CN205080913U - Conductive thin film , conductive thin film book, photonasty conductive thin film , photonasty conductive thin film book, conductive film substrate and device - Google Patents
Conductive thin film , conductive thin film book, photonasty conductive thin film , photonasty conductive thin film book, conductive film substrate and device Download PDFInfo
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- CN205080913U CN205080913U CN201520393123.6U CN201520393123U CN205080913U CN 205080913 U CN205080913 U CN 205080913U CN 201520393123 U CN201520393123 U CN 201520393123U CN 205080913 U CN205080913 U CN 205080913U
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Abstract
The utility model provides a conductive thin film, conductive thin film book, photonasty conductive thin film, photonasty conductive thin film book, conductive film substrate and device, this conductive thin film supports the film and sets up the conductive thin film who contains lurex's conducting layer on this support film for possessing, and wherein, the number of the metal condensation product in the above -mentioned conducting layer is counted below 7.0 with every 9cm2, this conductive thin film rolls up and makes through convoluteing above -mentioned conductive thin film on the roller, this photonasty conductive thin film supports the film for possessing, set up and contain lurex's the conducting layer and the photonasty conductive thin film on the light -sensitive resin layer of setting on this conducting layer on this supports film, and wherein, the number of the metal condensation product in the above -mentioned conducting layer is counted below 7.0 with every 9cm2, this photonasty conductive thin film rolls up and to make through convoluteing above -mentioned photonasty conductive thin film on the roller.
Description
Technical field
The utility model relates to conductive film, conductive film volume, photoelectric sensitivity conductive film, photoelectric sensitivity conductive film roll, conducting film base material and device.
Background technology
The display devices such as the miniaturized electronicss such as the large scale electronic equipment such as PC, TV, automatic navigator, mobile phone, electronic dictionary, OA and FA equipment employ liquid crystal display cells, touch-screen.And these liquid crystal display cells, touch-screen, the devices such as solar cell employ nesa coating in a part for transparent wiring, pixel electrode or terminal.
As the material of nesa coating, in the past owing to showing high transmissivity relative to visible ray, because being employed herein ITO (tin indium oxide; Indium-Tin-Oxide), indium oxide, tin oxide etc.
As the layout method of nesa coating, be generally following method: after formation nesa coating, above-mentioned nesa coating forms Resist patterns, remove the established part of conducting film by etching thus form conductive pattern.
Ito film, tin oxide film are formed by sputtering method usually.But the character of nesa coating easily changes along with the difference of sputtering condition, become the reason of etching speed deviation, the rate of finished products easily causing product reduces.In addition, the operation of the formation method of above-mentioned conductive pattern is long, in cost, also can become larger burden.
Recently, in order to eliminate the problems referred to above, attempt using the material substituting ITO, indium oxide, tin oxide etc. to form transparent conductive patterns.Such as, following patent documentation 1 discloses the formation method of following conductive pattern: on base material, form the conductive layer containing metallic fibers such as silver-colored fibers, then form photo-sensitive resin on the electrically conductive, carry out exposing, developing on it across patterned mask.
But, with regard to the method described in following patent documentation 1, be difficult to the low-resistivity seeking the surface resistivity of conductive pattern while the cementability guaranteeing base material and conductive pattern.In addition, when above-mentioned conductive pattern is used as wiring, pixel electrode or terminal, need to remove the operation of photo-sensitive resin, there is the operation forming conductive pattern and become numerous and diverse such problem.
In view of the above problems, method described in following patent documentation 2 discloses following method: by possessing support film, be arranged on the conductive layer containing metallic fiber in this support film and the photoelectric sensitivity conductive thin layer of photo-sensitive resin that is arranged on this conductive layer is pressed on base material to make photo-sensitive resin closely sealed on base material, it is exposed, develops, by so easy operation, with enough resolution formed with the cementability of base material fully and the little conductive pattern of surface resistivity.
Prior art document
Patent documentation
Patent documentation 1: U.S. Patent Publication No. 2007/0074316 publication
Patent documentation 2: No. 2010/021224th, International Publication
Utility model content
Inventors of the present utility model are when the photoelectric sensitivity conductive film described in volume production patent documentation 2, encounter following such problem: when the photoelectric sensitivity conductive film of use amount output is to form conductive pattern, adjacent pattern produces conducting each other, has an impact to the driving of touch panel.
The purpose of this utility model is: provide and can be formed the driving of touch panel without the conductive film of the high conducting film of the reliability of impact or conductive pattern, conductive film volume, photoelectric sensitivity conductive film, photoelectric sensitivity conductive film roll, conducting film base material and device etc.
Inventors of the present utility model find when volume production photoelectric sensitivity conductive film, in support film, applying conductive liquid is formed in the operation of conducting film, metallic fiber is wrapped around one another and form condensation product, the driving problems of above-mentioned touch panel can be produced due to this formed condensation product, thus complete the utility model.
The utility model provides following conductive film, conductive film volume, photoelectric sensitivity conductive film, photoelectric sensitivity conductive film roll, conducting film base material and device etc.
1. a conductive film, it is the conductive film possessing support film and be arranged on the conductive layer containing metallic fiber in this support film, and wherein, the number of the metal agglomerates thing in above-mentioned conductive layer is with every 9cm
2count less than 7.0.
2. the conductive film according to above-mentioned 1, wherein, above-mentioned metallic fiber is silver-colored fiber.
3. a conductive film volume, it is obtained by being wound on by the conductive film described in above-mentioned 1 or 2 on roller.
4. a photoelectric sensitivity conductive film, it is the photoelectric sensitivity conductive film possessing support film, be arranged on the conductive layer containing metallic fiber in this support film and be arranged on the photo-sensitive resin on this conductive layer, wherein, the number of the metal agglomerates thing in above-mentioned conductive layer is with every 9cm
2count less than 7.0.
5. the photoelectric sensitivity conductive film according to above-mentioned 4, wherein, above-mentioned metallic fiber is silver-colored fiber.
6. the photoelectric sensitivity conductive film according to above-mentioned 4 or 5, wherein, above-mentioned photo-sensitive resin contains binder polymer, has the photopolymerizable compound of ethylenic unsaturated bond and Photoepolymerizationinitiater initiater.
7. a photoelectric sensitivity conductive film roll, it is by the photoelectric sensitivity conductive winding film according to any one of above-mentioned 4 ~ 6 is obtained on roller.
8. a conducting film base material, it possesses the conducting film on base material and this base material, above-mentioned conducting film be by by the photoelectric sensitivity conductive film according to any one of above-mentioned 4 ~ 6 according to being laminated on base material with the closely sealed mode on base material of above-mentioned photo-sensitive resin, active ray is irradiated to the above-mentioned photo-sensitive resin on above-mentioned base material and is formed.
9. a conducting film base material, it possesses the conductive pattern on base material and this base material, above-mentioned conductive pattern be by by the photoelectric sensitivity conductive film according to any one of above-mentioned 4 ~ 6 according to being laminated on base material with the closely sealed mode on base material of above-mentioned photo-sensitive resin, active ray is irradiated to the established part of the above-mentioned photo-sensitive resin on above-mentioned base material, the unexposed portion development of above-mentioned photo-sensitive resin and conductive layer is formed.
10. a device, it possesses the conducting film base material described in above-mentioned 8 or 9.
According to the utility model, can provide and can be formed the driving of touch panel without the conductive film of the high conductive film of the reliability of impact or conductive pattern, conductive film volume, photosensitive conductive film, photoelectric sensitivity conductive film roll, conducting film base material and device etc.
Accompanying drawing explanation
Fig. 1 is the cross-sectional schematic of the execution mode representing photoelectric sensitivity conductive film of the present utility model.
Fig. 2 (a) ~ Fig. 2 (c) is the cross-sectional schematic be described for an execution mode of the formation method to conductive pattern.
Fig. 3 (a) ~ Fig. 3 (d) is the cross-sectional schematic be described for another execution mode of the formation method to conductive pattern.
Fig. 4 is the schematic top plan view of an example of the touch panel sensor representing electrostatic capacitive.
Embodiment
Conductive film of the present utility model possesses support film and is arranged on the conductive layer containing metallic fiber in support film, and the number of the metal agglomerates thing in conductive layer is with every 9cm
2count less than 7.0.
Photoelectric sensitivity conductive thin film of the present utility model for support film, be arranged on the conductive layer containing metallic fiber in support film and photo-sensitive resin be on the electrically conductive set, the number of the metal agglomerates thing in conductive layer is with every 9cm
2count less than 7.0.
What " metal agglomerates thing " was defined as metallic fiber cohesion and obtained is those of more than 50 μm with the light microscope diameter carried out when measuring.In addition, when metal agglomerates thing is the shape such as sheet, needle-like, with long limit (length that distance between two points is maximum) for diameter.In addition, the number of metal agglomerates thing can not be " 7.0/9cm
2it is " 6000/m below "
2below ", " 600/1000cm
2below ", " 60/100cm
2below " or " 6/10cm
2below ".
According to conductive film of the present utility model, conductive film volume, photoelectric sensitivity conductive film, photoelectric sensitivity conductive film roll, conducting film base material and device, short circuit between line when can suppress to form pattern.Thereby, it is possible to be formed the driving of touch panel without the high transparent conductive patterns of the reliability of impact, expect its touch panel displays screen field expansion that can increase fast in demand from now on of predicting.
Below, preferred implementation of the present utility model is described in detail.But the utility model is not limited to following execution mode.
In addition, in this manual, " A or B " refers to: containing the one party in A and B, also can contain both sides.
In addition, " ~ " number range of representing is used to represent numerical value described in the front and back comprising " ~ " scope respectively as minimum value and maximum.
In addition, illustrative material, when not indicating especially, can be used alone, also can be used in combination.
Fig. 1 is the cross-sectional schematic of the preferred implementation representing photoelectric sensitivity conductive film of the present utility model.The photo-sensitive resin 3 that photoelectric sensitivity conductive film 10 shown in Fig. 1 possesses support film 1, is arranged on the conductive layer 2 containing metallic fiber in support film 1 and is arranged on conductive layer 2.Conductive layer 2 is set as photosensitive layer 4 together with photo-sensitive resin 3.
As support film, can list: pet film, polyethylene film, polypropylene film, polycarbonate film etc. have the thin polymer film etc. of thermal endurance and solvent resistance.In the middle of them, from the viewpoint of the transparency, thermal endurance, preferred pet film.In addition, these thin polymer films can be afterwards can from photo-sensitive resin remove scope in implement surface-treated those.
The thickness of support film is preferably 1 μm ~ 200 μm, is more preferably 5 μm ~ 150 μm, more preferably 10 μm ~ 100 μm, is particularly preferably 15 μm ~ 60 μm.
As surface treatment, include, for example out: physical treatments such as corona treatment, sand delustring processing or the chemical treatment of release layer or easy adhesive linkage etc. is set.
From the viewpoint of can make sensitivity and resolution good, the haze value of support film is preferably 0.01 ~ 5.0%, is more preferably 0.01 ~ 3.0%, more preferably 0.01 ~ 2.0%, be particularly preferably 0.01 ~ 1.1%.In addition, haze value can measure according to JISK7105, such as, the commercially available nephelometers such as NDH-5000 (Japanese electricity Se Industrial Co., Ltd manufactures, ProductName) can be used to measure.
Conductive layer contains metallic fiber.Metallic fiber such as can by by metal ion NaBH
4prepared by the method for reducing Deng reducing agent or polyol process.In addition, " fiber " refers to the material of fine strip shape.
As the metal of metallic fiber, can list: silver, gold, platinum, copper etc., be preferably silver.
The average fiber footpath of metallic fiber is preferably 1nm ~ 50nm, is more preferably 2nm ~ 20nm, more preferably 3nm ~ 10nm.In addition, the average fiber of metallic fiber is long is preferably 1 μm ~ 100 μm, is more preferably 2 μm ~ 50 μm, more preferably 3 μm ~ 40 μm, is particularly preferably 5 μm ~ 35 μm.Average fiber footpath and average fiber length can be measured by the microscope such as light microscope or scanning electron microscope.
Conductive layer can containing other conducting fibre.As other conducting fibre, the carbon fibers etc. such as carbon nano-tube can be listed.Carbon nano-tube can use the commercially available products such as the Hipco single-layer carbon nano-tube of Unidym company.
The number of the metal agglomerates thing in conductive layer is 7.0/9cm
2below, 6.0/9cm is preferably
2below, 5.0/9cm is more preferably
2below, 4.0/9cm is particularly preferably
2below, pole is preferably 3.0/9cm
2below, 2.0/9cm is extremely particularly preferably
2below.
In addition, the number of the metal agglomerates thing in conductive layer can be 6000/m
2below, 5000/m is preferably
2below, 4500/m is more preferably
2below, 4000/m is particularly preferably
2below, pole is preferably 3000/m
2below, 2000/m is extremely particularly preferably
2below.
In addition, the number of the metal agglomerates thing in conductive layer can be 600/1000cm
2below, 500/1000cm is preferably
2below, 450/1000cm is more preferably
2below, 400/1000cm is particularly preferably
2below, pole is preferably 300/1000cm
2below, 200/1000cm is extremely particularly preferably
2below.
