CN214507750U - Electronic chip liquid cooling temperature-equalizing plate - Google Patents
Electronic chip liquid cooling temperature-equalizing plate Download PDFInfo
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- CN214507750U CN214507750U CN202120796109.6U CN202120796109U CN214507750U CN 214507750 U CN214507750 U CN 214507750U CN 202120796109 U CN202120796109 U CN 202120796109U CN 214507750 U CN214507750 U CN 214507750U
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Abstract
The utility model discloses an electronic chip liquid cooling temperature-uniforming plate, last aluminum plate and lower aluminum plate including the pressfitting of mutual sealing, go up aluminum plate and blow-up formation liquid cooling runner down between the aluminum plate, liquid cooling temperature-uniforming plate side is connected with inlet tube and outlet pipe. The utility model discloses a manufacturing approach of hot rolling inflation combines the liquid cooling board samming principle, provides simple structure, the surface is smooth, the temperature uniformity is good, low cost's electron chip liquid cooling samming board.
Description
Technical Field
The utility model relates to an electron chip heat dissipation technical field especially relates to an electron chip liquid cooling samming board.
Background
With the continuous increase of the heat flux density of the electronic chip and the increase of the power demand, the traditional air cooling technology cannot meet the heat dissipation requirement of the highly integrated electronic chip, and the liquid cooling technology gradually becomes the mainstream of the market.
The current liquid cooling technology comprises direct cooling and indirect cooling, wherein the direct cooling is that insulating liquid such as fluorinated liquid and the like is filled in a machine box to directly contact with an electronic chip for heat dissipation, and the mode is limited by the insulating liquid, so that the cost is high, the maintenance is difficult, and the application in the market is less. The indirect cooling is that a liquid flow channel is arranged in the liquid cooling plate, and the heat is taken away by the contact heat conduction of the liquid cooling plate and the electronic chip.
The cooling effect to electronic chip of its many notes of present liquid cold plate, however the liquid cold plate of only noting the cooling effect can lead to the fact bigger difference in temperature to electronic chip, and the holistic temperature uniformity of electronic chip is not very ideal, so how to consider the cooling effect and the temperature uniformity effect of liquid cold plate simultaneously at the in-process of design runner, improve current liquid cold plate, become one of the problem that the liquid cooling scheme is urgent to wait to solve.
Disclosure of Invention
In order to solve the above technical problem, an object of the present invention is to provide an electronic chip liquid cooling temperature equalization plate.
The purpose of the utility model is realized through the following technical scheme:
the utility model provides an electronic chip liquid cooling temperature-uniforming plate, includes last aluminum plate and lower aluminum plate of mutual sealed pressfitting, go up the inflation and form the liquid cooling runner between aluminum plate and the lower aluminum plate, liquid cooling temperature-uniforming plate side is connected with inlet tube and outlet pipe.
Compared with the prior art, the utility model discloses an advantage can have as follows to one or more embodiments: the electronic chip liquid cooling temperature equalizing plate has the advantages of simple structure, smooth surface, good temperature equalizing property and low cost by the hot rolling and blowing manufacturing method and combining the temperature equalizing principle of the liquid cooling plate.
Drawings
FIGS. 1a and 1b are an overall structural view and a side view of a trapezoidal diverging honeycomb liquid-cooled panel according to a first embodiment;
FIG. 2 is a flow channel schematic diagram of a trapezoidal diverging honeycomb liquid cooling plate;
FIGS. 3a and 3b are an overall structural view and a side view of a triangular divergent cellular liquid-cooled panel according to a second embodiment;
FIG. 4 is a schematic flow channel diagram of a triangular divergent honeycomb liquid cooling plate;
FIGS. 5a and 5b are an overall structural view and a side view of a serpentine liquid-cooled panel of the third embodiment;
fig. 6 is a flow channel structure diagram of a serpentine liquid cooling plate.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, embodiments of the present invention will be described in further detail with reference to the following embodiments and accompanying drawings.
Electronic chip liquid cooling temperature-uniforming plate, including last aluminum plate 1 and lower aluminum plate 2 of mutual sealed pressfitting, go up aluminum plate 1 and blow up formation liquid cooling runner 5 down between the aluminum plate 2, liquid cooling temperature-uniforming plate side is connected with inlet tube 3 and outlet pipe 4 (as shown in fig. 2).
The liquid cooling flow passages comprise three types, and three different types of liquid cooling flow passages form three liquid cooling temperature equalizing plates with different structures; the liquid cooling temperature equalizing plates with three different structures comprise a liquid cooling temperature equalizing plate with a trapezoidal gradually expanding honeycomb structure, a liquid cooling temperature equalizing plate with a triangular gradually expanding honeycomb structure and a liquid cooling temperature equalizing plate with a snake-shaped structure. The upper aluminum plate and the lower aluminum plate are matched in thickness and height expansion, and the material is alloy aluminum. Through holes are respectively formed in four corners of the liquid cooling temperature equalizing plate. Further, the upper aluminum plate and the lower aluminum plate have proper thicknesses and are matched with the swelling height. The upper aluminum plate can be 1mm thick, the lower aluminum plate can be 0.7mm thick, and the expansion height between the upper aluminum plate and the lower aluminum plate is 0.9 mm. Through holes are formed in four corners of the liquid cooling plates, so that the liquid cooling plates can be connected conveniently, and the diameter of each through hole is 5.2 mm.
First embodiment
As shown in fig. 1a, 1b and fig. 2, in this embodiment, the trapezoidal gradually expanding honeycomb-shaped structure liquid cooling plate is used for illustration, a circular island is arranged on an upper aluminum plate of the trapezoidal gradually expanding honeycomb-shaped structure liquid cooling temperature-uniforming plate, and a certain center distance exists between the circular island and the circular island. Furthermore, 32 circular islands with the diameter of 7mm are arranged on an upper aluminum plate of the liquid cooling temperature-equalizing plate with the trapezoidal gradually-expanding honeycomb-shaped structure, and the center distance between the circular islands is 13.5-16 mm.
Second embodiment
As shown in fig. 3a, 3b and 4, the embodiment is described in detail by using a liquid cooling plate with a triangular gradually-expanding honeycomb structure, wherein a circular island and an elliptical island are arranged on an upper aluminum plate of the liquid cooling temperature equalizing plate with the triangular gradually-expanding honeycomb structure, and a certain center distance exists between the circular island and the elliptical island. Further, be equipped with 30 circular islands and two oval islands that the diameter is 9mm on the last aluminum plate of triangle gradually-enlarged honeycomb structure liquid cooling temperature-uniforming plate, vertical center distance and horizontal center distance between the circular islands are 16mm, the oval center distance of oval island is 5.62mm and 11.67mm respectively.
Third embodiment
As shown in fig. 5a, 5b and 6, the liquid-cooled temperature-uniforming plate in the serpentine structure is described in detail in this embodiment, a circular island and an elliptical island are disposed on an upper aluminum plate of the serpentine liquid-cooled temperature-uniforming plate, and a certain center distance exists between the circular island and the elliptical island. Furthermore, be equipped with four circular islands and an oval island that the diameter is 9mm on the last aluminum plate of snakelike liquid cooling samming board, the perpendicular centre-to-centre spacing between the circular island is 18mm, the oval centre-to-centre spacing of oval island is 56 mm.
The embodiment also provides a manufacturing method of the electronic chip liquid cooling temperature equalizing plate, which comprises the following steps:
(1) printing and riveting, namely printing by using a screen printing plate which is reduced in a certain proportion according to the size of a graph pipeline graph, printing the graph on the roughened surface of an aluminum plate by using graphite, and covering a layer of aluminum plate on the surface of the printed aluminum plate for riveting to form a double-layer aluminum plate green body;
(2) hot rolling, namely performing hot rolling and rolling composite treatment on the green body to form a cooked blank;
(3) annealing, namely putting the cooked blank into a high-temperature annealing furnace for uniform annealing treatment;
(4) punching, wherein an inflation opening is formed in the annealed mature blank according to the corresponding position of a drawing, and the inflation opening is communicated with a liquid cold runner;
(5) blowing, namely putting the punched cooked blank into a bulging machine for blowing, and forming a liquid cooling channel;
(6) punching, namely putting the blown mature blank into a special punching die for punching, and removing redundant leftover materials and punching waste materials;
(7) and (3) welding pipelines, namely connecting a water inlet pipe joint and a water outlet pipe joint with the blowing plate by using argon arc welding or flame brazing to prepare the liquid-cooled temperature equalizing plate.
In the hot rolling of the step (2), the heating temperature is 460 ℃; in the annealing in the step (3), the annealing temperature is 400-500 ℃; in the punching in the step (6), circles with the diameter of 5.2mm are cut at four corners of the liquid-cooled temperature-equalizing plate according to a drawing to form through holes; and (5) in the step (7) of pipeline welding, the welded water inlet pipe joint and water outlet pipe joint are respectively connected with the water inlet pipe 3 and the water outlet pipe 4. After the step (7) of welding the pipelines, the method also comprises a surface treatment step (8): the liquid cooling temperature equalizing plate is subjected to surface treatment by means of anodic oxidation, powder spraying and the like, so that the liquid cooling temperature equalizing plate with a smooth, neat and attractive surface is obtained.
Although the embodiments of the present invention have been described above, the description is only for the convenience of understanding the present invention, and the present invention is not limited thereto. It will be apparent to persons skilled in the relevant art that various changes in form and detail can be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (6)
1. The utility model provides an electronic chip liquid cooling temperature-uniforming plate, its characterized in that, including last aluminum plate (1) and lower aluminum plate (2) of mutual sealed pressfitting, go up aluminum plate (1) and blow up down between aluminum plate (2) and form liquid cooling runner (5), liquid cooling temperature-uniforming plate side is connected with inlet tube (3) and outlet pipe (4).
2. The electronic chip liquid-cooled temperature-uniforming plate as claimed in claim 1, wherein said liquid-cooled flow passages (5) include three types, and three different types of liquid-cooled flow passages form three different structures of the liquid-cooled temperature-uniforming plate; the liquid cooling temperature equalizing plates with three different structures comprise a liquid cooling temperature equalizing plate with a trapezoidal gradually expanding honeycomb structure, a liquid cooling temperature equalizing plate with a triangular gradually expanding honeycomb structure and a liquid cooling temperature equalizing plate with a snake-shaped structure.
3. The liquid-cooled temperature-uniforming plate for electronic chips as claimed in claim 1, wherein the upper and lower aluminum plates are matched in thickness and height, and are made of aluminum alloy.
4. The liquid-cooled temperature-uniforming plate for electronic chip of claim 1, wherein through holes are respectively formed at four corners of the liquid-cooled temperature-uniforming plate.
5. The liquid-cooled temperature-equalizing plate for electronic chips as claimed in claim 2, wherein the upper aluminum plate of the liquid-cooled temperature-equalizing plate with the trapezoidal gradually-expanding honeycomb structure is provided with a circular island, and a certain center distance exists between the circular island and the circular island.
6. The liquid-cooled temperature-equalizing plate of claim 2, wherein a circular island and an elliptical island are respectively disposed on the upper aluminum plate of the liquid-cooled temperature-equalizing plate with the delta-divergent honeycomb structure and the upper aluminum plate of the liquid-cooled temperature-equalizing plate with the serpentine structure, and a certain center distance exists between the circular island and between the circular island and the elliptical island.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120796109.6U CN214507750U (en) | 2021-04-19 | 2021-04-19 | Electronic chip liquid cooling temperature-equalizing plate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120796109.6U CN214507750U (en) | 2021-04-19 | 2021-04-19 | Electronic chip liquid cooling temperature-equalizing plate |
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| CN214507750U true CN214507750U (en) | 2021-10-26 |
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| CN202120796109.6U Active CN214507750U (en) | 2021-04-19 | 2021-04-19 | Electronic chip liquid cooling temperature-equalizing plate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114025582A (en) * | 2021-11-23 | 2022-02-08 | 佛山市液冷时代科技有限公司 | 5G intelligent rod of collection AAU liquid cooling system |
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2021
- 2021-04-19 CN CN202120796109.6U patent/CN214507750U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114025582A (en) * | 2021-11-23 | 2022-02-08 | 佛山市液冷时代科技有限公司 | 5G intelligent rod of collection AAU liquid cooling system |
| CN114025582B (en) * | 2021-11-23 | 2022-06-10 | 佛山市液冷时代科技有限公司 | 5G intelligent rod of collection AAU liquid cooling system |
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