CN205123646U - High power density low pressure motor drive - Google Patents

High power density low pressure motor drive Download PDF

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Publication number
CN205123646U
CN205123646U CN201520907681.XU CN201520907681U CN205123646U CN 205123646 U CN205123646 U CN 205123646U CN 201520907681 U CN201520907681 U CN 201520907681U CN 205123646 U CN205123646 U CN 205123646U
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CN
China
Prior art keywords
drive plate
control board
shell
driver according
driver
Prior art date
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Active
Application number
CN201520907681.XU
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Chinese (zh)
Inventor
张允志
曹为理
廖良闯
刘超
邹金欣
李景银
陈卫彬
李帅
花磊
孙宏伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
China Shipbuilding Digital Information Technology Co ltd
716th Research Institute of CSIC
Original Assignee
716th Research Institute of CSIC
Jiangsu Jari Technology Group Co Ltd
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Priority to CN201520907681.XU priority Critical patent/CN205123646U/en
Application granted granted Critical
Publication of CN205123646U publication Critical patent/CN205123646U/en
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Abstract

The utility model provides a high power density low pressure motor drive, including shell, control panel, drive plate, fin, in the shell is arranged in to control panel and drive plate, and the control panel is located the drive plate upside, be connected fixedly between control panel and the drive plate through the contact pin, the drive plate bottom sets up a pad, and the pad is connected with the heat dissipation dish, the heat dissipation dish is connected with the shell. It converts busbar voltage into below the 10V power supply circuit to set up one on the control panel, power supply circuit is control panel and drive plate power supply, all be equipped with the embedment mouth on shell, control panel, the drive plate for encapsulating after the driver encapsulation finishes. This driver can improve the power density of driver, makes the driver have better radiating efficiency to can normally work under very low voltage.

Description

A kind of high power density low voltage motor driver
Technical field
The utility model relates to a kind of motor servo Driving technique, particularly a kind of high power density low voltage motor driver.
Background technology
High power density low voltage motor driver belongs to the part in motor servo system, be used to the control appliance controlling the operation of servomotor high accuracy, heat radiation and Power Management Design are then significant design parts wherein, and this driver is gathered around at extraordinary industrial control field and is widely used.Released similar motor driver abroad at present, but its radiating effect is unsatisfactory, easily occurs the system failure under high temperature, and power supply buses minimum voltage is also at more than 10V.
Summary of the invention
The purpose of this utility model is to provide a kind of high power density low voltage motor driver, and it can improve the power density of driver, makes driver have good radiating efficiency, and under can being normally operated in very low voltage.
A kind of high power density low voltage motor driver, comprises shell, control board, drive plate, fin; Described control board and drive plate are placed in shell, and control board is positioned on the upside of drive plate; Be connected and fixed by contact pin between described control board and drive plate; Arrange a pad bottom drive plate, pad is connected with heat dissipation plate; Heat dissipation plate is connected with shell.Described control board is arranged the power circuit that busbar voltage to be converted to below 10V by; Described power circuit is that control board and drive plate are powered; Described shell, control board, drive plate are equipped with embedding mouth, for encapsulating after driver encapsulation.
Further, the embedding mouth on described shell, control board, drive plate is two, and the embedding mouth on its housing is arranged at shell upper bottom surface.
Further, described control board is six laminates, and thickness is 0.8mm, and internal layer has more than 50% area to apply copper.
Further, described drive plate is six laminates, and thickness is 0.8mm, and internal layer has more than 80% area, and the deposited copper of institute is used for thermal conductance in drive plate bottom land.
The utility model compared with prior art, have the following advantages: (1) the utility model is pasted with a power circuit on control board, busbar voltage higher than 10V can be converted to the operating voltage lower than 10V by this circuit, meets voltage devices work; (2) the utility model adopts the means such as " control board and drive plate adopt and apply copper design " " in the enclosure encapsulating " " pad between drive plate and heating panel " that driver can be made to have good radiating efficiency.
Below in conjunction with Figure of description, the utility model is described further.
Accompanying drawing explanation
Fig. 1 is structure diagram of the present utility model.
Fig. 2 is drive plate device layout schematic diagram.
Fig. 3 is that driver control electricity is for electrical schematic.
Fig. 4 is control board and drive plate parameter schematic diagram.
Embodiment
Composition graphs 1, a kind of high power density low voltage motor driver, comprises shell 1, control board 2, drive plate 3, fin 4; Described control board 2 and drive plate 3 to be placed in shell 1, and control board 2 is positioned on the upside of drive plate 3; Be connected and fixed by contact pin 5 between described control board 2 and drive plate 3; Arrange a pad 6 bottom drive plate 3, pad 6 is connected with heat dissipation plate 4; Heat dissipation plate 4 is connected with shell 1.Described control board 2 is arranged the power circuit 2-1 that busbar voltage to be converted to below 10V by, described power circuit 2-1 is that control board and drive plate are powered; Described shell 1, control board 2, drive plate 3 are equipped with embedding mouth, for encapsulating after driver encapsulation.
After encapsulation, volume is 55mm × 50mm × 16mm, maximumly drive 960W motor, bus Power supply scope is 7.5 ~ 59V, inner printed board is designed to two-layer, control board 2 is upper, drive plate 3 under, to be connected by contact pin 5 between top level control plate 2 with lower floor drive plate 3 and fixing, contact pin 5 adopts welding manner with being connected between printed board, drive plate 3 bottom center has a square pads 6, be welded in fin 4 by the mode of Reflow Soldering, shell 1 makes box-like being stuck on heating panel 4 by the mode of injection mo(u)lding.
Described control board 2 is six laminates, and thickness is 0.8mm (as shown in Figure 4), and internal layer large area applies copper, can improve radiating efficiency.
Described control board 2 is made up of power circuit 2-1, control circuit, detection and telecommunication circuit, and wherein DC bus-bar voltage is converted to below 10V by power circuit 2-1, and the utility model is got 5V voltage and powered (as shown in Figure 3) to control board and drive plate.Control circuit mainly comprises DSP signal processor circuit and logic processing circuit.Detect and mainly comprise DC-bus voltage sampling circuit, analog input interface circuit and I/O signal interface circuit with telecommunication circuit, then this numeral, analog input output signal are normalized, send into DSP after digitized processing.
Drive plate 3 described in composition graphs 2 is six laminates, and thickness is 0.8mm (as shown in Figure 4), and internal layer large area applies copper, can improve radiating efficiency.6 attachment power device Metal-Oxide Semiconductor field-effect transistor (MOSFET) 3-4 are symmetrical parallel is loaded on printed board central authorities by Reflow Soldering mode, by deposited copper heat conduction in bottom square welding rod, then to be welded on fin by the mode of Reflow Soldering.At side MOSFET other laying temperature sensor chip 3-3, detect real time temperature to control power stage.Primarily of power circuit 3-3, inverter circuit, testing circuit composition, wherein power circuit 3-3 carries out boost conversion as input power (as shown in Figure 3) to drive plate 3 using 5V electricity on control board to 12V.Inverter circuit adopts linear PWM driving method, and the method can realize the four-quadrant running of motor.Testing circuit mainly comprises three-phase current sample circuit, is then normalized this analog signal, sends into DSP after digitized processing.In Fig. 2,3-1 is embedding mouth on drive plate 3, and the region of 3-2 instruction is pin field.Described actuator power inverter circuit ground single-point should be taked to be connected with control ground or single-point magnetic bead connects, and being connected in analog, weakening the interference between different electrical signals with this in control circuit with digitally answering single-point magnetic bead.
The material of described fin 4 is aluminium, and top layer nickel plating is beneficial to Reflow Soldering and can effectively dispels the heat.
The embedding mouth of each reserved 2 2mm on control board 2, drive plate 3 and shell, first upper and lower two plates are welded to connect by contact pin 5 during assembling, be welded to connect with bottom heat radiation sheet again, the upper plastic casing of last card again, after assembling, carry out encapsulating from one of them embedding mouth, be confirmed whether to fill by another embedding mouth, effectively can strengthen radiating effect and the reliability of whole device.

Claims (10)

1. a high power density low voltage motor driver, comprises shell, control board, drive plate, fin; Described control board and drive plate are placed in shell, and control board is positioned on the upside of drive plate; Be connected and fixed by contact pin between described control board and drive plate; Arrange a pad bottom drive plate, pad is connected with heat dissipation plate; Heat dissipation plate is connected with shell, it is characterized in that,
Described control board is arranged the power circuit that busbar voltage to be converted to below 10V by;
Described power circuit is that control board and drive plate are powered;
Described shell, control board, drive plate are equipped with embedding mouth, for encapsulating after driver encapsulation.
2. driver according to claim 1, is characterized in that, busbar voltage is converted to 5V voltage by described power circuit.
3. driver according to claim 1, is characterized in that, the embedding mouth on described shell, control board, drive plate is two, and the embedding mouth on its housing is arranged at shell upper bottom surface.
4. driver according to claim 3, is characterized in that, described embedding mouth internal diameter is 2mm.
5. driver according to claim 1 and 2, is characterized in that, described control board is six laminates, and thickness is 0.8mm, and internal layer has more than 50% area to apply copper.
6. driver according to claim 1, is characterized in that, described drive plate is six laminates, and thickness is 0.8mm, and internal layer has more than 80% area, and the deposited copper of institute is used for thermal conductance in drive plate bottom land.
7. driver according to claim 6, is characterized in that, described drive plate is pasted with 6 power device MOSFET, and every 3 of described MOSFET is row, and two row MOSFET are symmetrical arranged.
8. driver according to claim 7, is characterized in that, described drive plate is also pasted with temperature sensor, when power device temperature is more than a fixed value, cuts off the power supply to power device.
9. the driver according to claim 7 or 8, is characterized in that, described drive plate is also pasted with a second source circuit, and the voltage transitions provided by power circuit is the operating voltage of drive plate.
10. driver according to claim 1, is characterized in that, fin is aluminum, top layer nickel plating.
CN201520907681.XU 2015-11-12 2015-11-12 High power density low pressure motor drive Active CN205123646U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520907681.XU CN205123646U (en) 2015-11-12 2015-11-12 High power density low pressure motor drive

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520907681.XU CN205123646U (en) 2015-11-12 2015-11-12 High power density low pressure motor drive

Publications (1)

Publication Number Publication Date
CN205123646U true CN205123646U (en) 2016-03-30

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Country Status (1)

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CN (1) CN205123646U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105262407A (en) * 2015-11-12 2016-01-20 中国船舶重工集团公司第七一六研究所 High-power density low-voltage motor driver

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105262407A (en) * 2015-11-12 2016-01-20 中国船舶重工集团公司第七一六研究所 High-power density low-voltage motor driver

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20201118

Address after: 222061 Jiangsu city of Lianyungang Province Lake Road No. 18

Patentee after: 716TH RESEARCH INSTITUTE OF CHINA SHIPBUILDING INDUSTRY Corp.

Patentee after: CSIC Information Technology Co.,Ltd.

Address before: 222061 Jiangsu city of Lianyungang Province Lake Road No. 18

Patentee before: 716TH RESEARCH INSTITUTE OF CHINA SHIPBUILDING INDUSTRY Corp.

Patentee before: JIANGSU JARI TECHNOLOGY GROUP Co.,Ltd.

CP01 Change in the name or title of a patent holder
CP01 Change in the name or title of a patent holder

Address after: 222061 No.18, Shenghu Road, Lianyungang City, Jiangsu Province

Patentee after: The 716th Research Institute of China Shipbuilding Corp.

Patentee after: CSIC Information Technology Co.,Ltd.

Address before: 222061 No.18, Shenghu Road, Lianyungang City, Jiangsu Province

Patentee before: 716TH RESEARCH INSTITUTE OF CHINA SHIPBUILDING INDUSTRY Corp.

Patentee before: CSIC Information Technology Co.,Ltd.

CP01 Change in the name or title of a patent holder
CP01 Change in the name or title of a patent holder

Address after: 222061 No.18, Shenghu Road, Lianyungang City, Jiangsu Province

Patentee after: The 716th Research Institute of China Shipbuilding Corp.

Patentee after: China Shipbuilding Digital Information Technology Co.,Ltd.

Address before: 222061 No.18, Shenghu Road, Lianyungang City, Jiangsu Province

Patentee before: The 716th Research Institute of China Shipbuilding Corp.

Patentee before: CSIC Information Technology Co.,Ltd.