CN205602678U - Substrate -stopping mechanism for surface mount systems - Google Patents
Substrate -stopping mechanism for surface mount systems Download PDFInfo
- Publication number
- CN205602678U CN205602678U CN201620287966.2U CN201620287966U CN205602678U CN 205602678 U CN205602678 U CN 205602678U CN 201620287966 U CN201620287966 U CN 201620287966U CN 205602678 U CN205602678 U CN 205602678U
- Authority
- CN
- China
- Prior art keywords
- chip mounter
- base plate
- substrate
- guide rails
- transportation rail
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Supply And Installment Of Electrical Components (AREA)
Abstract
The utility model provides a substrate -stopping mechanism for surface mount systems, including the transportation rail of the base plate of workstation, transportation chip mounter, prevent the chip mounter the base plate along the transportation rail direction do exercises to board cylinder and the base plate that detects the chip mounter whether target in place to the board sensor, wherein, transportation rail, set up respectively to the board cylinder on the workstation, be in to board sensor settings transportation rail is last. The beneficial effects of the utility model are that: accessible transportation rail transports the base plate, when detecting the base plate to the board sensor, then by preventing the base plate to be done exercises along the transportation rail direction to the board cylinder, can be used to the chip mounter, does not need the manual work to lay the base plate, so practiced thrift the manual work, so more is fit for automatic streamlined production, saves the supplementary paster time, improves production efficiency, adopt photoelectricity and the trading halt mode that machinery combined together, reduce the error, improve the precision.
Description
Technical field
This utility model relates to chip mounter, particularly relates to a kind of baffle mechanism for chip mounter.
Background technology
Chip mounter: also known as " placement equipment ", " surface mount system " (Surface Mount System), in production line, it be arranged in a stannum machine or printer after, be a kind of equipment Surface Mount Component being accurately placed on PCB pad by mobile mounting head.It is divided into manual and full-automatic two kinds.
At present, chip mounter has in the following manner in terms of substrate trading halt:
Use substrate fixed form, i.e. substrate to be fixed on platform, then moved to patch location by platform, carrying out paster;
But, all there is certain deficiency in aforesaid way:
Using substrate fixed form, need manually to lay substrate up and down, one is that efficiency is low, needs labour cost, and two is to be industrial 4.0 epoch now, and plant equipment will be intelligent, is not suitable for automatic assembly line and produces.
Summary of the invention
In order to solve the problems of the prior art, this utility model provides a kind of baffle mechanism for chip mounter.
This utility model provides a kind of baffle mechanism for chip mounter, including workbench, the transport guide rails of the substrate of transport chip mounter, the substrate to plate cylinder and detection chip mounter that stops the substrate of chip mounter to carry out along described transport guide rails direction moving whether put in place to plate sensor, wherein, described transport guide rails, it is separately positioned on described workbench to plate cylinder, described is arranged in described transport guide rails to plate sensor.
As further improvement of the utility model, described have two to plate sensor, and described transport guide rails includes a pair parallel track, every described track is provided with described in one to plate sensor.
As further improvement of the utility model, described workbench is provided with position adjusting mechanism, described is fixed on described position adjusting mechanism to plate cylinder.
As further improvement of the utility model, described baffle mechanism also includes controller, described controller respectively with described to plate sensor, electrically connect to plate cylinder.
The beneficial effects of the utility model are: pass through such scheme, substrate can be transported by transport guide rails, when substrate being detected to plate sensor, then stoped substrate to move along transport guide rails direction by plate cylinder, can be used for chip mounter, it is not necessary to manually lay substrate, so having saved artificial, so it is more suitable for automatic assembly line to produce, saves the auxiliary patch time, improve production efficiency;Use the trading halt mode that photoelectricity combines with machinery, reduce error, improve precision.
Accompanying drawing explanation
Fig. 1 is the front view of a kind of baffle mechanism for chip mounter of this utility model.
Fig. 2 is the perspective view of a kind of baffle mechanism for chip mounter of this utility model.
Detailed description of the invention
This utility model is further illustrated by explanation and detailed description of the invention below in conjunction with the accompanying drawings.
As shown in Figure 1 to Figure 2, a kind of baffle mechanism for chip mounter, including workbench 5, the transport guide rails 4 of the substrate 3 of transport chip mounter, the substrate 3 to plate cylinder 1 and detection chip mounter that stops the substrate 3 of chip mounter to carry out along described transport guide rails 4 direction moving whether put in place to plate sensor 2, wherein, described transport guide rails 4, it is separately positioned on described workbench 5 to plate cylinder 1, described is arranged in described transport guide rails 4 to plate sensor 2.
As shown in Figure 1 to Figure 2, described have two to plate sensor 2, and described transport guide rails 4 includes a pair parallel track, every described track is provided with described in one to plate sensor 2.
As shown in Figure 1 to Figure 2, described workbench 5 is provided with position adjusting mechanism, described is fixed on described position adjusting mechanism to plate cylinder 1, can regulate the trading halt cylinder 1 position on workbench 5 according to substrate 3 width of chip mounter.
As shown in Figure 1 to Figure 2, described baffle mechanism also includes controller, described controller respectively with described to plate sensor 2, electrically connect to plate cylinder 1.
A kind of baffle mechanism for chip mounter that this utility model provides, for stoping substrate 3 the moving along transport guide rails 4 direction of chip mounter.
The operation principle of a kind of baffle mechanism for chip mounter that this utility model provides is: described trading halt cylinder 1 is used for blocking substrate 3, stops it to move along the direction of transport guide rails 4;Described it be used for sensing substrate 3 to plate sensor 2 and move.Trading halt cylinder 1 is arranged on workbench 5, is arranged on the appointment position of transport guide rails 4 to plate induction apparatus 2.When substrate 3 starts to move in transport guide rails 4, move to first to plate induction apparatus 2 time, pass the signal to controller to plate induction apparatus 2, then feed back to trading halt cylinder 1, make trading halt cylinder 1 stretch out;Substrate 3 continues to move on conveying track 4, until after second senses substrate 3 to plate induction apparatus 2, the reduce-speed sign that transport guide rails 4 is sent by controller reduces speed now until stopping, making substrate 3 transport slow down and time delay appropriate time, in time delay during this period of time, substrate 3 is transported at baffle plate cylinder 1 block substrate 3.It is thereby achieved that stop chip mounter substrate 3 moving along transport guide rails 4 direction.Need not manually lay substrate, save artificial, efficiency is the highest, is suitable for automatic assembly line and produces, use the trading halt mode that photoelectricity combines with machinery, reduce error, improves precision.
Above content is to combine concrete preferred implementation further detailed description of the utility model, it is impossible to assert that of the present utility model being embodied as is confined to these explanations.For this utility model person of an ordinary skill in the technical field, without departing from the concept of the premise utility, it is also possible to make some simple deduction or replace, all should be considered as belonging to protection domain of the present utility model.
Claims (4)
1. the baffle mechanism for chip mounter, it is characterized in that: the transport guide rails that includes the substrate of workbench, transport chip mounter, the substrate to plate cylinder and detection chip mounter stoping the substrate of chip mounter to carry out along described transport guide rails direction moving whether put in place to plate sensor, wherein, described transport guide rails, it is separately positioned on described workbench to plate cylinder, described is arranged in described transport guide rails to plate sensor.
Baffle mechanism for chip mounter the most according to claim 1, it is characterised in that: described have two to plate sensor, and described transport guide rails includes a pair parallel track, every described track is provided with described in one to plate sensor.
Baffle mechanism for chip mounter the most according to claim 1, it is characterised in that: described workbench is provided with position adjusting mechanism, described is fixed on described position adjusting mechanism to plate cylinder.
Baffle mechanism for chip mounter the most according to claim 1, it is characterised in that: described baffle mechanism also includes controller, described controller respectively with described to plate sensor, electrically connect to plate cylinder.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201620287966.2U CN205602678U (en) | 2016-04-08 | 2016-04-08 | Substrate -stopping mechanism for surface mount systems |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201620287966.2U CN205602678U (en) | 2016-04-08 | 2016-04-08 | Substrate -stopping mechanism for surface mount systems |
Publications (1)
Publication Number | Publication Date |
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CN205602678U true CN205602678U (en) | 2016-09-28 |
Family
ID=56971572
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201620287966.2U Expired - Fee Related CN205602678U (en) | 2016-04-08 | 2016-04-08 | Substrate -stopping mechanism for surface mount systems |
Country Status (1)
Country | Link |
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CN (1) | CN205602678U (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106428848A (en) * | 2016-09-30 | 2017-02-22 | 惠州金源精密自动化设备有限公司 | Workbin conveying mechanism and battery sorting collector |
CN107020432A (en) * | 2017-05-08 | 2017-08-08 | 宏泰集团(厦门)有限公司 | A kind of on-line automatic feeding welding equipment and its method |
CN108328334A (en) * | 2018-03-07 | 2018-07-27 | 三和盛电子科技(东莞)有限公司 | A kind of online characteristic detecting device |
CN108689097A (en) * | 2018-05-30 | 2018-10-23 | 常州铭赛机器人科技股份有限公司 | The orbit transports mechanism of Fluid coater and the Fluid coater with it |
-
2016
- 2016-04-08 CN CN201620287966.2U patent/CN205602678U/en not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106428848A (en) * | 2016-09-30 | 2017-02-22 | 惠州金源精密自动化设备有限公司 | Workbin conveying mechanism and battery sorting collector |
CN107020432A (en) * | 2017-05-08 | 2017-08-08 | 宏泰集团(厦门)有限公司 | A kind of on-line automatic feeding welding equipment and its method |
CN108328334A (en) * | 2018-03-07 | 2018-07-27 | 三和盛电子科技(东莞)有限公司 | A kind of online characteristic detecting device |
CN108689097A (en) * | 2018-05-30 | 2018-10-23 | 常州铭赛机器人科技股份有限公司 | The orbit transports mechanism of Fluid coater and the Fluid coater with it |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160928 Termination date: 20190408 |
|
CF01 | Termination of patent right due to non-payment of annual fee |