CN205312215U - Packing braid of thermistor chip and reel - Google Patents
Packing braid of thermistor chip and reel Download PDFInfo
- Publication number
- CN205312215U CN205312215U CN201521142530.6U CN201521142530U CN205312215U CN 205312215 U CN205312215 U CN 205312215U CN 201521142530 U CN201521142530 U CN 201521142530U CN 205312215 U CN205312215 U CN 205312215U
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- thermistor chip
- chip
- braid
- packaging
- thermistor
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Abstract
The utility model provides a braid of thermistor chip packing, covers area, carrier band, bottom area and thermistor chip including the face, the equidistant chip positioning hole that is equipped with on the carrier band, the thermistor chip is fixed in the chip positioning hole, laminate respectively in face lid area and bottom area the upper and lower surface of carrier band. The utility model discloses a braid of thermistor chip packing has following beneficial effect: can effectively prevent the aversion of thermistor chip in the transportation, put upside down that it is unanimous to guarantee that its arranges interval, the manipulator picks when carrying out the pay -off during the nation of being convenient for processes surely, compared with packing of the crystal cartridge among the prior art and blue membrane packing, packing braid processing need not the artifical chip of arranging, and degree of automation is high, and work efficiency is being shown to be promoted, compared with blue membrane packing, the packing braid be seal structure and the resting period long.
Description
Technical field
The utility model relates to a kind of packing chip structure, particularly relates to a kind of packing chip braid.
Background technology
Nation is a kind of mode playing line in chip production process surely, before being generally used for encapsulation, chip internal circuits gold thread or aluminum steel are connected with the gold-plated Copper Foil of package pins or wiring board, ultrasonic generator is utilized to produce ultrasonic wave, high-frequency vibration is produced through transverter, this vibration is sent to chopper by horn, when chopper contacts with lead-in wire and welded part, under the effect of pressure and vibration, metallic surface to be welded phase mutual friction, oxide film is destroyed, and there is viscous deformation, two pure metal coverings are caused to be in close contact, reach the combination of atomic distance, final formation is firmly mechanically connected. carrying out nation's timing at thermistor chip, first need to be captured by thermistor chip with mechanical manipulator, for this reason, thermistor chip must be package with the arrangement mode of neat rule to carry out feeding, to facilitate mechanical manipulator to capture.
In prior art, thermistor chip has following four kinds of packaging means usually: valve bag packaging, glass bottle packaging, crystal holder packaging and blue film packaging.
Wherein, valve bag packaging and glass bottle packaging are all be placed on by thermistor chip in valve bag or vial in a jumble, it does not have the arrangement mode of rule, is unfavorable for that nation determines the carrying out of technique.
Referring to Fig. 1, it is the schematic diagram of crystal holder Packaging Method. Crystal holder Packaging Method, first makes crystal holder according to thermistor chip size, then goes up chip typesetting to manually, and the electrode surface ensureing thermistor chip is upward, overall package after the multiple crystal holder of stacking.
Referring to Fig. 2, it is the schematic diagram of blue film Packaging Method. Blue film Packaging Method, first mould is made according to thermistor chip size, according to mould size, blue film is carried out cutting again, then by fixing to indigo plant film and thermistor chip laminating, and the electrode surface ensureing blue film and thermistor chip coheres, take out blue film, by overall package after multiple blue film-stack.
Crystal holder packaging and blue film packaging all need thermistor chip to be carried out arrangement operation, inefficiency to manually; Transportation easily causes thermistor chip displacement, puts upside down, and then can not ensure that its arrangement pitches and electrode surface are towards constant; In addition, the ageing shelf-time limiting thermistor chip of blue film viscosity.
Practical novel content
In order to solve the problems of the technologies described above, the utility model provides one and prevents chip displacement, puts upside down, ensure arrangements of chips spacing consistent, can automatization processing, shelf-time length thermistor chip packaging braid.
The technical scheme that the utility model adopts is:
A kind of thermistor chip packaging braid, comprises cover band, load band, bottom cap tape and thermistor chip; The described load first-class spacing of band is provided with chip positioning hole, and described thermistor chip is fixed in described chip positioning hole; Described cover band and bottom cap tape are fitted in the upper and lower surface of described load band respectively.
Thermistor chip of the present utility model packaging braid, has following useful effect: the displacement that can effectively prevent thermistor chip in transportation, put upside down, and ensures that its arrangement pitches is consistent, and when being convenient to carry out feeding during nation processes surely, mechanical manipulator captures; Packing compared with crystal holder of the prior art and blue film packaging, packaging braid is processed without the need to manual alignment chip, level of automation height, and working efficiency is significantly improved; Compared with blue film packaging, packaging braid is that sealed structure and shelf-time are long.
Further, described load is brought and is also provided with circular locating openings, described circular locating openings and described chip positioning hole one_to_one corresponding.
Further, described load band is paper load band.
Further, described thermistor chip is square NTC thermistor chip, and the shape size in described chip positioning hole is suitable with the shape size of described thermistor chip.
Further, described thermistor chip comprises surface metal electrode and thermal sensitive ceramics sheet, and described surface metal electrode is close to the upper and lower surface being fixed on described thermal sensitive ceramics sheet respectively.
Further, the surface metal electrode of described thermistor chip and the plane parallel at described load band place.
Surface metal electrode and the plane parallel at load band place, be convenient to nation's timing, and directly carrying out crawl with mechanical manipulator can process, it is not necessary to again judge direction, surface metal electrode place.
The utility model also provides a kind of thermistor chip packaging braid volume dish, comprises the packaging braid of the thermistor chip described in above-mentioned arbitrary item and tep reel, and the packaging braid of described thermistor chip is wound on described tep reel.
Further, described in each, thermistor chip packaging braid volume dish packaging has thermistor chip described in 4Kpcs or 8Kpcs.
Further, described tep reel posts the label indicating described thermistor chip quantity.
In order to understand better and implement, below in conjunction with accompanying drawing, the utility model is described in detail.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of crystal holder Packaging Method of the prior art;
Fig. 2 is the schematic diagram of blue film Packaging Method of the prior art;
Fig. 3 is the structural representation of thermistor chip of the present utility model packaging braid volume dish;
Fig. 4 is the structural representation of thermistor chip of the present utility model;
Fig. 5 is the structural representation of load band of the present utility model and thermistor chip.
Embodiment
Referring to Fig. 3, it is the structural representation of thermistor chip of the present utility model packaging braid volume dish.Thermistor chip of the present utility model packaging braid volume dish (hereinafter referred to as packaging braid volume dish) comprises thermistor chip packaging braid (hereinafter referred to as packaging braid) and tep reel 5, wherein, this packaging braid comprises cover band 1, load band 2, bottom cap tape 3 and thermistor chip 4.
Refer to Fig. 4, it is the structural representation of thermistor chip of the present utility model, the preferred square NTC thermistor chip of this thermistor chip 4, it comprises square thermal sensitive ceramics sheet 42 and the surface metal electrode 41 of two thin slice shapes, and the upper and lower surface of this thermal sensitive ceramics sheet 42 is close to respectively and is fixed with a surface metal electrode 41.
Referring to Fig. 5, it is the structural representation of load band of the present utility model and thermistor chip. This load is with 2 first-class spacing to be provided with square chip pilot hole 21, and and these circular locating openings 22 one to one, chip positioning hole 21. The shape size in this chip positioning hole 21 is suitable with the shape size of this thermistor chip. This bottom cap tape 3 is close to the lower surface being fixed on this load band 2, makes this thermistor chip 4 be fixed in this chip positioning hole 21 and accept by bottom cap tape 3. Meanwhile, surface metal electrode 41 and the plane parallel at load band 2 places, be convenient to nation's timing, and directly carrying out crawl with mechanical manipulator can process, it is not necessary to again judge direction, surface metal electrode place. The effect of this circular locating openings 21 is, when driving load band, the pilot pin on wheel disc inserts band dynamic load Tape movement in this circular locating openings 22, and thermistor chip 4 is corresponding simultaneously falls into chip positioning hole 21, accurate positioning. This load band 2 can be paper load band or plastic carrier, preferred paper load band in the present embodiment. The laminating of this cover band 1 is fixed on the upper surface of this load band 2, forms packaging braid. Thermistor chip 4 is played interval, support, fixing by this packaging braid.
This packaging braid is wound on this tep reel 5, forms packaging braid volume dish. Each this packaging braid volume dish packaging has 4Kpcs or 8Kpcs (4000 or 8000) this thermistor chip, and posts the label indicating this thermistor chip quantity on tep reel 5.
Packaging braid volume dish of the present utility model, adopts following step to make:
S1: the load band 2 choosing spacing chip positioning holes 21 such as being provided with, and it is with 2 to fit with bottom cap tape 3 hot pressing load. The size in the chip positioning hole 21 of selected load band is suitable with the size of packaging thermistor chip 4, as the thermistor chip of 0.55*0.55*0.2mm carried out tape package, then a chip positioning hole dimension can be selected to be the load band of 0.58*0.58*0.22mm.
S2: load be with in 2 loading braiding machines, will drive in the pilot pin insertion circular locating openings 22 carried on the wheel disc being with 2, and is poured into by thermistor chip 4 in the feed chute of braiding machine.
S3: according to the specification of load band 2 and thermistor chip 4, braiding machine is carried out program entry.
S4: thermistor chip 4 is placed in the chip positioning hole 21 of load band, and ensure the plane parallel of the surface metal electrode 41 of this thermistor chip with load band 2 places.
S5: load is with 2 and cover band 1 hot pressing gluing, sealing, forms packaging braid.
S6: this packaging braid is rolled into packaging braid volume dish with 4Kpcs or 8Kpcs.
S7: stick, on packaging braid volume dish, the label indicating thermistor chip quantity.
Thermistor chip of the present utility model packaging braid and packaging braid volume dish, there is following useful effect: carry out thermistor chip packing and the packaging braid structure of high pressure seal formation, can effectively prevent the displacement of thermistor chip in transportation, put upside down, ensure that its arrangement pitches is consistent, and thermistor chip parallel placement all the time, its surface metal electrode and load band place plane parallel, when being convenient to carry out feeding during nation processes surely, mechanical manipulator captures;Packing compared with crystal holder of the prior art and blue film packaging, packaging braid is processed without the need to manual alignment chip, level of automation height, and working efficiency is significantly improved; Compared with blue film packaging, packaging braid is that sealed structure and shelf-time are long.
The utility model is not limited to above-mentioned enforcement mode, if various change of the present utility model or distortion are not departed from spirit and scope of the present utility model, if these are changed and distortion belongs within claim of the present utility model and equivalent technologies scope, then the utility model also is intended to comprise these changes and distortion.
Claims (9)
1. a thermistor chip packaging braid, it is characterised in that: comprise cover band, load band, bottom cap tape and thermistor chip; The described load first-class spacing of band is provided with chip positioning hole, and described thermistor chip is fixed in described chip positioning hole; Described cover band and bottom cap tape are fitted in the upper and lower surface of described load band respectively.
2. thermistor chip according to claim 1 packaging braid, it is characterised in that: described load is brought and is also provided with circular locating openings, described circular locating openings and described chip positioning hole one_to_one corresponding.
3. thermistor chip according to claim 1 packaging braid, it is characterised in that: described load band is paper load band.
4. thermistor chip according to claim 1 packaging braid, it is characterised in that: described thermistor chip is square NTC thermistor chip, and the shape size in described chip positioning hole is suitable with the shape size of described thermistor chip.
5. thermistor chip according to claim 1 packaging braid, it is characterised in that: described thermistor chip comprises surface metal electrode and thermal sensitive ceramics sheet, and described surface metal electrode is close to the upper and lower surface being fixed on described thermal sensitive ceramics sheet respectively.
6. thermistor chip according to claim 5 packaging braid, it is characterised in that: the surface metal electrode of described thermistor chip and the plane parallel at described load band place.
7. a thermistor chip packaging braid volume dish, it is characterised in that: comprising thermistor chip according to any one of claim 1 to 6 packaging braid and tep reel, the packaging braid of described thermistor chip is wound on described tep reel.
8. thermistor chip according to claim 7 packaging braid volume dish, it is characterised in that: described in each, thermistor chip packaging braid volume dish packaging has thermistor chip described in 4Kpcs or 8Kpcs.
9. thermistor chip according to claim 7 packaging braid volume dish, it is characterised in that: described tep reel posts the label indicating described thermistor chip quantity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521142530.6U CN205312215U (en) | 2015-12-31 | 2015-12-31 | Packing braid of thermistor chip and reel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521142530.6U CN205312215U (en) | 2015-12-31 | 2015-12-31 | Packing braid of thermistor chip and reel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205312215U true CN205312215U (en) | 2016-06-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521142530.6U Active CN205312215U (en) | 2015-12-31 | 2015-12-31 | Packing braid of thermistor chip and reel |
Country Status (1)
| Country | Link |
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| CN (1) | CN205312215U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107607859A (en) * | 2017-10-24 | 2018-01-19 | 长电科技（滁州）有限公司 | A kind of chip testing and sealing device and its technique |
| CN108128667A (en) * | 2016-12-01 | 2018-06-08 | 何政豪 | Has the intelligent reel of radio frequency identification |
| CN108839941A (en) * | 2018-07-03 | 2018-11-20 | 中山市新驰宇电子发展有限公司 | A kind of disc type resistance general assembly and its application method |
| CN110436048A (en) * | 2018-08-21 | 2019-11-12 | 青岛海威物联科技有限公司 | Electronic tag assembly, electronic tag packing device and its application method |
| CN110844324A (en) * | 2019-11-15 | 2020-02-28 | 东莞市航达电子有限公司 | FPC carrier band |
-
2015
- 2015-12-31 CN CN201521142530.6U patent/CN205312215U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108128667A (en) * | 2016-12-01 | 2018-06-08 | 何政豪 | Has the intelligent reel of radio frequency identification |
| CN107607859A (en) * | 2017-10-24 | 2018-01-19 | 长电科技（滁州）有限公司 | A kind of chip testing and sealing device and its technique |
| CN107607859B (en) * | 2017-10-24 | 2023-04-11 | 长电科技（滁州）有限公司 | Chip testing and sealing device and process thereof |
| CN108839941A (en) * | 2018-07-03 | 2018-11-20 | 中山市新驰宇电子发展有限公司 | A kind of disc type resistance general assembly and its application method |
| CN110436048A (en) * | 2018-08-21 | 2019-11-12 | 青岛海威物联科技有限公司 | Electronic tag assembly, electronic tag packing device and its application method |
| CN110844324A (en) * | 2019-11-15 | 2020-02-28 | 东莞市航达电子有限公司 | FPC carrier band |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |