CN205430773U - Height switches on clear glass base circuit board - Google Patents
Height switches on clear glass base circuit board Download PDFInfo
- Publication number
- CN205430773U CN205430773U CN201620109484.8U CN201620109484U CN205430773U CN 205430773 U CN205430773 U CN 205430773U CN 201620109484 U CN201620109484 U CN 201620109484U CN 205430773 U CN205430773 U CN 205430773U
- Authority
- CN
- China
- Prior art keywords
- glass substrate
- circuit board
- conducting wire
- base circuit
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000011521 glass Substances 0.000 title claims abstract description 111
- 239000000758 substrate Substances 0.000 claims abstract description 47
- 239000002002 slurry Substances 0.000 claims abstract description 24
- 238000010438 heat treatment Methods 0.000 claims abstract description 4
- 229910021389 graphene Inorganic materials 0.000 claims description 26
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 25
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 238000003466 welding Methods 0.000 claims description 10
- 239000003973 paint Substances 0.000 claims description 8
- 238000001816 cooling Methods 0.000 abstract description 5
- 238000002844 melting Methods 0.000 abstract description 2
- 230000008018 melting Effects 0.000 abstract description 2
- 239000000843 powder Substances 0.000 description 35
- 238000000034 method Methods 0.000 description 18
- 239000000463 material Substances 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 4
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 4
- JBSLOWBPDRZSMB-FPLPWBNLSA-N dibutyl (z)-but-2-enedioate Chemical group CCCCOC(=O)\C=C/C(=O)OCCCC JBSLOWBPDRZSMB-FPLPWBNLSA-N 0.000 description 4
- 230000004927 fusion Effects 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 229940116411 terpineol Drugs 0.000 description 4
- 239000001856 Ethyl cellulose Substances 0.000 description 3
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 229920001249 ethyl cellulose Polymers 0.000 description 3
- 235000019325 ethyl cellulose Nutrition 0.000 description 3
- 238000005496 tempering Methods 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004513 sizing Methods 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229920002472 Starch Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000009172 bursting Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000005816 glass manufacturing process Methods 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000010309 melting process Methods 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 239000013528 metallic particle Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000008107 starch Substances 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- 238000009955 starching Methods 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
Abstract
The utility model provides a height switches on clear glass base circuit board, including glass substrate, glass substrate's surface be equipped with by print in the electrocondution slurry of glass substrate air face toasting, after the heating and cooling with the glass substrate fused conducting wire in surface, glass substrate's the surface and the upper surface parallel and level of conducting wire. The utility model discloses a for the melting concerns between glass substrate and the conducting wire, the contact is inseparable among the height switches on clear glass base circuit board, and glass substrate's surface and conducting wire upper surface parallel and level, and whole height switches on clear glass base circuit board's is surperficial level and smooth, and the conducting wire is not fragile, switches on the ability reinforce.
Description
Technical field
This utility model relates to a kind of high conducting clear glass base circuit board, belongs to field of electronic devices.
Background technology
Electronic industry is as national pillar industry, and development in recent years is maked rapid progress, particularly with the end product as development trend light, thin, short, little, to its basic industry printed wiring board industry, it is proposed that requirements at the higher level such as high density, small size, high conductivity.Wiring board techniques develops growth under this background rapidly, and the industry in each light current field, as computer and perimeter aid system, medical apparatus and instruments, mobile phone, number (taking the photograph) camera, Communication Equipment, precision instrument, Aero-Space etc., all technique and quality to printed wiring board propose many concrete and clear and definite technical specifications.
Traditional glass base circuit board utilizes plated film etch process or low-temperature silver sizing process to make.Plated film etch process is to plate one layer of conductive paste in glass pane surface, circuit is made with etching method, the electronic circuit of this glass base circuit board is combined with glass plate by binding agent, due to glass molecule except with fluorine element in addition to any element chemical reaction all cannot occur, so this coating process is substantially a kind of spraying coating process, being the organic material bonding process being mixed with conducting metal particles, binding agent makes the purity of conductive paste decline, making conductive capability excessively poor, best material also only has 1 × 10-4Ω, it is difficult to welding electronic component, it is also difficult to realize functional circuit.And low-temperature silver sizing process is to starch circuit at glass pane surface silk-screen low-temperature silver, realized by the baking-curing method within 200 DEG C, the method is unable to reach height leads ability possibly together with substantial amounts of organic bonding material in starching due to silver, and its conductive capability can only achieve 3 × 10-5Ω, electronic component is still difficult to solder to, poor adhesive force.Above-mentioned traditional glass base circuit board limits due to its technique, in made glass base circuit board, contacts the tightst between glass plate and conducting wire, conducting wire floats on glass pane surface, the air spots of whole glass base circuit board is sliding, and conducting wire is fragile to come off, and ultimately results in ducting capacity poor.
Summary of the invention
In order to solve the deficiencies in the prior art, this utility model provides a kind of high conducting clear glass base circuit board, for melted relation between glass substrate and conducting wire, contact is closely, and the surface of glass substrate is concordant with conducting wire upper surface, the surface of whole high conducting clear glass base circuit board smooths, and conducting wire is hardly damaged, and ducting capacity is strong.
This utility model be the technical scheme is that to provide a kind of high conducting clear glass base circuit board by its technical problem of solution, including glass substrate, the surface of described glass substrate is provided with the conducting wire melted with glass baseplate surface after toasting, heating and cool down by the electrocondution slurry being printed in glass substrate air surface, described conducting wire is graphene layer, or for the conductive layer being made up of the metal level melted with glass substrate of the graphene layer on top layer and bottom, and the contact surface between graphene layer and metal level is the most melted.
The surface of described glass substrate is concordant with the upper surface of conducting wire.
Described glass substrate is reinforced glass substrate.
Surface, described conducting wire remove to-be-welded elements pad beyond be partially covered with PCB organic welding resistance paint.
Described electrocondution slurry is 65～75:3:5～10:10 by mass ratio～the conducting powder of 20:1～3, cryogenic glass powder, ethyl cellulose, terpineol and dibutyl maleate form, and wherein conducting powder is the mixture of Graphene powder or metal powder and Graphene powder；If the mixture that conducting powder is metal powder and Graphene powder, then Graphene powder accounts for the mass percent of electrocondution slurry is 2 ‰～5%.
The surface of described glass substrate is provided with after being toasted 100～200 seconds at a temperature of 120～150 DEG C by the electrocondution slurry being printed in reinforced glass substrate air surface, be placed in 550～600 DEG C of temperature environments 300～360 seconds again, be subsequently placed in 710～730 DEG C of temperature environments maintain 120～220 seconds, after finally cooling with the conducting wire of reinforced glass substrate melt surface.
This utility model is had advantageous effect in that based on its technical scheme:
(1) for melting relation between glass substrate of the present utility model and conducting wire, contact closely, has the ability of superconducting, and conducting impedance is less than 5 × 10-8Ω；
(2) for melted relation between glass substrate of the present utility model and conducting wire, combine without medium, make circuit layer have the good capacity of heat transmission when high-power applications, and circuit layer fuses with glass substrate molecule in close, SMD SMD electronic components can be carried out and element is difficult to peel off；
(3) although in electrocondution slurry of the present utility model Graphene content few, the mass percent only accounting for electrocondution slurry is 2 ‰～5%, but its molecules align is the finest and close, light weight, metallic molecule surface can be floated on, higher than abrasion-resistant metal and conductivity due to it, the conducting wire therefore ultimately formed still ensures that its high on-state rate；Graphene is almost fully transparent, so the glass base circuit board made can guarantee that high transmission rate, light transmittance is more than 90%；
(4) surface of glass substrate of the present utility model is concordant with conducting wire upper surface, and the surface of whole high conducting clear glass base circuit board smooths, and conducting wire is hardly damaged；
(5) can there be PCB organic welding resistance paint conducting wire of the present utility model by subordinate cover, and the pad of to-be-welded elements on conducting wire is reserved, can protect circuit layer by it, prevents conducting wire surface oxidation, maintains and superconducts ability.
Accompanying drawing explanation
Fig. 1 is the structural representation of high conducting clear glass base circuit board of the present utility model.
Fig. 2 is that the AA of Fig. 1 is to sectional view.
Fig. 3 is covered with the sectional view of the high conducting clear glass base circuit board of PCB organic welding resistance paint.
In figure: 1-glass substrate, 2-conducting wire, 3-pad, 4-PCB organic welding resistance paint, 5-graphene layer, 6-metal level.
Detailed description of the invention
The utility model is described in further detail with embodiment below in conjunction with the accompanying drawings.
See figures.1.and.2, this utility model provides a kind of high conducting clear glass base circuit board, including glass substrate 1, the surface of described glass substrate is provided with by being printed in the electrocondution slurry of glass substrate air surface in baking, conducting wire 2 melted with glass baseplate surface after heating and cooling, described conducting wire 2 is graphene layer, or for the conductive layer being made up of the metal level 6 melted with glass substrate of the graphene layer 5 on top layer and bottom, and contact surface between graphene layer 5 and metal level 6 is the most melted, the surface of described glass substrate 1 is concordant with the upper surface of conducting wire 2.
Described electrocondution slurry is 65～75:3:5～10:10 by mass ratio～the conducting powder of 20:1～3, cryogenic glass powder, ethyl cellulose, terpineol and dibutyl maleate form, and wherein conducting powder is the mixture of Graphene powder or metal powder and Graphene powder；If the mixture that conducting powder is metal powder and Graphene powder, then Graphene powder accounts for the mass percent of electrocondution slurry is 2 ‰～5%；
The surface of described glass substrate is provided with after being toasted 100～200 seconds at a temperature of 120～150 DEG C by the electrocondution slurry being printed in reinforced glass substrate air surface, be placed in 550～600 DEG C of temperature environments 300～360 seconds again, be subsequently placed in 710～730 DEG C of temperature environments maintain 120～220 seconds, after finally cooling with the conducting wire of reinforced glass substrate melt surface.
Described glass substrate is reinforced glass substrate.
With reference to Fig. 3, the part that surface, described conducting wire removes beyond the pad 3 of to-be-welded elements can be coated with PCB organic welding resistance paint 4.
High conducting clear glass base circuit board processing technology of the present utility model is as follows:
(1) electrocondution slurry is printed on the air surface of glass plate；Described electrocondution slurry is 65～75:3:5～10:10 by mass ratio～the conducting powder of 20:1～3, cryogenic glass powder, ethyl cellulose, terpineol and dibutyl maleate form, and wherein conducting powder is the mixture of Graphene powder or metal powder and Graphene powder；If the mixture that conducting powder is metal powder and Graphene powder, then Graphene powder accounts for the mass percent of electrocondution slurry is 2 ‰～5%；
(2) glass substrate that will be covered with electrocondution slurry toasts 100～200 seconds at a temperature of 120～150 DEG C；
(3) glass plate is placed in 550～600 DEG C of temperature environments 300～360 seconds, it is subsequently placed in 710～730 DEG C of temperature environments maintenance 120～220 seconds, finally it is rapidly cooled to room temperature, the most now electrocondution slurry formation conducting wire is distributed in the surface of glass plate and melts with glass plate, and conducting wire becomes a part for glass plate；
(4) utilize screen printing technique that organic for colourless PCB welding resistance paint is carried out on circuit layer subordinate cover, make that circuit layer removes the part beyond the pad of to-be-welded elements and all covered by PCB organic welding resistance paint.
nullWherein，Electrocondution slurry is through special proportioning，Wherein electrocondution slurry and glass substrate are in the baking of step (2) and the melting process of step (3)，Glass starts when 500 DEG C to soften，When 550 DEG C, glass surface molecule has started to be in active state，Now the terpineol in electrocondution slurry and dibutyl maleate the most at high temperature volatilize，Cryogenic glass powder melted and with conducting powder and glass surface be in the glass molecule of active state carry out fusing during this temperature less than 550 DEG C then glass molecule the most inactive，If higher than 600 DEG C, glass plate enters about 720 DEG C high-temperature fusion after easily bursting the fusion by about five or six minutes，Now conducting powder molecule also begins to enliven，And carry out deep fusion with more active glass molecule，This process needs to complete for 2 to 4 minutes temperature the most preferably less than 710 DEG C in this stage or is integrated preventing the final glass deformation the most now glass surface molecule with conducting powder from fully fusing into higher than 730 DEG C，This fusion is molecular level，Compared with utilizing binding agent with traditional handicraft, there is higher adhesion，And glass surface and circuit layer surface can become an entirety，Make whole glass base circuit board smooth，It is applicable to various application occasions.
Step (3) alloying process carries out tempering, glass cools down rapidly when high temperature can make glass tempering, quickly cooling makes the conducting powder merged and glass molecule produce negative tension force and combine more firm, the process of tempering can make the glass of hidden defect rupture, the glass making high-quality is intact, improve the quality of finished product, allow glass base circuit board more solid simultaneously.
It is spherical, cube or irregular polyhedrons that metallic particles in electrocondution slurry can process polishing, is wherein processed as granule marshalling after cube, is particularly advantageous in electric conductivity；Although the Graphene content in electrocondution slurry is few, the mass percent only accounting for electrocondution slurry is 2 ‰～5%, but its molecules align is the finest and close, light weight, metallic molecule surface can be floated on, higher than abrasion-resistant metal and conductivity due to it, the conducting wire therefore ultimately formed still ensures that its high on-state rate；Graphene is almost fully transparent, so the glass base circuit board made can guarantee that high transmission rate.
Circuit layer can be protected by subordinate cover, prevents oxidation on metal surface；Traditional technique is all the covering process of material surface, or technique for sticking (including sintering, plated film etc.), subordinate cover makes material be combined with material, intermolecular interpenetrate, it is achieved that bi-material cannot peel off, being firmly combined with, after subordinate cover, the surface of whole glass base circuit board remains as a smooth surface, and reserved pad may be used for later stage welding electronic component.
The high conducting clear glass base circuit board light transmittance made, more than 90%, has the ability of superconducting, and conducting impedance is less than 5 × 10-8Ω, in the high conducting clear glass base circuit board made, conducting wire and glass plate combine without medium, make circuit layer have the good capacity of heat transmission when high-power applications, and circuit layer fuses with glass substrate molecule in close, SMD SMD electronic components can be carried out and element is difficult to peel off.
Claims (5)
1. one kind high conducting clear glass base circuit board, including glass substrate, it is characterized in that: the surface of described glass substrate is provided with the conducting wire melted with glass baseplate surface after toasting, heating and cool down by the electrocondution slurry being printed in glass substrate air surface, described conducting wire is graphene layer, or for the conductive layer being made up of the metal level melted with glass substrate of the graphene layer on top layer and bottom, and the contact surface between graphene layer and metal level is the most melted.
High conducting clear glass base circuit board the most according to claim 1, it is characterised in that: the surface of described glass substrate is concordant with the upper surface of conducting wire.
High conducting clear glass base circuit board the most according to claim 1, it is characterised in that: described glass substrate is reinforced glass substrate.
High conducting clear glass base circuit board the most according to claim 1, it is characterised in that: surface, described conducting wire removes and is partially covered with PCB organic welding resistance paint beyond the pad of to-be-welded elements.
High conducting clear glass base circuit board the most according to claim 1, it is characterised in that: the surface of described glass substrate is provided with after toast 100～200 seconds at a temperature of 120～150 DEG C by the electrocondution slurry being printed in reinforced glass substrate air surface, be placed in 550～600 DEG C of temperature environments 300～360 seconds again, be subsequently placed in 710～730 DEG C of temperature environments maintain 120～220 seconds, finally cool down after with the conducting wire of reinforced glass substrate melt surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620109484.8U CN205430773U (en) | 2016-02-03 | 2016-02-03 | Height switches on clear glass base circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620109484.8U CN205430773U (en) | 2016-02-03 | 2016-02-03 | Height switches on clear glass base circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205430773U true CN205430773U (en) | 2016-08-03 |
Family
ID=56540833
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620109484.8U Active CN205430773U (en) | 2016-02-03 | 2016-02-03 | Height switches on clear glass base circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205430773U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106231819A (en) * | 2016-08-18 | 2016-12-14 | 武汉华尚绿能科技股份有限公司 | A kind of preparation method of clear glass base double-layer circuit board |
| WO2017133362A1 (en) * | 2016-02-03 | 2017-08-10 | 武汉华尚绿能科技股份有限公司 | Highly conductive transparent glass-based circuit board |
-
2016
- 2016-02-03 CN CN201620109484.8U patent/CN205430773U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017133362A1 (en) * | 2016-02-03 | 2017-08-10 | 武汉华尚绿能科技股份有限公司 | Highly conductive transparent glass-based circuit board |
| US10512170B2 (en) | 2016-02-03 | 2019-12-17 | Wuhan Huashang Green Technology Co., Ltd. | Highly conductive transparent glass-based circuit board |
| CN106231819A (en) * | 2016-08-18 | 2016-12-14 | 武汉华尚绿能科技股份有限公司 | A kind of preparation method of clear glass base double-layer circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105555023B (en) | High conducting clear glass base circuit board | |
| CN106231819B (en) | A kind of preparation method of transparent glass base double-layer circuit board | |
| CN105682346A (en) | Manufacturing method for high-conduction transparent glass-based circuit board | |
| CN106097913A (en) | A kind of clear glass base display screen and preparation technology thereof | |
| CN106297967B (en) | Flexible conductive film and preparation method thereof, flexible touch screen and display panel | |
| WO2007032201A1 (en) | Chip-shaped electronic component | |
| CN205430773U (en) | Height switches on clear glass base circuit board | |
| JP2012250240A (en) | Metal filler, solder paste, and connected structure | |
| CN105811084A (en) | Antenna module and preparation method thereof | |
| CN205421632U (en) | Height switches on transparent cavity photoelectricity glass curtain wall | |
| CN103508759B (en) | High-power LED (Light Emitting Diode) base and preparation method thereof | |
| CN106255323A (en) | A kind of method that glass base circuit board is prepared in 3D printing | |
| US8518743B2 (en) | Die structure and die connecting method | |
| US6965167B2 (en) | Laminated chip electronic device and method of manufacturing the same | |
| CN105576061B (en) | Height conducting high voltage solar photoelectric glass plate | |
| US9905327B2 (en) | Metal conducting structure and wiring structure | |
| CN105522791B (en) | Laminated transparent glass with high conductivity | |
| CN205546183U (en) | Height switches on doubling clear glass | |
| JPH09306231A (en) | Conductive particulate and substrate | |
| KR100702449B1 (en) | Method for manufacturing light emitting device | |
| CN205388972U (en) | Height switches on high voltage solar energy photoelectricity glass board | |
| JP3741216B2 (en) | Wiring board manufacturing method | |
| JP2010080179A (en) | Manufacturing method of conductive particulate, conductive particulate, anisotropic conductive material, and conductive connection structure | |
| CN105720133A (en) | Manufacturing technology of high-conductivity and high-voltage solar photoelectric glass board | |
| JP3505321B2 (en) | Conductive fine particles and substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220927 Address after: Unit 401, Building 1, Qingdao World Financial Center Building, No. 19, Qinling Road, Laoshan District, Qingdao City, Shandong Province, 266100 Patentee after: Huashang Optoelectronics Technology Co.,Ltd. Address before: Room 325, Building 2, Smart Building, Block 0601, Jianghan Economic Development Zone, Jianghan District, Wuhan City, Hubei Province, 430000 Patentee before: WUHAN HUASHANG GREEN TECHNOLOGY Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20231010 Address after: Room 325, Building 2, Smart Building, Block 0601, Jianghan Economic Development Zone, Jianghan District, Wuhan City, Hubei Province, 430000 Patentee after: WUHAN HUASHANG GREEN TECHNOLOGY Co.,Ltd. Address before: Unit 401, Building 1, Qingdao World Financial Center Building, No. 19, Qinling Road, Laoshan District, Qingdao City, Shandong Province, 266100 Patentee before: Huashang Optoelectronics Technology Co.,Ltd. |
|
| TR01 | Transfer of patent right |