CN205282471U - Integrated circuit package structure - Google Patents
Integrated circuit package structure Download PDFInfo
- Publication number
- CN205282471U CN205282471U CN201521134878.0U CN201521134878U CN205282471U CN 205282471 U CN205282471 U CN 205282471U CN 201521134878 U CN201521134878 U CN 201521134878U CN 205282471 U CN205282471 U CN 205282471U
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- pad
- integrated circuit
- unicircuit
- face
- weld
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Abstract
The utility model provides a be convenient for discern the integrated circuit package structure of integrated circuit direction, including the integrated circuit body, the face of weld of integrated circuit body is equipped with a plurality of pads, the face of weld is used for wiring and welding, the pad is extended to the face of weld by the side of integrated circuit body, a plurality of pads are including treating the mark pad, treat that mark pad one side is equipped with identification mark, identification mark's diameter or circumscribed circle diameter are 0.5~3.5mm, identification mark and the distance of treating the mark pad are more than 0.5mm. The utility model has the advantages of set up polarity identification mark on one of them pad (treating the mark pad) of integrated circuit body, can make the chip mounter according to this identification mark's position automatic identification integrated circuit's direction, accurate paste the dress on the mainboard with integrated circuit, be unlikely to to influence simultaneously integrated circuit's function again.
Description
Technical field
The utility model relates to integrated circuit fields, specifically a kind of integrated circuit package structure.
Background technology
During the integrated circuit modules of electron trade encapsulates, the electric performance test point of terminal (pad) and particular requirement is normally welded in the bottom face of welding, and require fully not consider in producing, in production, whether in the right direction unicircuit attachment is mainly relies on the artificial surface after mounting to check that whether polarity is correct, cause unicircuit once attachment direction mistake hand inspection out or electric-examination find all to have caused established fact, maintenance can cause two injuries to unicircuit and mainboard.
Practical novel content
Technical problem to be solved in the utility model is: provide a kind of integrated circuit package structure being convenient to recognition integrated circuit direction.
In order to solve the problems of the technologies described above, the technical solution adopted in the utility model is: a kind of integrated circuit package structure, comprise unicircuit body, the face of weld of described unicircuit body is provided with multiple pad, described face of weld is used for wiring and welding, described pad is extended to face of weld by the side of unicircuit body, described multiple pad comprises pad to be marked, described pad side to be marked is provided with identification marking, the diameter of described identification marking or circumscribed circle diameter are 0.5��3.5mm, and the distance of described identification marking and pad to be marked is at more than 0.5mm.
Further, described identification marking is copper sheet.
Further, described identification marking is circle, trilateral, square, rhombus or cruciform.
Further, described face of weld is rectangle, and described pad to be marked is face of weld wherein first pad on a limit.
Further, pruned in one of them angle of described unicircuit body.
Further, described pad is " recessed " font on face of weld, and inwardly caves in the limit that the limit with unicircuit body of described pad overlaps.
Further, the distance between every two pads is 0.5��1.5mm, and the width of described pad is 0.5��0.7mm, and the length of described pad is 0.7��1.5mm.
Further, also comprising screening cover, the part face of described unicircuit body is provided with components and parts, and described screening cover is buckled on unicircuit body and covers components and parts.
The beneficial effects of the utility model are: arrange polarity identification mark on one of them pad (pad to be marked) of unicircuit body, the diameter of identification marking or circumscribed circle diameter are 0.5��3.5mm, the distance of described identification marking and pad to be marked is at more than 0.5mm, chip mounter can be made according to the direction of the automatic recognition integrated circuit in the position of this identification marking, accurately unicircuit is mounted on mainboard, it is unlikely to affect again the function of unicircuit simultaneously.
Accompanying drawing explanation
Fig. 1 is the structural representation of the utility model embodiment integrated circuit package structure.
Fig. 2 is the A place enlarged view of Fig. 1.
Fig. 3 is the structural representation of the utility model embodiment integrated circuit package structure.
Fig. 4 is the structural representation of the utility model embodiment integrated circuit package structure.
Label illustrates:
1, unicircuit body; 11, face of weld; 111, pad to be marked; 112, identification marking; 12, part face; 2, screening cover.
Embodiment
By technology contents of the present utility model being described in detail, is realized object and effect, below in conjunction with enforcement mode and coordinate accompanying drawing to be explained.
The design of the utility model most critical is: arrange polarity identification mark on one of them pad (pad to be marked) of unicircuit body, chip mounter can be made according to the direction of the automatic recognition integrated circuit in the position of this identification marking, accurately unicircuit is mounted on mainboard.
Please refer to Fig. 1 to Fig. 4, a kind of integrated circuit package structure, comprise unicircuit body 1, the face of weld 11 of described unicircuit body is provided with multiple pad, described face of weld is used for wiring and welding, described pad is extended to face of weld by the side of unicircuit body, described multiple pad comprises pad 111 to be marked, described pad side to be marked is provided with identification marking 112, the diameter of described identification marking or circumscribed circle diameter are 0.5��3.5mm, and the distance of described identification marking and pad to be marked is at more than 0.5mm.
From foregoing description, the beneficial effects of the utility model are: arrange polarity identification mark on one of them pad (pad to be marked) of unicircuit body, the diameter of identification marking or circumscribed circle diameter are 0.5��3.5mm, the distance of described identification marking and pad to be marked is at more than 0.5mm, chip mounter can be made according to the direction of the automatic recognition integrated circuit in the position of this identification marking, accurately unicircuit is mounted on mainboard, it is unlikely to affect again the function of unicircuit simultaneously.
Further, described identification marking is copper sheet.
Seen from the above description, above-mentioned identification marking can adopt and cover the mode that copper windows and obtain, it is not necessary to be welded on face of weld in addition.
Further, described identification marking is circle, trilateral, square, rhombus or cruciform.
Seen from the above description, identification marking is set to circle, trilateral, square, rhombus or cruciform, identification marking can be made to be easy to identify.
Further, described face of weld is rectangle, and described pad to be marked is face of weld wherein first pad on a limit.
Seen from the above description, near first pad identification marking being arranged on face of weld limit, chip mounter identification can be convenient to.
Further, pruned in one of them angle of described unicircuit body.
Seen from the above description, pruned in one of them angle of unicircuit body, it is preferable that, being pruned in an angle of the close identification marking of unicircuit body, is convenient to chip mounter and is identified in the attachment direction of unicircuit.
Further, described pad is " recessed " font on face of weld, and inwardly caves in the limit that the limit with unicircuit body of described pad overlaps.
Further, the distance between every two pads is 0.5��1.5mm, and the width of described pad is 0.5��0.7mm, and the length of described pad is 0.7��1.5mm.
Further, also comprising screening cover 2, the part face 12 of described unicircuit body is provided with components and parts, and described screening cover is buckled on unicircuit body and covers components and parts.
Seen from the above description, covered by screening cover above components and parts, can prevent dust from entering unicircuit.
Further, described identification marking is provided with multiple, and the distance between every two identification markings is greater than 5mm.
Please refer to Fig. 1 to Fig. 4, embodiment of the present utility model is: a kind of integrated circuit package structure, comprise unicircuit body 1, the face of weld 11 of described unicircuit body is provided with multiple pad, described face of weld is used for wiring and welding, described pad is extended to face of weld by the side of unicircuit body, described multiple pad comprises pad 111 to be marked, described pad side to be marked is provided with identification marking 112, the diameter of described identification marking or circumscribed circle diameter are 0.5mm, and the distance of described identification marking and pad to be marked is at more than 0.5mm. Described identification marking is copper sheet. Described identification marking is equilateral triangle. Described face of weld is the length of side is the square of 41.0mm, and described pad to be marked is face of weld wherein first pad on a limit, is pruned in an angle of the close identification marking of unicircuit body. Described pad is " recessed " font on face of weld, and inwardly caves in the limit that the limit with unicircuit body of described pad overlaps. Distance between every two pads is 1.0mm, and the width of described pad is 0.6mm, and the length of described pad is 1.0mm. Said integrated circuit encapsulation structure also comprises screening cover 2, the part face 12 of described unicircuit body is provided with components and parts, described screening cover is buckled on unicircuit body and covers components and parts, and wherein the thickness of unicircuit body is 1.0mm, and the height of screening cover is 1.8mm.
Certainly, described identification marking can also be circular, square, rhombus or cruciform. Distance between every two pads can be the arbitrary value in 0.5��1.5mm, and the width of described pad can be the arbitrary value in 0.5��0.7mm, and the length of described pad can be the arbitrary value in 0.7��1.5mm. The thickness of unicircuit body can be the arbitrary value in 1.0��1.2mm, and the height of screening cover can be the arbitrary value in 1.6��2.0mm.
In sum, the useful effect of the integrated circuit package structure that the utility model provides is: arrange polarity identification mark on one of them pad (pad to be marked) of unicircuit body, the diameter of identification marking or circumscribed circle diameter are 0.5��3.5mm, the distance of described identification marking and pad to be marked is at more than 0.5mm, chip mounter can be made according to the direction of the automatic recognition integrated circuit in the position of this identification marking, accurately unicircuit is mounted on mainboard, it is unlikely to affect again the function of unicircuit simultaneously; Above-mentioned identification marking can adopt to be covered the mode that copper windows and obtains, it is not necessary to is welded on face of weld in addition, decreases operation; Near first pad identification marking being arranged on face of weld limit, pruned in an angle of the close identification marking of unicircuit body, is convenient to chip mounter and is identified in the attachment direction of unicircuit; The part face of unicircuit body is provided with screening cover, can prevent dust from entering unicircuit. The utility model integrated circuit package structure makes in production process not affect again its electric property because 90-degree rotation causes the situation of component failure to obtain comparatively good solution, and in subsequent production process, such production inefficacy can be effectively reduced.
The foregoing is only embodiment of the present utility model; not thereby patent scope of the present utility model is limited; every equivalents utilizing the utility model specification sheets and accompanying drawing content to do; or directly or indirectly it is used in relevant technical field, all it is included in scope of patent protection of the present utility model with reason.
Claims (8)
1. an integrated circuit package structure, it is characterized in that: comprise unicircuit body, the face of weld of described unicircuit body is provided with multiple pad, described face of weld is used for wiring and welding, described pad is extended to face of weld by the side of unicircuit body, and described multiple pad comprises pad to be marked, and described pad side to be marked is provided with identification marking, the diameter of described identification marking or circumscribed circle diameter are 0.5��3.5mm, and the distance of described identification marking and pad to be marked is at more than 0.5mm.
2. integrated circuit package structure according to claim 1, it is characterised in that: described identification marking is copper sheet.
3. integrated circuit package structure according to claim 1, it is characterised in that: described identification marking is circle, trilateral, square, rhombus or cruciform.
4. integrated circuit package structure according to claim 1, it is characterised in that: described face of weld is rectangle, and described pad to be marked is face of weld wherein first pad on a limit.
5. integrated circuit package structure according to claim 1, it is characterised in that: pruned in one of them angle of described unicircuit body.
6. integrated circuit package structure according to claim 1, it is characterised in that: described pad is " recessed " font on face of weld, and inwardly caves in the limit that the limit with unicircuit body of described pad overlaps.
7. integrated circuit package structure according to claim 1, it is characterised in that: the distance between every two pads is 0.5��1.5mm, and the width of described pad is 0.5��0.7mm, and the length of described pad is 0.7��1.5mm.
8. integrated circuit package structure according to claim 1, it is characterised in that: also comprising screening cover, the part face of described unicircuit body is provided with components and parts, and described screening cover is buckled on unicircuit body and covers components and parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521134878.0U CN205282471U (en) | 2015-12-30 | 2015-12-30 | Integrated circuit package structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521134878.0U CN205282471U (en) | 2015-12-30 | 2015-12-30 | Integrated circuit package structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205282471U true CN205282471U (en) | 2016-06-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521134878.0U Active CN205282471U (en) | 2015-12-30 | 2015-12-30 | Integrated circuit package structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205282471U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110475429A (en) * | 2018-05-10 | 2019-11-19 | Oppo广东移动通信有限公司 | Semiconductor element and chip mounter, patch system |
-
2015
- 2015-12-30 CN CN201521134878.0U patent/CN205282471U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110475429A (en) * | 2018-05-10 | 2019-11-19 | Oppo广东移动通信有限公司 | Semiconductor element and chip mounter, patch system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |