a charging box 2 thereof, wherein the Bluetooth headset body 1 is in Bluetooth connection with a mobile phone terminal, the Bluetooth headset body 1 is composed of a headset shell and an earplug 6, the headset shell comprises a headset upper shell 3 and a headset lower shell 4, the headset upper shell 3 and the headset lower shell 4 are closed to form a cavity for mounting a lithium battery, an LTCC device and a loudspeaker, the cavity comprises a mounting cavity and a sound cavity, the LTCC device comprises an LTCC element, an LTCC functional device, an LTCC packaging substrate and an LTCC module substrate, the lithium battery is welded on the LTCC module substrate, and the LTCC functional device is a voice recognition acceleration sensor, a motion acceleration sensor, an optical sensor, a contact sensor, a Bluetooth chip, a signal processing circuit and the like through LTCC technology, The volume adjusting circuit, the R-V conversion circuit, the ADC conversion circuit, the electric quantity detection circuit and the main control PCB are integrated into an integrated packaging piece, the LTCC device is miniaturized, so that the mounting cavity is smaller, and correspondingly, the volume of the sound cavity is larger, and a loudspeaker with larger volume can be placed in the LTCC device;
the earphone upper shell 3 is provided with a micro touch control plate 9 connected with a contact sensor, the contact sensor is electrically connected with a main control PCB through a signal processing circuit, and the Bluetooth earphone body 1 is subjected to functional operation by touching the micro touch control plate 9;
optical sensor sets up at earphone inferior valve 4 and presses close to the position department of people's face, optical sensor passes through signal processing circuit and master control PCB board electric connection, and when taking off bluetooth headset body 1, the master control PCB board sends dormancy signal.
The earphone upper shell 3 and the earphone lower shell 4 are both provided with at least three tone adjusting holes 7, and the tone adjusting holes 7 are distributed at equal intervals in a linear array.
Earphone inferior valve 4 is equipped with 3 fixed connection's of earphone epitheca lug 5, the junction of earphone epitheca 3 and earphone inferior valve 4 is equipped with sealing washer 8, and seamless connection is realized through the point gluing after earphone epitheca 3 assembles with earphone inferior valve 4.
The installation cavity is provided with an installation support used for fixing the LTCC device, the installation support is provided with a cushion cotton contacted with the LTCC device, and a space convenient for heat dissipation is arranged between the bottom of the LTCC device and the inner wall of the installation cavity.
6 covers of earplug are established in the sound hole position of earphone shell, the box of charging 2 has the charging groove that supplies bluetooth headset body 1 to charge, and a pair of bluetooth headset body 1 can be placed and charge in the charging groove.
The lithium battery is respectively and electrically connected with the voice recognition acceleration sensor, the motion acceleration sensor, the optical sensor, the contact sensor, the Bluetooth chip and the main control PCB.
The voice recognition acceleration sensor, the motion acceleration sensor, the optical sensor, the contact sensor, the Bluetooth chip, the signal processing circuit, the volume adjusting circuit, the R-V conversion circuit, the ADC conversion circuit, the electric quantity detection circuit and the main control PCB are integrated into an integrated packaging piece through the LTCC technology, the miniaturization of the LTCC device enables the installation cavity to be smaller, correspondingly, the volume of the sound cavity is larger, and therefore a loudspeaker with larger volume can be placed in the sound cavity, the sound quality of the Bluetooth headset is further improved while the functionality of the Bluetooth headset is not influenced, meanwhile, the Bluetooth headset is lighter and smaller, the contact sensor is electrically connected with the main control PCB through the signal processing circuit, the Bluetooth headset is functionally operated in a continuous tapping mode or a long-time micro touch control board mode, and the optical sensor is electrically connected with the main control PCB through the signal processing circuit, when the Bluetooth headset body is taken down, the main control PCB board sends out dormancy signal, and the practicality is strong.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (6)
1. The utility model provides a novel bluetooth headset of miniaturization based on LTCC technique, includes bluetooth headset body and its box that charges, and bluetooth headset body is connected with cell-phone terminal bluetooth, its characterized in that, bluetooth headset body comprises earphone shell and earplug, the earphone shell includes earphone epitheca and earphone inferior valve, the earphone epitheca forms a cavity that is used for installing lithium cell, LTCC device and speaker with the earphone inferior valve closure, the cavity is including installation cavity and sound chamber, the LTCC device includes LTCC component, LTCC function device, LTCC encapsulation base plate and LTCC module base plate, the lithium cell welding is on LTCC module base plate, LTCC function device is one kind and is passed through LTCC technique with speech recognition acceleration sensor, motion acceleration sensor, optical sensor, contact pick up, bluetooth chip, signal processing circuit, volume control circuit, R-V converting circuit, The ADC conversion circuit, the electric quantity detection circuit and the main control PCB are integrated into an integrated packaging piece, the miniaturization of the LTCC device enables the installation cavity to be smaller, and correspondingly, the volume of the sound cavity is larger, so that a loudspeaker with larger volume can be placed in the LTCC device;
the earphone upper shell is provided with a micro touch control board connected with a contact sensor, the contact sensor is electrically connected with the main control PCB through a signal processing circuit, and the Bluetooth earphone body is subjected to functional operation by touching the micro touch control board;
the optical sensor is arranged at the lower shell of the earphone and close to the position of a human face, the optical sensor is electrically connected with the main control PCB through the signal processing circuit, and when the Bluetooth earphone body is taken down, the main control PCB sends a sleep signal.
2. The novel miniaturized bluetooth headset based on LTCC technology as claimed in claim 1, wherein the headset upper case and the headset lower case are both formed with at least three tuning holes, and the tuning holes are distributed in a linear array at equal intervals.
