CN205375352U - Radiator for notebook - Google Patents
Radiator for notebook Download PDFInfo
- Publication number
- CN205375352U CN205375352U CN201620025695.3U CN201620025695U CN205375352U CN 205375352 U CN205375352 U CN 205375352U CN 201620025695 U CN201620025695 U CN 201620025695U CN 205375352 U CN205375352 U CN 205375352U
- Authority
- CN
- China
- Prior art keywords
- heat
- radiator
- metal sheet
- fin
- radiating plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model relates to a radiator for notebook is including heat dissipation mainboard 1 and semiconductor radiator part 2, the semiconductor refrigeration component sets up on the heat dissipation mainboard, the heat absorbent surface of semiconductor refrigeration component makes progress, and the heat -delivery surface of semiconductor refrigeration component is downward, still include radiating coil pipe 3, radiating coil pipe is provided with on the heat absorbent surface of fin, still including setting up in the left left side heat dissipation curb plate 5 of heat dissipation mainboard and setting up in the right side heat dissipation curb plate 4 on heat dissipation mainboard right side. The utility model discloses simple structure, convenient to use, it is comparatively convenient that the dismantlement is maintained, and the radiating effect is better.
Description
Technical field
This utility model belongs to PC domain, relates to a kind of notebook radiator.
Background technology
Development along with technology, the speed of service of notebook is also more and more faster, display effect is become better and better, the volume of notebook is more and more less, cause CPU(central processing unit) and GPU(graphic process unit) integrated level more and more higher, thus its heat dissipation capacity is greatly increased, if the bad computer components that may result in of radiating effect is under the condition of high temperature and works, the speed of service is affected on the one hand, the life-span of computer components can be shortened on the other hand, even cause irreversible loss, thus notebook computer needs the radiator that a heat radiation is good.
Summary of the invention
In view of this, the purpose of this utility model is in that to provide a kind of notebook radiator.
For reaching above-mentioned purpose, this utility model provides following technical scheme: a kind of notebook radiator, including heat-dissipating main 1 and semiconductor heat-dissipating element 2, described semiconductor refrigerating element is arranged on heat-dissipating main；Upwards, the heat delivery surface of semiconductor refrigerating element is downward for the heat-absorbent surface of described semiconductor refrigerating element.
Further, also including radiator coil tube 3, described radiator coil tube is arranged on gelled heat-absorbent surface.
Further, refrigerating fluid it is full of in described radiator coil tube.
Further, also include being arranged at the left side radiating plate-fin 5 on the left of heat-dissipating main and be arranged at the right side radiating plate-fin 4 on the right side of heat-dissipating main.
Further, described left side radiating plate-fin is articulated with on heat-dissipating main by hinge 6；Described right side radiating plate-fin passes through hinge on heat-dissipating main.
Further, described left side radiating plate-fin is provided with air intake radiator fan 8；Described right side radiating plate-fin is provided with air-out radiator fan 7.
Further, described air intake radiator fan 8 is two with the quantity of air-out radiator fan 7.
Further, described semiconductor refrigerating element is peltier-element.
Further, described peltier-element include heat sink metal sheet 9 and with two thermopositive metal sheets 10, wherein a thermopositive metal sheet is electrically connected on the left of described heat sink metal sheet by n-type semiconductor 11, and another thermopositive metal sheet is electrically connected on the right side of heat sink metal sheet by p-type semiconductor 12；Described heat sink metal sheet is for contacting with notebook computer, and described thermopositive metal sheet is arranged at the back side of heat sink metal sheet.
The beneficial effects of the utility model are in that:
This utility model simple in construction, easy to use, demolition and maintenance are more convenient, and radiating effect is better.
Accompanying drawing explanation
In order to make the purpose of this utility model, technical scheme and advantage clearly, below in conjunction with accompanying drawing, this utility model is described in further detail, wherein:
Fig. 1 is structure diagram of the present utility model；
Fig. 2 is Peltier element structural representation.
Detailed description of the invention
Below in conjunction with accompanying drawing, preferred embodiment of the present utility model is described in detail.
As it is shown in figure 1, a kind of notebook radiator, including heat-dissipating main 1 and semiconductor heat-dissipating element 2, described semiconductor refrigerating element is arranged on heat-dissipating main；Upwards, the heat delivery surface of semiconductor refrigerating element is downward for the heat-absorbent surface of described semiconductor refrigerating element.
In the present embodiment, also including radiator coil tube 3, described radiator coil tube arranges on gelled heat-absorbent surface, and radiator coil tube is sealed heat-dissipating coil pipe.Being full of refrigerating fluid in radiator coil tube, refrigerating fluid can circulate in radiator coil tube, it is possible to improves cooling effect.
In the present embodiment, also include being arranged at the left side radiating plate-fin 5 on the left of heat-dissipating main and be arranged at the right side radiating plate-fin 4 on the right side of heat-dissipating main；Described left side radiating plate-fin is articulated with on heat-dissipating main by hinge 6；Described right side radiating plate-fin passes through hinge on heat-dissipating main.In use, it is possible to left side radiating plate-fin and right side radiating plate-fin are folded, make the descending one-tenth certain space of heat-dissipating main, further speed up heat radiation.Further, described left side radiating plate-fin and right side radiating plate-fin are inverted trapezoidal plate, so in folding, form radiator near user one end lower than away from user one end, more meet the use habit of people.
In the present embodiment, described left side radiating plate-fin is provided with air intake radiator fan 8；Described right side radiating plate-fin is provided with air-out radiator fan 7；The quantity of described air intake radiator fan 8 and air-out radiator fan 7 is two.The radiating effect strengthened further.
In the present embodiment, described semiconductor refrigerating element is peltier-element.
In the present embodiment, described peltier-element include heat sink metal sheet 9 and with two thermopositive metal sheets 10, wherein a thermopositive metal sheet is electrically connected on the left of described heat sink metal sheet by n-type semiconductor 11, and another thermopositive metal sheet is electrically connected on the right side of heat sink metal sheet by p-type semiconductor 12；Described heat sink metal sheet is for contacting with notebook computer, and described thermopositive metal sheet is arranged at the back side of heat sink metal sheet.
As to further improvement of this embodiment, described heat sink metal sheet surface configuration has the first intermediate layer, described first intermediate layer is provided with by the first component of at least one capillary soft tube coiling, described first thermopositive metal sheet and the second thermopositive metal sheet are provided with the second intermediate layer, described second intermediate layer is provided with by the component of at least one capillary soft tube coiling, in described first component and second component hydraulically full, be generally water.
What finally illustrate is, preferred embodiment above is only in order to illustrate the technical solution of the utility model and unrestricted, although this utility model being described in detail by above preferred embodiment, but skilled artisan would appreciate that, in the form and details it can be made various change, without departing from this utility model claims limited range.
Claims (9)
1. a notebook radiator, it is characterised in that: including heat-dissipating main (1) and semiconductor heat-dissipating element (2), described semiconductor refrigerating element is arranged on heat-dissipating main；Upwards, the heat delivery surface of semiconductor refrigerating element is downward for the heat-absorbent surface of described semiconductor refrigerating element.
2. radiator according to claim 1, it is characterised in that: also including radiator coil tube (3), described radiator coil tube is arranged on gelled heat-absorbent surface.
3. radiator according to claim 2, it is characterised in that: it is full of refrigerating fluid in described radiator coil tube.
4. radiator according to claim 1, it is characterised in that: also include the left side radiating plate-fin (5) being arranged on the left of heat-dissipating main and the right side radiating plate-fin (4) being arranged on the right side of heat-dissipating main.
5. radiator according to claim 4, it is characterised in that: described left side radiating plate-fin is articulated with on heat-dissipating main by hinge (6)；Described right side radiating plate-fin passes through hinge on heat-dissipating main.
6. the radiator according to claim 4 or 5, it is characterised in that: described left side radiating plate-fin is provided with air intake radiator fan (8)；Described right side radiating plate-fin is provided with air-out radiator fan (7).
7. radiator according to claim 6, it is characterised in that: the quantity of described air intake radiator fan (8) and air-out radiator fan (7) is two.
8. radiator according to claim 1, it is characterised in that: described semiconductor refrigerating element is peltier-element.
9. radiator according to claim 8, it is characterized in that: described peltier-element include heat sink metal sheet (9) and with two thermopositive metal sheets (10), wherein a thermopositive metal sheet is electrically connected on the left of described heat sink metal sheet by n-type semiconductor (11), and another thermopositive metal sheet is electrically connected on the right side of heat sink metal sheet by p-type semiconductor (12)；Described heat sink metal sheet is for contacting with notebook computer, and described thermopositive metal sheet is arranged at the back side of heat sink metal sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620025695.3U CN205375352U (en) | 2016-01-12 | 2016-01-12 | Radiator for notebook |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620025695.3U CN205375352U (en) | 2016-01-12 | 2016-01-12 | Radiator for notebook |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205375352U true CN205375352U (en) | 2016-07-06 |
Family
ID=56278290
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620025695.3U Expired - Fee Related CN205375352U (en) | 2016-01-12 | 2016-01-12 | Radiator for notebook |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205375352U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108196647A (en) * | 2017-12-11 | 2018-06-22 | 江苏奔拓电气科技有限公司 | A kind of computer radiator |
-
2016
- 2016-01-12 CN CN201620025695.3U patent/CN205375352U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108196647A (en) * | 2017-12-11 | 2018-06-22 | 江苏奔拓电气科技有限公司 | A kind of computer radiator |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102790020A (en) | Liquid cooling type heat dissipation device | |
| CN106648000A (en) | Built-in radiator of notebook computer | |
| CN205384567U (en) | Built -in heat -dissipation device of notebook computer | |
| CN205375352U (en) | Radiator for notebook | |
| CN205540515U (en) | Notebook computer cools off pad | |
| CN207610584U (en) | A kind of microchannel heat sink | |
| CN205644413U (en) | Heat sink | |
| CN106371535A (en) | Parallel type CPU cooling device | |
| CN206339926U (en) | The built-in radiator of notebook | |
| CN205028227U (en) | Modified has temperature cooling function's solid state hard drives | |
| CN107820373B (en) | It is atomized cooling body | |
| CN201638132U (en) | Heat dissipation module | |
| CN201852351U (en) | Omnibearing placed cold-heat complementary comprehensive heat exchanger | |
| CN206672012U (en) | A kind of novel computer cabinet radiator structure | |
| CN209070905U (en) | Energy-saving LED display screen with high heat dispersion | |
| CN106933314A (en) | The built-in radiator of notebook | |
| CN206421311U (en) | A kind of parallel CPU heat radiation cooling devices | |
| CN204679942U (en) | A kind of notebook computer radiating bracket of circulation cooling | |
| CN206224354U (en) | A kind of tandem CPU heat radiation cooling devices | |
| CN202033710U (en) | Notebook cooling pad | |
| CN201188200Y (en) | Improvement for computer refrigerating device | |
| CN205405391U (en) | Efficient radiator for computer | |
| CN205334352U (en) | Computer radiator | |
| CN205378466U (en) | Heat dissipation device | |
| CN204272578U (en) | A kind of novel immersion heat abstractor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160706 Termination date: 20170112 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |