CN205291765U - Aluminum base copper -clad laminate (CCL) - Google Patents
Aluminum base copper -clad laminate (CCL) Download PDFInfo
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- CN205291765U CN205291765U CN201520875748.6U CN201520875748U CN205291765U CN 205291765 U CN205291765 U CN 205291765U CN 201520875748 U CN201520875748 U CN 201520875748U CN 205291765 U CN205291765 U CN 205291765U
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Abstract
The utility model discloses an aluminum base copper -clad laminate (CCL). This aluminum base copper -clad laminate (CCL) includes: release film layer aluminum plate layer on the release film layer high heat conduction bonding sheet on the aluminum plate layer copper foil layer on the high heat conduction bonding sheet, wherein high heat conduction bonding sheet is turned into the liquid state and solidifies under the vacuum environment high pressure effect along with the rising of temperature under the highly compressed vacuum environment of high temperature by solid state. The utility model provides a technical scheme can satisfy the requirement of high -termal conductivity ability and high voltage withstanding performance.
Description
Technical field
This utility model belongs to wiring board manufacturing technology field, is specifically related to a kind of aluminum-based copper-clad plate.
Background technology
PCB(PrintedCircuitBoard, printed substrate) it is indispensable part in various electronic device. In wiring board, having one is ultra-thin aluminum-based copper-clad plate. The production method of existing ultra-thin aluminum-based copper-clad plate, what current industry was commonly used is use flexible PCB material material is covered film structure.
But, if using flexible PCB material material is covered film structure, shortcoming can be served by band, for instance high thermal conductivity and high voltage withstanding performance cannot be met, when namely cannot meet circuit work, produced heat transmission punctures requirement with high voltage withstanding.
Summary of the invention
Technical problem to be solved in the utility model is to provide a kind of aluminum-based copper-clad plate, can meet high thermal conductivity and the requirement of high voltage withstanding performance.
The technical scheme that this utility model provides is as follows:
This utility model provides a kind of aluminum-based copper-clad plate, including:
Release film layer, the aluminum layer on described release film layer, the high conducting adhesive sheet on described aluminum layer, copper foil layer on described high conducting adhesive sheet;
Wherein said high conducting adhesive sheet under the vacuum environment of High Temperature High Pressure along with the rising of temperature is solidified for liquid and under vacuum environment high pressure effect by solid state transformed.
Optionally, the thickness of described aluminum layer is 0.1mm-0.2mm, and described aluminum layer carries out the thickness after anodized more than 2.5 ��m.
Can be seen that from technique scheme, the ultra-thin aluminum-based copper-clad plate that this utility model produces, adopting has the high conducting adhesive sheet of high-termal conductivity to suppress, high conducting adhesive sheet has heat conductivity height, it is tightly combined, good insulation preformance, the feature of stable physical property, in bonding processes, high conducting adhesive sheet under the vacuum environment of High Temperature High Pressure along with the rising of temperature, solidified for liquid and under vacuum environment high pressure effect by solid state transformed, hence in so that the ultra-thin aluminum-based copper-clad plate produced, there is high thermal conductivity and high voltage withstanding performance, wiring board PCB is made operationally can effectively to carry out heat transmission, and good edge can be played and high voltage withstanding.
Accompanying drawing explanation
In order to be illustrated more clearly that this utility model embodiment or technical scheme of the prior art, the accompanying drawing used required in embodiment or description of the prior art will be briefly described below, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the premise not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Below in conjunction with accompanying drawing, this utility model is described further, in accompanying drawing:
Fig. 1 is the vacuum pressing-combining structural representation of ultra-thin aluminum-based copper-clad plate of the present utility model;
Fig. 2 is the structural representation of aluminum-based copper-clad plate of the present utility model;
Fig. 3 is ultra-thin aluminum-based copper-clad plate production method first pass schematic diagram of the present utility model;
Fig. 4 is ultra-thin aluminum-based copper-clad plate production method second procedure schematic diagram of the present utility model.
Detailed description of the invention
Below in conjunction with the accompanying drawing in this utility model embodiment, the technical scheme in this utility model embodiment is clearly and completely described, it is clear that described embodiment is only a part of embodiment of this utility model, rather than whole embodiments. Based on the embodiment in this utility model, all other embodiments that those of ordinary skill in the art obtain under not making creative work premise, broadly fall into the scope of this utility model protection.
This utility model provides a kind of ultra-thin aluminum-based copper-clad plate vacuum pressing-combining structure and aluminum-based copper-clad plate, can meet high thermal conductivity and the requirement of high voltage withstanding performance.
Below in conjunction with accompanying drawing, of the present utility model content is discussed in detail.
Fig. 1 is the vacuum pressing-combining structural representation of ultra-thin aluminum-based copper-clad plate of the present utility model.
The vacuum pressing-combining structure of ultra-thin aluminum-based copper-clad plate of the present utility model, vacuum pressing-combining structure sets gradually mirror steel plate 10, mould release membrance 11, super thin aluminum sheet 12, high conducting adhesive sheet 13, Copper Foil 14, mirror steel plate 10 from top to bottom.
Wherein, described Copper Foil can be rolled copper foil. Super thin aluminum sheet can be designed as 0.1mm-0.2mm. As required aluminum face is carried out anodized and overlap, pressing. In bonding processes, high conducting adhesive sheet along with the rising of temperature, is solidified for liquid and under vacuum environment high pressure effect by solid state transformed under the vacuum environment of High Temperature High Pressure. High conducting adhesive sheet has heat conductivity height, is tightly combined, the feature of good insulation preformance, stable physical property, can be converted into glass form when high temperature TG value reaches 140 DEG C, therefore electrical property and physical and chemical performance all be had higher resistance. This pressing mode of employing of the present utility model effectively solves the problem that the ultra-thin aluminum of high heat conduction cannot normally produce.
Fig. 2 is the structural representation of aluminum-based copper-clad plate of the present utility model.
As in figure 2 it is shown, this utility model also provides for a kind of aluminum-based copper-clad plate, including:
Release film layer 20, the aluminum layer 21 on described release film layer 20, the high conducting adhesive lamella 22 on described aluminum layer 21, copper foil layer 23 on described high conducting adhesive lamella 22;
Wherein said high conducting adhesive lamella under the vacuum environment of High Temperature High Pressure along with the rising of temperature is solidified for liquid and under vacuum environment high pressure effect by solid state transformed. The thickness of described aluminum layer is 0.1mm-0.2mm, and described aluminum layer carries out the thickness after anodized more than 2.5 ��m.
Fig. 3 is ultra-thin aluminum-based copper-clad plate production method first pass schematic diagram of the present utility model.
As it is shown on figure 3, include:
Step 301, aluminium sheet is carried out anodized.
Step 302, it is sequentially placed mirror steel plate, mould release membrance, aluminium sheet, high conducting adhesive sheet, Copper Foil, mirror steel plate from the bottom up.
This step includes: spread a mould release membrance at mirror steel plate, a folded aluminium sheet on mould release membrance, places a high conducting adhesive sheet, tightens to be placed with at high conducting adhesive sheet and put a Copper Foil, place a mirror steel plate on Copper Foil on aluminium sheet.
Described high conducting adhesive sheet can for thermally conductive resin prepreg that resin content is 50%-60%; Described Copper Foil can be rolled copper foil.
Step 303, cover cover plate send into vacuum pressing-combining machine carry out vacuum pressing-combining after obtain ultra-thin aluminum-based copper-clad plate.
The pressing-in temp carrying out vacuum pressing-combining described in this step is 190 DEG C��210 DEG C, and pressure requirements is 400-600psi, and hot pressing time is 2 hours, and the time of colding pressing is 1 hour; In bonding processes, described high conducting adhesive sheet under the vacuum environment of High Temperature High Pressure along with the rising of temperature is solidified for liquid and under vacuum environment high pressure effect by solid state transformed.
Fig. 4 is ultra-thin aluminum-based copper-clad plate production method second procedure schematic diagram of the present utility model. Fig. 4 describe in more detail this utility model scheme relative to Fig. 3.
As shown in Figure 4, including:
Step 401, aluminium sheet is carried out anodized.
Because aluminium sheet is ultra-thin, need to carrying out anodized, anodized thickness generally requires more than 2.5 ��m. Super thin aluminum sheet can be designed as 0.1mm-0.2mm.
Step 402, the aluminium sheet after carrying out anodized is carried out process.
In this step, the aluminium sheet that anodized is good need to carry out oil removing cleaning, removes plate face organic impurities. Through horizontal processing machine, aluminium sheet is carried out.
Step 403, aluminium sheet is dried.
This step is dried temperature and is controlled at 85 DEG C-95 DEG C, and speed is 2.5 ms/min.
Step 404, fold in advance by predetermined hierarchy structure.
The mirror steel plate that cleaning is clean carries out lamination operation. Mirror steel plate first spreads a mould release membrance, a folded super thin aluminum sheet on mould release membrance, aluminium sheet is placed a high conducting adhesive sheet, high conducting adhesive sheet tightens to be placed with puts a Copper Foil, Copper Foil is placed a clean mirror steel plate of cleaning, repeats step 304. Copper Foil can be rolled copper foil.
High conducting adhesive sheet used by this step can for thermally conductive resin prepreg that resin content is 50%-60%.
Step 405, carry out pressing, obtain the ultra-thin aluminum-based copper-clad plate after pressing.
The aluminium sheet structure sheaf folded is covered steel plate cover plate by this step, goes to vacuum pressing-combining machine. Pressing-in temp is 190 DEG C��210 DEG C, pressure requirements 400-600psi(Poundspersquareinch, pound/square inch), hot pressing time 2 hours, cold pressing 1 hour time.
Step 406, the ultra-thin aluminum-based copper-clad plate after pressing is torn open plate, cutting edge and pasting protective film.
Undertaken tearing plate operation open by the ultra-thin aluminum-based copper-clad plate after having colded pressing, need double 4 handss to operate together during operation, it is prevented that bending as far as possible. Then on request the edges of boards of ultra-thin aluminum-based copper-clad plate are carried out cutting, the aluminum face of ultra-thin aluminum-based copper-clad plate is carried out pasting protective film. Finally, reexamine the sheet material of the ultra-thin aluminum-based copper-clad plate suppressed with or without folding line and other bad problems, as no problem then can shipment.
In sum, this utility model adopts has the high conducting adhesive sheet of high-termal conductivity to suppress, high conducting adhesive sheet has heat conductivity height, it is tightly combined, good insulation preformance, the feature of stable physical property, in bonding processes, high conducting adhesive sheet under the vacuum environment of High Temperature High Pressure along with the rising of temperature, solidified for liquid and under vacuum environment high pressure effect by solid state transformed, hence in so that the ultra-thin aluminum-based copper-clad plate produced, there is high thermal conductivity and high voltage withstanding performance, wiring board PCB is made operationally can effectively to carry out heat transmission, and good edge can be played and high voltage withstanding.The ultra-thin aluminum-based copper-clad plate that this utility model produces, it is possible to the heat conductivity of PCB is accomplished 1.5W/2W/3W, proof voltage can reach exchange (AC) more than 2000V, therefore meets high thermal conductivity and the requirement of high voltage withstanding performance.
The technical scheme above this utility model embodiment provided, it is described in detail, principle of the present utility model and embodiment are set forth by specific case used herein, and the explanation of above example is only intended to help to understand method of the present utility model and core concept thereof; Simultaneously for one of ordinary skill in the art, according to thought of the present utility model, all will change in specific embodiments and applications, in sum, this specification content should not be construed as restriction of the present utility model.
Claims (2)
1. an aluminum-based copper-clad plate, it is characterised in that including:
Release film layer, the aluminum layer on described release film layer, the high conducting adhesive lamella on described aluminum layer, copper foil layer on described high conducting adhesive lamella;
Wherein said high conducting adhesive lamella under the vacuum environment of High Temperature High Pressure along with the rising of temperature is solidified for liquid and under vacuum environment high pressure effect by solid state transformed.
2. aluminum-based copper-clad plate according to claim 1, it is characterised in that: the thickness of described aluminum layer is 0.1mm-0.2mm, and described aluminum layer carries out the thickness after anodized more than 2.5 ��m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520875748.6U CN205291765U (en) | 2015-11-05 | 2015-11-05 | Aluminum base copper -clad laminate (CCL) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520875748.6U CN205291765U (en) | 2015-11-05 | 2015-11-05 | Aluminum base copper -clad laminate (CCL) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205291765U true CN205291765U (en) | 2016-06-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520875748.6U Expired - Fee Related CN205291765U (en) | 2015-11-05 | 2015-11-05 | Aluminum base copper -clad laminate (CCL) |
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| Country | Link |
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| CN (1) | CN205291765U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105196645A (en) * | 2015-11-05 | 2015-12-30 | 惠州市煜鑫达科技有限公司 | Production method of ultra-thin aluminum based copper-clad plate, vacuum laminating structure and aluminum based copper-clad plate |
| CN106163097A (en) * | 2016-08-31 | 2016-11-23 | 珠海市联健电子科技有限公司 | A kind of anti-creeping aluminium base and method thereof |
| US20220201835A1 (en) * | 2020-12-22 | 2022-06-23 | Wanjiong Lin | Circuit Board and a Driving Power Supply with the Circuit Board Thereof |
-
2015
- 2015-11-05 CN CN201520875748.6U patent/CN205291765U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105196645A (en) * | 2015-11-05 | 2015-12-30 | 惠州市煜鑫达科技有限公司 | Production method of ultra-thin aluminum based copper-clad plate, vacuum laminating structure and aluminum based copper-clad plate |
| CN106163097A (en) * | 2016-08-31 | 2016-11-23 | 珠海市联健电子科技有限公司 | A kind of anti-creeping aluminium base and method thereof |
| CN106163097B (en) * | 2016-08-31 | 2018-11-09 | 珠海市联健电子科技有限公司 | A kind of anticreep aluminum substrate and its method |
| US20220201835A1 (en) * | 2020-12-22 | 2022-06-23 | Wanjiong Lin | Circuit Board and a Driving Power Supply with the Circuit Board Thereof |
| US11778723B2 (en) * | 2020-12-22 | 2023-10-03 | Self Electronics Co., Ltd. | Circuit board and a driving power supply with the circuit board thereof |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160608 Termination date: 20201105 |
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| CF01 | Termination of patent right due to non-payment of annual fee |