CN205310565U - Accurate positioning mechanism of green wafer process - Google Patents
Accurate positioning mechanism of green wafer process Download PDFInfo
- Publication number
- CN205310565U CN205310565U CN201521051736.8U CN201521051736U CN205310565U CN 205310565 U CN205310565 U CN 205310565U CN 201521051736 U CN201521051736 U CN 201521051736U CN 205310565 U CN205310565 U CN 205310565U
- Authority
- CN
- China
- Prior art keywords
- ceramic chips
- projecting shaft
- hinge seat
- cylinder
- end hinge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
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Abstract
The utility model discloses an accurate positioning mechanism of green wafer process, the inaccurate problem in location when having solved current green wafer process. Include that the right back apex angle department of bottom surface is provided with fulcrum end hinge chain seat (four to six -tenehs) under rectangle green piece sucking disc (5), the left front apex angle department of bottom surface is provided with swing end hinge chain seat (11) under rectangle green piece sucking disc, the top of projecting shaft (10) of slope cylinder (8) is together articulated with swing end hinge chain seat, fulcrum end hinge chain seat (6) is together articulated with round pin axle (4), orientation cylinder (14) around the preceding side of bottom surface is provided with under rectangle green piece sucking disc, orientation piece (15) around being provided with on the projecting shaft of front and back orientation cylinder, orientation cylinder (12) about the left side end of bottom surface is provided with under rectangle green piece sucking disc, orientation piece (13) about being provided with on the projecting shaft of controlling the orientation cylinder. The utility model discloses simple structure, the modern design, the location is accurate.
Description
Technical field
The present invention relates to a kind of detent mechanism, add the precision positioning mechanism in man-hour particularly to a kind of ceramic chips.
Background technology
LTCC production technology, it is exactly that low-temperature co-fired ceramic powder is made green band, section molding, carry out punching on the green band of molding, hole slip casting, conductor, the technique such as resistance printing make required circuitous pattern, and multiple passive elements can be imbedded wherein, then Multi-stacking compaction is together, sinter at 900 DEG C, make the passive integration assembly of three-dimensional circuit network, may be made as the three-dimensional circuit substrate of built-in passive element, IC and active device can be mounted on its surface, make passive/active integrated functional module. Ceramic chips punching, laminate and in the production process of lamination, it is necessary to ceramic chips is accurately positioned. Existing location technology is to carry out to ceramic chips two adjacent straight arms of angle as origin reference location by two the vertical limits, location being fixed on base plate, then promotes two other vertical limit of ceramic chips to realize the location of ceramic chips with cylinder. The following problem of this localization method: when ceramic chips is sized larger than processing dimension, promotes cylinder that ceramic chips can be made to deform, thus damaging ceramic chips or affecting machining accuracy; When ceramic chips is smaller in size than processing dimension, owing to promoting interfering with each other of cylinder and positioning table, making two other vertical edges of ceramic chips can not come on origin reference location limit, thus positioning inaccurate, thus affecting machining accuracy.
Summary of the invention
The invention provides a kind of ceramic chips precision machining detent mechanism, solve existing ceramic chips and add the technical problem that man-hour, location was forbidden.
The present invention solves above technical problem by the following technical programs:
A kind of ceramic chips precision machining detent mechanism, including rectangular base, behind the right side of rectangular base, drift angle place is provided with column, the top end face of column is provided with bearing pin supporting seat, bearing pin supporting seat is provided with bearing pin, the rectangular base of the front left side of column is provided with tilt cylinders hinge seat, behind the right side of rectangle ceramic chips sucker bottom surface, drift angle place is provided with support end hinge seat, the left front drift angle place of rectangle ceramic chips sucker bottom surface is provided with swinging end hinge seat, the cylinder body bottom of tilt cylinders is hinged on tilt cylinders hinge seat, the top of the projecting shaft of tilt cylinders is hinged with swinging end hinge seat, support end hinge seat is together with hinge, front side end at rectangle ceramic chips sucker bottom surface is provided with fore-and-aft direction positioning cylinder, the projecting shaft of fore-and-aft direction positioning cylinder is provided with fore-and-aft direction locating piece, left-hand end at rectangle ceramic chips sucker bottom surface is provided with left and right directions positioning cylinder, the projecting shaft of left and right directions positioning cylinder is provided with left and right directions locating piece.
The projecting shaft of tilt cylinders is provided with spacing ring.
The present invention adopts cylinder as power drive, three rotating shafts realize the guiding to tilting action, oscillating bearing realizes the universal adjustment of sucker, limiting cylinder is pushed into the limit, location of sucker makes ceramic chips slide on two the vertical limited blocks being arranged on limiting cylinder along the sucker tilted, thus realizing being accurately positioned of ceramic chips. Present configuration is simple, novel in design, accurate positioning.
Accompanying drawing explanation
Fig. 1 is the structural representation of the present invention.
Detailed description of the invention
Below in conjunction with accompanying drawing, the present invention is described in detail:
A kind of ceramic chips precision machining detent mechanism, including rectangular base 1, behind the right side of rectangular base 1, drift angle place is provided with column 2, the top end face of column 2 is provided with bearing pin supporting seat 3, bearing pin supporting seat 3 is provided with bearing pin 4, the rectangular base 1 of the front left side of column 2 is provided with tilt cylinders hinge seat 7, behind the right side of rectangle ceramic chips sucker 5 bottom surface, drift angle place is provided with support end hinge seat 6, the left front drift angle place of rectangle ceramic chips sucker 5 bottom surface is provided with swinging end hinge seat 11, the cylinder body bottom of tilt cylinders 8 is hinged on tilt cylinders hinge seat 7, the top of the projecting shaft 10 of tilt cylinders 8 is hinged with swinging end hinge seat 11, support end hinge seat 6 is hinged with bearing pin 4, front side end at rectangle ceramic chips sucker 5 bottom surface is provided with fore-and-aft direction positioning cylinder 14, the projecting shaft of fore-and-aft direction positioning cylinder 14 is provided with fore-and-aft direction locating piece 15, left-hand end at rectangle ceramic chips sucker 5 bottom surface is provided with left and right directions positioning cylinder 12, the projecting shaft of left and right directions positioning cylinder 12 is provided with left and right directions locating piece 13.
The projecting shaft 10 of tilt cylinders 8 is provided with spacing ring 9.
The present invention passes through rectangle ceramic chips sucker with a right angle for fulcrum, another positioning straight arm of angle diagonally swung downward, it is achieved that ceramic chips slides into two positioning straight arm of angle places of rectangle ceramic chips sucker automatically, realizes being accurately positioned ceramic chips. Overcome traditional easily damage ceramic chips produced with cylinder promotion ceramic chips realization location or position problem not in place. When arranging the position of location ceramic chips, not by the impact of ceramic chips scale error. After having orientated as, ceramic chips two vertical edges therein rest on limit, two orthogonal location, and this is conducive to the stable absorption of ceramic chips and places to the accurate of next station.
Claims (2)
1. a ceramic chips precision machining detent mechanism, including rectangular base (1), behind the right side of rectangular base (1), drift angle place is provided with column (2), the top end face of column (2) is provided with bearing pin supporting seat (3), bearing pin supporting seat (3) is provided with bearing pin (4), the rectangular base (1) of the front left side of column (2) is provided with tilt cylinders hinge seat (7), it is characterized in that, behind the right side of rectangle ceramic chips sucker (5) bottom surface, drift angle place is provided with support end hinge seat (6), the left front drift angle place of rectangle ceramic chips sucker (5) bottom surface is provided with swinging end hinge seat (11), the cylinder body bottom of tilt cylinders (8) is hinged on tilt cylinders hinge seat (7), the top of the projecting shaft (10) of tilt cylinders (8) is hinged with swinging end hinge seat (11), support end hinge seat (6) is hinged with bearing pin (4), front side end at rectangle ceramic chips sucker (5) bottom surface is provided with fore-and-aft direction positioning cylinder (14), the projecting shaft of fore-and-aft direction positioning cylinder (14) is provided with fore-and-aft direction locating piece (15), left-hand end at rectangle ceramic chips sucker (5) bottom surface is provided with left and right directions positioning cylinder (12), the projecting shaft of left and right directions positioning cylinder (12) is provided with left and right directions locating piece (13).
2. a kind of ceramic chips precision machining detent mechanism according to claim 1, it is characterised in that be provided with spacing ring (9) on the projecting shaft (10) of tilt cylinders (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521051736.8U CN205310565U (en) | 2015-12-16 | 2015-12-16 | Accurate positioning mechanism of green wafer process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521051736.8U CN205310565U (en) | 2015-12-16 | 2015-12-16 | Accurate positioning mechanism of green wafer process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205310565U true CN205310565U (en) | 2016-06-15 |
Family
ID=56185261
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521051736.8U Withdrawn - After Issue CN205310565U (en) | 2015-12-16 | 2015-12-16 | Accurate positioning mechanism of green wafer process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205310565U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105437393A (en) * | 2015-12-16 | 2016-03-30 | 中国电子科技集团公司第二研究所 | Accurate positioning mechanism for green ceramic chip processing |
| CN108831855A (en) * | 2018-05-22 | 2018-11-16 | 中国电子科技集团公司第二研究所 | A kind of flexible base board dynamic positioning mechanism and localization method |
-
2015
- 2015-12-16 CN CN201521051736.8U patent/CN205310565U/en not_active Withdrawn - After Issue
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105437393A (en) * | 2015-12-16 | 2016-03-30 | 中国电子科技集团公司第二研究所 | Accurate positioning mechanism for green ceramic chip processing |
| CN105437393B (en) * | 2015-12-16 | 2017-07-14 | 中国电子科技集团公司第二研究所 | Ceramic chips precision machining detent mechanism |
| CN108831855A (en) * | 2018-05-22 | 2018-11-16 | 中国电子科技集团公司第二研究所 | A kind of flexible base board dynamic positioning mechanism and localization method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20160615 Effective date of abandoning: 20170714 |
|
| AV01 | Patent right actively abandoned |