CN204065659U - For the manufacture of the transfer printing type photosensitive conductive film of the corrosion-resisting pattern on decorating board or conductive pattern - Google Patents
For the manufacture of the transfer printing type photosensitive conductive film of the corrosion-resisting pattern on decorating board or conductive pattern Download PDFInfo
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- CN204065659U CN204065659U CN201420444290.4U CN201420444290U CN204065659U CN 204065659 U CN204065659 U CN 204065659U CN 201420444290 U CN201420444290 U CN 201420444290U CN 204065659 U CN204065659 U CN 204065659U
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Abstract
The utility model provides transfer printing type photosensitive conductive film that to produce bubble when can suppress to form corrosion-resisting pattern or conductive pattern on the decorating board with difference of height, that preferably can use in the manufacture of corrosion-resisting pattern on decorating board or conductive pattern.Transfer printing type photosensitive conductive film possesses support membrane, the conducting film be arranged on described support membrane, be arranged on the photo-sensitive resin on described conducting film and be arranged on described photo-sensitive resin implement embossing processing diaphragm.
Description
Technical field
The utility model relates to the transfer printing type photosensitive conductive film for the manufacture of the corrosion-resisting pattern on decorating board or conductive pattern.Particularly relate to the transfer printing type photosensitive conductive film of the conductive pattern of the electrode wiring use that can manufacture the devices such as flat-panel monitors such as can be used as liquid crystal display cells, touch panel (touch-screen), solar cell, illumination.
Background technology
In the display device etc. of the miniaturized electronicss such as the large scale electronic equipment such as PC or televisor, auto-navigation system, mobile phone, e-dictionary, OA/FA equipment etc., liquid crystal display cells and touch panel are popularized.In recent years, towards the high performance of this middle-size and small-size liquid crystal panel, inquiring into the one-piece type touch panel of cover glass.
According to this mode, touch panel can be made up of cover glass in the past, touch panel and liquid crystal panel these 3 to be cut down into 2 and forms, and can predict the slimming of equipment and the reduction of manufacturing cost.In addition, due to without being required glass substrate or film substrate in touch panel in the past, therefore there is the advantage that boundary reflection reduces, visuality improves.
But the transparency electrode as touch panel forms material, uses ITO (tin indium oxide), indium oxide, tin oxide etc. in the past always, because they can demonstrate high transmissivity to visible ray.The electrode that the transparency electrode use arranged in substrate used for liquid crystal display element etc. is carried out Butut to the nesa coating be made up of above-mentioned material and obtained.
Ito film or tin oxide film are generally formed by sputtering method, but according to the kind etc. of the sputtering difference of mode, sputtering power or air pressure, substrate temperature, environmental gas, the character of nesa coating easily changes.In addition, in the method, there is following problems: evaporation cannot be carried out to difference of height (step) part, or when base material is PET film, base material shrinks because of heat during sputtering.
In recent years, attempted using the material substituting ITO, indium oxide and tin oxide etc. to form transparent conductive pattern.Such as disclose the formation method of following conductive pattern: on substrate, form the conducting film containing conducting fibres such as silver-colored fibers and on this conducting film, form photo-sensitive resin, carry out exposing, developing (with reference to patent documentation 1 or 2) across pattern mask above it.
Prior art document
Patent documentation
Patent documentation 1: No. 2010/021224th, International Publication
Patent documentation 2: No. 2013/051516th, International Publication
Utility model content
The technical matters that utility model will solve
But, the one-piece type touch panel of cover glass also directly forms electrode sometimes on the base material implementing several μm of decorations, when the photosensitive conductive film that above-mentioned patent documentation is recorded is fitted on this decorating board, film can not follow difference of height completely, bubble or be full of cracks enter between film and substrate, with its for main cause and exist broken string or the such problem of pattern cannot be formed.
The utility model completes in view of the above fact, its object is to provide transfer printing type photosensitive conductive film that to produce bubble when can suppress to form corrosion-resisting pattern or conductive pattern on the decorating board with difference of height, that preferably can use in the manufacture of corrosion-resisting pattern on decorating board or conductive pattern.
For the method for technical solution problem
The utility model provides following concrete mode.
<1> transfer printing type photosensitive conductive film, it possesses support membrane, the conducting film be arranged on described support membrane, be arranged on the photo-sensitive resin on described conducting film and be arranged on described photo-sensitive resin implement embossing processing diaphragm.
Transfer printing type photosensitive conductive film described in the above-mentioned <1> of <2>, wherein, the gross thickness of described conducting film and described photo-sensitive resin is more than 10 μm.
Transfer printing type photosensitive conductive film described in the above-mentioned <2> of <3>; wherein; the arithmetic average roughness Ra of the described photo-sensitive resin side of described diaphragm, when the thickness of described photo-sensitive resin is set to T, is more than 0.5 μm and less than 0.2T μm.
Transfer printing type photosensitive conductive film described in the above-mentioned <1> of <4>, its average transmittance in the wavelength region may of 400nm ~ 700nm is more than 80%.
Transfer printing type photosensitive conductive film described in the above-mentioned <2> of <5>, its average transmittance in the wavelength region may of 400nm ~ 700nm is more than 80%.
Transfer printing type photosensitive conductive film described in the above-mentioned <3> of <6>, its average transmittance in the wavelength region may of 400nm ~ 700nm is more than 80%.
<7> transfer printing type photosensitive conductive film volume, it possesses core and is wound on the transfer printing type photosensitive conductive film in described core, and described transfer printing type photosensitive conductive film is the transfer printing type photosensitive conductive film according to any one of above-mentioned <1> ~ <6>.
Utility model effect
According to the utility model, when can suppress to form corrosion-resisting pattern or conductive pattern on the decorating board with difference of height, produce bubble.
Accompanying drawing explanation
Fig. 1 is the schematic section of the embodiment representing the transfer printing type photosensitive conductive film that can use in the utility model.
Fig. 2 is the schematic section of the embodiment representing the transfer printing type photosensitive conductive film that can use in the utility model.
Fig. 3 is the partial cut stereographic map of the embodiment representing the transfer printing type photosensitive conductive film that can use in the utility model.
Fig. 4 is the schematic diagram representing a decorating board embodiment that can use in the utility model.
Fig. 5 represents the sectional view according to the utility model form of lamination transfer printing type photosensitive conductive film on decorating board.
Fig. 6 is the figure located represented when utilizing the interface of the decorating board of observation by light microscope embodiment and comparative example and transfer printing type photosensitive conductive film.
Fig. 7 represents the photo (embodiment 1) utilizing the decorating board of observation by light microscope Fig. 5 state and the interface of photosensitive conductive film.
Fig. 8 represents the photo (comparative example 1) utilizing the decorating board of observation by light microscope Fig. 5 state and the interface of photosensitive conductive film.
Symbol description
1 support membrane
2 conducting films
2a conductive pattern
3 photo-sensitive resins
3a resin-cured layer
4 photographic layers
5 implement embossing processing diaphragm
10,12 photosensitive conductive films
20 decorating boards
Embodiment
Below explain embodiment of the present utility model.
Fig. 1 is the schematic section of the embodiment representing the transfer printing type photosensitive conductive film that can use in the utility model.Transfer printing type photosensitive conductive film 10 shown in Fig. 1 has support membrane 1, is arranged on the photographic layer 4 on support membrane 1 and is arranged on the diaphragm 5 implementing embossing processing on photographic layer 4.Photographic layer 4 is made up of the conducting film 2 be arranged on support membrane 1 and the photo-sensitive resin 3 be arranged on conducting film 2.In addition, the transfer printing type photosensitive conductive film shown in Fig. 1 shows the form that photographic layer contains conducting fibre in the scope that the mask of the support membrane side of described photographic layer 4 is conductive.
Fig. 2 is the schematic section of the embodiment representing the transfer printing type photosensitive conductive film that can use in the utility model.Embodiment shown in Fig. 2 is except the shape difference implementing the face of embossing processing of diaphragm 5, identical with the embodiment shown in the Fig. 1 illustrated.As shown in Figures 1 and 2, the shape of embossing processing is not particularly limited.
As support membrane 1, can polymer film be used, preferably there is the polymer film of thermotolerance and solvent resistance.As this polymer film, such as, can enumerate polyethylene terephthalate film, polyethylene film, polypropylene screen, polycarbonate membrane.Wherein, from the view point of the transparency or thermotolerance, preferred polyethylene terephthalate film.
Above-mentioned polymer film, in order to peel off from photographic layer 4 easy afterwards, also can be passed through demoulding process.
The thickness of support membrane 1, from the view point of physical strength, is preferably more than 5 μm, is more preferably more than 10 μm, more preferably more than 15 μm.Be more than above-mentioned numerical value by making the thickness of support membrane 1, such as in the operation in order to form conducting film 2 and applying conductive dispersion liquid etc., in the operation in order to form photo-sensitive resin 3 and photosensitive resin coating composition or peel off in the operation of support membrane 1 from photographic layer 4, can prevent support membrane 1 from breaking.In addition, from the view point of the exploring degree fully guaranteeing conductive pattern when support membrane 1 pair of photo-sensitive resin 3 irradiates active ray, the thickness of support membrane 1 is preferably less than 100 μm, is more preferably less than 80 μm, more preferably less than 60 μm.
The haze value of support membrane 1 becomes good from the view point of making sensitivity and exploring degree, be preferably 0.01% ~ 5.0%, be more preferably 0.01% ~ 3.0%, more preferably 0.01 ~ % ~ 2.0%, be particularly preferably 0.01% ~ 1.5%.In addition, haze value can use haze meter (Japanese electricity Se Industrial Co., Ltd system; NDH-5000), measure according to JIS K 7105.
Conducting film 2 can containing at least a kind of electric conductor be selected from inorganic conductive body and organic conductor.As long as can obtain the electric conductivity of conducting film 2, then can be not particularly limited to use inorganic conductive body and organic conductor, these electric conductors can be used alone or combinationally use two or more.
As inorganic conductive body, metal fibre described later can be enumerated.As organic conductor, electric conductive polymer can be enumerated.As electric conductive polymer, at least a kind of electric conductor be selected from polythiophene, polythiofuran derivative, polyaniline and polyaniline derivative can be used.Such as, what can combinationally use in polyethylene dioxythiophene, poly-hexyl thiophene and polyaniline is one kind or two or more.When conducting film 2 is formed containing organic conductor, preferably containing organic conductor and photoresist.
Conducting film 2 is preferably containing conducting fibre.Contain conducting fibre by conducting film, electric conductivity and the transparency can be taken into account, can form that developability improves further, the conductive pattern of exploring degree excellence.
As above-mentioned conducting fibre, such as, can enumerate the carbon fibers etc. such as the metal fibre of gold, silver, copper, platinum etc., carbon nano-tube.They can be used alone or combinationally use two or more.From the view point of electric conductivity, preferably use golden fiber or silver-colored fiber, from the view point of the electric conductivity that easily can adjust conducting film, more preferably use silver-colored fiber.
Above-mentioned metal fibre is such as by utilizing the reductive agents such as NaBH4 the method for reducing metal ions or polyol process to be prepared.In addition, above-mentioned carbon nano-tube can use the commercially available products such as the Hipco single-layer carbon nano-tube of Unidym company.
The fiber footpath of conducting fibre is preferably 1nm ~ 50nm, is more preferably 2nm ~ 20nm, more preferably 3nm ~ 10nm.In addition, the fiber of conducting fibre long be preferably 1 μm ~ 100 μm, be more preferably 2 μm ~ 50 μm, more preferably 3 μm ~ 10 μm.Fiber footpath and fiber length measure by scanning electron microscope.
Fig. 3 is the partial cut stereographic map of the embodiment representing the transfer printing type photosensitive conductive film that can use in the utility model.The photographic layer 4 that transfer printing type photosensitive conductive film 12 shown in Fig. 3 has support membrane 1 and is arranged on support membrane 1.Photographic layer 4 is made up of the conducting film 2 be arranged on support membrane 1 and the photo-sensitive resin 3 be arranged on conducting film 2.Conducting film 2 as shown in Figure 3, preferably has the cross-linked structure of the Contact of conducting fibre.The conducting film 2 with this cross-linked structure can be formed on the surface of support membrane 1 side of photo-sensitive resin 3, but if the surface of the photographic layer 4 exposed when peeling off support membrane 1 can obtain electric conductivity along its direction, face, the form that then also can enter in conducting film 2 with a part for photo-sensitive resin 3 is formed, and can also be formed with the form containing conducting film 2 in the top layer of support membrane 1 side of photo-sensitive resin 3.
Conducting film 2 is such as formed as follows: be coated on support membrane 1 by the electric conductor dispersion liquid containing more than one in above-mentioned inorganic conductive body and organic conductor, water or the dispersion stabilizer such as organic solvent and surfactant as required or electric conductor solution, carry out drying afterwards and formed.Coating such as can utilize the known methods such as the painting of rolling method, comma rubbing method, gravure coating process, air knife coating method, mould method, stick coating method, spraying process to carry out.In addition, drying can at 30 DEG C ~ 150 DEG C, utilize hot wind convection type dryer etc. to carry out about 1 ~ 30 minute.In conducting film 2, inorganic conductive body or organic conductor also can coexist with surfactant or dispersion stabilizer.Conducting film 2 also can be by multiple electric conductor dispersion liquid or electric conductor solution being coated on successively on support membrane 1 and the conducting film that forms of the multiple films carrying out drying and obtain.
The thickness of conducting film 2 is different according to the purposes of formed conductive pattern or required electric conductivity, is preferably less than 1 μm, is more preferably 1nm ~ 0.5 μm, more preferably 5nm ~ 0.1 μm.When the thickness of conducting film 2 is below 1 μm, the transmittance in the wavelength region may of 400 ~ 700nm is enough high, and patternability is also excellent, is particularly suitable for the making of transparency electrode.In addition, the thickness of conducting film 2 refers to the value utilizing scanning electron microscope photo to measure.
After support membrane 1 is formed conducting film 2, can photo-sensitive resin 3 be set further.In addition, also can as required the conducting film 2 being formed at support membrane 1 be laminated on the photo-sensitive resin 3 be arranged on substrate.
Photo-sensitive resin 3 can be formed by the photosensitive polymer combination of the photopolymerizable compound and (c) Photoepolymerizationinitiater initiater that have ethylenic unsaturated link containing (a) binder polymer, (b).Photo-sensitive resin 3, by containing mentioned component, can improve cementability and the patternability of substrate and conductive pattern further.These materials can be not particularly limited to use known material.
The thickness of photographic layer 4 is different according to purposes, be preferably 5 μm ~ 50 μm with dried thickness gauge, be more preferably 10 μm ~ 50 μm, more preferably 10 μm ~ 40 μm, be particularly preferably 12 μm ~ 40 μm, be extremely preferably 14 μm ~ 35 μm.When this thickness is more than 5 μm, can tracing ability be laminated to well there are less than 5 μm differences of height decorating board on, when thickness is more than 10 μm, lamination can be carried out better by tracing ability.That is, when being more than 2X relative to the difference of height X of described decorating board, the thickness of described photographic layer, lamination can be carried out better by tracing ability, during for more than 3X, lamination can be carried out well by tracing ability further.
From the view point of light transmission, the thickness of photographic layer 4 is preferably less than 50 μm, is more preferably less than 40 μm, more preferably less than 35 μm.Preferred from the viewpoint of the photo-curable of photographic layer 4.The thickness of photographic layer 4 can utilize scanning electron microscope to measure.
In photosensitive conductive film 10, the average transmittance in the wavelength region may of the preferred 400nm ~ 700nm of photographic layer 4 (duplexer of above-mentioned conducting film 2 and above-mentioned photo-sensitive resin 3) is more than 80%, is more preferably more than 85%.When photographic layer 4 meets this condition, the transparency of display pannel etc. improves further.
For transfer printing type photosensitive conductive film of the present utility model, the mode contacted according to the face of the opposition side, support membrane side with photographic layer arranges the diaphragm implementing embossing and process further.In addition, the shape of embossing processing also can be the shape except shape shown in Fig. 1 or Fig. 2.By using the film implementing embossing processing, fine drawing decorative pattern can be transferred on the surface of photographic layer resin bed 3, air duct during crimping can be formed.
As diaphragm, the polymer film with thermotolerance and solvent resistance with surfaceness can be used.As polymer film, polyethylene terephthalate film, polypropylene screen, polyethylene film etc. can be enumerated.In addition, as diaphragm, also the polymer film identical with above-mentioned support membrane can be used.
The diaphragm with surfaceness such as by between the metallic roll of the decorative pattern etc. of the so-called wrinkle that made stretching polyethylene film in surface working and rubber rollers by obtaining.The film of acquisition like this is referred to as wrinkle processing of films or embossing processing of films etc.In addition, be dispersed in the diaphragm that also can obtain in film and there is surfaceness with making particulate homogenous.Obtain the method with the diaphragm of surfaceness and be not defined in these methods.
Shaggy shape is not particularly limited (such as with reference to Fig. 1 or Fig. 2); but the concavo-convex surfaceness in the face contacted with photographic layer of described diaphragm is from the view point of the bubble suppressing to produce during lamination; in arithmetic average roughness (Ra); when the thickness of photographic layer 4 is set to T; be preferably more than 0.5 μm and less than 0.2T μm; be more preferably more than 1.0 μm and less than 0.2T μm, more preferably more than 1.1 μm and less than 0.2T μm.
The arithmetic average roughness (Ra) of diaphragm 5 is defined by JIS B0601:2013, such as, can measure according to following order.
A () cuts out the working sample of 5cm × 10cm from diaphragm.
B () utilizes suction pipe to drip 1 and drops in after on smooth glass substrate (10cm × 10cm), utilize clearer by working sample crimping on the glass substrate according to the mode not entering bubble.
C () utilizes pressing plate to be fixed at the length direction two ends of working sample, select arbitrarily the mensuration region (regions of 284.1 μm × 213.1 μm) in 10 place's working samples.
D () uses measuring shape laser microscope (VK-X200, KEYENCE Co., Ltd. system), with object lens 50 times of Observe and measure regions, Simultaneously test arithmetic average roughness (Ra) and maximum height (Rmax), then calculate the mean value at 10 places altogether.
E () carries out above-mentioned operation (a) ~ (d) repeatedly, amount to acquisition 3 measured values, adopts the mean value of 3 times repeatedly as arithmetic average roughness (Ra).
The thickness of diaphragm is preferably 1 μm ~ 100 μm, be more preferably 5 μm ~ 50 μm, more preferably 5 μm ~ 40 μm, be particularly preferably 15 μm ~ 30 μm.The thickness of diaphragm is preferably more than 1 μm from the aspect of mechanical strength, is preferably less than 100 μm from becoming less expensive aspect.
In order to easily be peeled off from photo-sensitive resin 3 by diaphragm, the bonding force between diaphragm and photo-sensitive resin 3 is preferably less than the bonding force between support membrane 1 and photographic layer 4 (conducting film 2 and photo-sensitive resin 3).
In addition, contained in the preferred diaphragm of diaphragm diameter is the fish-eye number of more than 80 μm is 5/m
2below.It should be noted that, " flake " be material is carried out heat fusing, utilize mixing, extrude, biaxial stretch-formed, the tape casting etc. when manufacturing film, the foreign matter of material, non-dissolved matter, oxidative degradation thing etc. enter into film and produce.
Use from the view point of in the touch panel purposes etc. requiring the transparency, the average transmittance of transfer printing type photosensitive conductive film 10 in the wavelength region may of 400nm ~ 700nm is preferably more than 80%, is more preferably more than 85%.Transmittance can utilize UV spectrometer (such as Hitachi Co., Ltd's system, 228A type W beam spectrophotometer and ultraviolet-visible pectrophotometer (U-3310)), haze meter (such as Japanese electricity Se Industrial Co., Ltd system, goods name " NDH5000 ") etc. to measure.
Photosensitive conductive film 10 such as can store with the form of web-like with the flat form of former state or be wound in cylindric etc. core.
In an embodiment of the present utility model, transfer printing type photosensitive conductive film volume possesses core and is wound on the transfer printing type photosensitive conductive film in described core, and described transfer printing type photosensitive conductive film is the transfer printing type photosensitive conductive film of the present utility model illustrated.In addition, be now preferably in outermost mode according to support membrane 1 and reel.
As core, as long as being then not particularly limited of using in the past, the plastics such as polyvinyl resin, acrylic resin, polystyrene resin, Corvic, ABS resin (acrylonitrile-butadiene-styrene copolymer) can be enumerated.In addition, from the view point of end face protection, preferably end face spacer is set at the end face of the photosensitive conductive film of wound into rolls, and then from the view point of resistance to Fusion Edges, damp proof end face spacer is preferably set.In addition, when bale packing photosensitive conductive film, be preferably packaged in the little black sheet of moisture-penetrability.
In an embodiment of the present utility model, transfer printing type photosensitive conductive film preferably possesses support membrane, the conducting film be arranged on described support membrane, be arranged on the photo-sensitive resin on described conducting film and be arranged on the transfer printing type photosensitive conductive film of diaphragm implementing embossing processing on described photo-sensitive resin.By having this formation, transparent electrode pattern excellent in reliability can be formed.In addition, the gross thickness of described conducting film and described photo-sensitive resin is more preferably more than 10 μm.
The decorating board that can use in the utility model, except having difference of height, is not particularly limited.
Fig. 4 is the schematic diagram of the embodiment representing the decorating board that can use in the utility model.
As decorating board 20, the plastic bases such as glass substrate, cyclo-olefin-polymer films, polyethylene terephthalate, polycarbonate can be enumerated.The thickness X of the difference of height of decorating board 20 suitably can be selected according to application target.
Decorating board is the substrate of decoration difference of height substrate being implemented to several μm, and this difference of height requires to be about 10 μm usually, is more preferably less than 10 μm, more preferably less than 5 μm, more preferably less than 3 μm again.
Relative to difference of height X, the thickness of photographic layer 4 is preferably more than 1.5X, is more preferably more than 2X, more preferably more than 3X.
Minimum transmittance in the wavelength region may of the preferred 400nm ~ 700nm of decorating board 20 is more than 80%.Decorating board 20 is when meeting this condition, and the high brightness in display pannel etc. becomes easy.
The lamination of transfer printing type photosensitive conductive film on decorating board carries out preferably by vacuum lamination.Lamination operation such as can be enumerated and be heated while photographic layer 4 side pressure be connected on substrate 20 and carry out stacked method after removing diaphragm by transfer printing type photosensitive conductive film 10.This operation, from the position of the removing of adaptation, tracing ability and entrapped air pockets, is under reduced pressure carried out stacked.Degree of decompression is preferably below 10hPa, but is not particularly limited to this condition.
Photographic layer resin 3 and/or decorating board 20 are preferably heated to 70 DEG C ~ 130 DEG C, preferably make crimping pressure be about 0.1MPa ~ 1.0MPa (1kgf/cm by transfer printing type photosensitive conductive film 10 stacked
2~ 10kgf/cm
2left and right), but be not particularly limited to these conditions.In addition, if photo-sensitive resin 3 is heated to 70 DEG C ~ 130 DEG C as mentioned above, then there is no need to carry out thermal pretreatment to decorating board 20 in advance, but in order to improve stackability further, also can carry out the thermal pretreatment of decorating board 20.
Fig. 5 represents the sectional view according to the utility model form of lamination transfer printing type photosensitive conductive film on decorating board.
Method according to the present embodiment, arranging photographic layer 4 by being laminated on decorating board 20 by the transfer printing type made in addition photosensitive conductive film 10, can be formed on decorating board 20 by photographic layer 4 more easily, can seek the raising of throughput rate.
By using transfer printing type photosensitive conductive film of the present utility model to be laminated on decorating board, conductive pattern can be formed on decorating board.Afterwards, irradiate the exposure process of active ray by the established part of the photosensitive layer to the transfer printing type photosensitive conductive film be laminated on decorating board and after described exposure process, the part beyond the described established part of described photographic layer removed, can conductive pattern be formed.
The condition of exposure process and developing procedure can adjust with reference to the content of above-mentioned patent documentation 1 and 2.
The electronic unit had with the decorating board of conductive pattern formed by the utility model is reduced due to the situation producing bubble when lamination, therefore can suppress the broken string etc. of transparency electrode, become the electronic unit that reliability is high.
Embodiment
Specifically describe the utility model according to embodiment below, but the utility model is not defined in this.
(embodiment 1)
The making > of < transfer printing type photosensitive conductive film
[making of conducting film (conducting film of photosensitive conductive film) W1]
Relative to nano silver wire dispersion soln (Cambrios Co., Ltd. system, ClearOhm Ink-A AQ) every 30 mass parts, add ultrapure water (Wako Pure Chemical Industries, Ltd.'s system, ultrapure water Ultrapure Water) 70 mass parts, rust preventive (Cambrios Co., Ltd. system, ClearOhm SFT-D) 0.12 mass parts, prepare conducting film formation coating.With 30g/m on 50 μm of thick polyethylene terephthalates (Co., Ltd.'s system, trade name " A1517 " are spun by PET film, Japan)
2be coated with this conducting film formation coating equably, utilize the hot wind convection type dryer of 50 DEG C dry 30 minutes, form conducting film W1.The dried thickness of conducting film is 0.1 μm.
[making of the solution X1 of photosensitive polymer combination]
Use stirring machine that the material shown in table 1 is mixed 15 minutes, make the solution X1 of photosensitive polymer combination.
Table 1
Acryl resin A: methacrylic acid/methyl methacrylate/ethyl acrylate/styrene=20/50/20/10, weight-average molecular weight are 80,000
TMPTA: trimethylolpropane triacrylate (chemical industry Co., Ltd. of Xin Zhong village system, trade name)
TPO:2,4,6-trimethylbenzoy-dipheny-phosphine oxide (BASF Co., Ltd. system, trade name " LUCIRIN TPO ")
OFS6030: γ-methacryloxypropyl trimethoxy silane (DOW CORNING TORAY Co., Ltd. system, trade name)
8032 ADDITIVE: octamethylcy-clotetrasiloxane (DOW CORNING TORAY Co., Ltd. system, trade name)
[making of photosensitive conductive film V1]
The solution X1 of photosensitive polymer combination is coated on above-mentioned conducting film W1 equably, utilizes the hot wind convection type dryer of 100 DEG C dry 10 minutes, form photo-sensitive resin.After the drying of the photographic layer be made up of conducting film and photo-sensitive resin, thickness is 15 μm.And then; for the transfer printing type photosensitive conductive film possessing the diaphragm (Okura Industrial Co., Ltd.'s system, trade name T-5N, surface roughness Ra are 1.2 μm) implementing embossing processing on described photographic layer; after diaphragm is peeled off removing; photo-sensitive resin side is layered on the decorating board with 5 μm of differences of height, utilizes vacuum laminator (name mechanism makes made, upper lower hot pressing board temperature: 110 DEG C, laminate surface pressure: 0.5MPa) to implement heat lamination with vacuum time 20 seconds, 30 seconds pressing times.Afterwards, when utilizing the interface of observation by light microscope decorating board and transfer printing type photosensitive conductive film, have no bubble in the ornamental portion or its periphery being easy to residual bubble.In addition, locating is 6 places shown in Fig. 6, evaluates by following standard.
In A: Fig. 61 ~ 3 all has no bubble and occurs.
In in B: Fig. 61 ~ 3,2 places have no bubble generation.
In in C: Fig. 61 ~ 3,1 place has no bubble generation.
Bubble is all had to occur in D: Fig. 61 ~ 3.
The mensuration > of < surfaceness
According to the arithmetic average roughness (Ra) on the two sides of following sequential determination diaphragm.
A () cuts out the working sample of 5cm × 10cm from diaphragm.
B () utilizes suction pipe to drip 1 and drops in after on smooth glass substrate (10cm × 10cm), utilize clearer by working sample crimping on the glass substrate according to the mode not entering bubble.
C () utilizes pressing plate to be fixed at the length direction two ends of working sample, select arbitrarily the mensuration region (regions of 284.1 μm × 213.1 μm) in 10 place's working samples.
D () uses measuring shape laser microscope (VK-X200, KEYENCE Co., Ltd. system), with object lens 50 times of Observe and measure regions, Simultaneously test arithmetic average roughness (Ra), then calculates the mean value at 10 places altogether.
E () carries out above-mentioned operation (a) ~ (d) repeatedly, amount to acquisition 3 measured values, adopts the mean value of 3 times repeatedly as arithmetic average roughness (Ra).
[the conducting evaluation after transfer printing type photosensitive conductive film V1 is transferred to decorating board]
The closely sealed wiring diagram with the wide transparent electrode pattern for 1mm/1mm of live width/spacing on the support membrane 1 being laminated to the transfer printing type photosensitive conductive film V1 on above-mentioned decorating board.Then, parallel rays exposure machine (Co., Ltd. O rc makes made, EXM1201) is used, from support film side (above photosensitive conductive film conducting film) with exposure 5 × 10
2j/m
2(measured value under i ray) irradiation ultraviolet radiation.
After exposure, placing after 15 minutes under room temperature (23 DEG C ~ 25 DEG C), support membrane is removed, then by spraying 1 quality % aqueous sodium carbonate 30 seconds at 30 DEG C, developing.By development, decorating board forms the wide conductive pattern for 1/1mm of live width/spacing.
Then, at the two ends of difference of height part, printing silver sticks with paste (Co., Ltd.'s system, DW-117H-41 spin in Japan), utilizes box like dryer to heat 30 minutes at 120 DEG C, and silver is stuck with paste solidification.
Then, use noncontact ohmer (Napson Co., Ltd. system, EC-80P), confirm the conducting at the two ends of difference of height part.Show the result in table 2.
(embodiment 2 ~ 6, comparative example 1 ~ 4)
Change over the condition that table 2 is recorded, evaluate similarly to Example 1.Show the result in table 2.In addition, in comparative example 1 ~ 4, as diaphragm, use polyethylene film (Tamapoly Co., Ltd. system, trade name " NF-13 ").
By embodiment 1 and comparative example 1 are utilized 6 places shown in the decorating board of observation by light microscope Fig. 5 state and Fig. 6 of photosensitive conductive film the photo that obtains be shown in Fig. 7 and Fig. 8.
Utilizability in industry
The utility model is by carrying out vacuum lamination to the transfer printing type photosensitive conductive film 10 possessing the diaphragm implementing embossing processing, utilizing operation in the past can form the gimmick of electrode pattern on decorating board, can expect the expansion in the touch panel of OGS type (one glass solution: one-piece type also referred to as cover glass) or the OPS type (one plastic solution) that can increase to some extent in demand from now on of can predicting.
Claims (7)
1. a transfer printing type photosensitive conductive film, it possesses support membrane, the conducting film be arranged on described support membrane, be arranged on the photo-sensitive resin on described conducting film and be arranged on described photo-sensitive resin implement embossing processing diaphragm.
2. transfer printing type photosensitive conductive film according to claim 1, wherein, the gross thickness of described conducting film and described photo-sensitive resin is more than 10 μm.
3. transfer printing type photosensitive conductive film according to claim 2, wherein, the arithmetic average roughness Ra of the described photo-sensitive resin side of described diaphragm, when the thickness of described photo-sensitive resin is set to T, is more than 0.5 μm and less than 0.2T μm.
4. transfer printing type photosensitive conductive film according to claim 1, its average transmittance in the wavelength region may of 400nm ~ 700nm is more than 80%.
5. transfer printing type photosensitive conductive film according to claim 2, its average transmittance in the wavelength region may of 400nm ~ 700nm is more than 80%.
6. transfer printing type photosensitive conductive film according to claim 3, its average transmittance in the wavelength region may of 400nm ~ 700nm is more than 80%.
7. a transfer printing type photosensitive conductive film volume, it possesses core and is wound on the transfer printing type photosensitive conductive film in described core, and described transfer printing type photosensitive conductive film is the transfer printing type photosensitive conductive film according to any one of claim 1 ~ 6.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-164104 | 2013-08-07 | ||
| JP2013164104 | 2013-08-07 | ||
| JP2014-136780 | 2014-07-02 | ||
| JP2014136780A JP2015052774A (en) | 2013-08-07 | 2014-07-02 | Method for manufacturing resist pattern or conductive pattern on decorative substrate, and transfer type photosensitive conductive film |
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| CN204065659U true CN204065659U (en) | 2014-12-31 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107250958A (en) * | 2015-03-24 | 2017-10-13 | 富士胶片株式会社 | Transfer film, the electrode diaphragm of capacitive input device, layered product, the manufacture method of layered product and capacitive input device |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107250958A (en) * | 2015-03-24 | 2017-10-13 | 富士胶片株式会社 | Transfer film, the electrode diaphragm of capacitive input device, layered product, the manufacture method of layered product and capacitive input device |
| US10649590B2 (en) | 2015-03-24 | 2020-05-12 | Fujifilm Corporation | Transfer film, electrode protective film for electrostatic capacitance-type input device, laminate, method for manufacturing laminate, and electrostatic capacitance-type input device |
| CN107250958B (en) * | 2015-03-24 | 2020-07-28 | 富士胶片株式会社 | Transfer film, electrostatic capacitance type input device, protective film for electrode thereof, laminate, and method for manufacturing laminate |
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