CN205309579U - Panel laser cutting machine - Google Patents
Panel laser cutting machine Download PDFInfo
- Publication number
- CN205309579U CN205309579U CN201520968676.XU CN201520968676U CN205309579U CN 205309579 U CN205309579 U CN 205309579U CN 201520968676 U CN201520968676 U CN 201520968676U CN 205309579 U CN205309579 U CN 205309579U
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- Prior art keywords
- cutting
- laser cutting
- conveyer device
- conveying roller
- chip
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Abstract
The utility model discloses a panel laser cutting machine, including conveyor, cutting device and chip removal device, conveyor includes a plurality of conveying rollers and support frame, and the both ends of conveying roller articulate on the support frame, and the support frame is fixed subaerial, and the one end of conveying roller is fixed with the band pulley, and the band pulley passes through belt transmission, and the one end of one of them conveying roller is connected through the output shaft of shaft coupling with driving motor, and driving motor fixes on the support frame that corresponds, conveyor's one end is equipped with cutting device, and cutting device locates directly over the conveyor through the stand including cutting cantilever, cutting cantilever to it is parallel with the conveyor mesa, there is the cutting head through slider slidable mounting on the cutting cantilever, this novel simple structure, convenient to use, the cutting is accurate, the error is little, has improved effect of cutting, satisfy carry out high efficiency cutting to sheet metal class panel in, improve sheet metal class plate structure's processing property and machining precision.
Description
Technical field
This utility model relates to a kind of cutting machine, specifically a kind of plate with laser cutting machine.
Background technology
Cut is that the high power density laser bundle utilizing line focus irradiates workpiece, make irradiated material melt rapidly, vaporize, ablation or reach burning-point, blow down melt substance by the high velocity air coaxial with light beam simultaneously, thus realizing cutting open workpiece, cut belongs to one of method for hot cutting; High efficiency cutting efficiency is the main development direction of numerical control optical-fiber laser cutting machine, and high acceleration, high speed are those that have previously been the main pursuit direction of laser cutting machine high efficiency, are the raisings in laser cutting machine work efficiency amount. Amount develops into necessary corresponding matter after to a certain degree and matches, the essence of the efficient work efficiency of laser cutting machine is exactly that people-oriented, alleviates the working strength of people, saves the working time, improve the positive motility of people, and then improve the work efficiency of laser cutting machine. The clear bits of existing laser cutting machine are all manually successively expect that slag is integrated to remove, and thick and heavy iron filings bring a lot of inconvenience to cleaning.
Utility model content
The purpose of this utility model is in that to provide a kind of plate with laser cutting machine, with the problem solving to propose in above-mentioned background technology.
For achieving the above object, this utility model provides following technical scheme:
A kind of plate with laser cutting machine, including conveyer device, cutter sweep and chip removal device, described conveyer device includes multiple conveying roller and bracing frame, the two ends of conveying roller are hinged on bracing frame, bracing frame fixes on the ground, and one end of conveying roller is fixed with belt wheel, and belt wheel passes through belt transmission, one end of one of them conveying roller is connected with the output shaft of drive motor by shaft coupling, and drive motor is fixed on the bracing frame of correspondence, one end of described conveyer device is provided with cutter sweep, cutter sweep includes cutting cantilever, cutting cantilever is located at directly over conveyer device by column, and it is parallel with conveyer device table top, cutting cantilever is provided with cutting head by skid, cutting head includes locating rack, laser cutting head and gases at high pressure nozzle, locating rack is connected with slide block, laser cutting head and gases at high pressure nozzle are installed on locating rack, and gases at high pressure nozzle ring cuts axis distribution around laser cutting head, gases at high pressure nozzle-axis and laser cutting head cutting axes intersect, and intersection point is positioned on conveyer device table top, gases at high pressure nozzle is separately connected with high-pressure pump by airway, high-pressure pump separately connects with noble gas air accumulator, it is provided with chip removal device bottom described conveyer device, the end of chip removal device is communicated to the entrance of Integrated Chip bucket, chip removal device specifically includes vibration source, connecting rod and chip hopper, and vibration source connects chip hopper by connecting rod, and the port of export of chip hopper is communicated to the entrance of Integrated Chip bucket.
Further, described high-pressure pump is another and noble gas air accumulator is installed in conveyer device side.
Further, described Integrated Chip bucket is movably arranged on bracing frame.
Compared with prior art, this new structure is simple, easy to use, cutting is accurately, error is little, improve cutting effect, meet thin plate class sheet material is carried out high efficiency cutting while, separately effectively sheet material cutting face can be protected and scarfing cinder processes, metallic residue is avoided to be bonded on cutting face on the one hand, affect cutting face quality, high temperature when can effectively prevent on the other hand sheet metal because of cutting and with the oxygen generation oxidation reaction in air cause that the phenomenon that cutting accuracy and cut quality decline occurs, thus contributing to improving further processing characteristics and the machining accuracy of thin plate class plate construction.
Accompanying drawing explanation
Fig. 1 is the structural representation of plate with laser cutting machine.
Detailed description of the invention
Below in conjunction with detailed description of the invention, the technical scheme of this patent is described in more detail.
Refer to Fig. 1, a kind of plate with laser cutting machine, including conveyer device 1, cutter sweep 2 and chip removal device 3, described conveyer device 1 includes multiple conveying roller 11 and bracing frame 12, and the two ends of conveying roller 11 are hinged on bracing frame 12, and bracing frame 12 fixes on the ground, one end of conveying roller 11 is fixed with belt wheel 13, belt wheel 13 is by belt 14 transmission, and one end of one of them conveying roller 11 is connected by the output shaft of shaft coupling with drive motor 15, and drive motor 15 is fixed on the bracing frame 12 of correspondence, one end of described conveyer device 1 is provided with cutter sweep 2, cutter sweep 2 includes cutting cantilever 21, cutting cantilever 21 is located at directly over conveyer device 1 by column 22, and it is parallel with conveyer device 1 table top, cutting cantilever 21 is slidably fitted with cutting head by slide block 23, cutting head includes locating rack 24, laser cutting head 25 and gases at high pressure nozzle 26, locating rack 24 is connected with slide block 23, laser cutting head 25 and gases at high pressure nozzle 26 are installed on locating rack 24, and gases at high pressure nozzle 26 cuts axis distribution around laser cutting head 25, gases at high pressure nozzle 26 axis and laser cutting head 25 cut axes intersect, and intersection point is positioned on conveyer device 1 table top, gases at high pressure nozzle 26 is separately connected with high-pressure pump 28 by airway 27, high-pressure pump 28 separately connects with noble gas air accumulator 29, and high-pressure pump 28 is another and noble gas air accumulator 29 is installed in conveyer device 1 side, it is provided with chip removal device 3 bottom described conveyer device 1, the end of chip removal device 3 is communicated to the entrance of Integrated Chip bucket 4, chip removal device 3 specifically includes vibration source 31, connecting rod 32 and chip hopper 33, vibration source 31 connects chip hopper 33 by connecting rod 32, and the port of export of chip hopper 33 is communicated to the entrance of Integrated Chip bucket 4, vibration source 31 is specially elastic link formula structure, and it is rotated by eccentric shaft and makes connecting rod 32 end do reciprocating, evokes chip hopper 33 and does directed movement, promotes the chip in chip hopper 33 constantly to move towards the entrance of Integrated Chip bucket 4, the power of vibration source 31 output makes chip hopper 33 have low-angle reciprocally swinging, and then the vibration of the material orientation in chip hopper 33 is transmitted, the waste residue occurred when cutter sweep 2 works, owing to the reason of deadweight drops on the chip hopper 33 in chip removal device 3, by the vibration type transmission principle of chip removal device 3, all waste residues on chip hopper 33 are focused in Integrated Chip bucket 4, and then cleaning unified by the waste residue occurred when equipment is worked.
Above the better embodiment of this patent is explained in detail, but this patent is not limited to above-mentioned embodiment, in the ken that one skilled in the relevant art possesses, it is also possible under the premise without departing from this patent objective, make various change.
Claims (3)
1. a plate with laser cutting machine, including conveyer device, cutter sweep and chip removal device, it is characterized in that, described conveyer device includes multiple conveying roller and bracing frame, and the two ends of conveying roller are hinged on bracing frame, and bracing frame fixes on the ground, one end of conveying roller is fixed with belt wheel, belt wheel passes through belt transmission, and one end of one of them conveying roller is connected with the output shaft of drive motor by shaft coupling, and drive motor is fixed on the bracing frame of correspondence, one end of described conveyer device is provided with cutter sweep, cutter sweep includes cutting cantilever, cutting cantilever is located at directly over conveyer device by column, and it is parallel with conveyer device table top, cutting cantilever is provided with cutting head by skid, cutting head includes locating rack, laser cutting head and gases at high pressure nozzle, locating rack is connected with slide block, laser cutting head and gases at high pressure nozzle are installed on locating rack, and gases at high pressure nozzle ring cuts axis distribution around laser cutting head, gases at high pressure nozzle-axis and laser cutting head cutting axes intersect, and intersection point is positioned on conveyer device table top, gases at high pressure nozzle is separately connected with high-pressure pump by airway, high-pressure pump separately connects with noble gas air accumulator, it is provided with chip removal device bottom described conveyer device, the end of chip removal device is communicated to the entrance of Integrated Chip bucket, chip removal device specifically includes vibration source, connecting rod and chip hopper, and vibration source connects chip hopper by connecting rod, and the port of export of chip hopper is communicated to the entrance of Integrated Chip bucket.
2. plate with laser cutting machine according to claim 1, it is characterised in that described high-pressure pump is another and noble gas air accumulator is installed in conveyer device side.
3. plate with laser cutting machine according to claim 1, it is characterised in that described Integrated Chip bucket is movably arranged on bracing frame.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201520968676.XU CN205309579U (en) | 2015-11-27 | 2015-11-27 | Panel laser cutting machine |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201520968676.XU CN205309579U (en) | 2015-11-27 | 2015-11-27 | Panel laser cutting machine |
Publications (1)
Publication Number | Publication Date |
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CN205309579U true CN205309579U (en) | 2016-06-15 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201520968676.XU Expired - Fee Related CN205309579U (en) | 2015-11-27 | 2015-11-27 | Panel laser cutting machine |
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Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105945433A (en) * | 2016-07-08 | 2016-09-21 | 上海元阳金属制品有限公司 | Plate laser cutting equipment and method |
CN105965271A (en) * | 2016-07-04 | 2016-09-28 | 范月涵 | Laser cutting equipment capable of continuously processing sheet metal strip |
CN106001931A (en) * | 2016-07-21 | 2016-10-12 | 张家港市旭骏机械部件有限公司 | Multipoint marking device on arc workpiece |
CN106216853A (en) * | 2016-08-25 | 2016-12-14 | 张美华 | High-speed laser board separator |
CN106624375A (en) * | 2016-11-16 | 2017-05-10 | 亚太绿建(北京)科技集团有限公司 | Intelligent omnibearing laser cutting working station |
CN107803597A (en) * | 2017-09-11 | 2018-03-16 | 天津龙驰机械制造股份有限公司 | A kind of laser cutting device |
CN107900531A (en) * | 2017-11-13 | 2018-04-13 | 安徽奥锐智能科技有限公司 | A kind of cutting bed of optical-fiber laser cutting machine |
CN108687603A (en) * | 2018-05-25 | 2018-10-23 | 芜湖拓达电子科技有限公司 | A kind of grinding device of polishing glass end face |
CN109202306A (en) * | 2018-11-26 | 2019-01-15 | 王志超 | A kind of plate with laser saw component lifting apparatus |
CN109940286A (en) * | 2018-07-24 | 2019-06-28 | 江西普热斯勒先进成型技术有限公司 | Full-automatic uncoiling is cut by laser production line |
CN111014984A (en) * | 2019-12-25 | 2020-04-17 | 中建科工集团有限公司 | Laser cutting machine bed-jig slag clearing device |
CN113857659A (en) * | 2021-11-04 | 2021-12-31 | 武汉市工程科学技术研究院 | Laser cutting device |
CN113857659B (en) * | 2021-11-04 | 2024-05-31 | 武汉市工程科学技术研究院 | Laser cutting device |
-
2015
- 2015-11-27 CN CN201520968676.XU patent/CN205309579U/en not_active Expired - Fee Related
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105965271A (en) * | 2016-07-04 | 2016-09-28 | 范月涵 | Laser cutting equipment capable of continuously processing sheet metal strip |
CN105945433A (en) * | 2016-07-08 | 2016-09-21 | 上海元阳金属制品有限公司 | Plate laser cutting equipment and method |
CN106001931A (en) * | 2016-07-21 | 2016-10-12 | 张家港市旭骏机械部件有限公司 | Multipoint marking device on arc workpiece |
CN106216853A (en) * | 2016-08-25 | 2016-12-14 | 张美华 | High-speed laser board separator |
CN106624375A (en) * | 2016-11-16 | 2017-05-10 | 亚太绿建(北京)科技集团有限公司 | Intelligent omnibearing laser cutting working station |
CN106624375B (en) * | 2016-11-16 | 2018-09-14 | 亚太绿建(北京)科技集团有限公司 | A kind of intelligent omnibearing laser cutting work station |
CN107803597A (en) * | 2017-09-11 | 2018-03-16 | 天津龙驰机械制造股份有限公司 | A kind of laser cutting device |
CN107900531A (en) * | 2017-11-13 | 2018-04-13 | 安徽奥锐智能科技有限公司 | A kind of cutting bed of optical-fiber laser cutting machine |
CN108687603A (en) * | 2018-05-25 | 2018-10-23 | 芜湖拓达电子科技有限公司 | A kind of grinding device of polishing glass end face |
CN108687603B (en) * | 2018-05-25 | 2020-05-01 | 安徽国隆玻璃科技有限公司 | Polishing device for polishing glass end face |
CN109940286A (en) * | 2018-07-24 | 2019-06-28 | 江西普热斯勒先进成型技术有限公司 | Full-automatic uncoiling is cut by laser production line |
CN109940286B (en) * | 2018-07-24 | 2023-05-16 | 江西普热斯勒先进成型技术有限公司 | Full-automatic uncoiling laser cutting production line |
CN109202306A (en) * | 2018-11-26 | 2019-01-15 | 王志超 | A kind of plate with laser saw component lifting apparatus |
CN109202306B (en) * | 2018-11-26 | 2020-08-25 | 郑州力锋自动化设备有限公司 | Workpiece lifting device of plate laser cutting machine |
CN111014984A (en) * | 2019-12-25 | 2020-04-17 | 中建科工集团有限公司 | Laser cutting machine bed-jig slag clearing device |
CN113857659A (en) * | 2021-11-04 | 2021-12-31 | 武汉市工程科学技术研究院 | Laser cutting device |
CN113857659B (en) * | 2021-11-04 | 2024-05-31 | 武汉市工程科学技术研究院 | Laser cutting device |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160615 Termination date: 20171127 |
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CF01 | Termination of patent right due to non-payment of annual fee |