CN205488091U - Slim encapsulation module suitable for three -terminal power device - Google Patents
Slim encapsulation module suitable for three -terminal power device Download PDFInfo
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- CN205488091U CN205488091U CN201620130576.4U CN201620130576U CN205488091U CN 205488091 U CN205488091 U CN 205488091U CN 201620130576 U CN201620130576 U CN 201620130576U CN 205488091 U CN205488091 U CN 205488091U
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Abstract
The utility model relates to a slim encapsulation module suitable for three -terminal power device, it includes package substrate and is located the last power switch circuit of package substrate the last gland of package substrate has the encapsulation casing that matees with package substrate, and it is internal that power switch circuit lies in the encapsulating shell, still including the signal connection body that is used for the power spliced pole of drawing forth the power end of power switch circuit internal power device and is used for drawing forth the signal end of power switch circuit internal power device, the one end of power spliced pole and the power butt welding of power switch circuit internal power device connect, and it is external that the encapsulating shell is worn out to the other end of power spliced pole, and the signal connection body female or arrange the needle for SMD rows, are equipped with on the encapsulation casing to be used for naked signal connection body coupling hole of personally experiencing sth. Part of the body with signal connection. The utility model discloses compact structure reduces the packaging technology degree of difficulty, convenient to use, and effective encapsulation thickness that reduces the parasitic wparameter, and accommodation is wide, safe and reliable.
Description
Technical field
This utility model relates to a kind of package module, a kind of thin encapsulation module being applicable to three-terminal power device, belongs to the technical field of power power electronic device.
Background technology
Power IGBT(igbt), MOSFET(mos field effect transistor) module is the core component of energy saving system and industrial automation system, it is widely used in the fields such as inverter type welder, electric vehicle controller, regenerative resource (solar energy and wind energy), another kind can be become to need form from a kind of formal argument electric energy, to meet the various needs of electrical equipment, thus reach to optimise the purpose of electric energy.To in electric energy transformation process, the requirement eternal to power model and power electronic system is: lightening, high power density, high reliability, low price, technique are simple and easy to install and use, and this is also the developing direction of power model.
At present, typical high power module has a multiple design, but the main or following three kinds of modes of lead-out mode for terminal: first kind of way is that all signals are the most the same with power terminal, is all pin type or pellet electrode form；The second way is the power model of band nut, and nut is positioned over for books circulation road below the terminal after bending, and signal terminal or be pin type or for pellet electrode for small area analysis loop；The third mode is also the power model of band nut, and the difference of the second way is signal terminal and power terminal all uses bending placing nut as this mode connecting end.
Above-mentioned several terminal lead-out mode is the most common, but there is its dissatisfactory one side for high-power encapsulation, no matter first kind of way is pin type or pellet electrode, it is the most relatively fine for the pin of conduction, thus the sectional area of terminal is less, cause it to be typically only suitable for applying in middle low power occasion, become big if desired for the electric current allowing terminal flow through, will certainly use the mode that multi-terminal is in parallel, this can bring again the even stray inductance of current unevenness to become big and wait series of problems.And the lead-out mode of this many PIN needle welds in the installing hole in pcb board to be inserted simultaneously in application process again, gradient and the assembling matching of PIN needle are required higher by this, use cumbersome.
nullThe power terminal of the above-mentioned second way and the third mode is required for being rolled over by bending jig in 90 °，Below power terminal, put into nut in advance be easy to be connected with bringing-out by power terminal subsequently through screw，The defect of described lead-out mode is: power terminal needs to carry out bending technique，But the bending dynamics of power terminal and angle are wayward，Terminal after bending is difficult to into 90 ° of standard，Make bending technique requirement higher，On the one hand power terminal may crack at bending part，The problem causing the increase of local electrical resistance because of the existence of cracks，On the other hand the multiple electrode terminals after bending are difficult in one plane，This can cause the circuit board in application process and the loose contact of indivedual terminal and the contact resistance that causes is excessive，In turn result in the superheating phenomenon of local，Also the fastness of junction is influenced whether.
In addition, the power terminal that the above-mentioned second way and the third mode are welded, as run into assembling coupling or the situation of bending technique misoperation, most easily cause terminal to be limited by shell, and cause terminal by a long-term stress, the stress in Forging Process in addition, application process is tightened the stress of screw, easily cause terminal solder joint loosen even come off, have influence on the long-term reliability of module.And no matter the signal terminal of the second way and the third mode is pin type, chip or bending the mode putting nut, it it is all monomeric form, in module encapsulation process, to place signal terminal one by one weld again, application process to be welded or the turn of the screw one by one, operates comparatively laborious, and the power model of this mode is the most, form of terminal various kinds, there is no unified standard, cause terminal client to select, use and change difficulty.
