CN205065446U - LED lighting device - Google Patents

LED lighting device Download PDF

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Publication number
CN205065446U
CN205065446U CN201520614257.6U CN201520614257U CN205065446U CN 205065446 U CN205065446 U CN 205065446U CN 201520614257 U CN201520614257 U CN 201520614257U CN 205065446 U CN205065446 U CN 205065446U
Authority
CN
China
Prior art keywords
metal substrate
led
light device
led light
led wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201520614257.6U
Other languages
Chinese (zh)
Inventor
叶林涛
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Lifeng Weichuang Technology Co Ltd
Original Assignee
Shenzhen Lifeng Weichuang Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Lifeng Weichuang Technology Co Ltd filed Critical Shenzhen Lifeng Weichuang Technology Co Ltd
Priority to CN201520614257.6U priority Critical patent/CN205065446U/en
Application granted granted Critical
Publication of CN205065446U publication Critical patent/CN205065446U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model is suitable for a lighting technology field provides a LED lighting device, including the metal substrate and with metal base plate electrically connected's LED wafer, the subsides of LED wafer are covered on the metal substrate to with metal base plate electrically connected. The utility model discloses a LED wafer covers on the metal substrate through direct subsides of solid brilliant mode, need not to use the support, has saved the material cost of support to and with the electric technology step of being connected of LED wafer and support, saved the manual work, and improved production efficiency, and the LED lamps and lanterns can be done very thinly, portable and depositing.

Description

A kind of LED light device
Technical field
The utility model belongs to lighting device technical field, particularly relates to a kind of LED light device.
Background technology
At present, the LED lamp bead that LED lamp uses, its wafer is fixed on support, by by support welding on metallic substrates, realizes the electrical connection of wafer and metal substrate.In other words, existing LED lamp necessarily uses support, but making support needs material and cost of labor, is fixed on by wafer on support and also needs human weld.On the other hand, after using support, the height of wafer can be increased, be unfavorable for that LED lamp is toward lightening development.In addition, the interface that existing LED lamp is not connected with USB, can not directly utilize the USB interface generally used at present to carry out powering or charging.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of LED light device, and being intended to solve LED lamp of the prior art needs to use support, and the material existed, cost of labor is high and be unfavorable for the problem of LED toward lightening development.
The utility model is achieved in that a kind of LED light device, the LED wafer comprising metal substrate and be electrically connected with metal substrate, and described LED wafer is covered on described metal substrate, and is electrically connected with described metal substrate.
Further, described LED light device also comprises USB interface, and described USB interface is electrically connected with described metal substrate.
Further, described metal substrate is covered with some equally distributed LED wafer, described LED wafer is coated with one deck packaging plastic.
Further, the shape of described some LED wafer formations is identical with the shape of incandescent lamp floor projection.
Further, described packaging plastic is milky material.
Further, described metal substrate is provided with a prism, and described USB interface protrudes described prism.
Further, described metal substrate is aluminium base.
Further, described metal substrate in the form of sheets.
Further, described metal substrate offers hanging hole.
The utility model compared with prior art, beneficial effect is: LED wafer of the present utility model is directly pasted on metallic substrates by the mode of die bond, without the need to using support, save the material cost of support, and by the processing step that LED wafer is electrically connected with support, save artificial, improve production efficiency, and LED lamp can be done very thin, is easy to carry and deposits.
Accompanying drawing explanation
Fig. 1 is the schematic front view of a kind of LED light device that the utility model embodiment provides.
Detailed description of the invention
In order to make technical problem to be solved in the utility model, technical scheme and beneficial effect clearly understand, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the utility model, and be not used in restriction the utility model.
As shown in Figure 1, be a preferred embodiment of the present utility model, a kind of LED light device, comprises metal substrate 1, the LED wafer 2 be electrically connected with metal substrate 1 and USB interface 3.LED wafer 2 is covered on metal substrate 1, and is electrically connected with metal substrate 1, and USB interface 3 is electrically connected with metal substrate 1.
The LED wafer 2 of the present embodiment is directly covered on metal substrate 1 by the mode of die bond, without the need to using support, save the material cost of support, and by processing step that LED wafer 2 is electrically connected with support, save artificial, improve production efficiency, and LED lamp can be done, and is easy to carry and deposits very thin.In addition, LED lamp of the present utility model is provided with USB interface 3, and the USB of electronic equipment can be utilized easily to power or charge.
Said metal substrates 1 is covered with some equally distributed LED wafer 2, LED wafer 2 is coated with one deck packaging plastic 4; Packaging plastic 4 preferentially selects milky material, thus light can be made soft, has the effect of eyeshield.
Metal substrate 1 in the form of sheets, in the back up advertisement of metal substrate 1 or personal information, thus can give client as postcard.In order to improve heat dispersion, metal substrate 1 aluminium substrate.
In order to cater to the cognition of consumer to conventional lamp, the shape that some LED wafer 2 are formed is identical with the shape of incandescent lamp floor projection.Thus when lamp lighting, its luminous shape is just as traditional incandescent lamp.
Metal substrate 1 is provided with a prism 11, and USB interface 3 protrudes prism 11.Thus, the shape of metal substrate 1 and the design of USB interface can be made to be convenient to plug and to save its space outerpace taken,
Metal substrate 1 offers hanging hole 12, rope can be penetrated in hanging hole 12, be easy to carry to make lighting device.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all do within spirit of the present utility model and principle any amendment, equivalent to replace and improvement etc., all should be included within protection domain of the present utility model.

Claims (9)

1. a LED light device, the LED wafer comprising metal substrate and be electrically connected with metal substrate, is characterized in that, described LED wafer is covered on described metal substrate, and is electrically connected with described metal substrate.
2. LED light device as claimed in claim 1, it is characterized in that, described LED light device also comprises USB interface, and described USB interface is electrically connected with described metal substrate.
3. LED light device as claimed in claim 1 or 2, is characterized in that, described metal substrate is covered with some equally distributed LED wafer, described LED wafer is coated with one deck packaging plastic.
4. LED light device as claimed in claim 3, is characterized in that, the shape that described some LED wafer are formed is identical with the shape of incandescent lamp floor projection.
5. LED light device as claimed in claim 3, it is characterized in that, described packaging plastic is milky material.
6. LED light device as claimed in claim 2, it is characterized in that, described metal substrate is provided with a prism, and described USB interface protrudes described prism.
7. LED light device as claimed in claim 1 or 2, it is characterized in that, described metal substrate is aluminium base.
8. LED light device as claimed in claim 1 or 2, it is characterized in that, described metal substrate in the form of sheets.
9. LED light device as claimed in claim 1 or 2, is characterized in that, described metal substrate offers hanging hole.
CN201520614257.6U 2015-08-14 2015-08-14 LED lighting device Expired - Fee Related CN205065446U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520614257.6U CN205065446U (en) 2015-08-14 2015-08-14 LED lighting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520614257.6U CN205065446U (en) 2015-08-14 2015-08-14 LED lighting device

Publications (1)

Publication Number Publication Date
CN205065446U true CN205065446U (en) 2016-03-02

Family

ID=55392001

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201520614257.6U Expired - Fee Related CN205065446U (en) 2015-08-14 2015-08-14 LED lighting device

Country Status (1)

Country Link
CN (1) CN205065446U (en)

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160302

Termination date: 20170814