CN205318407U - Fingerprint module preparation tool - Google Patents
Fingerprint module preparation tool Download PDFInfo
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- CN205318407U CN205318407U CN201521095931.0U CN201521095931U CN205318407U CN 205318407 U CN205318407 U CN 205318407U CN 201521095931 U CN201521095931 U CN 201521095931U CN 205318407 U CN205318407 U CN 205318407U
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- die cavity
- locating dowel
- fingerprint module
- reference column
- magnet
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Abstract
The utility model discloses a fingerprint module preparation tool, including bottom plate and offer the die cavity unit at this bottom plate upper surface, second die cavity that the die cavity unit includes locating component, is used for to inlay dress apron and sensing chip's first die cavity and is used for inlaying the dress flexible circuit board, first die cavity and the 2nd die cavity communicate, locating component include a collet post and a plurality of first reference column at the bottom of the protruding chamber of locating first die cavity, and first reference column interval distribution in the inner edge of first die cavity, collet post lie in the respectively central authorities of first reference column, the protruding second reference column that is equipped with of upper surface of first reference column, the combination of this second reference column and first reference column is the step form. The utility model discloses simplified production process, it is efficient to laminate, and the precision is high.
Description
Technical field
This utility model relates to a kind of fingerprint module and makes tool.
Background technology
In recent years, under the urgent needs of security fields, biological identification technology is rapidly developed, at present, biological identification technology mainly has: the various ways such as fingerprint, iris, face, ear, palmmprint, palm shape, vein, voice, brain wave, saliva, DNA, abnormal smells from the patient, signature, gait, retina, infrared temperature spectrum, every kind of identification technology has had extensive use according to own characteristic in specific field. Showing field at touch-control, have the advantages such as high uniqueness, high stability, high accuracy, high security, high collection property, low cost due to fingerprint recognition, fingerprint recognition will be become " standard configuration " from " apolegamy " in touch control display device. Rise along with the means such as online payment, mobile payment; information security is had higher requirement; " uniqueness of fingerprint " this feature is utilized to carry out information protection; existing high safety; having again good operability, fingerprint recognition system will become the only selection of protection information security.
At present, capacitance type fingerprint identification module comparatively popular on market, substantially can be divided into band becket from profile and without the big class of becket two. Wherein, without the fingerprint module of becket as it is shown in figure 1, generally comprise the flexible PCB 30 of stacking from the bottom to top, induction chip 20 and cover plate 10. Owing to fingerprint recognition module device volume is little, Anawgy accuracy is required height, require possess significantly high working (machining) efficiency simultaneously, packaging technology is proposed high requirement by this, but, current existing technique is primarily present laminating, and efficiency is low, precision is low, the glue that overflows is difficult to the problems such as management and control, especially, in the laminating process without becket fingerprint recognition module, the problems referred to above become apparent from.
Utility model content
In order to overcome the deficiencies in the prior art, the purpose of this utility model is in that to provide a kind of fingerprint module to make tool, which simplify Making programme, and laminating efficiency is high, and precision is high.
The purpose of this utility model realizes by the following technical solutions:
A kind of fingerprint module makes tool, including base plate and the die cavity unit being opened in this plate upper surface, die cavity unit includes positioning component, for being embedded in the first die cavity of cover plate and induction chip and for being embedded in the second die cavity of flexible PCB, first die cavity and the connection of the second die cavity, the collet post at the bottom of chamber that positioning component includes being convexly equipped in the first die cavity and some first locating dowels, first locating dowel is spaced apart in the inner edge of the first die cavity, and collet post is positioned at the central authorities of each first locating dowel;The upper surface of the first locating dowel is convexly equipped with the second locating dowel, and the combination of this second locating dowel and the first locating dowel is step-like.
Preferably, the first die cavity is rectangular, and the first locating dowel is positioned at the corner of the first die cavity, and the edge of the second die cavity is provided with the profile locating slot for flexible PCB is positioned.
Preferably, the first locating dowel, the second locating dowel are all in fan-shaped, and collet post is rounded.
Preferably, the difference in height of collet post and the first locating dowel is equal to the thickness of cover plate.
Preferably, die cavity unit is multiple, and the arrangement in array-like on base plate.
Preferably, this fingerprint module makes tool and also includes press strip, and the two ends of this press strip are provided with the first magnet, and press strip collapses and is located at same a line die cavity unit or with string die cavity unit, being fixed with the second magnet on the base plate corresponding with the first magnet positions, the second magnet and the first magnet magnetic are attracting.
Compared to existing technology, the beneficial effects of the utility model are in that:
This utility model passes through the first die cavity, second die cavity accurate limit to cover plate, induction chip and flexible PCB, spacing in conjunction with positioning component, can effectively solve the problem that in laminating process, efficiency is low, precision is low, the glue that overflows is difficult to management and control, avoid buying the abutted equipment of high accuracy high price simultaneously, thus enormously simplify Making programme, reduce cost of manufacture, improve product quality.
Accompanying drawing explanation
Fig. 1 is the composition schematic diagram of existing fingerprint module;
Fig. 2 is the structural representation that this utility model fingerprint module makes tool;
Fig. 3 is the structural representation of this utility model die cavity unit;
Fig. 4 is the schematic diagram being assembled with fingerprint module in this utility model die cavity unit;
Fig. 5 is the package assembly schematic diagram of this utility model fingerprint module;
Fig. 6 is the schematic diagram that this utility model fingerprint module makes that tool is pressed by press strip.
In figure: 10, cover plate; 20, induction chip; 30, flexible PCB; 40, glue layer; 50, base plate; 60, press strip; 70, the first magnet; 80, die cavity unit; 100, the first die cavity; 101, the first locating dowel; 102, collet post; 200, the second die cavity; 201, the second locating dowel; 202, profile locating slot.
Detailed description of the invention
Below, in conjunction with accompanying drawing and detailed description of the invention, this utility model is described further:
A kind of fingerprint module as shown in figures 2-6 makes tool, including base plate 50 and the die cavity unit 80 being opened in this base plate 50 upper surface, die cavity unit 80 includes positioning component, for being embedded in the first die cavity 100 of cover plate 10 and induction chip 20 and for being embedded in the second die cavity 200 of flexible PCB 30, first die cavity 100 connects with the second die cavity 200, the collet post 102 at the bottom of chamber that positioning component includes being convexly equipped in the first die cavity 100 and some first locating dowels 101, first locating dowel 101 is spaced apart in the inner edge of the first die cavity 100, collet post 102 is positioned at the central authorities of each first locating dowel 101, the upper surface of the first locating dowel 101 is convexly equipped with the second locating dowel 201, and the combination of this second locating dowel 201 and the first locating dowel 101 is step-like.
Owing to cover plate 10 overall dimensions is less than the overall dimensions of flexible PCB 30, the fingerprint module of this example self is without becket, thus cover plate 10 cannot be positioned, then have to by means of positioning component and adopt upside-down mounting mode to assemble, therefore, as it is shown on figure 3, base plate 50 devises first locating dowel the 101, second locating dowel 201.
As shown in Figure 4, by first die cavity the 100, second die cavity 200 accurate limit to cover plate 10, induction chip 20 and flexible PCB 30, spacing in conjunction with positioning component, can effectively solve the problem that in laminating process, efficiency is low, precision is low, the glue that overflows is difficult to management and control.The second step-like locating dowel 201 will and the first locating dowel 101 between form high low head, this difference in height is also the oneself height of the second locating dowel 201, usually, the height of this second locating dowel 201 is slightly larger than the gross thickness of induction chip 20 and flexible PCB 30, with the thickness 10-15um of glue between adaptive cover plate 10 and induction chip 20, meanwhile, the second die cavity 200 also allow flexible PCB 30 profile location more accurate.
The making material of the base plate 50 of this example can be the resistant to elevated temperatures materials of high rigidity such as bakelite (bakelite), rustless steel, AL, there to be higher form retention at 150 DEG C of temperature, and indeformable, not warpage.
As a preferred embodiment, as shown in Figure 3, first die cavity 100 is rectangular, first locating dowel 101 is positioned at the corner of the first die cavity 100, the edge of the second die cavity 200 is provided with the profile locating slot 202 for flexible PCB 30 is positioned, and this profile locating slot 202 can be strengthened the coupling to flexible PCB 30 and position. First locating dowel the 101, second locating dowel 201 is all in fan-shaped, and collet post 102 is rounded. Respectively 1 the first fan-shaped locating dowel 101 is respectively set at 4 jiaos, it is preferable that the bottom surface radius of fan-shaped locating dowel is more than 2mm, and collet post 102 bottom surface radius size is advisable with the 1/4 of cover plate 10 bottom surface figure minor axis length. Second locating dowel 201 role is to solve the alignment issues between flexible PCB 30 and the cover plate 10 with induction chip 20.
Wherein, the difference in height of collet post 102 and the first locating dowel 101 is equal to the thickness of cover plate 10, so can help to reduce the contact area of cover plate 10 edge and bottom surface and base plate 50, after effectively reducing baking, excessive glue layer 40 causes the problem that this tool and product cannot separate, and also solves the orientation problem of cover plate 10 simultaneously.
Exemplarily, as in figure 2 it is shown, die cavity unit 80 is multiple, and arrangement, the setting of multiple die cavity unit 80 in array-like on base plate 50, it may be achieved mass production and repeatedly using. One opens greatly a base plate 50 can be distributed a large amount of die cavity unit 80, it is possible to being set to 4 × 4 arrangements, examine bright especially at this, this utility model unit arrangement mode is not limited to N × N, it is also possible to be N × M arrangement mode, and wherein N, M are positive integer.
Preferably, as shown in Figure 6, this fingerprint module makes tool and also includes press strip 60, the two ends of this press strip 60 are provided with the first magnet 70, press strip 60 collapses and is located at same a line die cavity unit 80 or with string die cavity unit 80, being fixed with the second magnet on the base plate 50 corresponding with the first magnet 70 position, the second magnet and the first magnet 70 magnetic are attracting. After often completing the fingerprint module group assembling in above-mentioned a line unit die cavity, placing press strip 60 herein above, by the first magnet 70 and the second magnet, there is a natural attraction between the sexes, makes press strip 60 and fingerprint module firmly press together.
Described fingerprint module is adopted to make the fingerprint module group assembling method of tool, including:
S1, induction chip 20 and flexible PCB 30 are fitted;
S2, make at described fingerprint module and the first die cavity 100 of tool is placed cover plate 10 and to be positioned assembly spacing;
S3, upper surface coating adhesive water layer 40 to cover plate 10, control this glue layer 40 thickness after hardening and be 10-20 μm, as shown in Figure 5;
Induction chip 20 is also pasted onto on cover plate 10 by described glue layer 40 by S4, inversion flexible PCB 30, simultaneously by position-limit mechanism, induction chip 20 is spacing, by the second die cavity 200, flexible PCB 30 is spacing;
S5, to the flexible PCB 30 corresponding with the first die cavity 100 towards keeping pressure bottom the first die cavity 100, make cover plate 10, induction chip 20, flexible PCB 30 three by good bond together;
S6, the fingerprint module being pressed together on base plate 50 carries out performing after vacuum defoamation high-temperature baking.
When placing cover plate 10, putting into cover plate 10 by being printed with facing up of ink on base plate 50, the material of cover plate 10 used can be glass, sapphire, pottery etc. Preferably, the first locating dowel 101 controls to be advisable between 0.01-0.015mm to the marginal gap of cover plate 10.
The THICKNESS CONTROL of glue layer 40 is advisable for 10-20um after hardening, this design contributes to reducing the contact area of cover plate 10 edge and bottom surface and the first die cavity 100, the problem that laminating glue excessive after effectively reducing baking causes tool and product to separate, also solves the orientation problem of cover plate 10 simultaneously. Glue used can be A, B bi-component heat curing-type glue, it is also possible to is one-component heat curing-type glue, it is preferable that adopts A, B bi-component heat curing-type glue, proportionally configures and is sufficiently stirred for half an hour before use, standing in order to using. Coating glue can be coated with by hand and automatically can also be coated with equipment, coating route can be " rice " font, " ten " font,The non-closed fonts such as font, " Y " font, in order to get rid of bubble, eliminate " extremely bubble ". Coated glue quantity is advisable with thickness 10-20um after subsequent cure, and cured glue water outward flange distance cover plate 10 edge 0.03-0.05mm is advisable.
Preferably, the laminating of induction chip 20 and flexible PCB 30 adopts reflow soldering process, and peak temperature controls below 240 DEG C.
This example adopts deaeration machine that the fingerprint module being pressed together on base plate 50 is carried out deaeration, and deaeration air pressure is 3-4kg, and deaeration temperature is 45-50 DEG C, and inclined heated plate is 15-30min. The purpose carrying out deaeration is in that to extrude away the bubble of parcel in glue layer 40, is beneficial to protect the stable assembling of fingerprint module.
The fingerprint module level being pressed together on base plate 50 is inserted heated oven by this example, performs high-temperature baking by heated oven, and heating-up temperature is 65-150 DEG C, and heat time heating time is 5-30min. The purpose heated by heated oven is, is dried by glue layer 40, to keep enough bonding strength. Preferably, acid extraction controls respectively at 80 DEG C, 15min.
