CN205452233U - Tray unit and utilize its base plate system of placing with temperature adjusting function - Google Patents
Tray unit and utilize its base plate system of placing with temperature adjusting function Download PDFInfo
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- CN205452233U CN205452233U CN201620284708.9U CN201620284708U CN205452233U CN 205452233 U CN205452233 U CN 205452233U CN 201620284708 U CN201620284708 U CN 201620284708U CN 205452233 U CN205452233 U CN 205452233U
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- lower plate
- substrate
- heat transfer
- temperature
- transfer gas
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- Condensed Matter Physics & Semiconductors (AREA)
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- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Drying Of Semiconductors (AREA)
- Plasma & Fusion (AREA)
Abstract
The utility model relates to a tray unit and utilize its base plate system of placing with temperature adjusting function. The utility model discloses a tray unit that has temperature adjusting function includes: the hypoplastron, it is formed with second heat transfer gas flow path with the mode that can make gas flow along vertical direction, with second heat transfer gas flow path separately is formed with temperature regulation portion place the base plate on the second heat transfer gas flow path, the upper plate, it is in order covering the mode of hypoplastron install in on the hypoplastron, so that the plane of base plate can expose and form porosely in plasma's mode.
Description
Technical field
This utility model relates to a kind of tray unit making substrate place when Cement Composite Treated by Plasma and system.
Background technology
It is said that in general, use plasma for substrate etch.
The plasma processing apparatus that plasma occurs is made up of chamber, the antenna of the outer upper being installed on this chamber and the chuck that makes substrate be positioned over intracavity portion, high frequency by means of antenna provision, it is internally formed plasma so that the substrate being positioned over chuck is processed in chamber.
But, owing to this plasma arc processing apparatus places a substrate on chuck and processes, thus when processing multiple substrate, operation needs the long period, there is the problem that productivity ratio reduces.
Recently, to enable process multiple substrate simultaneously, developing a kind of technology, multiple substrate can processed simultaneously at the pallet of the disc-shape of the chuck top multiple substrates of placement, thus improving described problem with fixture is fixing.
On the other hand, plasma arc processing apparatus according to the structure of source electrode, has atom, energy that the amount of ion, ion have concentrates on the tendency of central part or edge part.
Therefore, when etching work procedure, not only the central part of pallet is different with edge part temperature, and the etching speed of central part and edge part is the most different, there is the problem that the uniformity (uniformity) of substrate reduces.
Such as, when etching work procedure, if the temperature of central part is higher than the temperature of edge part, it is poor that the substrate in the most centrally located portion and the substrate being positioned at edge part produce the uniformity, in the past in order to solve this problem, using the central part of chuck and the control of the temperature of edge part is different and that make homogeneous temperature method.
But, conventional art there is problems of, different according to size, the kind of substrate, central part and edge part region, and during change substrate, the critical piece of etching equipment needs to change chuck every time.
If it addition, change chuck, then setting process needs the long period, needs too much expense, cannot be carried out etching work procedure in the process, there is the problem that productivity ratio is low.
The item illustrated as described background technology is intended merely to promote the understanding to background of the present utility model, is not construed as recognizing that it belongs to the conventional art that these those skilled in the art have understood.
Prior art literature
Patent documentation
(patent documentation 1) KR10-2012-0097667 (2012.09.05)
Utility model content
The purpose of this utility model is to provide a kind of and just can regulate the tray unit with temp regulating function of temperature of substrate of centrally located portion and edge part and utilize its substrate place system without changing chuck.
The tray unit with temp regulating function of the present utility model being intended to reach this purpose includes: lower plate, it is vertically formed with the second heat transfer gas stream in the way of can making gas flowing, it is separately formed with temperature regulation section with described second heat transfer gas stream, described second heat transfer gas stream is placed with substrate；And upper plate, it is installed in described lower plate in the way of can making gas flowing, is formed porose in the way of enabling the plane of described substrate to be exposed to plasma.
It addition, described temperature regulation section of the present utility model is formed at the other space in described lower plate.
It addition, described temperature regulation section of the present utility model is formed with the groove shape caved in the central part bottom surface of described lower plate.
It addition, described temperature regulation section of the present utility model is formed with the groove shape caved in the edge part bottom surface of described lower plate.
Additionally, described lower plate of the present utility model includes central part and extends the edge part formed from described central part upper end to both sides, there is " T " shaped sections, described upper plate includes being formed with the horizontal part in described hole, vertically extending the vertical component effect of formation from the two ends of described horizontal part, described temperature regulation section, at described edge part, is formed with groove shape by described vertical component effect and described lower plate.
It addition, described lower plate of the present utility model also includes the more than one supplementary wall extending downwards formation from plane perpendicular ground, described supplementary wall splits described temperature regulation section.
The substrate place system of the present utility model being intended to reach this purpose includes: chuck, its be formed the first heat transfer gas stream and with described first heat transfer gas stream separate temperature adjusting fluid stream；Lower plate, it is vertically formed with the second heat transfer gas stream enabling in the way of the gas of described first heat transfer gas stream supply flows, and it is separately formed with temperature regulation section with described second heat transfer gas stream, it is installed on described chuck, and on described second heat transfer gas stream, places substrate；And upper plate, it is formed porose in the way of enabling the plane of described substrate to be exposed to plasma.
Additionally, separate predetermined distance at this utility model along the width of described substrate and be formed with multiple described temperature adjusting fluid stream, also include control portion, described control portion regulates temperature or the flow of fluid of fluid by described temperature adjusting fluid stream according to the temperature of described substrate, regulating the temperature of described chuck, described control portion regulates temperature and the flow of fluid of the fluid by the plurality of temperature adjusting fluid stream simultaneously.
It addition, described temperature regulation section of the present utility model is the other space formed in described lower plate.
It addition, described first heat transfer gas stream of the present utility model is vertically formed, described temperature regulation section is formed with the groove shape caved in the central part bottom surface of described lower plate.
It addition, described first heat transfer gas stream of the present utility model is vertically formed, described temperature regulation section is formed with the groove shape caved in the edge part bottom surface of described lower plate.
Additionally, described lower plate of the present utility model includes central part and extends the edge part formed from described central part upper end to both sides, there is " T " shaped sections, described upper plate includes being formed with the horizontal part in described hole, vertically extending the vertical component effect of formation from the two ends of described horizontal part, described temperature regulation section, at described edge part, is formed with groove shape by described vertical component effect and described lower plate.
It addition, described lower plate of the present utility model also includes the more than one supplementary wall extending downwards formation from plane perpendicular ground, described supplementary wall splits described temperature regulation section.
According to this utility model, following effect can be obtained.
First, it is not necessary to change chuck according to size and the kind of substrate.
Second, there is the advantage that can save the time changing and arranging chuck.
3rd, productivity ratio is improved.
4th, it is possible to save expense.
Accompanying drawing explanation
Fig. 1 is to represent the tray unit with temp regulating function of the present utility model and utilize its figure of first embodiment of substrate place system.
Fig. 2 is to represent the tray unit with temp regulating function of the present utility model and utilize its figure of the second embodiment of substrate place system.
Fig. 3 is to represent the tray unit with temp regulating function of the present utility model and utilize its figure of the 3rd embodiment of substrate place system.
Fig. 4 is to represent the tray unit with temp regulating function of the present utility model and utilize its figure of the 4th embodiment of substrate place system.
Fig. 5 is to represent the tray unit with temp regulating function of the present utility model and utilize its figure of the 5th embodiment of substrate place system.
Fig. 6 (a), Fig. 6 (b) are to represent the tray unit with temp regulating function of the present utility model and utilize its figure of sixth embodiment of substrate place system.
Fig. 7 (a), Fig. 7 (b) are to represent the tray unit with temp regulating function of the present utility model and utilize its figure of the 7th embodiment of substrate place system.
Fig. 8 (a), Fig. 8 (b) are to represent the tray unit with temp regulating function of the present utility model and utilize its figure of the 8th embodiment of substrate place system.
Symbol description
10-chuck, 12-the first heat transfer gas stream, 14-temperature adjusting fluid stream, 20-lower plate, 22-the second heat transfer gas stream, 24-supplementary wall, 30-temperature regulation section, 40-upper plate, 42-horizontal part, 44-vertical component effect, 50-control portion, C-central part, E-edge part, W-substrate, P-seal member.
Detailed description of the invention
The purpose of this utility model, specific advantage and new feature will be apparent from from the described further below and embodiment relevant to accompanying drawing.In this manual, it should be noted that in terms of giving reference marks to the element of each figure, be limited to identical element, even if being shown on different accompanying drawing, make that there is identical symbol the most as far as possible.Although it addition, first, second term such as grade may be used for illustrating various element, but described element is not limited by described term.Described term is served only for an element to be different from the purpose of other element.It addition, explanation this utility model in terms of, when judge think related known technology is illustrated unnecessarily may obscure main idea of the present utility model time, it describes omission in detail.
With reference to the accompanying drawings, embodiment of the present utility model is described in detail.
Fig. 1 is to represent the tray unit with temp regulating function of the present utility model and utilize its figure of first embodiment of substrate place system.
As it is shown in figure 1, the tray unit with temp regulating function of the present utility model includes lower plate 20 and upper plate 40, its substrate place system is utilized to include chuck 10, lower plate 20 and upper plate 40.
In chuck 10, it is formed with the first heat transfer gas stream 12 along the vertical direction, therein, is formed with multiple temperature adjusting fluid stream 14 orthogonal with the formation direction of the first heat transfer gas stream 12.
Multiple temperature adjusting fluid streams 14 can separate predetermined distance and arrange, it is also possible to according to the intention of designer, change its interval and arrange.
Temperature adjusting fluid stream 14 can also be connected with each other multiple.
In the case of connection has temperature adjusting fluid stream 14, from side supply temperature regulated fluid, the temperature adjusting fluid having circulated temperature adjusting fluid stream 14 is discharged from opposite side.
Helium (He) gas is mainly used but it also may according to the intention of design, use various non-active gas by the heat transfer gas of the first heat transfer gas stream 12 supply.
Lower plate 20 is placed and is fixed on chuck 10, can place multiple substrate W in its plane.
Additionally, in lower plate 20, vertically it is formed with the second heat transfer gas stream 22, can to flow from the heat transfer gas of the first heat transfer gas stream 12 supply, this second heat transfer gas stream 22 both may be located on imagination vertical line same with described first heat transfer gas stream 12, it is also possible to is positioned on mutually different imagination vertical line.
Even if the second heat transfer gas stream 22 is positioned on imagination vertical line mutually different with the first heat transfer gas stream 12, heat transfer gas can be along the trickle slot flowing of formation between the plane at the bottom surface of lower plate 20 and chuck 10.
On the second heat transfer gas stream 22, place described substrate W.
In lower plate 20, it is separately formed with temperature regulation section 30 with the second heat transfer gas stream 22, is formed porose in upper plate 40 so that substrate W plane can be exposed to plasma.
On the other hand, the substrate place system with temp regulating function of the present utility model can also include control portion 50.
As mentioned above, temperature adjusting fluid stream 14 can separate predetermined distance along the width of substrate W and arrange multiple, control portion 50 according to the temperature of substrate W, regulates temperature or the amount of fluid of fluid by temperature adjusting fluid stream 14, thus regulates the temperature of chuck 10.
Control portion 50 can also the simultaneously temperature of regulated fluid and the amount of fluid.
Temperature regulation section 30 can be the other space formed in described lower plate 20, and it can be in the central part C bottom surface of lower plate 20 with the groove shape formation of depression.
When the temperature of the substrate W that the temperature ratio of the substrate W of centrally located portion C is positioned at edge part E is high, 50, control portion is adjusted to less than upper plate 40 or the temperature of substrate W by the temperature of the fluid of temperature adjusting fluid stream 14, the central part C of lower plate 20 is thinner than edge part E due to thickness, thermal impedance is little, thus temperature reduces rapidly, on the contrary, edge part E due to thickness thicker than central part C, thermal impedance is big, thus temperature slowly reduces.
As a result, central part C realizes Jun Heng with the temperature of edge part E, and the substrate W of centrally located portion C becomes identical with the etching speed of the substrate W being positioned at edge part E, and the uniformity of substrate W is improved.
When the temperature of the substrate W that the temperature ratio of the substrate W of centrally located portion C is positioned at edge part E is low, 50, control portion is adjusted to higher than upper plate 40 or the temperature of substrate W by the temperature of the fluid of temperature adjusting fluid stream 14, thermal resistance robust due to described central part C and edge part E, central part C temperature rises rapidly, and edge part E temperature slowly rises, it is achieved temperature equalization.
As in figure 2 it is shown, according to the tray unit with temp regulating function of the present utility model and the second embodiment of the substrate place system utilizing it, temperature regulation section 30 can also be in the edge part E bottom surface of lower plate 20 with the groove shape formation of depression.
On the other hand, Fig. 3 is to represent the tray unit with temp regulating function of the present utility model and utilize its figure of the 3rd embodiment of substrate place system, and Fig. 4 is the figure representing the 4th embodiment.
As shown in Figures 3 and 4, the tray unit with temp regulating function of the present utility model and utilize its upper plate 40 of substrate place system to may include that horizontal part 42, its formation is porose so that substrate W can be exposed to plasma；Vertical component effect 44, it vertically extends formation from the two ends of horizontal part 42, and the flat face of its end and chuck 10, its medial surface connects with the side of horizontal part 42.
Fig. 5 is the 5th embodiment of the tray unit with temp regulating function of the present utility model and the substrate place system utilizing it.
The substrate place system with temp regulating function of the present utility model includes upper plate 40, lower plate 20, temperature regulation section 30, control portion 50, the composition identical with a described embodiment of the present utility model and another embodiment substitutes with described explanation, only illustrates centered by distinctive points.
According to the another embodiment of the substrate place system with temp regulating function of the present utility model, lower plate 20 includes central part C and extends the edge part E formed from this central part C upper end to both sides, is formed as having " T " shaped sections on the whole.
Upper plate 40 includes: horizontal part 42, and it could be formed with hole, makes substrate W can be exposed to plasma；Vertical component effect 44, it vertically extends formation from the two ends of horizontal part 42, and the flat face of its end and chuck 10, its medial surface connects with the side of horizontal part 42.
Temperature regulation section 30, at edge part E, is formed with groove shape by vertical component effect 44 and lower plate 20.
When the temperature of the substrate W that the temperature ratio of the substrate W of centrally located portion C is positioned at edge part E is high, 50, control portion is adjusted to higher than upper plate 40 or substrate W temperature by the temperature of the fluid of temperature adjusting fluid stream 14, the edge part E of lower plate 20 is thinner than central part C due to thickness, thermal impedance is little, thus temperature rises rapidly, on the contrary, central part C due to thickness thicker than edge part E, thermal impedance is big, thus temperature slowly rises.
As a result, central part C realizes Jun Heng with the temperature of edge part E, and the substrate W of centrally located portion C becomes identical with the etching speed of the substrate W being positioned at edge part E, and the uniformity of substrate W is improved.
When the temperature of the substrate W that the temperature ratio of the substrate W of centrally located portion C is positioned at edge part E is low, 50, control portion is adjusted to less than upper plate 40 or the temperature of substrate W by the temperature of the fluid of temperature adjusting fluid stream 14, thermal resistance robust due to described central part C and edge part E, central part C temperature slowly reduces, edge part E temperature reduces rapidly, thus realizes temperature equalization.
On the other hand, as shown in Figures 1 to 5, the lower end of lower plate 20 edge part E and the lower end of chuck 10 or upper plate 40 edge part E are airtight with seal member P with chuck 10, and seal member P can use various parts such as o-ring.
Fig. 6 (a), Fig. 6 (b) are to represent the tray unit with temp regulating function of the present utility model and utilize its figure of sixth embodiment of substrate place system, Fig. 7 (a), Fig. 7 (b) are to represent the tray unit with temp regulating function of the present utility model and utilize its figure of the 7th embodiment of substrate place system, and Fig. 8 (a), Fig. 8 (b) are to represent the tray unit with temp regulating function of the present utility model and utilize its figure of the 8th embodiment of substrate place system.
As shown in Fig. 6 (a) to Fig. 8 (b), the lower plate 20 of the pallet with temp regulating function of the present utility model can also include that the plane perpendicular ground from lower plate 20 extends downwards the more than one supplementary wall 24 of formation, in order to space corresponding with temperature regulation section 30 can be divided into more than one.
By means of supplementary wall 24, the temperature regulation section 30 of lower plate 20 is divided into more than one, when observing from cross section, can separate predetermined distance and be formed with the groove of multiple depression.I.e., temperature regulation section 30 is formed with circular groove at the central part C of lower plate 20, or is formed with ring-type groove, by means of the supplementary wall 24 splitting it at the edge part E of lower plate 20, form more than one ring-type groove, such that it is able to form multiple described temperature regulation section 30.
Above by specific embodiment, this utility model is described in detail, but this is to illustrate this utility model, it is not limited to the substrate place system with temp regulating function of the present utility model, can be in technological thought of the present utility model, being changed by person of ordinary skill in the field or improve, this is self-evident.
Simple deformation of the present utility model or even change, belong to field of the present utility model, and according to appended claims, concrete protection domain of the present utility model will be clear and definite.
Claims (13)
1. a tray unit with temp regulating function, it is characterised in that including:
Lower plate, it is vertically formed with the second heat transfer gas stream in the way of can making gas flowing, is separately formed with temperature regulation section with described second heat transfer gas stream, is placed with substrate on described second heat transfer gas stream；
Upper plate, it is installed in described lower plate in the way of can covering described lower plate, is formed porose in the way of enabling the plane of described substrate to be exposed to plasma.
The tray unit with temp regulating function the most according to claim 1, it is characterised in that
Described temperature regulation section is formed at the other space in described lower plate.
The tray unit with temp regulating function the most according to claim 2, it is characterised in that
Described temperature regulation section is formed with the groove shape caved in the central part bottom surface of described lower plate.
The tray unit with temp regulating function the most according to claim 2, it is characterised in that
Described temperature regulation section is formed with the groove shape caved in the edge part bottom surface of described lower plate.
The tray unit with temp regulating function the most according to claim 2, it is characterised in that
Described lower plate includes central part and extends the edge part formed from described central part upper end to both sides, has " T " shaped sections,
Described upper plate includes being formed with the horizontal part in described hole, vertically extending the vertical component effect of formation from the two ends of described horizontal part,
Described temperature regulation section, at described edge part, is formed with groove shape by described vertical component effect and described lower plate.
The tray unit with temp regulating function the most as claimed in any of claims 2 to 5, it is characterised in that
Described lower plate also includes the more than one supplementary wall extending downwards formation from plane perpendicular ground,
Described supplementary wall splits described temperature regulation section.
7. a substrate place system, it is characterised in that including:
Chuck, its be formed the first heat transfer gas stream and with described first heat transfer gas stream separate temperature adjusting fluid stream；
Lower plate, it is vertically formed with the second heat transfer gas stream enabling in the way of the gas of described first heat transfer gas stream supply flows, and it is separately formed with temperature regulation section with described second heat transfer gas stream, it is installed on described chuck, and on described second heat transfer gas stream, places substrate；And
Upper plate, it is formed porose in the way of enabling the plane of described substrate to be exposed to plasma.
Substrate place system the most according to claim 7, it is characterised in that
Width along described substrate separates predetermined distance and is formed with multiple described temperature adjusting fluid stream,
Also including control portion, described control portion according to the temperature of described substrate, regulates the temperature of fluid by described temperature adjusting fluid stream or the flow of fluid regulates the temperature of described chuck,
Described control portion regulates temperature and the flow of fluid of the fluid by the plurality of temperature adjusting fluid stream simultaneously.
Substrate place system the most according to claim 8, it is characterised in that
Described temperature regulation section is the other space formed in described lower plate.
Substrate place system the most according to claim 8, it is characterised in that
Described first heat transfer gas stream is vertically formed,
Described temperature regulation section is formed with the groove shape caved in the central part bottom surface of described lower plate.
11. substrate place systems according to claim 8, it is characterised in that
Described first heat transfer gas stream is vertically formed,
Described temperature regulation section is formed with the groove shape caved in the edge part bottom surface of described lower plate.
12. substrate place systems according to claim 8, it is characterised in that
Described lower plate includes central part and extends the edge part formed from described central part upper end to both sides, has " T " shaped sections,
Described upper plate includes being formed with the horizontal part in described hole, vertically extending the vertical component effect of formation from the two ends of described horizontal part,
Described temperature regulation section, at described edge part, is formed with groove shape by described vertical component effect and described lower plate.
13. according to the substrate place system described in any one in claim 9 to 12, it is characterised in that
Described lower plate also includes the more than one supplementary wall extending downwards formation from plane perpendicular ground,
Described supplementary wall splits described temperature regulation section.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2015-0182122 | 2015-12-18 | ||
| KR1020150182122A KR102489201B1 (en) | 2015-12-18 | 2015-12-18 | Tray unit having temperature control function and system for supporting substrate using the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205452233U true CN205452233U (en) | 2016-08-10 |
Family
ID=56606749
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620284708.9U Active CN205452233U (en) | 2015-12-18 | 2016-04-07 | Tray unit and utilize its base plate system of placing with temperature adjusting function |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR102489201B1 (en) |
| CN (1) | CN205452233U (en) |
| TW (1) | TWM526754U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109983347A (en) * | 2016-11-23 | 2019-07-05 | 吉佳蓝科技股份有限公司 | Probe card screw fastening device and the probe card assembling device for having it |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11610792B2 (en) | 2019-08-16 | 2023-03-21 | Applied Materials, Inc. | Heated substrate support with thermal baffles |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6001183A (en) * | 1996-06-10 | 1999-12-14 | Emcore Corporation | Wafer carriers for epitaxial growth processes |
| KR100734016B1 (en) * | 2006-07-06 | 2007-06-29 | 주식회사 래디언테크 | Receiving substrate and plasma processing apparatus having the same |
| KR100954754B1 (en) * | 2008-03-25 | 2010-04-27 | (주)타이닉스 | Tray for plasma processing apparatus |
| KR20120097667A (en) | 2011-02-25 | 2012-09-05 | 서현모 | Substrate tray for plasma processing with excellent cooling effect and plasma processing apparatus |
| KR101504880B1 (en) * | 2014-11-14 | 2015-03-20 | 주식회사 기가레인 | Unit for supporting substrate |
-
2015
- 2015-12-18 KR KR1020150182122A patent/KR102489201B1/en active IP Right Grant
-
2016
- 2016-03-22 TW TW105203958U patent/TWM526754U/en unknown
- 2016-04-07 CN CN201620284708.9U patent/CN205452233U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109983347A (en) * | 2016-11-23 | 2019-07-05 | 吉佳蓝科技股份有限公司 | Probe card screw fastening device and the probe card assembling device for having it |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20170073333A (en) | 2017-06-28 |
| TWM526754U (en) | 2016-08-01 |
| KR102489201B1 (en) | 2023-01-18 |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |