CN205248307U - Dark purple outer LED packaging structure - Google Patents

Dark purple outer LED packaging structure Download PDF

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Publication number
CN205248307U
CN205248307U CN201520904014.6U CN201520904014U CN205248307U CN 205248307 U CN205248307 U CN 205248307U CN 201520904014 U CN201520904014 U CN 201520904014U CN 205248307 U CN205248307 U CN 205248307U
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CN
China
Prior art keywords
deep ultraviolet
seal chamber
silica gel
ultraviolet led
oxygen
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201520904014.6U
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Chinese (zh)
Inventor
吕天刚
王跃飞
李坤锥
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongli Zhihui Group Co Ltd
Original Assignee
Guangzhou Hongli Tronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority to CN201520904014.6U priority Critical patent/CN205248307U/en
Application granted granted Critical
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Abstract

The utility model provides a dark purple outer LED packaging structure, includes seal chamber and locates dark purple outer LED in the seal chamber, seal chamber's inner wall is equipped with the organosilicon glue film. Silica gel is a high activity adsorption material, belongs to the amorphous substance, does not take place the reaction with any material except that alkali, hydrofluoric acid, and water insoluble and any solvent is nontoxic tasteless, chemical properties stabilization, the utility model discloses utilize silica gel the adsorptivity can, add dark purple outer LED packaging structure with it in, can absorb encapsulating the oxygen that seal up up for safekeeping in seal chamber after the completion absorb oxygen because silica gel passes through absorption pattern, so its speed of absorbing oxygen is very fast, the cost of silica gel is relatively low, adds the simple process on silica gel layer moreover in seal chamber.

Description

A kind of deep ultraviolet LED encapsulating structure
Technical field
The utility model relates to LED field, especially a kind of deep ultraviolet LED encapsulating structure.
Background technology
One of them requirement of the encapsulation of deep ultraviolet LED is deep ultraviolet LED need to be placed in the environment of sealing anaerobic. Under existing encapsulation condition, be subject to the restriction of environment or the restriction of sealed in unit, can not accomplish to encapsulate complete anaerobic in cavity, so after deep ultraviolet LED has encapsulated, always in the cavity of encapsulation, there is a small amount of oxygen, these oxygen are by ultraviolet long-term irradiation meeting ozonize, and ozone can cause the light decay of LED, accelerates the aging of LED. For removing the oxygen in encapsulation cavity, a kind of organic light-emitting diode packaging structure and display unit that prior art is 104269497 as China Patent Publication No., wherein this encapsulating structure comprises: an Organic Light Emitting Diode substrate, and Organic Light Emitting Diode substrate surface is provided with organic light emitting diode device; One base plate for packaging, base plate for packaging surface is provided with the active metal rete for absorbing the inner oxygen of encapsulating structure; The edge of Organic Light Emitting Diode substrate and base plate for packaging is bonding fixing to form annular seal space, You Jifa by fluid sealant
Optical diode device and described active metal rete are positioned at annular seal space, and active metal rete absorbs residual in annular seal space or the outside oxygen infiltrating. This technology is used for OLED, and is on base plate for packaging, to be provided with metal level, and the formation technique of metallic diaphragm is relatively complicated, and from material and technique, the cost of increase is more; Metallic diaphragm is by absorbing oxygen with oxygen chemical reaction in addition, and this chemical reaction needs long process the oxygen in encapsulation cavity could be absorbed completely.
Summary of the invention
Technical problem to be solved in the utility model is to provide a kind of deep ultraviolet LED encapsulating structure, can absorb the oxygen in seal chamber, and packaging cost is relatively low, and technique is simple, and the speed of absorption oxygen is relatively very fast.
For solving the problems of the technologies described above, the technical solution of the utility model is: a kind of deep ultraviolet LED encapsulating structure, comprises seal chamber and be located at the deep ultraviolet LED in described seal chamber; It is characterized in that: the inwall of described seal chamber is provided with organosilicon glue-line. Silica gel is a kind of high activity material, belongs to amorphous substance, except highly basic, hydrofluoric acid, do not react with any material, and water insoluble and any solvent, nonpoisonous and tasteless, stable chemical nature; The utility model utilizes the absorption property of silica gel, is joined in deep ultraviolet LED encapsulating structure, after encapsulation can being completed, seal the oxygen absorption in seal chamber up for safekeeping, because silica gel absorbs oxygen by suction type, so it absorbs the speed of oxygen; The cost of silica gel is relatively low, and in seal chamber, adds the technique of silica gel layer simple.
As improvement, described seal chamber by LED substrate, be located on described LED substrate and the transparent cover plate that surrounds the box dam of described deep ultraviolet LED and cover described box dam top forms.
As improvement, described deep ultraviolet LED is located on described LED substrate, and described organosilicon glue-line is located on described LED substrate, and organosilicon glue-line is provided with the hole of dodging of passing through for deep ultraviolet LED.
As improvement, described deep ultraviolet LED is located on described LED substrate, and described deep ultraviolet LED is located on described LED substrate, and described organosilicon glue-line is coated on LED substrate and is positioned at the surrounding position of described deep ultraviolet LED.
As improvement, described LED substrate and box dam are integrated, and can adopt ceramic substrate or metal substrate.
As improvement, described organosilicon glue-line is provided with some perforation, increases the adsorption area of organosilicon glue-line.
As improvement, described organosilicon glue-line is fixed by UV glue.
The beneficial effect that the utility model compared with prior art brought is:
The utility model utilizes the absorption property of silica gel, is joined in deep ultraviolet LED encapsulating structure, after encapsulation can being completed, seal the oxygen absorption in seal chamber up for safekeeping, because silica gel absorbs oxygen by suction type, so it absorbs the speed of oxygen; The cost of silica gel is relatively low, and in seal chamber, adds the technique of silica gel layer simple.
Brief description of the drawings
Fig. 1 is the utility model cutaway view.
Detailed description of the invention
Below in conjunction with Figure of description, the utility model is described in further detail.
As shown in Figure 1, a kind of deep ultraviolet LED encapsulating structure, comprises seal chamber 4 and is located at the deep ultraviolet LED6 in described seal chamber 4, the inwall of described seal chamber 4 is provided with organosilicon glue-line 5. Described seal chamber 4 by LED substrate 1, be located on described LED substrate 1 and the transparent cover plate 3 that surrounds the box dam 2 of described deep ultraviolet LED6 and cover described box dam 2 tops forms; Described LED substrate 1 and box dam 2 are integrated, and can adopt pottery or metal material. Described deep ultraviolet LED6 is located on described LED substrate 1, described organosilicon glue-line 5 is coated in around the deep ultraviolet LED of LED substrate, this mode can be convenient to realize, organosilicon glue-line 5 also can be fixed on described LED substrate 1 by UV glue in addition, organosilicon glue-line 5 can cover the dress of seal chamber 4 bottom, and organosilicon glue-line 5 is provided with the hole of dodging of passing through for deep ultraviolet LED6, and the periphery of deep ultraviolet LED6 is white organosilicon glue-line 5, there is certain reflex, increase light emission rate. Described organosilicon glue-line 5 is provided with some perforation 51, increases the adsorption area of organosilicon glue-line 5.
Silica gel is a kind of high activity sorbing material, belongs to amorphous substance, except highly basic, hydrofluoric acid, do not react with any material, and water insoluble and any solvent, nonpoisonous and tasteless, stable chemical nature; The utility model utilizes the absorption property of silica gel, joined in deep ultraviolet LED6 encapsulating structure, after encapsulation can being completed, seal the oxygen absorption in seal chamber 4 up for safekeeping, because silica gel absorbs oxygen by suction type, so it absorbs the speed of oxygen; The cost of silica gel is relatively low, and in seal chamber 4, adds the technique of silica gel layer simple.

Claims (7)

1. a deep ultraviolet LED encapsulating structure, comprises seal chamber and is located at the deep ultraviolet LED in described seal chamber; It is characterized in that: the inwall of described seal chamber is provided with organosilicon glue-line.
2. a kind of deep ultraviolet LED encapsulating structure according to claim 1, is characterized in that: described seal chamber by LED substrate, be located on described LED substrate and the transparent cover plate that surrounds the box dam of described deep ultraviolet LED and cover described box dam top forms.
3. a kind of deep ultraviolet LED encapsulating structure according to claim 1, is characterized in that: described deep ultraviolet LED is located on described LED substrate, described organosilicon glue-line is located on described LED substrate, and organosilicon glue-line is provided with the hole of dodging of passing through for deep ultraviolet LED.
4. a kind of deep ultraviolet LED encapsulating structure according to claim 1, it is characterized in that: described deep ultraviolet LED is located on described LED substrate, described deep ultraviolet LED is located on described LED substrate, and described organosilicon glue-line is coated on LED substrate and is positioned at the surrounding position of described deep ultraviolet LED.
5. a kind of deep ultraviolet LED encapsulating structure according to claim 2, is characterized in that: described LED substrate and box dam are integrated.
6. a kind of deep ultraviolet LED encapsulating structure according to claim 1, is characterized in that: described organosilicon glue-line is provided with some perforation.
7. a kind of deep ultraviolet LED encapsulating structure according to claim 1, is characterized in that: described organosilicon glue-line is fixed by UV glue.
CN201520904014.6U 2015-11-13 2015-11-13 Dark purple outer LED packaging structure Active CN205248307U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520904014.6U CN205248307U (en) 2015-11-13 2015-11-13 Dark purple outer LED packaging structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520904014.6U CN205248307U (en) 2015-11-13 2015-11-13 Dark purple outer LED packaging structure

Publications (1)

Publication Number Publication Date
CN205248307U true CN205248307U (en) 2016-05-18

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201520904014.6U Active CN205248307U (en) 2015-11-13 2015-11-13 Dark purple outer LED packaging structure

Country Status (1)

Country Link
CN (1) CN205248307U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109671830A (en) * 2017-10-16 2019-04-23 紫岳科技有限公司 UV disinfection system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109671830A (en) * 2017-10-16 2019-04-23 紫岳科技有限公司 UV disinfection system

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C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee
CP01 Change in the name or title of a patent holder

Address after: 510890 Huadu District, Guangdong, Guangzhou Flower Town, SAST Road, No. 1, No. 1

Patentee after: Hongli Newell group Limited by Share Ltd

Address before: 510890 Huadu District, Guangdong, Guangzhou Flower Town, SAST Road, No. 1, No. 1

Patentee before: Guangzhou Hongli Tronic Co., Ltd.