In addition, the number of the metal agglomerates thing in conductive layer can be 60/100cm
2below, 50/100cm is preferably
2below, 45/100cm is more preferably
2below, 40/100cm is particularly preferably
2below, pole is preferably 30/100cm
2below, 20/100cm is extremely particularly preferably
2below.
In addition, the number of the metal agglomerates thing in conductive layer can be 6.0/10cm
2below, 5.0/10cm is preferably
2below, more preferably 4.0/10cm
2below, 3.0/10cm is particularly preferably
2below, pole is preferably 2.0/10cm
2below.
In addition, lower limit is not particularly limited, and can be 0/9cm
2(0/m
2, 0/1000cm
2, 0/100cm
2, 0/10cm
2).
The thickness of conductive layer, according to the purposes of formed conducting film, conductive pattern, the difference of required conductivity and different, is preferably less than 1 μm, is more preferably 1nm ~ 0.5 μm, more preferably 5nm ~ 0.1 μm.When the thickness of conductive layer is below 1 μm, the light transmittance in the wavelength region may of 450 ~ 650nm is high, and patternability is also excellent, is particularly suitable for making transparency electrode.
Conductive layer preferably has the network that metallic fiber contacts with each other.The conductive layer with such network can be formed in the support film side of photo-sensitive resin on the surface, as long as but the layer of conductivity can be obtained just along this direction, face in the surface of exposing when having peeled off support film, can be formed with the form be contained in the top layer, support film side of photo-sensitive resin, also can be island (can have non-existent part when observing with vertical view).In addition, the thickness with the conductive layer of network can be measured by scanning electron microscope photo.
Conductive layer containing metallic fiber can be formed by following method: in support film, apply the metallic fibre dispersing liquid (conduction liquid) above-mentioned metallic fiber being contained in the decentralized medium such as water or organic solvent, then carry out drying.In conduction liquid, the dispersion stabilizers such as surfactant can be added.After drying, the conductive layer be formed in support film can carry out lamination as required.
Coating can be coated with the known methods such as method, stick coating method, spraying process and be carried out by rolling method, comma rubbing method, gravure coating process, air knife coating method, mould, but impurity that is good from the viewpoint of film thickness distribution, that be mixed into coating fluid in enclosed system is so less, is preferably mould painting method.
As organic solvent, can list: five ethylene glycol monododecyl ether, ethanol, isopropyl alcohol etc.In the conductive layer, dispersion stabilizer can remain and not evaporate.
Preferably after coated with conductive liquid, carry out drying.From the viewpoint of preventing to become problem in time-consuming operation because of solvent evaporates, baking temperature is preferably more than 20 DEG C.Be more preferably more than 25 DEG C and be less than 65 DEG C, more preferably more than 35 DEG C and be less than 65 DEG C, being particularly preferably 40 ~ 60 DEG C.
By making to be in above-mentioned scope, uniform film can be formed, becoming and being easy to make conductive layer low resistance or low haze.Particularly, when metallic fiber is silver-colored fiber, by making to be in said temperature scope, low resistance or low haze is significantly made to become easy.
Form Bei Nade whirlpool from the viewpoint of preventing convection current from producing thus become uneven, not easily form low-resistance conductive layer, baking temperature is preferably less than 65 DEG C.When baking temperature is more than 80 DEG C, likely can produces Marangoni Convection and metallic fiber is wound around.
As photo-sensitive resin, preferably formed by the photosensitive polymer combination of the photopolymerizable compound and (c) Photoepolymerizationinitiater initiater that there is ethylenic unsaturated bond containing (a) binder polymer, (b).They can use without particular limitation existing known those, the photosensitive polymer combination described in No. 2013/084886, preferred International Publication.
Photo-sensitive resin is formed preferably by following method: be formed on the conductive layer in support film, coating is dissolved in methyl alcohol, ethanol, acetone, methylethylketone, glycol monoethyl ether, ethylene glycol monoethyl ether, toluene, N, the solid constituent of dinethylformamide or propylene glycol monomethyl ether equal solvent is the solution of the photosensitive polymer combination of about 10 ~ 60 quality %, and carries out drying.In order to prevent the diffusion of the organic solvent in rear operation, the remaining organic solvent amount in dried photo-sensitive resin is preferably below 2 quality %.
The thickness of photo-sensitive resin is different according to the difference of purposes, is preferably 1 ~ 50 μm, is more preferably 1 ~ 30 μm, more preferably 1 ~ 15 μm, be particularly preferably 1 ~ 10 μm with dried thickness gauge.When this thickness be less than 1 μm be less than time, have coating become difficulty tendency; When more than 50 μm, cause sensitivity to become insufficient because Transmission light reduces, thus have the tendency that the photo-curable of the photo-sensitive resin of transfer printing reduces.
With regard to the photoelectric sensitivity conductive film of present embodiment, the duplexer of above-mentioned conductive layer and above-mentioned photo-sensitive resin is when being set as 1 ~ 10 μm by two-layer total thickness, minimum light transmittance in the wavelength region may of 450 ~ 650nm is preferably more than 80%, is more preferably more than 85%.Be more than 80% by above-mentioned minimum light transmittance, the visuognosis degree on display screen panel etc. can be improved.
Photoelectric sensitivity conductive film of the present utility model can according to the mode stacked guard film contacted with the face of support film side opposite side with photo-sensitive resin.
In addition, conductive film of the present utility model can according to the mode stacked guard film contacted with the face of support film side opposite side with conductive layer.
As protective film, pet film, polypropylene film, polyethylene film etc. can be used to have the thin polymer film etc. of thermal endurance and solvent resistance.In addition, as protective film, the thin polymer film identical with above-mentioned support film can also be used.
Bonding force between protective film and photosensitive layer is preferably little than the bonding force between photosensitive layer and support film, to make to be easy to protective film to peel off from photosensitive layer when peeling off protective film and being laminated to base material from photo-sensitive resin side.
On the other hand, the bonding force between protective film and photosensitive layer is preferably large than the bonding force between photosensitive layer and support film, to make to be easy to support film to peel off from photosensitive layer when peeling off support film and being laminated to base material from conducting film side.
In addition, with regard to conductive film of the present utility model, the bonding force between protective film and conductive layer is preferably little than the bonding force between conductive layer and support film, to make to be easy to protective film to peel off from conductive layer.
Conductive film of the present utility model can be wound on roller and make conductive film volume.
In addition, photoelectric sensitivity conductive winding film of the present utility model can be made photoelectric sensitivity conductive film roll on roller.
By forming conductive film volume and photoelectric sensitivity conductive film roll, keeping quality can be improved.
Roller can use known manner.
Preferably be wound on roller after stacked guard film.
According to the above-mentioned photoelectric sensitivity conductive film of mode lamination closely sealed with above-mentioned photo-sensitive resin on base material, active ray is irradiated to the above-mentioned photo-sensitive resin on base material, can conducting film be formed thus.
In addition, according to the above-mentioned photoelectric sensitivity conductive film of mode lamination closely sealed with above-mentioned photo-sensitive resin on base material, active ray is irradiated to the established part of the above-mentioned photo-sensitive resin on base material, is developed in the unexposed portion of photo-sensitive resin and conductive layer, can conductive pattern be formed thus.
An execution mode of conducting film base material of the present utility model possesses the above-mentioned conducting film on base material and this base material.
In addition, other execution modes of conducting film base material of the present utility model possess the above-mentioned conductive pattern on base material and this base material.
As the material of base material, can list: PETG, Merlon, cyclic olefin polymer etc.
As active ray, can list: comprise the ultraviolet of i ray, luminous ray, radioactive ray etc., preferred i ray.As light source, extra-high-pressure mercury vapour lamp etc. can be used.
When irradiating active ray to established part, preferably use photomask.As the pattern of photomask, live width line-spacing (L/S) pattern etc. can be listed.
With regard to the development in unexposed portion, preferably use alkaline aqueous solution as developer solution.
Below, the execution mode of accompanying drawing to the formation method of conductive pattern is used to be described.
As shown in Fig. 2 (a) ~ Fig. 2 (c), the photo-sensitive resin 3 of the photoelectric sensitivity conductive film 10 with support film 1, conductive layer 2 and photo-sensitive resin 3 is laminated to (Fig. 2 (a)) on base material 20, then across mask pattern 5 pattern-like, active ray L (Fig. 2 (b)) is irradiated to photo-sensitive resin 3, removed the unexposed portion of above-mentioned photo-sensitive resin and conductive layer by development, thus form conductive pattern (2a+3b) (Fig. 2 (c)).The conductive pattern obtained like this has the thickness of resin-cured layer 3b on the basis of the thickness of conducting film 2a.
These thickness become the height difference H b with base material 20, become be difficult to obtain the required flatness such as display screen when this difference in height is large.In addition, become when difference in height is large and be easy to visuognosis conductive pattern.Therefore, use as long as separate with the method shown in Fig. 3 (a) ~ Fig. 3 (d) according to purposes.
Above-mentioned with height difference H b that is base material in order to reduce, as as described in Fig. 3 (a) ~ Fig. 3 (d), preferably after first exposure process (Fig. 3 (b)) of active ray is irradiated to the established part of the photosensitive layer 4 with support film 1, possess following second exposure process (Fig. 3 (c)): peel off support film 1, then in the presence of oxygen active ray is irradiated to part or all of the exposure portion in the first exposure process and unexposed portion.Second exposure process carries out in the presence of oxygen, such as, preferably carry out in atmosphere.In addition, the condition of oxygen concentration can be also the increase in.
In the developing procedure of the formation method of the conductive pattern of Fig. 3 (a) ~ Fig. 3 (d), remove the surface portion of the not fully solidification of the photo-sensitive resin 3 exposed in the second exposure process.Specifically, by wet development, the superficial layer that namely surface portion of the not fully solidification of photo-sensitive resin 3 comprises conducting film 2 is removed, form conducting film 2a and resin-cured layer 3a.Thus, obtain the conductive pattern base material 42 being provided with conductive pattern and the resin-cured layer not with conducting film on base material, reduction compared with the height difference H a of conductive pattern can being made and the situation of conductive pattern being only set on base material.
The formation method of conducting film, the formation method of conductive pattern can select known manner.Specifically, can with reference to the mode described in No. WO2013/051516, International Publication or No. WO2010/021224, International Publication.
Conducting film base material of the present utility model can in middle uses such as the devices such as the panel display screens such as liquid crystal display cells, touch-screen, solar cell.
Conducting film base material of the present utility model can particularly preferably use as the formation of the transparency electrode of capacitive touch panel, capacitive touch panel transducer.
Fig. 4 is the schematic top plan view of an example of the touch panel sensor representing electrostatic capacitive.Fig. 4 illustrates an example of the capacitive touch panel transducer possessing transparent base 101 and transparency electrode (X position coordinate) 103 and transparency electrode (Y position coordinates) 104 in touch screen 102.Transparency electrode 103 and transparency electrode 104 may reside on same plane, also can be layered on transparent base 101, can also configure according to the mode sandwiching transparent base 101.
With regard to capacitive touch panel, above-mentioned transparency electrode 103 and 104 has the lead-out wiring (not shown) for being connected with the control circuit of the driving element circuit controlling the signal of telecommunication.
With regard to above-mentioned touch panel sensor, at least one in transparency electrode uses conductive film of the present utility model or photoelectric sensitivity conductive film to be formed.In this case, another transparency electrode can be pre-formed over the transparent substrate by the known method employing transparent conductive material.
Embodiment
Below, based on embodiment, the utility model is specifically described, but the utility model is not limited to this.
Production Example 1 < prepares silver-colored fiber dispersion 1 >
(1) silver-colored fiber is prepared with polyol process
In the there-necked flask of 2000ml, put into 500ml ethylene glycol, under nitrogen atmosphere by magnetic stirrer while be heated to 160 DEG C with oil bath.Drip the PtCl of 2mg wherein
2be dissolved in the ethylene glycol of 50ml and the solution obtained.After 4 ~ 5 minutes, drip the AgNO of 5g from respective dropping funel with 1 minute
3be dissolved in the ethylene glycol of 300ml and the solution that obtains and by the weight average molecular weight of 5g be 40,000 the solution that obtains of PVP (manufacturing with the Guang Chun medicine Co., Ltd.) ethylene glycol that is dissolved in 150ml, stir 60 minutes with 160 DEG C afterwards.
Place below above-mentioned reaction solution to 30 DEG C, then with acetone diluted to 10 times, by centrifugal separator with 2000 turns of centrifugations 20 minutes, supernatant decanted liquid.Add acetone to sediment and stir, then carrying out centrifugation with condition same as described above, decant acetone.Afterwards, use distilled water similarly to carry out twice centrifugation, obtain silver-colored fiber thus.During the silver-colored fiber obtained by observation by light microscope, the average fiber footpath (diameter) of five that choose arbitrarily is 5nm, and average fiber length is 30 μm.
(2) silver-colored fiber dispersion 1 is prepared
In pure water, be 0.2 quality % to make the concentration of the silver-colored fiber obtained in (1) and the mode that the concentration of dodecyl-five ethylene glycol (five ethylene glycol monododecyl ether) is 0.1 quality % is disperseed, obtain silver-colored fiber dispersion 1.
Production Example 2 < prepares the solution > of photosensitive polymer combination
Material shown in table 1 is coordinated according to use level shown in this table (unit: mass parts), prepares the solution of photosensitive polymer combination.
Table 1
Each composition in table 1 is shown below.
Acrylic resin A: methacrylic acid/methyl methacrylate/ethyl acrylate=12/58/30, weight average molecular weight is 67000, and acid number is 78.3mgKOH/g
TMPTA: trimethylolpropane triacrylate (chemical industry Co., Ltd. of Xin Zhong village manufactures, ProductName)
TPO:2,4,6-trimethylbenzoy-dipheny-phosphine oxide (BASF Co., Ltd. manufactures, and product is called " LUCIRINTPO ")
SH-30: octamethylcy-clotetrasiloxane (Dong Li DOW CORNING Co., Ltd. manufactures, ProductName)
The weight average molecular weight of acrylic resin A is obtained with polystyrene standard conversion by gel permeation chromatography (GPC) method according to following condition.
For the polymer of 0.5mg, the solution of the 1ml of solvent [oxolane (THF)/dimethyl formamide (DMF)=1/1 (volumetric ratio)] is used to measure.
Determinator: the L4000UV that company of detector Hitachi Co., Ltd manufactures
Pump: the L6000 that company of Hitachi Co., Ltd manufactures
The C-R4AChromatopac that company of Shimadzu Scisakusho Ltd manufactures
Condition determination: post GelpackGL-S300MDT-5 × 2 piece
Eluent: THF/DMF=1/1 (volumetric ratio)
LiBr(0.03mol/l)，H
3PO
4(0.06mol/l)
Flow velocity: 1.0ml/ minute, detector: UV270nm
Acid number measures by the following method.The solid-state acrylic resin A of accurate weighing 1g, the acrylic resin A then gone out by accurate weighing puts into conical flask, adds 30g acetone, dissolves equably.Next, the phenolphthalein as indicator is added into this solution in right amount, and uses the KOH aqueous solution of 0.1N to carry out titration.Then, acid number is calculated by following formula.
Acid number=10 × Vf × 56.1/ (Wp × I)
In formula, Vf represents the titer (mL) of the KOH aqueous solution, and Wp represents the quality (g) of the resin solution recorded, and I represents the ratio (quality %) of the nonvolatile component in the resin solution recorded.
Embodiment 1 ~ 3
(1) making of conductive film and evaluation
The silver-colored fiber dispersion 1 (30kg) obtained in Production Example 1 is used THREE-ONE motor (Yamato science Co., Ltd. manufactures, BL1200), stir 30 minutes with the rotating speed of more than the 800rpm shown in table 2.By this silver-colored fiber dispersion 1 according to 25g/m
2(Teijin Ltd manufactures to be applied to pet film equably, product is called " G2-50 ", thick is 50 μm) on, with dry 10 minutes of the hot wind convection type drying machines of 50 DEG C, and after confirmation moisture evaporation, pressurize with the line pressure of 10kg/cm, in support film, form conductive layer (conductive film) thus.In addition, be about 0.02 μm when measuring with the dried thickness of scanning electron microscope to conductive layer.The nano silver wire condensation product (metal agglomerates thing) of above-mentioned conductive layer is measured by following method.
(detection method of nano silver wire condensation product)
Shear the conductive film of 10cm at Width, mark the foursquare frame of 9 3cm × 3cm equably, carry out dark field observation with light microscope, obtain every 9cm
2the number of nano silver wire condensation product, be converted into every 1m
2quantity.
(2) making of photoelectric sensitivity conductive film and evaluation
Next, the dissolution homogeneity of photosensitive polymer combination obtained in Production Example 2 is coated with on the conductive layer being formed on pet film of the conductive film obtained in (1), with dry 10 minutes of the hot wind convection type drying machines of 100 DEG C, form photo-sensitive resin thus.Afterwards, cover photo-sensitive resin with protective film (polyethylene film, TAMAPOLY Co., Ltd. manufactures, and product is called " NF-13 "), obtain the photoelectric sensitivity conductive film of embodiment 1 ~ 3.In addition, the dried thickness of photo-sensitive resin is 5 μm.
(3) making of conducting film and evaluation
Polycarbonate substrate thick for 1mm is heated to 80 DEG C.In its surface protective film is peeled off while make photo-sensitive resin opposite with base material to the photoelectric sensitivity conductive film obtained in above-mentioned (2), 110 DEG C, carry out lamination under the condition of 0.4MPa.After lamination, polycarbonate substrate is cooled, when the temperature of base material reaches 23 DEG C, use the exposure machine (Co., Ltd. O RC manufactures, and product is called " HMW-201B ") with high-pressure mercury lamp from support film side, with 1000mJ/cm
2exposure illumination carried out to conductive layer and photo-sensitive resin penetrate.After exposure, place 15 minutes with room temperature (25 DEG C), then peel off the pet film as support film, on polycarbonate substrate, form the conducting film of bag contg. silver fiber thus.
(mensuration of sheet resistance value)
Use non-planar contact surfaces ohmer (NAPSON Co., Ltd. manufactures, and product is called " EC-80P "), measure the sheet resistance value of the conducting film be formed on above-mentioned polycarbonate substrate.Evaluation result is shown in table 2.
(4) making of conductive pattern and evaluation
Peel off the protective film of the photoelectric sensitivity conductive film obtained in above-mentioned (2), then with 110 DEG C, photoelectric sensitivity conductive thin layer is pressed on the pet film base material of 150 μm by the condition of 0.4MPa.After lamination, pet film base material is cooled, when the temperature of pet film base material reaches 23 DEG C, (Co., Ltd. O RC manufactures to use the exposure machine with ultrahigh pressure mercury lamp, product is called " HMW-201B ") across the photomasks of L/S=150 μm/30 μm, with 25mJ/cm
2exposure from support film side, illumination is carried out to conductive layer and photo-sensitive resin and penetrates.After placing 15 minutes with room temperature (25 DEG C), peel off the pet film as support film, with 100mJ/cm
2carry out illumination from support film stripping side to conductive layer and photo-sensitive resin to penetrate.After exposure, place 15 minutes with room temperature (25 DEG C), then use spray development machine, with 30 DEG C, the aqueous sodium carbonate of 1% carries out development in 40 seconds, obtains the conductive pattern of L/S=150 μm/30 μm.
(driven nature of touch panel)
Whether short circuit between the adjacent pattern being detected the conductive pattern obtained in above-mentioned by circuit tester (manufacture of MULTIMEASURINGINSTRUMENTS Co., Ltd.), is calculated the ratio of the quantity of the pattern of short circuit and is set as short circuit ratio from the pattern numbers of entirety that is 500.Evaluate according to following benchmark.Result is shown in table 2.
"○": short circuit ratio is less than 2%
" △ ": short circuit ratio is less than 2%, but transducer sensitivity low (being sometimes failure to actuate)
"×": short circuit ratio is more than 2%
"-": nano silver wire condensation product is too much, therefore cannot measure.
Comparative example 1 ~ 6
Except by the speed setting of stirring be below 600rpm table 2 shown in rotating speed and except mixing time is set as the time shown in table 2, operate in the same manner as embodiment 1 ~ 3, manufacture conductive film, photoelectric sensitivity conductive film, conducting film and conductive pattern, and evaluate.Result is shown in table 2.
The dried thickness of conductive layer is about 0.02 μm.The dried thickness of photo-sensitive resin is 5 μm.
Production Example 3 < silver fiber dispersion prepares 2 ~ 6 >
The impact of pH when making conducting film to study, has prepared following silver-colored fiber dispersion 2 ~ 6.
In pure water, to add hydrochloric acid except employing pH is set as that the solution of 4.6 replaces, except pure water, preparing, obtain silver-colored fiber dispersion 2 in the same manner as silver-colored fiber dispersion 1.The pH of silver fiber dispersion 2 is 6.0.
In pure water, with make above-mentioned in the concentration of silver-colored fiber that obtains be 0.2 quality % and the mode that the concentration of dodecyl five ethylene glycol is 0.1 quality % is disperseed, obtain silver-colored fiber dispersion 3.The pH of silver fiber dispersion 3 is 7.8.
In pure water, to add sodium carbonate pH is set as, except the solution of 9.5, prepare in the same manner as silver-colored fiber dispersion 1, obtain silver-colored fiber dispersion 4 except employing.The pH of silver fiber dispersion 4 is 8.5.
In pure water, to add hydrochloric acid pH is set as, except the solution of 3.1, prepare in the same manner as silver-colored fiber dispersion 1, obtain silver-colored fiber dispersion 5 except employing.The pH of silver fiber dispersion 5 is 3.1.
In pure water, to add sodium carbonate pH is set as, except the solution of 12.1, prepare in the same manner as silver-colored fiber dispersion 1, obtain silver-colored fiber dispersion 6 except employing.The pH of silver fiber dispersion 6 is 11.6.
Embodiment 4 ~ 6
The impact of pH when making conducting film to study, except using in Production Example 3 the silver-colored fiber dispersion 2 ~ 4 that obtains replacing silver-colored fiber dispersion 1 according to mode shown in table 3, use magnetic stirring apparatus with the rotating speed of 200rpm stir 30 minutes, conductive layer is formed time baking temperature be set as except 50 DEG C, manufacture in the same manner as embodiment 1 ~ 3, obtain the conductive film of embodiment 4 ~ 6, photoelectric sensitivity conductive film, conducting film and conductive pattern.The dried thickness of conductive layer is about 0.02 μm, and the dried thickness of photo-sensitive resin is 5 μm.
The detection method of nano silver wire condensation product and the driven nature of touch panel of conductive layer are evaluated in the same manner as embodiment 1 ~ 3.Result is shown in table 3.
For the nano silver wire condensation product of conductive layer, "-" represents that condensation product is with every 9cm
2meter, more than 260, cannot count too much.
(detection method of the nano silver wire condensation product in silver-colored fiber dispersion)
Evaluate silver-colored fiber dispersion 2 ~ 6 by streaming particle image analytical equipment (Sysmex Co., Ltd. manufactures, and product is called " FPIA-3000 "), detect condensation product.Measure and evaluate with every 110 μ L units.Result is shown in table 3.
(confirmation of coating state)
To the conductive layer of conductive film with visual observations outward appearance.Coating becomes and is set as zero uniformly, uneven to be set as ×.Result is shown in table 3.
Comparative example 7 and 8
Except according to using in Production Example 3 the silver-colored fiber dispersion 5 and 6 obtained to replace silver-colored fiber dispersion 2 ~ 4, baking temperature to be set as 70 DEG C in comparative example 7, to be set as except 100 DEG C in comparative example 8 shown in table 3 like that, manufacture conductive film etc. in the same manner as embodiment 4 ~ 6, and evaluate.Result is shown in table 3.
The dried thickness of conductive layer is about 0.02 μm, and the dried thickness of photo-sensitive resin is 5 μm.
Table 3
Embodiment 7
With or without the impact of the filter progress based on filter when making conducting film to study, carry out following experiment.
(coil as ADVANTEC Co., Ltd. manufactures by 30 μm of nylon plate filters, product is called " KS-293-ST ", nylon filter is that Tokyo SCREEN Co., Ltd. manufactures, product is called " N-330-T ") the silver-colored fiber dispersion 1 (100kg) obtained in Production Example 1 is filtered, according to 32g/m
2(Teijin Ltd manufactures to be coated on pet film equably, product is called " A1517 ", 16 μm are thick) on, with dry 10 minutes of the hot wind convection type drying machines of 50 DEG C, and after confirmation moisture evaporation, pressurize with the line pressure of 10kgf/cm (98N/cm), in support film, form conductive layer (conductive film) thus.In addition, the dried thickness of conductive layer is about 0.02 μm.
Except employ above-mentioned in the conductive film that obtains and employ the protective film of polypropylene (prince F-Tex Co., Ltd. manufactures; product is called " ES-201 ") replace beyond protective film NF-13; operate in the same manner as embodiment 1 ~ 3, manufacture photoelectric sensitivity conductive film, conducting film and conductive pattern.The dried thickness of photo-sensitive resin is 5 μm.
The driven nature of the detection method of nano silver wire condensation product, the mensuration of sheet resistance value and touch panel is evaluated in the same manner as embodiment 1 ~ 3.Result is shown in table 4.
Embodiment 8
(coil as ADVANTEC Co., Ltd. manufactures except 30 μm of nylon plate filters being changed to 30 μm of SUS dish filters, product is called " KS-293-ST ", SUS filter is that Tokyo SCREEN Co., Ltd. manufactures) beyond, manufacture conductive film etc. similarly to Example 7, and evaluate.Result is shown in table 4.
Embodiment 9
Except 30 μm of nylon plate filters being changed to 40 μm of PP (polypropylene) box filters, (3M Amada Co., Ltd. manufactures, and product is called " Betapure
tMnT-T series ") beyond, manufacture conductive film etc. similarly to Example 7, and evaluate.Result is shown in table 4.
Embodiment 10
Except 30 μm of nylon plate filters being changed to 50 μm of PP box filters, (3M Amada Co., Ltd. manufactures, and product is called " Betapure
tMnT-T series ") beyond, manufacture conductive film etc. similarly to Example 7, and evaluate.Result is shown in table 4.
Embodiment 11
Except 30 μm of nylon plate filters being changed to 50 μm of PO (polyolefin) box filters, (3M Amada Co., Ltd. manufactures, and product is called " Betapure
tMnT-T series ") beyond, manufacture conductive film etc. similarly to Example 7, and evaluate.Result is shown in table 4.
Comparative example 9
Except not filtering silver-colored fiber dispersion 1, manufacture conductive film etc. similarly to Example 7, and evaluate.Result is shown in table 4.
Comparative example 10
Except 30 μm of nylon plate filters being changed to 70 μm of PO box filters, (3M Amada Co., Ltd. manufactures, and product is called " Betapure
tMnT-T series ") beyond, manufacture conductive film etc. similarly to Example 7, and evaluate.Result is shown in table 4.
Utilizability in industry
Conductive film of the present utility model, conductive film volume, photoelectric sensitivity conductive film, photoelectric sensitivity conductive film roll, conducting film base material and device can in middle uses such as the devices such as display device, solar cell.
Above several execution modes of the present utility model and/or embodiment are described in detail, but to those skilled in the art, easily when substantially not departing from enlightenment and the effect of novelty of the present utility model, a large amount of changes is applied to these execution modes illustratively and/or embodiment.Therefore, these a large amount of changes are also contained in scope of the present utility model.
Content as the Japanese publication specification on the basis of the Paris Convention priority of the application is all quoted so far.
Claims (73)
1. a conductive film, it is the conductive film possessing support film and be arranged on the conductive layer containing metallic fiber in this support film, and wherein, the number of the metal agglomerates thing in described conductive layer is with every 9cm
2count less than 7.0.
2. conductive film according to claim 1, wherein, the number of described metal agglomerates thing is with every 9cm
2count less than 6.0.
3. conductive film according to claim 1, wherein, the number of described metal agglomerates thing is with every 9cm
2count less than 5.0.
4. conductive film according to claim 1, wherein, the number of described metal agglomerates thing is with every 9cm
2count less than 4.0.
5. conductive film according to claim 1, wherein, the number of described metal agglomerates thing is with every 9cm
2count less than 3.0.
6. conductive film according to claim 1, wherein, the number of described metal agglomerates thing is with every 9cm
2count less than 2.0.
7. conductive film according to claim 1, wherein, the number of described metal agglomerates thing is with every 9cm
2count more than 0.
8. conductive film according to claim 1, wherein, the number of described metal agglomerates thing is 6.0/10cm
2below.
9. conductive film according to claim 1, wherein, the number of described metal agglomerates thing is 5.0/10cm
2below.
10. conductive film according to claim 1, wherein, the number of described metal agglomerates thing is 4.0/10cm
2below.
11. conductive films according to claim 1, wherein, the number of described metal agglomerates thing is 3.0/10cm
2below.
12. conductive films according to claim 1, wherein, the number of described metal agglomerates thing is 2.0/10cm
2below.
13. conductive films according to claim 1, wherein, the number of described metal agglomerates thing is 0/10cm
2above.
14. conductive films according to claim 1, wherein, described metallic fiber is silver-colored fiber.
15. conductive films according to claim 1, wherein, the average fiber footpath of described metallic fiber is 1nm ~ 50nm.
16. conductive films according to claim 1, wherein, the average fiber footpath of described metallic fiber is 2nm ~ 20nm.
17. conductive films according to claim 1, wherein, the average fiber footpath of described metallic fiber is 3nm ~ 10nm.
18. conductive films according to claim 1, wherein, the average fiber length of described metallic fiber is 1 μm ~ 100 μm.
19. conductive films according to claim 1, wherein, the average fiber length of described metallic fiber is 2 μm ~ 50 μm.
20. conductive films according to claim 1, wherein, the average fiber length of described metallic fiber is 3 μm ~ 40 μm.
21. conductive films according to claim 1, wherein, the average fiber length of described metallic fiber is 5 μm ~ 35 μm.
22. conductive films according to claim 1, wherein, the thickness of described support film is 1 μm ~ 200 μm.
23. conductive films according to claim 1, wherein, the thickness of described support film is 5 μm ~ 150 μm.
24. conductive films according to claim 1, wherein, the thickness of described support film is 10 μm ~ 100 μm.
25. conductive films according to claim 1, wherein, the thickness of described support film is 15 μm ~ 60 μm.
26. conductive films according to claim 1, wherein, the thickness of described conductive layer is less than 1 μm.
27. conductive films according to claim 1, wherein, the thickness of described conductive layer is 1nm ~ 0.5 μm.
28. conductive films according to claim 1, wherein, the thickness of described conductive layer is 5nm ~ 0.1 μm.
29. conductive films according to claim 1, wherein, according to the mode stacked guard film contacted with the face of support film side opposite side with described conductive layer.
30. 1 kinds of conductive film volumes, it is obtained by being wound on by the conductive film according to any one of claim 1 ~ 29 on roller.
31. 1 kinds of photoelectric sensitivity conductive films, it is the photoelectric sensitivity conductive film possessing support film, be arranged on the conductive layer containing metallic fiber in this support film and be arranged on the photo-sensitive resin on this conductive layer, wherein, the number of the metal agglomerates thing in described conductive layer is with every 9cm
2count less than 7.0.
32. photoelectric sensitivity conductive films according to claim 31, wherein, the number of described metal agglomerates thing is with every 9cm
2count less than 6.0.
33. photoelectric sensitivity conductive films according to claim 31, wherein, the number of described metal agglomerates thing is with every 9cm
2count less than 5.0.
34. photoelectric sensitivity conductive films according to claim 31, wherein, the number of described metal agglomerates thing is with every 9cm
2count less than 4.0.
35. photoelectric sensitivity conductive films according to claim 31, wherein, the number of described metal agglomerates thing is with every 9cm
2count less than 3.0.
36. photoelectric sensitivity conductive films according to claim 31, wherein, the number of described metal agglomerates thing is with every 9cm
2count less than 2.0.
37. photoelectric sensitivity conductive films according to claim 31, wherein, the number of described metal agglomerates thing is with every 9cm
2count more than 0.
38. photoelectric sensitivity conductive films according to claim 31, wherein, the number of described metal agglomerates thing is 6.0/10cm
2below.
39. photoelectric sensitivity conductive films according to claim 31, wherein, the number of described metal agglomerates thing is 5.0/10cm
2below.
40. photoelectric sensitivity conductive films according to claim 31, wherein, the number of described metal agglomerates thing is 4.0/10cm
2below.
41. photoelectric sensitivity conductive films according to claim 31, wherein, the number of described metal agglomerates thing is 3.0/10cm
2below.
42. photoelectric sensitivity conductive films according to claim 31, wherein, the number of described metal agglomerates thing is 2.0/10cm
2below.
43. photoelectric sensitivity conductive films according to claim 31, wherein, the number of described metal agglomerates thing is 0/10cm
2above.
44. photoelectric sensitivity conductive films according to claim 31, wherein, described metallic fiber is silver-colored fiber.
45. photoelectric sensitivity conductive films according to claim 31, wherein, the average fiber footpath of described metallic fiber is 1nm ~ 50nm.
46. photoelectric sensitivity conductive films according to claim 31, wherein, the average fiber footpath of described metallic fiber is 2nm ~ 20nm.
47. photoelectric sensitivity conductive films according to claim 31, wherein, the average fiber footpath of described metallic fiber is 3nm ~ 10nm.
48. photoelectric sensitivity conductive films according to claim 31, wherein, the average fiber length of described metallic fiber is 1 μm ~ 100 μm.
49. photoelectric sensitivity conductive films according to claim 31, wherein, the average fiber length of described metallic fiber is 2 μm ~ 50 μm.
50. photoelectric sensitivity conductive films according to claim 31, wherein, the average fiber length of described metallic fiber is 3 μm ~ 40 μm.
51. photoelectric sensitivity conductive films according to claim 31, wherein, the average fiber length of described metallic fiber is 5 μm ~ 35 μm.
52. photoelectric sensitivity conductive films according to claim 31, wherein, the thickness of described support film is 1 μm ~ 200 μm.
53. photoelectric sensitivity conductive films according to claim 31, wherein, the thickness of described support film is 5 μm ~ 150 μm.
54. photoelectric sensitivity conductive films according to claim 31, wherein, the thickness of described support film is 10 μm ~ 100 μm.
55. photoelectric sensitivity conductive films according to claim 31, wherein, the thickness of described support film is 15 μm ~ 60 μm.
56. photoelectric sensitivity conductive films according to claim 31 or 44, wherein, described photo-sensitive resin contains binder polymer, has the photopolymerizable compound of ethylenic unsaturated bond and Photoepolymerizationinitiater initiater.
57. photoelectric sensitivity conductive films according to claim 31, wherein, the thickness of described conductive layer is less than 1 μm.
58. photoelectric sensitivity conductive films according to claim 31, wherein, the thickness of described conductive layer is 1nm ~ 0.5 μm.
59. photoelectric sensitivity conductive films according to claim 31, wherein, the thickness of described conductive layer is 5nm ~ 0.1 μm.
60. photoelectric sensitivity conductive films according to claim 31, wherein, the thickness of described photo-sensitive resin counts 1 ~ 50 μm with dried thickness.
61. photoelectric sensitivity conductive films according to claim 31, wherein, the thickness of described photo-sensitive resin counts 1 ~ 30 μm with dried thickness.
62. photoelectric sensitivity conductive films according to claim 31, wherein, the thickness of described photo-sensitive resin counts 1 ~ 15 μm with dried thickness.
63. photoelectric sensitivity conductive films according to claim 31, wherein, the thickness of described photo-sensitive resin counts 1 ~ 10 μm with dried thickness.
64. photoelectric sensitivity conductive films according to claim 31, wherein, according to the mode stacked guard film contacted with the face of support film side opposite side with described photo-sensitive resin.
65. 1 kinds of photoelectric sensitivity conductive film rolls, it is by the photoelectric sensitivity conductive winding film according to any one of claim 31 ~ 64 is obtained on roller.
66. 1 kinds of conducting film base materials, it possesses the conducting film on base material and this base material,
Described conducting film be by by the photoelectric sensitivity conductive film according to any one of claim 31 ~ 64 according to being laminated on base material with the closely sealed mode on base material of described photo-sensitive resin, active ray is irradiated to the described photo-sensitive resin on described base material and is formed.
67. 1 kinds of conducting film base materials, it possesses the conductive pattern on base material and this base material,
Described conductive pattern be by by the photoelectric sensitivity conductive film according to any one of claim 31 ~ 64 according to being laminated on base material with the closely sealed mode on base material of described photo-sensitive resin, active ray is irradiated to the established part of the described photo-sensitive resin on described base material, the unexposed portion development of described photo-sensitive resin and conductive layer is formed.
68. 1 kinds of devices, it possesses the conducting film base material described in claim 66 or 67.
69. devices according to claim 68, it is touch-screen.
70. devices according to claim 68, it is solar cell.
71. devices according to claim 68, it is panel display screen.
72. devices according to claim 68, it is capacitive touch panel.
73. devices according to claim 68, it is capacitive touch panel transducer.
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014118615 | 2014-06-09 | ||
| JP2014-118615 | 2014-06-09 | ||
| JP2014-187645 | 2014-09-16 | ||
| JP2014187645 | 2014-09-16 | ||
| JP2015-096867 | 2015-05-11 | ||
| JP2015096867A JP2016066590A (en) | 2014-06-09 | 2015-05-11 | Conductive film, photosensitive conductive film, method of forming conductive film, method of forming conductive pattern and conductive film substrate |
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|---|---|
| CN205080913U true CN205080913U (en) | 2016-03-09 |
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| CN201520393123.6U Expired - Fee Related CN205080913U (en) | 2014-06-09 | 2015-06-09 | Conductive thin film , conductive thin film book, photonasty conductive thin film , photonasty conductive thin film book, conductive film substrate and device |
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| CN (1) | CN205080913U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110402276A (en) * | 2017-03-14 | 2019-11-01 | 同和电子科技有限公司 | The manufacturing method of the good silver nanowires dispersion liquid of line property detached from each other |
| CN114702717A (en) * | 2022-05-12 | 2022-07-05 | 汪坤 | Antistatic super-hydrophobic BOPP plastic film and preparation method thereof |
-
2015
- 2015-06-09 CN CN201520393123.6U patent/CN205080913U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110402276A (en) * | 2017-03-14 | 2019-11-01 | 同和电子科技有限公司 | The manufacturing method of the good silver nanowires dispersion liquid of line property detached from each other |
| CN114702717A (en) * | 2022-05-12 | 2022-07-05 | 汪坤 | Antistatic super-hydrophobic BOPP plastic film and preparation method thereof |
| CN114702717B (en) * | 2022-05-12 | 2023-08-18 | 中山永宁薄膜制品有限公司 | Antistatic super-hydrophobic BOPP plastic film and preparation method thereof |
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