CN205427744U - High -efficient computer heat conduction radiation device - Google Patents
High -efficient computer heat conduction radiation device Download PDFInfo
- Publication number
- CN205427744U CN205427744U CN201521079831.9U CN201521079831U CN205427744U CN 205427744 U CN205427744 U CN 205427744U CN 201521079831 U CN201521079831 U CN 201521079831U CN 205427744 U CN205427744 U CN 205427744U
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- China
- Prior art keywords
- heat
- fin
- fixed wings
- heat sink
- conducting strip
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model belongs to the computer realm especially relates to a high -efficient computer heat conduction radiation device, including heat sink device, the conducting strip, the heat conduction support, base plate and heat pipe, the conducting strip sets up on heat sink device, the heat conduction support sets up on the conducting strip, the base plate sets up on the heat conduction support, heat pipe one end is connected with heat sink device, heat pipe other end substrate connection, heat sink device includes the several fin, fin parallel arrangement, the fin includes fin body and fixed wing, fixed wing is a plurality of, a plurality of fixed wings set up the edge at the fin body respectively, fixed wing and fin body parallel arrangement, fixed wing is provided with protruded structure, protruded structure sets up with fixed wing is perpendicular, it has the fixed orifices to open corresponding to protruded structure's position at the fin body, the heat pipe core sets up the inner fin along the inside pipe wall, the inner fin is for there being salient screw thread line structure. The beneficial effect of the utility model: simple structure, design effect number has strengthened surrounding air and has flowed, makes it change in the heat dissipation, and the radiating efficiency is high.
Description
Technical field
It is exactly computer realm that this utility model belongs to, and particularly relates to a kind of high-availability computer heat conducting and heat radiating device.
Background technology
Along with the development of electronic technology, the speed that computer runs is increasingly faster, and the operating frequency of the core component CPU of computer is more and more higher, and the integrated circuit of cabinet inside extension gets more and more, and its caloric value and power consumption increase the most therewith.The frequency of up-to-date CPU improves the use voltage of circuit when overclocking, and its caloric value is huge.So many heat is distributed rapidly, is to ensure that the major issue that computer work is stable.
Utility model content
For the problems referred to above to be solved, this utility model provides a kind of high-availability computer heat conducting and heat radiating device.
nullThe technical solution of the utility model: a kind of high-availability computer heat conducting and heat radiating device，Including heat sink assembly，Conducting strip、Heat conduction support、Substrate，It is characterized in that described conducting strip is arranged on described heat sink assembly，Described heat conduction support is arranged on described conducting strip，Described substrate is arranged on described heat conduction support，Described heat pipe one end is connected with described heat sink assembly，Substrate described in the described heat pipe other end connects，Described heat sink assembly includes several fin，Described fin be arranged in parallel，Described fin includes fin body and fixed wings，Described fixed wings is multiple，Multiple described fixed wings are separately positioned on the limit of fin body，Described fixed wings be arranged in parallel with described fin body，Described fixed wings is provided with prominent structure，Described prominent structure is vertically arranged with described fixed wings，The position corresponding to described prominent structure in described fin body has fixing hole，Several described fin coordinate the described heat sink assembly of composition by described prominent structure with described fixing hole，Described heat pipe includes heat pipe shell and heat tube core，Described heat pipe shell is wrapped in outside described heat tube core，Described heat tube core arranges inner fin along inside pipe wall，Described inner fin is for there being protrusion threaded line structure，Working medium it is full of in described heat tube core.
Described fin body is rectangle, and described fixed wings is 4, and 4 described fixed wings are arranged on the corner of described fin body.
Described prominent structure and described fixing hole are rectangle.
Arranging heat conductive silica gel between described conducting strip and described heat sink assembly, arrange heat conductive silica gel between described heat conduction support and described conducting strip, described fixed plate and described heat conduction support arrange heat conductive silica gel.
The described inner fin that described heat pipe is provided with protrusion threaded line structure along inside pipe wall is 2, and 2 described inner fins are symmetrical arranged along inwall and intersect.
This utility model provides the benefit that: simple in construction, reasonable in design, strengthens surrounding air flowing so that it is be easier to heat radiation, and radiating efficiency is high.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model
Fig. 2 is the structure chart of heat sink assembly of the present utility model.
Fig. 3 is the sectional structure chart of heat pipe of the present utility model.
In figure:
1. heat sink assembly 2. fin body
3. fixed wings 4. highlights structure
5. fixing hole 6. conducting strip
7. heat conduction support 8. substrate
9. heat pipe 10. heat pipe shell
11. heat tube core 12. inner fins
13. first threaded line structure 14. second threaded line structures
15. working medium
Detailed description of the invention
Below in conjunction with the accompanying drawings a kind of detailed description of the invention of the present utility model is explained.
nullThis utility model relates to a kind of high-availability computer heat conducting and heat radiating device，Including heat sink assembly 1、Conducting strip 6、Heat conduction support 7、Substrate 8 and heat pipe 9 are that conducting strip is arranged on heat sink assembly 1，Heat conduction support 7 is arranged on conducting strip 6，Substrate 8 is arranged on heat conduction support，Heat pipe 9 one end is connected with heat sink assembly 1，Heat pipe 9 other end substrate 8 connects，Heat sink assembly 1 includes several fin，Fin be arranged in parallel，Fin includes fin body 2 and fixed wings 3，Fixed wings 3 is multiple，Multiple fixed wings 3 are separately positioned on the limit of fin body 2，Fixed wings 3 be arranged in parallel with fin body 2，Fixed wings 3 is provided with prominent structure 4，Prominent structure 4 is vertically arranged with fixed wings 3，Fixing hole 5 is had corresponding to the position highlighting structure 4 in fin body 2，Several fin coordinate composition heat sink assembly 1 by prominent structure 4 with fixing hole 5.Fin body 1 is rectangle, and fixed wings 3 is 4, and 4 fixed wings 3 are arranged on the corner of fin body 2.Prominent structure 4 and fixing hole 5 are rectangle, and heat pipe includes heat pipe shell 10 and heat tube core 11, and heat pipe shell 10 is wrapped in outside heat tube core 11, and heat tube core 11 arranges inner fin 12 along inside pipe wall, and inner fin 12, for there being protrusion threaded line structure, is full of working medium 15 in heat tube core.
Arranging heat conductive silica gel between conducting strip 6 and heat sink assembly 1, arrange heat conductive silica gel between heat conduction support 7 and conducting strip 6, fixed plate 8 and heat conduction support 7 arrange heat conductive silica gel.
The inner fin that heat tube core 11 is provided with protrusion threaded line structure along inside pipe wall is 2, it is not the first threaded line structure 13 and the second threaded line structure 14, first threaded line structure 13 and the second threaded line structure 14 are symmetrical arranged along inwall and intersect, with being to make working medium 10 clash into inside heat pipe by not stall during heat pipe 6, improve heat transfer efficiency, reduce heat exchange volume.
Make use-case: thermal source such as CPU or memorizer are fixing on the substrate 8 by fixed structure such as fixation clamp, heat pipe 9 one end is connected with heat sink assembly 1, heat pipe 9 other end substrate 8 connects, the heat part that thermal source produces passes to heat sink assembly 1 by heat pipe 9, another part thermal pathways conducting strip 6 and heat conduction support 7 pass to heat sink assembly 1, the inner fin that heat tube core 9 is provided with protrusion threaded line structure along inside pipe wall is 2, it is not the first threaded line structure 13 and the second threaded line structure 14, first threaded line structure 13 and the second threaded line structure 14 are symmetrical arranged along inwall and intersect, with being to make working medium 10 clash into inside heat pipe 9 by not stall during heat pipe 6, improve heat transfer efficiency.
