CN205428994U

CN205428994U - Linerless end LED chip

Info

Publication number: CN205428994U
Application number: CN201520850711.8U
Authority: CN
Inventors: 郭伟杰
Original assignee: Zhangzhou Lidaxin Optoelectronic Technology Co ltd
Current assignee: Zhangzhou Lidaxin Optoelectronic Technology Co ltd
Priority date: 2015-10-30
Filing date: 2015-10-30
Publication date: 2016-08-03
Anticipated expiration: 2025-10-30

Abstract

The utility model provides a linerless end LED chip, includes chip layer and the protective layer of setting on this chip layer, and this linerless end LED chip installs on a light source board, and this protective layer can be got rid of. The utility model discloses a make the protective layer on the chip layer, put into production with manufacturing process in play the effect of supporting with fixed. And this protective layer after LED install the chip is on the light source board, is got rid of for can get rid of the structure to the protective layer. The LED chip that finally sets up on the light source board does not have substrate or protective layer, has avoided the light that the substrate absorbs or reflection LED chip sends, has improved luminous efficiency greatly, has the advantage that luminous efficiency is better.

Description

LED chip of the linerless end

Technical field

This utility model relates to a kind of LED chip, LED chip of a kind of linerless end.

Background technology

Semiconductor light-emitting-diode i.e. LED, is a kind of semiconducting solid luminescent device.It is to utilize solid semiconductor chip as luminescent material, occurs the compound energy releasing surplus to cause photon to launch by carrier in the semiconductors, directly sends the light of the colors such as the bluish-green blue or green orange of reddish yellow is purple.In recent years, at chip field, flip chip technology (fct) is just a dark horse, particularly more favourable in the application market of high-power, outdoor lighting.But, existing flip-chip generally comprises substrate, such as the substrate of sapphire material.The refractive index of substrate is all higher than transparent adhesive tape during encapsulation, result in total reflection, so that optical efficiency reduces.

Utility model content

In view of this, it is necessary to the LED chip of the linerless end that a kind of optical efficiency is high is provided.

A kind of LED chip of the linerless end, including chip layer and be arranged on the protective layer in this chip layer, this LED chip of linerless end is arranged on a light source board, and this protective layer can be removed.

Compared with prior art, LED chip of the linerless end, by making protective layer in chip layer, supports and fixing effect producing and playing in manufacturing process.And protective layer is removable structure, after LED chip is arranged on light source board, remove this protective layer.The LED chip being ultimately disposed on light source board is without substrate or protective layer, it is to avoid the light that substrate absorbs or reflection LED chip sends, and substantially increases light extraction efficiency, has the more preferable advantage of light extraction efficiency.

Accompanying drawing explanation

Fig. 1 be this utility model linerless end LED chip method for packing in the schematic diagram of step 2；

Fig. 2 be this utility model linerless end LED chip method for packing in the schematic diagram of step 3；

Fig. 3 be this utility model linerless end LED chip method for packing in the schematic diagram of step 3；

Fig. 4 be this utility model linerless end LED chip method for packing in the schematic diagram of step 4；

Fig. 5 be this utility model linerless end LED chip method for packing in the schematic diagram of step 5；

Fig. 6 be this utility model linerless end LED chip method for packing in the schematic diagram of step 5；

Fig. 7 be this utility model linerless end LED chip method for packing in the schematic diagram of step 6；

Fig. 8 is the schematic diagram of this utility model linerless end LED chip.

Detailed description of the invention

With detailed description of the invention, this utility model is described in further detail below in conjunction with the accompanying drawings.

The LED chip of the linerless end of this utility model first embodiment, refer to Fig. 1, Fig. 8.

This LED chip of linerless end includes chip layer 20 and is arranged on the protective layer 40 in this chip layer 20.After this LED chip of linerless end is installed on light source board 50, this protective layer 40 can be removed.Arranging chip electrode 21 in this chip layer 20, this LED chip of linerless end passes through chip electrode 21 welded and installed on light source board 50.Wherein, this LED chip of linerless end does not include substrate 10 structure in traditional die, and uses a kind of removable protective layer 40 replacement substrate 10.Protective layer 40 is making and is serving in transportation the effect of protection LED chip of the linerless end.And when coming into operation after linerless back welding is received on light source board 50, protective layer 40 is removed so that the illuminating effect of LED chip of the linerless end will not be affected by substrate and protective layer.Avoid the light that substrate absorbs or reflection LED chip sends, substantially increase light extraction efficiency, there is the more preferable advantage of light extraction efficiency.

This protective layer 40 is made up of polymer, dissolves this polymer by solvent and can remove this protective layer 40.This polymer is PMMA material or PDMS material.

Refer to Fig. 1 to Fig. 8, make LED chip of the linerless end by the method for packing of LED chip of the following linerless end:

Refer to Fig. 1 to Fig. 8, the method for packing of this LED chip of linerless end mainly comprises the steps that making chip layer 20 over the substrate 10；Remove substrate 10 and protective layer 40 is set in this chip layer 20；This chip layer 20 and protective layer 40 are arranged on light source board 50, remove this protective layer 40 afterwards.The structure finally obtained is that LED chip of the linerless end is arranged on light source board 50, it is to avoid substrate 10 absorbs or reflect the light that LED chip sends, and substantially increases light extraction efficiency, has more preferable illuminating effect.Certainly, above-mentioned steps can also include other common chip package steps.The following is the preferred embodiment comprising common encapsulation step:

Step one: first, makes chip layer 20 over the substrate 10, then arranges chip electrode 21, the LED chip structure needed for formation in chip layer 20.Wherein, it is more preferred to flip LED chips structure, it is salient point due to the chip electrode 21 of flip LED chips structure so that the support of chip is fixing the easiest so that follow-up production and make more convenient.

Step 2: supporter 30 is set in the bottom of this chip layer 20.Refer to Fig. 1, by arranging this step primarily to chip layer 20 can be played support fixation in production and the manufacturing process of follow-up removal substrate 10 grade.Wherein, this supporter 30 is supporting plate structure, and this supporter 30 is bonded in the bottom of chip layer 20, say, that this supporter 30 is arranged on the lower section of the chip electrode 21 of this chip layer 20.By peeling off this supporter 30 removable.Or, this supporter 30 is fixing sucking disk, and this chip layer 20 is adsorbed above this supporter 30.Certainly, according to different LED chip structure, it is also possible to be not provided with this supporter 30.

Step 3: remove substrate 10, and protective layer 40 is set in chip layer 20.Refer to Fig. 2 and Fig. 3, removal substrate 10 solves and directly applies to the LED chip with substrate 10 there is the problem such as extinction, reflection light in illumination.Set up protective layer 40 after removing substrate 10, it is ensured that follow-up production and manufacturing process chip layer 20 still are able to receive good support and fix simultaneously.Wherein, this protective layer 40 is made up of polymer, dissolves this polymer by solvent and can remove this protective layer 40.Preferably, polymer selects PMMA material or PDMS material.Certainly, this protective layer 40 can also use other can play protection LED chip effect and the material that can remove very easily is made.

Step 4: after arranging protective layer 40 in this chip layer 20, removes the supporter 30 arranged in step 2.Refer to Fig. 4, due to already provided with protective layer 40, for the support of chip layer 20 is fixed.Therefore without arranging supporter 30 again.The follow-up LED chip that the cutting carrying out chip layer 20 is formed single, the existence of this supporter 30 can affect cutting technique.

Step 5: the chip layer 20 being provided with protective layer 40 is cut into multiple single LEDs chip.Refer to Fig. 5 and Fig. 6, more described single LEDs chip is welded on light source board 50.In this step, support and the protection of this protective layer 40 is received due to this chip layer 20, it is not easy to fracture or contaminated occurs, thus ensure that being smoothed out of production technology.

Step 6: remove protective layer 40.Refer to Fig. 7 and Fig. 8, it show the LED chip of the linerless end being made up of the method for packing of LED chip of the above-mentioned linerless end.This LED chip of linerless end includes chip layer 20 and is arranged on the protective layer 40 in this chip layer 20, and after this chip of linerless end 10LED is installed on light source board 50, this protective layer 40 can be removed.After LED chip being arranged on light source board 50, remove protective layer 40 so that LED chip is fixed by the support of light source board 50, it is not necessary to other support fixed structure.Simplify LED chip, eliminate substrate 10, it is to avoid substrate 10 absorbs or reflect the light that LED chip sends, and substantially increases efficiency of light extraction, has more preferable illuminating effect.

Realizing removing protective layer 40 it should be understood that protective layer 40 is dissolved by solvent, as long as protective layer 40 can be removed, not destroying chip layer 20 affects the use of final products simultaneously, and other technologies means certainly can also be used to remove protective layer 40.Such as, this chip layer 20 is welded on this light source board 50 in high temperature environments, can select specific material, makes this protective layer 40 be decomposed removal by high temperature in welding step.

In sum, this LED chip of linerless end does not include the substrat structure in traditional die, and uses a kind of removable protective layer to replace substrate.Protective layer is making and is serving in transportation the effect of protection LED chip of the linerless end.And when coming into operation after linerless back welding is received on light source board, protective layer is removed so that the illuminating effect of LED chip of the linerless end will not be affected by substrate and protective layer.Avoid the light that substrate absorbs or reflection LED chip sends, substantially increase light extraction efficiency, there is the more preferable advantage of light extraction efficiency.

The foregoing is only preferred embodiment of the present utility model; not in order to limit this utility model; all within spirit of the present utility model and principle, any modification, equivalent substitution and improvement etc. done, should be included within the scope of this utility model protection.

Claims

1. the LED chip of the linerless end, it is characterised in that include chip layer and be arranged on the protective layer in this chip layer, is arranged on a light source board in this LED chip of linerless end, and this protective layer can be removed.

LED chip of the linerless end the most according to claim 1, it is characterised in that arrange chip electrode in this chip layer, this LED chip of linerless end passes through chip electrode welded and installed on light source board.

LED chip of the linerless end the most according to claim 1, it is characterised in that this protective layer is made up of polymer, dissolves this polymer by solvent and can remove this protective layer.

LED chip of the linerless end the most according to claim 3, it is characterised in that this polymer is PMMA material or PDMS material.