It will be apparent to those skilled in the art that can technical scheme as described above and design, make other various corresponding changes and deformation, and all these change and deformation all should belong within this utility model scope of the claims.
Claims (6)
1. a fingerprint module makes tool, it is characterized in that, including base plate and the die cavity unit being opened in this plate upper surface, die cavity unit includes positioning component, for being embedded in the first die cavity of cover plate and induction chip and for being embedded in the second die cavity of flexible PCB, first die cavity and the connection of the second die cavity, the collet post at the bottom of chamber that positioning component includes being convexly equipped in the first die cavity and some first locating dowels, first locating dowel is spaced apart in the inner edge of the first die cavity, and collet post is positioned at the central authorities of each first locating dowel; The upper surface of the first locating dowel is convexly equipped with the second locating dowel, and the combination of this second locating dowel and the first locating dowel is step-like.
2. fingerprint module according to claim 1 makes tool, it is characterised in that the first die cavity is rectangular, and the first locating dowel is positioned at the corner of the first die cavity, and the edge of the second die cavity is provided with the profile locating slot for flexible PCB is positioned.
3. fingerprint module according to claim 1 makes tool, it is characterised in that the first locating dowel, the second locating dowel are all in fan-shaped, and collet post is rounded.
4. fingerprint module according to claim 1 makes tool, it is characterised in that the difference in height of collet post and the first locating dowel is equal to the thickness of cover plate.
5. the fingerprint module according to any one of claim 1-4 makes tool, it is characterised in that die cavity unit is multiple, and the arrangement in array-like on base plate.
6. fingerprint module according to claim 5 makes tool, it is characterized in that, this fingerprint module makes tool and also includes press strip, the two ends of this press strip are provided with the first magnet, press strip collapses and is located at same a line die cavity unit or with string die cavity unit, being fixed with the second magnet on the base plate corresponding with the first magnet positions, the second magnet and the first magnet magnetic are attracting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521095931.0U CN205318407U (en) | 2015-12-24 | 2015-12-24 | Fingerprint module preparation tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521095931.0U CN205318407U (en) | 2015-12-24 | 2015-12-24 | Fingerprint module preparation tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205318407U true CN205318407U (en) | 2016-06-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521095931.0U Expired - Fee Related CN205318407U (en) | 2015-12-24 | 2015-12-24 | Fingerprint module preparation tool |
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| Country | Link |
|---|---|
| CN (1) | CN205318407U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105447478A (en) * | 2015-12-24 | 2016-03-30 | 深圳市深越光电技术有限公司 | Fingerprint module manufacturing fixture and assembling method thereof |
-
2015
- 2015-12-24 CN CN201521095931.0U patent/CN205318407U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105447478A (en) * | 2015-12-24 | 2016-03-30 | 深圳市深越光电技术有限公司 | Fingerprint module manufacturing fixture and assembling method thereof |
| CN105447478B (en) * | 2015-12-24 | 2019-05-07 | 深圳市深越光电技术有限公司 | A kind of fingerprint mould group production jig and its assemble method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: GUANGDONG YUEZHONG PHOTOELECTRIC TECHNOLOGY Co.,Ltd. Assignor: TOPTOUCH ELECTRONICS CO.,LTD. Contract record no.: 2017440020020 Denomination of utility model: Fingerprint module manufacturing fixture and assembling method thereof Granted publication date: 20160615 License type: Common License Record date: 20170310 |
|
| EE01 | Entry into force of recordation of patent licensing contract | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20171116 Address after: 523718 Guangdong city in Dongguan Province town of Tangxia City Industrial Park Keyuan information industry A10 No. C15 Lu Yi Lu Patentee after: GUANGDONG YUEZHONG PHOTOELECTRIC TECHNOLOGY Co.,Ltd. Address before: Baoan District Shenzhen City, Guangdong province 518000 streets Guanlan Liguang community Li New Light Industrial Zone No. 118 Patentee before: TOPTOUCH ELECTRONICS CO.,LTD. |
|
| TR01 | Transfer of patent right | ||
| CP03 | Change of name, title or address |
Address after: Room 301, Building 7, Luyi South Road, Tangxia Town, Dongguan City, Guangdong Province Patentee after: Guangdong Xingxing Electronic Technology Co.,Ltd. Address before: 523718 C15, No. A10 Industrial Luyi Road, Keyuan City, Tangxia Town, Dongguan City, Guangdong Province Patentee before: GUANGDONG YUEZHONG PHOTOELECTRIC TECHNOLOGY Co.,Ltd. |
|
| CP03 | Change of name, title or address | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160615 Termination date: 20211224 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |