CN205452257U

CN205452257U - A wafer anchor clamps for metal evaporation

Info

Publication number: CN205452257U
Application number: CN201521132704.0U
Authority: CN
Inventors: 白龙刚; 王大伟
Original assignee: XI'AN LIXIN OPTOELECTRONIC TECHNOLOGY Co Ltd
Current assignee: XI'AN LIXIN OPTOELECTRONIC TECHNOLOGY Co Ltd
Priority date: 2015-12-30
Filing date: 2015-12-30
Publication date: 2016-08-10
Anticipated expiration: 2025-12-30

Abstract

The utility model provides a wafer anchor clamps for metal evaporation can avoid current anchor clamps contact segment the follow -up technology of coating by vaporization metal pair to bring unfavorable influence. These wafer anchor clamps include annular base and end cover, and annular base's the inside region of extending of inner circle is used for bearing wafer, end cover and annular base adaptation lock, the inside region of extending of annular base's inner circle be a plurality of tooth that extends to the annular base center, and the inner circle of tooth is less than the radius of wafer to the central distance of base, and the outer lane of tooth is more than or equal to the radius of wafer to the central distance of base. Adopt the utility model discloses, the outward flange region of wafer can form the metal level to eliminated platform jump, the marginal gap of having avoided the rete gradient to cause, thus prevented the pollution of abrasive material to the wafer surface, and then promoted the product yield, reduced the follow -up technology degree of difficulty.

Description

A kind of wafer jig for evaporation of metal

Technical field

This utility model relates to a kind of wafer jig for evaporation of metal.

Background technology

Wafer needs when carrying out evaporation of metal technique to be installed by corresponding fixture to fix, as shown in Figure 1, 2, wafer jig, including circular base and end cap, the region (annular table terrace) that the inner ring of circular base inwardly extends is used for support wafer, and end cap fastens with circular base adaptation.

Existing pedestal structure be that the ring-type carrier ring of the 5mm extended internally out on inner ring subjective basis is for supporting wafer.So when fixing wafer, crystal round fringes one encloses about 5mm scope and blocks on above-mentioned annular table terrace；During evaporation, the part that is blocked can not be deposited with metal, and subsequent technique is brought adverse influence.

First, it is impossible to complete carries out electron beam metal evaporation (physical process) to wafer, affects outward appearance；

Secondly, in following electroplating technology (electrochemical process), edge, owing to not having metal to cover, causes plating can not deposit (plating need to be carried out on conducting medium film)；

3rd, when rear technique is thinning, due to film layer gradient difference (edge does not has metal to cover), abrasive solution etc. can be caused to enter inside wafer, pollute wafer；Additionally, due to edge discontinuity equalization can cause curved edge even sliver in process of lapping, have a strong impact on product yield；

4th, after grinding, wafer with support that carrier is more difficult separates, and have more cull.

Utility model content

In order to avoid subsequent technique cannot be brought adverse influence by evaporation metal by existing holder contacts part, the utility model proposes a kind of new wafer jig.

Solution of the present utility model is as follows:

A kind of wafer jig for evaporation of metal, including circular base and end cap, the region that the inner ring of circular base inwardly extends fastens with circular base adaptation for support wafer, end cap；The region that the inner ring of circular base inwardly extends is changed into several teeth extended to circular base center by this utility model, the inner ring of tooth is more than or equal to the radius (i.e. wafer only obtains support with these tooth contacts) of wafer to the distance of base central less than the radius of wafer, the distance of the outer ring of tooth to base central.

On the basis of above scheme, this utility model has made following optimization the most further:

When unassembled wafer, the edge of described end cap is crimped on the outer ring of described tooth.Can also suitably increase the size of end cap, the form adaptation using end cap to contact with the upper surface of circular base fastens.

The upper surface of tooth is less than the upper surface (direction supporting carrier sensing wafer is defined as from top to bottom) of described circular base.

It is provided with three teeth altogether, is positioned at the third office of inner ring.So with minimum tooth and wafer contacts the stability ensureing support.

The tooth thickness in vertical wafer direction is less than the thickness of circular base inner ring main body.For example, it is possible to the central region several teeth being arranged on pedestal inner ring body normal direction.

The upper surface of tooth is at same plane.

Each tooth is less than 3mm along the length in base central direction.

After assembling with wafer, what each tooth projected on wafer is shaped as square, rectangle, triangle, trapezoidal, arc, semi-circular or the combination in any of above shape.

Technique effect of the present utility model is as follows:

1, disposed wafer by several little teeth, can guarantee that crystal column surface overwhelming majority evaporation metal, it is ensured that electrodeposited coating metal uniform fold crystal column surface during plating；

2, the outer edge region of wafer can form metal level, thus eliminates step difference, it is to avoid the edge slot that film layer gradient causes, thus prevents the abrasive material pollution to crystal column surface, and then improves product yield, reduces subsequent technique difficulty；

3, abrasive material can be avoided to destroy the support carrier used when grinding, make wafer and support carrier well to separate, and reduce cull in a large number.

Accompanying drawing explanation

Fig. 1 is that tradition wafer jig installs, with wafer, the schematic diagram coordinated.

Fig. 2 is the thin portion schematic diagram of Fig. 1.

Fig. 3 is the schematic diagram of this utility model wafer jig.

Fig. 4 is the thin portion schematic diagram of Fig. 3.

Fig. 5 is the product wafer schematic diagram that outer edge region has endless metal belt.

The schematic diagram of product wafer when Fig. 6 is technique for thinning back side.

Drawing reference numeral illustrates:

1-circular base；2-wafer；3-end cap；

101-annular table terrace；The little tooth of 102-；The inner ring main body of 103-circular base.

4-isolation area；5-metal area；6-wafer；7-endless metal belt；8-supports carrier.

Detailed description of the invention

As shown in Figure 3,4, the inner ring trisection posistion at circular base retains the little tooth of three 3mm × 3mm sizes, with these three little tooth, wafer is carried out carrying and fixes.

Inner ring inner major diameter is slightly larger than wafer external diameter, keep suitable gap, the outer edge region making wafer can form metal level (endless metal belt of 5mm as shown in the figure, this endless metal belt and the metal being positioned at the chip functions district in the middle part of wafer are generated) by electron beam evaporation primary depositing.Wafer is when operation electroplating technology; at this region re-plating last layer metal so that crystal round fringes does not exist step difference (as shown in Figure 6), stop that abrasive material pollutes crystal column surface; improving product yield, also makes crystal round fringes and protection adhesive tape preferably to paste.

Claims

1., for a wafer jig for evaporation of metal, including circular base and end cap, the region that the inner ring of circular base inwardly extends fastens with circular base adaptation for support wafer, end cap；It is characterized in that: the region that the inner ring of described circular base inwardly extends is several teeth extended to circular base center, the distance of the inner ring of tooth to base central is less than the radius of wafer, and the distance of the outer ring of tooth to base central is more than or equal to the radius of wafer.

Wafer jig for evaporation of metal the most according to claim 1, it is characterised in that: when unassembled wafer, the edge of described end cap is crimped on the outer ring of described tooth.

Wafer jig for evaporation of metal the most according to claim 1, it is characterised in that: the upper surface of described tooth is less than the upper surface of described circular base.

Wafer jig for evaporation of metal the most according to claim 1, it is characterised in that: it is provided with three teeth altogether, is positioned at the third office of inner ring.

Wafer jig for evaporation of metal the most according to claim 1, it is characterised in that: the described tooth thickness in vertical wafer direction is less than the thickness of circular base inner ring main body.

Wafer jig for evaporation of metal the most according to claim 3, it is characterised in that: the upper surface of described tooth is at same plane.

Wafer jig for evaporation of metal the most according to claim 3, it is characterised in that: each tooth is less than 3mm along the length in base central direction.

Wafer jig for evaporation of metal the most according to claim 3, it is characterised in that: after assembling with wafer, what each tooth projected on wafer is shaped as square, rectangle, triangle, trapezoidal, arc, semi-circular or the combination in any of above shape.