Summary of the invention
The purpose of this utility model is to overcome the deficiencies in the prior art, it is provided that a kind of thin encapsulation module being applicable to three-terminal power device, its compact conformation, reduce packaging technology difficulty, easy to use, effectively reduce package thickness, minimizing parasitic parameter, wide accommodation, safe and reliable.
The technical scheme provided according to this utility model, the described thin encapsulation module being applicable to three-terminal power device, including base plate for packaging and be positioned at the power switch circuit on described base plate for packaging, gland has the encapsulating housing mated with base plate for packaging on the package substrate, and power switch circuit is positioned at encapsulating housing；Also include that the power for being drawn by the power end of power switch circuit internal power device connects post and is used for the signal connector drawn by the signal end of power switch circuit internal power device, described power connects one end of post and welds with the power end of power switch circuit internal power device, power connects the other end of post and passes outside encapsulating housing, signal connector includes SMD row mother or pricking with needle, and encapsulating housing is provided with for by signal connector connecting hole exposed for signal connector.
Described power connects post and passes at least 0.5mm of the height outside encapsulating housing, and power connection post passes one end of encapsulating housing and is provided with the screw thread for connecting.
The degree of depth of described screw thread is that power connects the 30% ~ 100% of post height.
Described screw thread is internal thread hole or external screw thread；The top that described internal thread hole connects post from power downwardly extends or extends internally from the side of power connection post.
Described power connects the cross section of post and includes circle, ellipse, square, hexagon, rhombus or trapezoidal.
Described power device includes MOSFET, IGBT or controllable silicon.
Described base plate for packaging is for covering copper ceramic substrate, aluminum-based copper-clad plate or cuprio copper-clad plate.
Described power connects post and passes the end outside encapsulating housing and be provided with and be connected the connection post securing member that post is fastenedly connected with described power.
Described power is connected post and is connected with the power end of power device by buffer structure, and described buffer structure is L-shaped, S type, c-type or U-shaped.
Advantage of the present utility model: connect post by power and the power end of power device is drawn, signal connector uses pricking with needle or the form of mother row, once the signal end of power device can be drawn, power connection post passes the end of encapsulating housing and has internal thread hole or external screw thread, it is easy to and is connected post securing member and is fastenedly connected, thus reduce the whole height of power package module to reduce the parasitic parameter of terminal, obtain ultrathin low inductance power module, reduce processing cost, shorten the cycle of encapsulation；Screwed hole by power terminal exit, save nut, eliminate the bending process in encapsulation process simultaneously, also the layout very advantages of simple of whole module is made, not only optimize every stray parameter, and make package module extremely simple in the utilization of terminal, facilitate application personnel that terminating circuit structure is designed to lamination straight cutting mode, it is easy to maintenance and the replacing of subsequent module, it is simple to the miniaturization of end product and integrated.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of this utility model embodiment 1.
Fig. 2 is the electrical schematic diagram of this utility model embodiment 1.
Fig. 3 is the schematic diagram of this utility model embodiment 2.
Fig. 4 is the electrical schematic diagram of this utility model embodiment 2.
nullDescription of reference numerals: 1-base plate for packaging、2-encapsulating housing、3-casing step、4-power connects post、5-signal connector、6-connects hole, post location、7-signal connector connecting hole、8-connects post securing member、9-housing connecting hole、10-the first signal connection end、11-secondary signal connects end、12-connects styletable face、13-the first power connects end、14-the second power connects end、15-the 3rd signal connection end、16-the 4th signal connection end、17-internal thread hole、18-the 5th signal connection end、19-the 6th signal connection end、20-the 7th signal connection end、21-the 8th signal connection end、22-the 3rd power connects end、23-the 4th power connects end、24-the 5th power connects end、25-the 9th signal connection end and 26-the tenth signal connection end.
Detailed description of the invention
Below in conjunction with concrete drawings and Examples, the utility model is described in further detail.
In order to reduce packaging technology difficulty, easy to use, effectively reduce package thickness, reduce parasitic parameter, this utility model includes base plate for packaging 1 and is positioned at the power switch circuit on described base plate for packaging 1, having, at described base plate for packaging 1 upper press cover, the encapsulating housing 2 mated with base plate for packaging 1, power switch circuit is positioned at encapsulating housing 2；Also include that the power for being drawn by the power end of power switch circuit internal power device connects post 4 and is used for the signal connector 5 drawn by the signal end of power switch circuit internal power device, described power connects one end of post 4 and welds with the power end of power switch circuit internal power device, power connects the other end of post 4 and passes outside encapsulating housing 2, signal connector 5 includes SMD row mother or pricking with needle, and encapsulating housing 2 is provided with for by signal connector connecting hole 7 exposed for signal connector 5.
Specifically, base plate for packaging 1 is for covering copper ceramic substrate, aluminum-based copper-clad plate or cuprio copper-clad plate, base plate for packaging 1 can also select other existing conventional forms, the shape of base plate for packaging 1 can carry out selection as required and determine, after the shape of base plate for packaging 1 determines, encapsulating housing 2 is consistent with the form fit of base plate for packaging 1.Laying power switch circuit on base plate for packaging 1 by conventional processing step, the concrete form of power switch circuit can select as required, and specially known to those skilled in the art, here is omitted.In this utility model embodiment, power device includes MOSFET, IGBT or controllable silicon, certainly, power device can also use other three terminal device, power device can be that known to one single chip or package thickness device, specially those skilled in the art, here is omitted.
In order to be able to realize the switch purpose of power switch circuit, need the power end of power switch circuit internal power device, signal end is drawn, i.e. connect post 4 by the power consistent with the power end quantity of power device to be drawn by the power end one_to_one corresponding of power device, power is connected post 4 one end and is connected by soldering power end corresponding with power device, power connects the other end of post 4 and passes outside encapsulating housing 2, the signal end of power device carries out coupling electrical connection by using female or pricking with needle the signal connector 5 of SMD row, by signal connector 5, the signal end correspondence of power device is drawn, after making signal connector 5 exposed by connector connecting hole 7, follow-up connection can be easy to, thus reduce the whole height of power package module to reduce the parasitic parameter of terminal, obtain ultrathin low inductance power module.
Further, described power connects post 4 and passes at least 0.5mm of the height outside encapsulating housing 2, and power connection post 4 passes one end of encapsulating housing 2 and is provided with the screw thread for connecting.
In this utility model embodiment, power connects the cross section of post 4 and includes circle, ellipse, square, hexagon, rhombus or trapezoidal, and the degree of depth of screwed hole is that power connects the 30% ~ 100% of post 4 height.When being embodied as, described screw thread can be internal thread hole 17 or external screw thread, and the top that described interior internal thread hole 17 connects post 4 from power downwardly extends or extends internally from the side of power connection post 4.Described internal thread hole 17 can be connected post 4 in coaxial distribution with power, and internal thread hole 17 can also connect the outer surface of post 4 side and extend internally by power, specifically can select as required, and specially known to those skilled in the art, here is omitted.Described power connects post 4 and passes the end outside encapsulating housing 2 and be provided with and be connected the connection post securing member 8 that post 4 is fastenedly connected with described power, can be facilitated by internal thread hole 17 or external screw thread and be connected post securing member 8 and be fastenedly connected.Being connected with the power end of power device additionally, described power connects post 4 by buffer structure, described buffer structure is L-shaped, S type, c-type or U-shaped.
In this utility model embodiment, overcome the deficiency of existing conventional power terminal by the cooperation of power connection post 4 and signal connector 5, reduce processing cost, shorten the cycle of encapsulation；Internal thread hole by power terminal exit, save nut, eliminate the bending process in encapsulation process simultaneously, also the layout very advantages of simple of whole module is made, not only optimize every stray parameter, and make package module extremely simple in the utilization of terminal, facilitate utilization personnel that terminating circuit structure is designed to lamination straight cutting mode, it is easy to maintenance and the replacing of subsequent module, it is simple to the miniaturization of end product and integrated.
In order to enable more clearly thin encapsulation module of the present utility model to be illustrated, it is described in detail below by embodiment 1 and embodiment 2.
Embodiment 1
As shown in Figure 1, thin encapsulation module is cooperatively formed by base plate for packaging 1, encapsulating housing 2, power connection post 4 and signal connector 5, base plate for packaging 1 and encapsulating housing 2 are square, there is the casing step 3 of indent at four end angles of encapsulating housing 2, described casing step 3 upper shell connecting hole 9, by making encapsulating housing 2 be fastenedly connected with the radiator in base plate for packaging 1 and subsequent applications at the built-in bolt of housing connecting hole 9 etc..Power connects post 4 in bar shape, the end that power connection post 4 is positioned at outside encapsulating housing 2 has internal thread hole 17, it is fastenedly connected with being connected post securing member 8 by internal thread hole 17, arranging on encapsulating housing 2 and allow power to connect the hole 6, connection post location that post 4 passes, power connects post 4 and passes outside encapsulating housing 2 by connecting hole 6, post location.
After above-mentioned encapsulation, the thickness of whole power package module can reach 5mm, as long as power connection post 4 passes the end outside power housing 2 and exceeds more than encapsulating housing 0.5mm, i.e. can ensure that effective electrical isolation capabilities.After using power to connect post 4, under subsequent installation twisting force, 3 number of levelss that traditional c-type, S type, L-type and the U-shaped power end leading-out form of stress ratio suffered by solder connecting post 4 for bonding power that be positioned on base plate for packaging 1 is little, are effectively guaranteed the joint reliability of solder joint.It is traditional c-type, S type, L-type and U-shaped power end leading-out form more than 4 times by using power to connect its sectional area of post 4, hence it is evident that improve the conveyance capacity of terminal.
In addition, during by using power connection post 4 to be drawn by the power end of power device, because the column capacity of heat transmission of power connection post 4 is more higher than conventional c, S type, L-type and U-shaped power end leading-out form, it is thus possible to make the overall temperature rise in use of whole power package module have dropped 3 DEG C, thermal resistance diminishes the most accordingly.During by using power connection post 4 to be drawn by the power end of power device, power connect post 4 from inductance value by original more than 10nH, be reduced to only 1-2nH, decrement is obvious, the parasitic parameter of module is improved relatively big, decreases module electromagnetic interference in the course of the work.
As shown in Figure 2, schematic diagram for power switch circuit internal power device, power device includes a MOSFET element and critesistor NTC, the gate terminal of MOSFET element forms secondary signal and connects end 11, the drain electrode end of MOSFET element can form first signal connection end the 10, second power and connect end 14, and the source terminal of MOSFERT device forms the first power and connects end 13；One end of critesistor NTC forms the 3rd signal connection end 15, and the other end of critesistor NTC forms the 4th signal connection end 16.Connecting post 4 by two power to be drawn by first power connection end the 13, second power connection end 14 respectively, the first signal connection end 10, secondary signal connector the 11, the 3rd signal connector 15 and the 4th signal connector 16 are drawn by the signal connector 5 female by the row of employing.The end passing encapsulating housing 2 at power connection post 4 arranges connection post securing member 8, and described connection post securing member 8 can be the form such as nut or bolt, consequently facilitating realize coordinating with the connection of exterior terminal with power device.Conventional multiple single signal terminal is can substitute for, hence it is evident that simplify the packaging technology of module by signal connector 5；The welding sequence that row is female, pricking with needle eliminates terminal of instant-plugging, facilitates terminal client to install and changes power model, also allows for end product to laminating, and integrated direction develops.
Embodiment 2
As shown in Figure 3, thin encapsulation module is cooperatively formed by base plate for packaging 1, encapsulating housing 2, power connection post 4 and signal connector 5, base plate for packaging 1 and the rectangular shape of encapsulating housing 2, there is the casing step 3 of indent at four end angles of encapsulating housing 2, described casing step 3 upper shell connecting hole 9, by making encapsulating housing 2 be fastenedly connected with the radiator in base plate for packaging 1 and subsequent applications at the built-in bolt of housing connecting hole 9 etc..Power connects post 4 in bar shape, the end that power connection post 4 is positioned at outside encapsulating housing 2 has internal thread hole 17, arranging on encapsulating housing 2 and allow power to connect the hole 6, connection post location that post 4 passes, power connects post 4 and passes outside encapsulating housing 2 by connecting hole 6, post location.Power connects post 4 to be had the end of internal thread hole 17 and is formed and connect styletable face 12, and described connection styletable face 12 is in plane.
As shown in Figure 4, power device comprises two MOSFET element, the drain electrode end of one MOSFET element is connected with the source terminal of another MOSFET element, and form the 5th signal connection end the 18, the 6th signal connection end the 19, the 7th signal connection end 20 and the 8th signal connection end 21 the most respectively, additionally, also form the 3rd power to connect end the 22, the 4th power connection end 23 and the 5th power connection end 24；In addition, it can include one end of critesistor NTC, described critesistor NTC forms the 9th signal connection end 25 and the tenth signal connection end 26.
Connect post 4 by three power respectively the 3rd power connection end the 22, the 4th power connection end 23 and the 5th power to be connected end 25 and drawn, 5th signal connection end the 18, the 6th signal connection end the 19, the 7th signal connection end the 20, the 8th signal connection end the 21, the 9th signal connection end 25 and the tenth signal connection end 26 are all connected on the signal connector 5 that the row of employing is female, use signal connector 5 can effectively simplify encapsulating structure.
Usually, when signal connector 5 uses row female, the described row's main bag shell containing plastics and the electrode being placed in shell；When signal connector 5 uses pricking with needle, described pricking with needle its comprise L-shaped electrode and the unit of plastic for fixed electrode, in actual application, row is female and pricking with needle uses the most in pairs, and row is female, the specific constructive form of pricking with needle is that known to those skilled in the art, here is omitted.
Above-described is only preferred implementation of the present utility model, and this utility model is not limited to above example.It is appreciated that the oher improvements and changes that those skilled in the art directly derive or associate on the premise of without departing from spirit of the present utility model and design are all considered as within protection domain of the present utility model.
Claims (9)
1. the thin encapsulation module being applicable to three-terminal power device, including base plate for packaging (1) and be positioned at the power switch circuit on described base plate for packaging (1), have the encapsulating housing (2) mated with base plate for packaging (1) at described base plate for packaging (1) upper press cover, power switch circuit is positioned at encapsulating housing (2)；It is characterized in that: also include that the power for being drawn by the power end of power switch circuit internal power device connects post (4) and for the signal connector (5) drawn by the signal end of power switch circuit internal power device, described power connects one end of post (4) and welds with the power end of power switch circuit internal power device, power connects the other end of post (4) and passes encapsulating housing (2) outward, signal connector (5) includes SMD row mother or pricking with needle, and encapsulating housing (2) is provided with for by signal connector connecting hole (7) exposed for signal connector (5).
The thin encapsulation module being applicable to three-terminal power device the most according to claim 1, it is characterized in that: described power connects post (4) and passes encapsulating housing (2) height at least 0.5mm outward, and power connection post (4) passes one end of encapsulating housing (2) and is provided with the screw thread for connecting.
The thin encapsulation module being applicable to three-terminal power device the most according to claim 2, is characterized in that: the degree of depth of described screw thread is that power connects the 30% ~ 100% of post (4) height.
The thin encapsulation module being applicable to three-terminal power device the most according to claim 2, is characterized in that: described screw thread is internal thread hole (17) or external screw thread；The top that described internal thread hole (17) connects post (4) from power downwardly extends or extends internally from the side of power connection post (4).
The thin encapsulation module being applicable to three-terminal power device the most according to claim 1, is characterized in that: described power connects the cross section of post (4) and includes circle, ellipse, square, hexagon, rhombus or trapezoidal.
The thin encapsulation module being applicable to three-terminal power device the most according to claim 1, is characterized in that: described power device includes MOSFET, IGBT or controllable silicon.
The thin encapsulation module being applicable to three-terminal power device the most according to claim 1, is characterized in that: described base plate for packaging (1) is for covering copper ceramic substrate, aluminum-based copper-clad plate or cuprio copper-clad plate.
The thin encapsulation module being applicable to three-terminal power device the most according to claim 1, is characterized in that: described power connects post (4) and passes encapsulating housing (2) end outward and be provided with and be connected connection post securing member (8) that post (4) is fastenedly connected with described power.
The thin encapsulation module being applicable to three-terminal power device the most according to claim 1, is characterized in that: described power is connected post (4) and is connected with the power end of power device by buffer structure, and described buffer structure is L-shaped, S type, c-type or U-shaped.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620130576.4U CN205488091U (en) | 2016-02-19 | 2016-02-19 | Slim encapsulation module suitable for three -terminal power device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201620130576.4U CN205488091U (en) | 2016-02-19 | 2016-02-19 | Slim encapsulation module suitable for three -terminal power device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105529313A (en) * | 2016-02-19 | 2016-04-27 | 无锡新洁能股份有限公司 | Thin type package module suitable for three-terminal power device |
| CN108305852A (en) * | 2017-01-12 | 2018-07-20 | 三菱电机株式会社 | Semiconductor module |
-
2016
- 2016-02-19 CN CN201620130576.4U patent/CN205488091U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105529313A (en) * | 2016-02-19 | 2016-04-27 | 无锡新洁能股份有限公司 | Thin type package module suitable for three-terminal power device |
| CN108305852A (en) * | 2017-01-12 | 2018-07-20 | 三菱电机株式会社 | Semiconductor module |
| CN108305852B (en) * | 2017-01-12 | 2021-04-30 | 三菱电机株式会社 | Semiconductor module |
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