3. The novel miniaturized Bluetooth headset based on LTCC technology as claimed in claim 1, wherein the lower headset housing has a protrusion fixedly connected to the upper headset housing, a sealing ring is disposed at the connection between the upper headset housing and the lower headset housing, and the upper headset housing and the lower headset housing are assembled and then seamlessly connected by dispensing.
4. The novel miniaturized Bluetooth headset based on LTCC technology as claimed in claim 1, wherein the mounting cavity is provided with a mounting bracket for fixing the LTCC device, the mounting bracket is provided with a cushion cotton contacting with the LTCC device, and a gap facilitating heat dissipation is provided between the bottom of the LTCC device and the inner wall of the mounting cavity.
5. The novel miniaturized Bluetooth headset based on LTCC technology as claimed in claim 1, wherein the ear plug covers a sound hole of the headset case, the charging box has a charging slot for charging the Bluetooth headset body, and a pair of Bluetooth headset bodies can be placed in the charging slot for charging.
6. The novel miniaturized Bluetooth headset based on LTCC technology as claimed in claim 1, wherein the lithium battery is electrically connected to the voice recognition acceleration sensor, the motion acceleration sensor, the optical sensor, the contact sensor, the Bluetooth chip and the main control PCB respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110544518.1A CN113271514A (en) | 2021-05-19 | 2021-05-19 | Novel miniaturized bluetooth headset based on LTCC technique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110544518.1A CN113271514A (en) | 2021-05-19 | 2021-05-19 | Novel miniaturized bluetooth headset based on LTCC technique |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113271514A true CN113271514A (en) | 2021-08-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110544518.1A Pending CN113271514A (en) | 2021-05-19 | 2021-05-19 | Novel miniaturized bluetooth headset based on LTCC technique |
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| Country | Link |
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| CN (1) | CN113271514A (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201336359Y (en) * | 2008-12-30 | 2009-10-28 | 晨讯科技(沈阳)有限公司 | Bluetooth antenna and Bluetooth module based on LTCC technology |
| US20090321911A1 (en) * | 2006-12-23 | 2009-12-31 | Kyung Joo Son | Semiconductor Package and Manufacturing Method Thereof |
| CN103200482A (en) * | 2013-04-09 | 2013-07-10 | 北京兴科迪科技有限公司 | Solar charging-type Bluetooth headset and vehicle provided with same |
| CN103794838A (en) * | 2013-08-01 | 2014-05-14 | 南京理工大学 | LTCC-based S-waveband high-performance micro band-pass balanced filter |
| CN105762117A (en) * | 2016-05-06 | 2016-07-13 | 中国工程物理研究院电子工程研究所 | Staggered laminated three-dimensional packaging structure of LTCC substrates |
| CN205620542U (en) * | 2016-05-13 | 2016-10-05 | 中国电子科技集团公司第五十八研究所 | Miniaturized altimeter signal processing of high performance and control SIP module |
| CN106057770A (en) * | 2016-07-22 | 2016-10-26 | 美的智慧家居科技有限公司 | System-level packaging chip and preparation method thereof, and device comprising the same |
| CN206947320U (en) * | 2017-06-21 | 2018-01-30 | 北京七星华创微电子有限责任公司 | A kind of electronic device package shell |
| CN109346449A (en) * | 2018-11-13 | 2019-02-15 | 北方电子研究院安徽有限公司 | A kind of high-power high-voltage LTCC module heat dissipating encapsulation |
| CN209860896U (en) * | 2019-07-01 | 2019-12-27 | 中电科技德清华莹电子有限公司 | Novel radio frequency front end module based on LTCC technology |
-
2021
- 2021-05-19 CN CN202110544518.1A patent/CN113271514A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090321911A1 (en) * | 2006-12-23 | 2009-12-31 | Kyung Joo Son | Semiconductor Package and Manufacturing Method Thereof |
| CN201336359Y (en) * | 2008-12-30 | 2009-10-28 | 晨讯科技(沈阳)有限公司 | Bluetooth antenna and Bluetooth module based on LTCC technology |
| CN103200482A (en) * | 2013-04-09 | 2013-07-10 | 北京兴科迪科技有限公司 | Solar charging-type Bluetooth headset and vehicle provided with same |
| CN103794838A (en) * | 2013-08-01 | 2014-05-14 | 南京理工大学 | LTCC-based S-waveband high-performance micro band-pass balanced filter |
| CN105762117A (en) * | 2016-05-06 | 2016-07-13 | 中国工程物理研究院电子工程研究所 | Staggered laminated three-dimensional packaging structure of LTCC substrates |
| CN205620542U (en) * | 2016-05-13 | 2016-10-05 | 中国电子科技集团公司第五十八研究所 | Miniaturized altimeter signal processing of high performance and control SIP module |
| CN106057770A (en) * | 2016-07-22 | 2016-10-26 | 美的智慧家居科技有限公司 | System-level packaging chip and preparation method thereof, and device comprising the same |
| CN206947320U (en) * | 2017-06-21 | 2018-01-30 | 北京七星华创微电子有限责任公司 | A kind of electronic device package shell |
| CN109346449A (en) * | 2018-11-13 | 2019-02-15 | 北方电子研究院安徽有限公司 | A kind of high-power high-voltage LTCC module heat dissipating encapsulation |
| CN209860896U (en) * | 2019-07-01 | 2019-12-27 | 中电科技德清华莹电子有限公司 | Novel radio frequency front end module based on LTCC technology |
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Application publication date: 20210817 |