Heat sink assembly 1 is made up of several fin, fin includes fin body 2 and fixed wings 3, fixed wings 3 is provided with prominent structure 4, fin body 2 is provided with the fixing hole 5 corresponding with highlighting structure 4, several fin coordinate composition to be assembled into heat sink assembly 1 by prominent structure 4 with fixing hole 5, the bonding strength of heat sink assembly 1 is big, after assembling after heat sink assembly 1, certain space is formed between fin, it is easy to air circulation, be conducive to heat radiation, fin is unlikely to deform, transport assembling is not easily broken and scatters, prominent structure 4 and fixing hole 5, simple in construction, it is readily produced, do not waste raw material.
Overall structure is simple, good heat dissipation effect.
Above an example of the present utility model is described in detail, but content has been only preferred embodiment of the present utility model, it is impossible to be considered for limiting practical range of the present utility model.All impartial changes made according to this utility model application range and improvement etc., within all should still belonging to patent covering scope of the present utility model.
Claims (5)
- null1. a high-availability computer heat conducting and heat radiating device，Including heat sink assembly、Conducting strip、Heat conduction support、Substrate and heat pipe，It is characterized in that described conducting strip is arranged on described heat sink assembly，Described heat conduction support is arranged on described conducting strip，Described substrate is arranged on described heat conduction support，Described heat pipe one end is connected with described heat sink assembly，Substrate described in the described heat pipe other end connects，Described heat sink assembly includes several fin，Described fin be arranged in parallel，Described fin includes fin body and fixed wings，Described fixed wings is multiple，Multiple described fixed wings are separately positioned on the limit of fin body，Described fixed wings be arranged in parallel with described fin body，Described fixed wings is provided with prominent structure，Described prominent structure is vertically arranged with described fixed wings，The position corresponding to described prominent structure in described fin body has fixing hole，Several described fin coordinate the described heat sink assembly of composition by described prominent structure with described fixing hole，Described heat pipe includes heat pipe shell and heat tube core，Described heat pipe shell is wrapped in outside described heat tube core，Described heat tube core arranges inner fin along inside pipe wall，Described inner fin is for there being protrusion threaded line structure，Working medium it is full of in described heat tube core.
- A kind of high-availability computer heat conducting and heat radiating device the most according to claim 1, it is characterised in that described fin body is rectangle, and described fixed wings is 4, and 4 described fixed wings are arranged on the corner of described fin body.
- A kind of high-availability computer heat conducting and heat radiating device the most according to claim 1, it is characterised in that described prominent structure and described fixing hole are rectangle.
- A kind of high-availability computer heat conducting and heat radiating device the most according to claim 1, it is characterized in that arranging heat conductive silica gel between described conducting strip and described heat sink assembly, arranging heat conductive silica gel between described heat conduction support and described conducting strip, described fixed plate and described heat conduction support arrange heat conductive silica gel.
- A kind of high-availability computer heat conducting and heat radiating device the most according to claim 1, it is characterised in that the described inner fin that described heat pipe is provided with protrusion threaded line structure along inside pipe wall is 2, and 2 described inner fins are symmetrical arranged along inwall and intersect.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521079831.9U CN205427744U (en) | 2015-12-23 | 2015-12-23 | High -efficient computer heat conduction radiation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521079831.9U CN205427744U (en) | 2015-12-23 | 2015-12-23 | High -efficient computer heat conduction radiation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205427744U true CN205427744U (en) | 2016-08-03 |
Family
ID=56538013
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521079831.9U Expired - Fee Related CN205427744U (en) | 2015-12-23 | 2015-12-23 | High -efficient computer heat conduction radiation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205427744U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106449292A (en) * | 2016-10-14 | 2017-02-22 | 无锡市海升电子科技有限公司 | Quick cooling type electric leakage protector |
-
2015
- 2015-12-23 CN CN201521079831.9U patent/CN205427744U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106449292A (en) * | 2016-10-14 | 2017-02-22 | 无锡市海升电子科技有限公司 | Quick cooling type electric leakage protector |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160803 Termination date: 20161223 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |