CN205464326U - Thin wall seals liquid cooling passageway based on quick forming technology of metal - Google Patents
Thin wall seals liquid cooling passageway based on quick forming technology of metal Download PDFInfo
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- CN205464326U CN205464326U CN201620025427.1U CN201620025427U CN205464326U CN 205464326 U CN205464326 U CN 205464326U CN 201620025427 U CN201620025427 U CN 201620025427U CN 205464326 U CN205464326 U CN 205464326U
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Abstract
The utility model relates to a liquid cooling heat dissipation technical field, the utility model discloses a thin wall seals liquid cooling passageway based on quick forming technology of metal, the preparation of the quick forming technology of liquid cooling passageway adoption metal, the cross -section of liquid cooling passageway is the straight line and is connected the loop configuration that forms with the pitch arc, and the loop configuration is piled up the direction along the metal and is rounded rectangle, the top of liquid cooling passageway is the plane, and its plane is connected through two arcs all the other walls with the liquid cooling passageway. Setting up to the plane through the top with the liquid cooling passageway, having avoided the appearance on circular arc summit, this plane is connected through two arcs all the other walls with the liquid cooling passageway simultaneously, has also kept the comparatively good mechanics characteristic in cross -section. Because adopt this structure for can minimum metal wall thickness drop 0.5 to 0.6mm.
Description
Technical field
This utility model relates to liquid-cooling heat radiation technology, a kind of thin-walled cold passage of sealing fluid based on metal quick shaping process, the thinnest available sealing wall thickness.
Background technology
Liquid-cooling heat radiation is the electron trade conventional type of cooling to thermoelectron chip occurred frequently.Its principle is to arrange the cold passage of liquid in the inside of electronic chip installing plate (playing cooling effect, also known as cold drawing) simultaneously, is passed through coolant, utilizes coolant to be taken away by the heat that electronic chip produces, thus lowers the temperature to heat dissipation of electronic chip.
Improve a kind of effective way of liquid-cooling heat radiation efficiency, be to try to shorten the heat transfer distances between euthermic chip and coolant, i.e. as it is shown in figure 1, the top board wall thickness (size H in figure) of the cold passage of reducer as far as possible, thus reduce heat transfer temperature difference.The traditional design method of the cold drawing containing the cold passage of liquid, is that cold drawing is divided into upper and lower two parts process respectively, the most welded.The wherein part containing the cold passage of liquid, its processing method, the technique such as including line cutting, Milling Machining, spark machined.In this kind of technique, owing to processing mode, processing technique etc. limit, it is only capable of processing the cold passage of liquid of simple cross sectional shape, welded with another part the most again.Bear the consideration of coolant pressure based on welded seal reliability and weld seam, generally liquid cold passage top plate thickness is not less than 1mm, and the cold channel pitch of each liquid is not less than 2mm.
Rapid shaping technique, development since the eighties in last century is born, rapid shaping technique based on metal material has had certain technology maturity in recent years, it is widely used in the industries such as electronics, Aero-Space, specific manufacture, quick shaping process is utilized to manufacture the various electronic chip installing plates (cold drawing) containing the cold passage of liquid the most of common occurrence, electronic chip cold drawing is designed based on quick shaping process, cold drawing need not be divided into two parts process respectively, also this procedure of welding is eliminated, belong to one-shot forming technique, thus obtain increasing concern.
Generally, being retrained by quick shaping process, the cold passage of liquid of making is piling up the top board wall thickness 3-4mm to be reached at forming direction upper channel top, the most easily produces seepage hole and hole, causes the cold channel seal of liquid to lose efficacy.And blocked up top board wall thickness is the biggest to the negative effect of radiating efficiency.
Summary of the invention
For top board wall thickness thickness of the prior art at least at 3-4mm, cause the technical problem that the negative effect to radiating efficiency is the biggest, the utility model discloses a kind of thin-walled cold passage of sealing fluid based on metal quick shaping process.
The technical solution of the utility model is as follows
The utility model discloses a kind of thin-walled cold passage of sealing fluid based on metal quick shaping process, the cold passage of described liquid uses metal quick shaping process to prepare, the cross section of the cold passage of liquid is that straight line is connected the loop configuration formed with camber line, and loop configuration is round rectangle along metal accumulation direction；The top of the cold passage of liquid is plane, and its plane is connected by remaining wall of two arc passages cold with liquid.By the top of cold for liquid passage is set to plane, it is to avoid the appearance on circular arc summit, this plane is connected by remaining wall of two arc passages cold with liquid simultaneously, also maintain the mechanical characteristic that cross section is the most excellent.Because using this structure so that minimum metal wall thickness can be down to 0.5-0.6mm.
Further, the radius of two arcs connecting top planes is equal.Certainly radius can also be unequal.
Further, arc and each straight line plane take smooth manner to carry out transition.Using to seamlessly transit to avoid circular arc curvature and straight line to intersect the hard transition intersection formed, thus avoids in the rapid shaping course of processing the most laser sintered to hard point of intersection so that repeatedly melts at sintering, destroys original molding structure.
Further, radius R1, R2 value of two arcs of connection top planes is between 0.1mm-3mm, and arc top plane length value is between 0.1mm-1mm.Particularly, in radius R1, R2 value of two arcs at 0.1mm-2.9mm, arc top plane length value is between 0.1mm-0.9mm, and the one-pass finished rate of product is higher.
By using above technical scheme, the beneficial effects of the utility model are: sealing fluid cold passage of based on metal quick shaping process manufacture needed for metallic walls thickness is greatly reduced, minimum metal wall thickness is down to 0.5-0.6mm by 3mm-4mm, thus improves liquid cold passage heat-sinking capability.
Accompanying drawing explanation
Fig. 1 is liquid-cooling heat radiation principle schematic.
Fig. 2 is metal quick shaping process flow process.
Fig. 3 is the cold drawing structural representation of different runner cross sectional shape.
Fig. 4 is metal quick shaping process schematic diagram.
Fig. 5 is the method for designing schematic diagram of the thin-walled cold passage of sealing fluid based on metal quick shaping process.
Fig. 6-Fig. 8 is the scheme schematic diagram of tri-kinds of different cross section shapes of a, b, c.
Wherein: 11 is euthermic chip；12 is the cold passage of liquid；13 is top board wall thickness H；14 is the chip mounting board (cold drawing) containing the cold passage of liquid.
21 is generating laser.
31 is runner；32 is cold drawing.
41 is normal sintering region；21 is generating laser；43 is sintering region, " 4 " direction.
51 is metal rapid shaping matrix；52 is metal rapid shaping stacked direction.
61 for needing radiating electronic chip；62 is metal rapid shaping stacked direction.
71 for needing radiating electronic chip；72 is metal rapid shaping stacked direction.
Detailed description of the invention
Below in conjunction with Figure of description, describe detailed description of the invention of the present utility model in detail.
The utility model discloses a kind of thin-walled cold passage of sealing fluid based on metal quick shaping process, its schematic diagram is as shown in Figure 1.
Metal quick shaping process manufactures the cold channel flow of liquid as shown in Figure 2.Rapid shaping processing technique employing laser laminar sintering metal powder the mode stacked manufacture part.Its principle, as in figure 2 it is shown, utilize laser transmitter projects lf to need the powder of moulding section in metal dust, cools down after powder melts again and i.e. completes by powder to the sintering transformation of solid.For part to be processed, first " 1 " direction along Fig. 2 is inswept needs sintered powder for the laser beam of one fixed width, completes powder curing flow process.Then generating laser moves a beam width, the again inswept powder needing sintering along " 1 " direction along " 2 " direction.So circulation, repeats the above staggered process scanning sintering, until completing the region of this layer of there is a need to powder curing.
After completing all processing of layer plane, process equipment can the most uniformly be paved with certain thickness new metal powder layer along " 3 " direction as shown in Figure 2, then repeats process shown in Fig. 2, and processing this plane needs the region of sintering.This process is continuous the most repeatedly, until part machines.
Owing to cold drawing series products indoor design has logical liquid stream road, needing the through-flow coolant with certain pressure, therefore leading to liquid stream road is also a kind of pressure pipeline.In general, circular cross-section or similar round cross section are pressure pipeline mechanics Optimum cross section shapes, as shown in Figure 3.Bearing the logical liquid stream road of certain pressure, to be designed as wall thickness when circular cross-section or similar round cross section in theory the thinnest.
Liquid cold runner is circular cross-section or the cold drawing in similar round cross section, and during quick forming fabri-cation, major part flow process is consistent with flow process shown in Fig. 2.When manufacture proceeds to powder bed as shown in Figure 4, when i.e. needing to manufacture circular cross-section summit layer, processing mode has certain change.The wire path that runner circular arc summit is formed, according to metal quick shaping process code requirement, process equipment can identify this path automatically, laser beam can carry out the reinforcement sintering of " Z " font in " 4 " direction along Fig. 4, again solidify this region, it is ensured that the metal dust in the wire path that summit is formed fully sinters.When liquid cold passage top board wall thickness is relatively thin, the wire path repeatedly formed along sintering circular arc summit, " 4 " direction at each accumulation horizon due to laser beam, this region melting-solidification-melting-solidification repeatedly can be caused, form hole or crackle so that the cold passage of liquid is revealed and cannot be sealed.Therefore, continuing stacking powder bed, until after liquid cold passage top plate thickness reaches about 3-4mm, the energy of laser beam is not enough to melted penetrate thicker metal solid, or when through-thickness cannot form the space, the crackle that run through, the cold pipeline of liquid just can reach sealing state.
By the method for designing design cold channel cross-sectional shape of sealing fluid described in this patent, channel metal wall thickness can be greatly decreased when utilizing Rapid metallic to manufacture the cold passage of liquid.
Thin-walled based on the processing of metal rapid shaping seals the method for designing of passage, it is characterized in both having ensured as similar round so that the cross section of the cold passage of liquid, make it have excellent mechanical characteristic, the top structure of semicircular arc-shaped can be avoided the occurrence of again so that it is avoid the occurrence of the path of needs " Z " the type route sintering that circular arc summit is formed in the fabrication process.
Structure described in patent is as it is shown in figure 5, be designed as rounded rectangle shape along the cold channel roof of liquid in metal accumulation direction, and circular arc and each straight line plane take smooth manner to carry out transition.This design has changed circular arc type top into similar round top, it is to avoid the appearance on circular arc summit, also maintains the mechanical characteristic that cross section is the most excellent simultaneously.According to the requirement of metal quick shaping process, in the plane being perpendicular to ground level, the diameter of circular opening section feature can not be more than 6mm.In the parallel plane with ground level, the jib-length (such as " l " feature in Fig. 4) of cantilever design not can exceed that 1mm.Therefore in Fig. 5, radius of corner R1, R2 and arc top plane length l are the most restricted.Radius of corner R1, R2 value need to be between 0.1mm-3mm (R1, R2 value can be unequal), and arc top plane length l value is between 0.1mm-1mm.
This patent method is supported the cold drawing design between 0.5mm-7mm of the width of the internal cold passage of liquid and manufactures, and can keep the sealing that top plate thickness is not less than 0.5mm, yield rate is about more than 95%.
For solving certain heat dissipation of electronic chip problem, it is respectively designed with the thin-walled cold passage of sealing fluid based on metal quick shaping process of tri-kinds of different cross section shape schemes of Fig. 6-Fig. 8 a, b, c.Wherein scheme a uses this patent method for designing design cold channel roof of liquid, and the cold channel roof of scheme b liquid is designed as semicircle, and the cold channel roof of scheme c liquid is designed as rectangle.Manufacture 3 class exemplars by metal quick shaping process and detect the sealing of the cold passage of liquid under different channel roof thickness condition.In air-proof condition next top, thin-walled thickness is designated as Ha, Hb, Hc to tri-kinds of cold passages of liquid of a, b, c respectively.
Owing to scheme b is semicircle, its arc top can form needs " Z " font sintering region, it is therefore desirable to just can make the cold passage of sealing fluid after thicker top board wall.Scheme c, owing to cantilever design length is more than 1mm, is permitted beyond technique, and therefore it can not be successfully produced.Scheme a according to the design of this patent method, it is possible to produce the very thin cold passage of wall liquid.Through trial-production, the top minimum wall thickness (MINI W.) contrast meeting seal request is as follows:
Respectively scheme a trial-produceed successfully, two kinds of cold drawings of b are carried out heat dispersion test.Use same procedure that one euthermic chip of the same race is respectively installed the cold drawing of two schemes, and apply the thermal power of 20w.Be passed through temperature in the cold drawing of two schemes is 25 DEG C simultaneously the most simultaneously, and flow is the cooling water of 0.5l/min, tests euthermic chip case temperature, and test result contrast is as follows:
| Cold drawing scheme | a | b |
| Electronic chip case temperature (DEG C) | 45.5 | 62.2 |
As can be seen here, the method for designing of the thin-walled cold passage of sealing fluid based on metal quick shaping process that employing patent is advocated obtains the thinnest sealing wall thickness, has huge advantage with the contrast of other designs.Thin-walled liquid cold passage cold drawing has a clear superiority on heat dispersion simultaneously.
The coefficient gone out given in the above embodiments and parameter; it is available to those skilled in the art realize or use utility model; utility model does not limit and only takes aforementioned disclosed numerical value; in the case of without departing from the thought of utility model; above-described embodiment can be made various modifications or adjustment by those skilled in the art; thus the protection domain of utility model is not limited by above-described embodiment, and should be the maximum magnitude meeting the inventive features that claims are mentioned.
Claims (5)
1. the thin-walled cold passage of sealing fluid based on metal quick shaping process, it is characterized in that the cold passage of described liquid uses metal quick shaping process to prepare, the cross section of the cold passage of liquid is that straight line is connected the loop configuration formed with camber line, and loop configuration is round rectangle along metal accumulation direction；The top of the cold passage of liquid is plane, and its plane is connected by remaining wall of two arc passages cold with liquid.
2. the thin-walled cold passage of sealing fluid based on metal quick shaping process as claimed in claim 1, it is characterised in that the radius of two arcs connecting top planes is equal.
3. the thin-walled cold passage of sealing fluid based on metal quick shaping process as claimed in claim 1, it is characterised in that the radius of two arcs connecting top planes is unequal.
4. the thin-walled cold passage of sealing fluid based on metal quick shaping process as claimed in claim 1, it is characterised in that arc and each straight line plane take smooth manner to carry out transition.
5. the thin-walled cold passage of sealing fluid based on metal quick shaping process as claimed in claim 1, it is characterised in that radius R1, R2 value of two arcs of connection top planes is between 0.1mm-3mm, and arc top plane length value is between 0.1mm-1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620025427.1U CN205464326U (en) | 2016-01-12 | 2016-01-12 | Thin wall seals liquid cooling passageway based on quick forming technology of metal |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201620025427.1U CN205464326U (en) | 2016-01-12 | 2016-01-12 | Thin wall seals liquid cooling passageway based on quick forming technology of metal |
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| CN205464326U true CN205464326U (en) | 2016-08-17 |
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| CN201620025427.1U Withdrawn - After Issue CN205464326U (en) | 2016-01-12 | 2016-01-12 | Thin wall seals liquid cooling passageway based on quick forming technology of metal |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105436504A (en) * | 2016-01-12 | 2016-03-30 | 中国电子科技集团公司第二十九研究所 | Thin-wall sealing liquid cooling channel based on metal quick forming technology |
-
2016
- 2016-01-12 CN CN201620025427.1U patent/CN205464326U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105436504A (en) * | 2016-01-12 | 2016-03-30 | 中国电子科技集团公司第二十九研究所 | Thin-wall sealing liquid cooling channel based on metal quick forming technology |
| CN105436504B (en) * | 2016-01-12 | 2018-04-03 | 中国电子科技集团公司第二十九研究所 | A kind of thin-walled sealing fluid cold passage based on metal quick shaping process |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20160817 Effective date of abandoning: 20180403 |