CN205071082U - High heat dissipation cell -phone structure with blocking function - Google Patents
High heat dissipation cell -phone structure with blocking function Download PDFInfo
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- CN205071082U CN205071082U CN201520877117.8U CN201520877117U CN205071082U CN 205071082 U CN205071082 U CN 205071082U CN 201520877117 U CN201520877117 U CN 201520877117U CN 205071082 U CN205071082 U CN 205071082U
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- mainboard
- heat radiation
- nanometer copper
- aluminium alloy
- fore shell
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Abstract
The utility model discloses a high heat dissipation cell -phone structure with blocking function, shell including the aluminum alloy before is located before this aluminum alloy the upper end of shell and sets up a battery cover, set up a mainboard in the installation cavity before the aluminum alloy in the middle of shell and the battery cover, the up end of mainboard is provided with the more than one mainboard chip that generates heat, is located every mainboard and generates heat the upper end of chip and all set up a screening cover, rectifying on the screening cover and generating heat the chip position to the mainboard and set up a through -hole, set up a series thermal silica in this through -hole, the screening cover sets up a nanometer copper graphite radiating sheet with series thermal silica's up end. The utility model discloses a novel nanometer copper synthetic graphite material passes through series thermal silica with the source that generates heat on mainboard and the mainboard and is connected with nanometer copper graphite radiating sheet through the trompil of double -shielded cover to ground connection is realized to the shell before adopting radium carver skill and aluminum alloy with nanometer copper graphite radiating sheet, and overall structure has the comprehensive properties who shields with ground connection concurrently when having good heat conduction, heat dispersion.
Description
Technical field
The utility model relates to a kind of height heat radiation handset structure with function of shielding.
Background technology
Along with handset use continuous increase, use day by day universal, mobile phone has become the necessity of people's daily life.And smart mobile phone is following developing direction, its communication dominant frequency is high, and long-time use can produce amount of heat, and when acknowledge(ment) signal is more weak, situation is more serious, causes mobile phone to run slowly the phenomenons such as even deadlock.Therefore, heating is the key factor affecting mobile phone useful life, solves mobile phone heat conduction, heat radiation and relevant issues and normally runs mobile phone very crucial.
Summary of the invention
Technical problem to be solved in the utility model be to provide a kind of there is excellent heat conduction, heat dispersion while, have concurrently the combination property of shielding & grounding have function of shielding height heat radiation handset structure.
The utility model is achieved through the following technical solutions: a kind of height heat radiation handset structure with function of shielding, comprise aluminium alloy fore shell, the upper end being positioned at this aluminium alloy fore shell arranges a battery cover, an installation cavity is formed between described battery cover and aluminium alloy fore shell, in the installation cavity of described aluminium alloy fore shell and battery cover centre, a mainboard is set, the upper surface of described mainboard is provided with more than one mainboard euthermic chip, the upper end being positioned at each mainboard euthermic chip all arranges a screening cover, and the lower end of described screening cover is installed on mainboard;
Screening cover is rectified a through hole is arranged to mainboard euthermic chip position, one heat conductive silica gel is set in this through hole, the lower surface of described heat conductive silica gel and the upper surface of mainboard euthermic chip offset, described screening cover is concordant mutually with the upper surface of heat conductive silica gel, the upper surface of screening cover and heat conductive silica gel arranges a Nanometer Copper graphite heat radiation fin, and the lower surface of described Nanometer Copper graphite heat radiation fin and the upper surface of screening cover and heat conductive silica gel offset.
As preferred technical scheme, the side of described Nanometer Copper graphite heat radiation fin arranges a dogleg section, the bottom of dogleg section and the upper surface of aluminium alloy fore shell offset, and the contact position radium of Nanometer Copper graphite heat radiation fin and aluminium alloy fore shell is carved, and realizes the ground connection of aluminium alloy fore shell and mainboard.
As preferred technical scheme, the upper end of described Nanometer Copper graphite heat radiation fin is with Copper Foil.
As preferred technical scheme, the L-shaped shape of this dogleg section described.
The beneficial effects of the utility model are: the utility model adopts novel employing Nanometer Copper Prof. Du Yucang graphite material, pyrotoxin on mainboard and mainboard is connected with Nanometer Copper graphite heat radiation fin through the perforate of double shield cover by heat conductive silica gel, and adopt radium carver's skill and aluminium alloy fore shell to be grounded Nanometer Copper graphite heat radiation fin, overall structure, while having excellent heat conduction, heat dispersion, has the combination property of shielding & grounding concurrently.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is overall structure schematic diagram of the present utility model.
Embodiment
All features disclosed in this specification, or the step in disclosed all methods or process, except mutually exclusive feature and/or step, all can combine by any way.
Arbitrary feature disclosed in this specification (comprising any accessory claim, summary and accompanying drawing), unless specifically stated otherwise, all can be replaced by other equivalences or the alternative features with similar object.That is, unless specifically stated otherwise, each feature is an example in a series of equivalence or similar characteristics.
As shown in Figure 1, a kind of height heat radiation handset structure with function of shielding of the present utility model, comprise aluminium alloy fore shell 4, the upper end being positioned at this aluminium alloy fore shell 4 arranges a battery cover 2, an installation cavity is formed between described battery cover 2 and aluminium alloy fore shell 4, in the installation cavity that described aluminium alloy fore shell 4 is middle with battery cover 2, a mainboard 6 is set, the upper surface of described mainboard 6 is provided with more than one mainboard euthermic chip 5, the upper end being positioned at each mainboard euthermic chip 5 all arranges a screening cover 8, and the lower end of described screening cover 8 is installed on mainboard 6;
Screening cover 8 is rectified a through hole is arranged to mainboard euthermic chip 5 position, one heat conductive silica gel 7 is set in this through hole, the lower surface of described heat conductive silica gel 7 and the upper surface of mainboard euthermic chip offset, described screening cover 8 is concordant mutually with the upper surface of heat conductive silica gel 7, screening cover 8 arranges a Nanometer Copper graphite heat radiation fin 1 with the upper surface of heat conductive silica gel 7, and the lower surface of described Nanometer Copper graphite heat radiation fin 1 and the upper surface of screening cover and heat conductive silica gel offset.
Wherein, the side of Nanometer Copper graphite heat radiation fin arranges a dogleg section 3, and the bottom of dogleg section 3 and the upper surface of aluminium alloy fore shell offset, and the contact position radium of Nanometer Copper graphite heat radiation fin and aluminium alloy fore shell is carved, realize the ground connection of aluminium alloy fore shell and mainboard, the L-shaped shape of this dogleg section.
On aluminium alloy after relevant position radium carving, realize the ground connection between aluminium alloy fore shell and mainboard, there is ground protection function, use safer.
The upper end of Nanometer Copper graphite heat radiation fin 1 is with Copper Foil, and after Copper Foil, it has shielding action to the perforate of screening cover.
Because Nanometer Copper graphite heat radiation fin upper end is with Copper Foil, therefore this structure has the superior point of easy accessibility concurrently, and hardness increases, and easy disassembly, there will not be the phenomenon of wrinkling foaming, reusable after folding.
Operation principle: the heat that mainboard and mainboard euthermic chip produce transmits out by the heat conductive silica gel between pyrotoxin and Nanometer Copper graphite heat radiation fin fast, effective quick heat radiating, prevent the situation of the too fast rising of pyrotoxin short period heat accumulation temperature, successful.
The beneficial effects of the utility model are: the utility model adopts novel employing Nanometer Copper Prof. Du Yucang graphite material, pyrotoxin on mainboard and mainboard is connected with Nanometer Copper graphite heat radiation fin through the perforate of double shield cover by heat conductive silica gel, and adopt radium carver's skill and aluminium alloy fore shell to be grounded Nanometer Copper graphite heat radiation fin, overall structure, while having excellent heat conduction, heat dispersion, has the combination property of shielding & grounding concurrently.
The above, be only embodiment of the present utility model, but protection range of the present utility model is not limited thereto, and any change of expecting without creative work or replacement, all should be encompassed within protection range of the present utility model.Therefore, the protection range that protection range of the present utility model should limit with claims is as the criterion.
Claims (4)
1. one kind has the height heat radiation handset structure of function of shielding, it is characterized in that: comprise aluminium alloy fore shell, the upper end being positioned at this aluminium alloy fore shell arranges a battery cover, an installation cavity is formed between described battery cover and aluminium alloy fore shell, in the installation cavity of described aluminium alloy fore shell and battery cover centre, a mainboard is set, the upper surface of described mainboard is provided with more than one mainboard euthermic chip, and the upper end being positioned at each mainboard euthermic chip all arranges a screening cover, and the lower end of described screening cover is installed on mainboard;
Screening cover is rectified a through hole is arranged to mainboard euthermic chip position, one heat conductive silica gel is set in this through hole, the lower surface of described heat conductive silica gel and the upper surface of mainboard euthermic chip offset, described screening cover is concordant mutually with the upper surface of heat conductive silica gel, the upper surface of screening cover and heat conductive silica gel arranges a Nanometer Copper graphite heat radiation fin, and the lower surface of described Nanometer Copper graphite heat radiation fin and the upper surface of screening cover and heat conductive silica gel offset.
2. the height heat radiation handset structure with function of shielding according to claim 1, it is characterized in that: the side of described Nanometer Copper graphite heat radiation fin arranges a dogleg section, the bottom of dogleg section and the upper surface of aluminium alloy fore shell offset, the contact position radium of Nanometer Copper graphite heat radiation fin and aluminium alloy fore shell is carved, and realizes the ground connection of aluminium alloy fore shell and mainboard.
3. the height heat radiation handset structure with function of shielding according to claim 1, is characterized in that: the upper end of described Nanometer Copper graphite heat radiation fin is with Copper Foil.
4. the height heat radiation handset structure with function of shielding according to claim 2, is characterized in that: the L-shaped shape of this dogleg section described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520877117.8U CN205071082U (en) | 2015-11-05 | 2015-11-05 | High heat dissipation cell -phone structure with blocking function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520877117.8U CN205071082U (en) | 2015-11-05 | 2015-11-05 | High heat dissipation cell -phone structure with blocking function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205071082U true CN205071082U (en) | 2016-03-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201520877117.8U Active CN205071082U (en) | 2015-11-05 | 2015-11-05 | High heat dissipation cell -phone structure with blocking function |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106793723A (en) * | 2016-11-13 | 2017-05-31 | 上海与德信息技术有限公司 | Radome, circuit board assemblies, the method for implanting of heat conductive silica gel and system |
| CN107529320A (en) * | 2017-09-04 | 2017-12-29 | 广东欧珀移动通信有限公司 | A kind of electronic equipment, housing unit and circuit board assemblies |
| CN107580449A (en) * | 2017-09-21 | 2018-01-12 | 广东欧珀移动通信有限公司 | Radome, radiating subassembly and electronic equipment |
| CN107592772A (en) * | 2017-08-24 | 2018-01-16 | 深圳禾苗通信科技有限公司 | A kind of the CPU radiator structures and its manufacture craft in scolding tin filling gap |
| CN107757030A (en) * | 2017-11-29 | 2018-03-06 | 李国强 | A kind of heat radiating type smart mobile phone |
| CN107820359A (en) * | 2016-09-14 | 2018-03-20 | 深圳市掌网科技股份有限公司 | A kind of main PCB A plates |
| CN108471695A (en) * | 2018-04-02 | 2018-08-31 | 广州三星通信技术研究有限公司 | Portable terminal |
| CN111148406A (en) * | 2019-12-31 | 2020-05-12 | 北京升哲科技有限公司 | Heat dissipation shielding system of Internet of things base station and Internet of things base station |
| CN112888284A (en) * | 2020-12-25 | 2021-06-01 | 重庆金山医疗机器人有限公司 | Shielding box, shielding structure and heat dissipation method |
-
2015
- 2015-11-05 CN CN201520877117.8U patent/CN205071082U/en active Active
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107820359A (en) * | 2016-09-14 | 2018-03-20 | 深圳市掌网科技股份有限公司 | A kind of main PCB A plates |
| CN106793723A (en) * | 2016-11-13 | 2017-05-31 | 上海与德信息技术有限公司 | Radome, circuit board assemblies, the method for implanting of heat conductive silica gel and system |
| CN107592772A (en) * | 2017-08-24 | 2018-01-16 | 深圳禾苗通信科技有限公司 | A kind of the CPU radiator structures and its manufacture craft in scolding tin filling gap |
| CN107529320A (en) * | 2017-09-04 | 2017-12-29 | 广东欧珀移动通信有限公司 | A kind of electronic equipment, housing unit and circuit board assemblies |
| CN107580449A (en) * | 2017-09-21 | 2018-01-12 | 广东欧珀移动通信有限公司 | Radome, radiating subassembly and electronic equipment |
| CN107757030A (en) * | 2017-11-29 | 2018-03-06 | 李国强 | A kind of heat radiating type smart mobile phone |
| CN108471695A (en) * | 2018-04-02 | 2018-08-31 | 广州三星通信技术研究有限公司 | Portable terminal |
| CN111148406A (en) * | 2019-12-31 | 2020-05-12 | 北京升哲科技有限公司 | Heat dissipation shielding system of Internet of things base station and Internet of things base station |
| CN112888284A (en) * | 2020-12-25 | 2021-06-01 | 重庆金山医疗机器人有限公司 | Shielding box, shielding structure and heat dissipation method |
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| C14 | Grant of patent or utility model | ||
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