CN205018861U - Buckpot and cooking utensil - Google Patents
Buckpot and cooking utensil Download PDFInfo
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- CN205018861U CN205018861U CN201520757293.8U CN201520757293U CN205018861U CN 205018861 U CN205018861 U CN 205018861U CN 201520757293 U CN201520757293 U CN 201520757293U CN 205018861 U CN205018861 U CN 205018861U
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- buckpot
- conductive structure
- pot body
- hole
- pot
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Abstract
The utility model provides a buckpot and cooking utensil. The buckpot includes: the pot body, heat conduction structure, heat conduction structure are inlayed and are established in the digester shell of pot body, and the inner wall surface parallel and level of heat conduction structure and pot body or be less than the inner wall surface of pot body. Through increasing the heat conduction structure that corresponds the setting with the position of temperature sensing device in the digester shell at the pot body to make eat the material in the pot the temperature can fast, accurately the conduction be for the temperature sensing device through the heat conduction structure so that the temperature sensing device can in time acquire the real -time temperature who eats the material in the pot, so as cooking utensil can be accurate, in time control eat the culinary art progress of material, be favorable to guaranteeing the taste of food material. Because the heat conduction structure is with the surperficial parallel and level of the inner wall of pot body or be less than the inner wall surface of pot body, therefore avoids the heat conduction structure to occupy the space in the pot, convenient to use person washs the buckpot simultaneously.
Description
Technical field
The utility model relates to small household appliances technical field, in particular to a kind of buckpot and cooking apparatus.
Background technology
At present, buckpot, when fricassee, is difficult to the temperature accurately controlling food in buckpot.This is because the pot wall thickness of buckpot is thicker, and causes temperature conduction excessively slow, thus cause use buckpot cooking food time be difficult to control the duration and degree of heating.
Such as: when cooking congee, because be difficult to the actual temperature recording food, and the electro-heat equipment causing cooking apparatus still constantly continuous heating, thus the problem such as cause congee to overflow in pot.
Utility model content
Main purpose of the present utility model is to provide a kind of buckpot and cooking apparatus, to solve in prior art the problem being difficult to the food materials temperature measured exactly in buckpot.
To achieve these goals, according to an aspect of the present utility model, provide a kind of buckpot, comprising: pot body; Conductive structure, conductive structure is embedded in the pot wall of pot body, and conductive structure is concordant with the inner wall surface of pot body or lower than the inner wall surface of pot body.
Further, conductive structure is embedded in the sidewall and/or diapire of the pot wall of pot body.
Further, conductive structure is positioned at the diapire of pot body, and conductive structure is positioned at center position or the marginal position place of the diapire of pot body.
Further, the pot wall of pot body offers through hole, and conductive structure is embedded in through hole, and through hole is straight hole or shoulder hole.
Further, through hole is shoulder hole, and the hole sectional area of the hole section of the inner wall surface side of the close pot wall of shoulder hole is greater than the hole sectional area of the hole section of the outer wall surface side near pot wall.
Further, the thickness of conductive structure is less than or equal to the degree of depth of through hole.
Further, the pot wall of pot body offers blind hole, and conductive structure is embedded in blind hole.
Further, blind hole is formed by the outer wall surface of pot wall is recessed to inner wall surface side, and the distance X between the hole diapire of blind hole and inner wall surface is more than or equal to 2 millimeters.
Further, buckpot also comprises protective layer, and protective layer covers conductive structure to make conductive structure and air insulated.
Further, conductive structure is that metal or material with carbon element are made.
Further, conductive structure by embed or pre-buried technique be combined with pot body and with pot body sinter molding.
According to another aspect of the present utility model, provide a kind of cooking apparatus, comprise buckpot and the temperature sensing device for the heating-up temperature that detects buckpot, buckpot is above-mentioned buckpot, and the conductive structure of buckpot is corresponding with the position of temperature sensing device to be arranged.
Further, cooking apparatus is electric cooker or electric cooking pot.
Application the technical solution of the utility model, by increasing the conductive structure that arrange corresponding to the position of temperature sensing device in the pot wall of pot body, conducted quickly and accurately to temperature sensing device by conductive structure to enable the temperature of food materials in pot, with the real time temperature enabling temperature sensing device get food materials in pot in time, so that cooking apparatus can control the culinary art progress of food materials accurately and timely, be conducive to the mouthfeel ensureing food materials.Because conductive structure is concordant with the inner wall surface of pot body or lower than the inner wall surface of pot body, thus avoid conductive structure to take space in pot, be convenient to user simultaneously and buckpot is cleaned.
Accompanying drawing explanation
The Figure of description forming a application's part is used to provide further understanding of the present utility model, and schematic description and description of the present utility model, for explaining the utility model, is not formed improper restriction of the present utility model.In the accompanying drawings:
Fig. 1 shows the structural representation of the buckpot according to first embodiment of the present utility model; And
Fig. 2 shows the structural representation of the buckpot according to second embodiment of the present utility model.
Wherein, above-mentioned accompanying drawing comprises the following drawings mark:
10, pot body; 20, conductive structure.
Detailed description of the invention
It should be noted that, when not conflicting, the embodiment in the application and the feature in embodiment can combine mutually.Below with reference to the accompanying drawings and describe the utility model in detail in conjunction with the embodiments.
It is noted that following detailed description is all exemplary, be intended to provide further instruction to the application.Unless otherwise, all technology used herein and scientific terminology have the identical meanings usually understood with the application person of an ordinary skill in the technical field.
In the utility model, when not doing contrary explanation, the noun of locality of use such as " inside and outside " refers to profile inside and outside relative to each parts itself, but the above-mentioned noun of locality is not limited to the utility model.
In order to solve in prior art the problem being difficult to the food materials temperature measured exactly in buckpot, the utility model provides a kind of buckpot and cooking apparatus.Cooking apparatus comprises buckpot and the temperature sensing device for the heating-up temperature that detects buckpot.
Alternatively, cooking apparatus is electric cooker or electric cooking pot.
As depicted in figs. 1 and 2, buckpot comprises pot body 10 and conductive structure 20, and conductive structure 20 is embedded in the pot wall of pot body 10, and conductive structure 20 is concordant with the inner wall surface of pot body 10 or lower than the inner wall surface of pot body 10.
In order to ensure the heat conductivility of buckpot, preferably, arrange corresponding with the position of the temperature sensing device in cooking apparatus for conductive structure 20.
By increasing the conductive structure 20 that arrange corresponding to the position of temperature sensing device in the pot wall of pot body 10, conducted quickly and accurately to temperature sensing device by conductive structure 20 to enable the temperature of food materials in pot, with the real time temperature enabling temperature sensing device get food materials in pot in time, so that cooking apparatus can control the culinary art progress of food materials accurately and timely, be conducive to the mouthfeel ensureing food materials.Because conductive structure 20 is concordant with the inner wall surface of pot body 10 or lower than the inner wall surface of pot body 10, thus avoid conductive structure 20 to take space in pot, be convenient to user simultaneously and buckpot is cleaned.
It should be noted that, conductive structure 20 should adopt a kind of good conductor material of heat, and the heat conductivility of the good conductor material of this heat should be better than the heat conductivility of the material of pot body 10.
Alternatively, conductive structure 20 is that metal or material with carbon element are made.Due to the one that material with carbon element is nonmetallic materials, thus other nonmetallic materials, as long as have heat conductivility, also can use as conductive structure 20.
Conductive structure 20 in the utility model is combined rear and pot body 10 sinter molding by embedding or pre-buried technique with pot body 10.By the buckpot of above-mentioned processes, can ensure that conductive structure 20 merges with pot body 10 perfection, avoid the two to depart from, improve the overall construction intensity of buckpot, extend the service life of buckpot.
In addition, first by pot body 10 sinter molding, then again conductive structure 20 can also be inserted in pot body 10, thus conductive structure 20 and pot body 10 are closely merged.
Moreover, conductive structure 20 and pot body 10 are combined completely, form a pot courage overall, allow temperature sensing device can determine the temperature of food in pot rapidly when thermal contact conductance structure 20 like this, thus make cooking apparatus reach the object of accurate temperature controlling, reduction energy consumption.
In order to improve the protection to conductive structure 20, food materials are cooked to avoid conductive structure 20 to wear and tear, come off or be unfavorable for, the buckpot in the utility model also comprises protective layer, and protective layer covers conductive structure 20 to make conductive structure 20 and air insulated.
Alternatively, protective layer is the protective finish of metal material.Protective finish is coated in the surface of conductive structure 20 and the junction of conductive structure 20 and pot body 10; be completely covered to make conductive structure 20; not taking on pot body 10 while too much space, again conductive structure 20 being played a protective role, effectively can extend the service life of conductive structure 20.
Certainly, protective layer can also be glaze layer.Like this, by glaze layer, conductive structure 20 is covered, not only avoid the wearing and tearing of external force to conductive structure 20, also can not affect the heat conductivility of conductive structure 20, thus effectively extend the whole service life of buckpot.
Temperature sensing device in the utility model is temperature controller or temperature-sensing probe.
In the detailed description of the invention shown in Fig. 1 and Fig. 2, conductive structure 20 is conducting strips.Conducting strip, as conductive structure 20, not only has the feature of easily processing, is also convenient to assemble.
Alternatively, conducting strip is polygon lamellar body, circular lamellar body or ring slice etc.
Alternatively, conducting strip is multiple, and multiple conducting strip is disposed on the diverse location of pot wall.Like this, be conducive to the scope of application expanding buckpot, thus temperature sensing device can be gone up in place according to the concrete condition assembling of cooking apparatus.
Conductive structure 20 in the utility model is embedded in the sidewall and/or diapire of the pot wall of pot body 10.Certainly, now, temperature sensing device also should be arranged on the position corresponding with the sidewall of pot wall and/or diapire accordingly.
As depicted in figs. 1 and 2, conductive structure 20 is positioned at the diapire of pot body 10, and conductive structure 20 is positioned at the center position of the diapire of pot body 10.Generally speaking, temperature sensing device can be arranged on the center position of the bottom of cooking apparatus, thus arranges conductive structure 20 at the center position of the diapire of pot body 10, is conducive to the measurement accuracy improving temperature sensing device.
Certainly, conductive structure 20 can also be positioned at the marginal position place of the diapire of pot body 10.Accordingly, temperature sensing device is also positioned at the marginal position place of the bottom of cooking apparatus.
As shown in Figure 1, the pot wall of pot body 10 offers through hole, and conductive structure 20 is embedded in through hole, and through hole is straight hole or shoulder hole.Like this, conductive structure 20 is made accurately and rapidly can to react the temperature of food materials.
In the detailed description of the invention shown in Fig. 1, through hole is shoulder hole, and the hole sectional area of the hole section of the inner wall surface side of the close pot wall of shoulder hole is greater than the hole sectional area of the hole section of the outer wall surface side near pot wall.Because through hole is shoulder hole, thus the effect of backstop, location is played at cascaded surface place to conductive structure 20, can effectively avoid conductive structure and pot body 10 to depart from.
Alternatively, the thickness of conductive structure 20 is less than or equal to the degree of depth of through hole.When the thickness of conductive structure 20 is less than the degree of depth of through hole, be conducive to filling above-mentioned protective layer.
In the detailed description of the invention shown in Fig. 2, the pot wall of pot body 10 offers blind hole, and conductive structure 20 is embedded in blind hole.It is sensitive that the temperature-sensitive effect of this structure does not have through hole to arrange the temperature-sensitive effect of conductive structure 20, and processing is more difficult.
Specifically, blind hole is formed by the outer wall surface of pot wall is recessed to inner wall surface side, and the distance X between the hole diapire of blind hole and inner wall surface is more than or equal to 2 millimeters.This is to ensure that buckpot can not ftracture when sintering, and ensures the integrality of buckpot inside.
When using the cooking apparatus in the utility model, food is filled in buckpot, cook, in buckpot, temperature can be passed to conductive structure 20 by food temperature rapidly, by conductive structure 20, temperature is passed to the temperature sensing device of cooking apparatus, cooking apparatus, by confirming the temperature of conductive structure 20, judges required culinary art data, reach accurate temperature controlling with this, reduce the object of energy consumption.
It should be noted that used term is only to describe detailed description of the invention here, and be not intended to the illustrative embodiments of restricted root according to the application.As used herein, unless the context clearly indicates otherwise, otherwise singulative is also intended to comprise plural form, in addition, it is to be further understood that, " comprise " when using term in this manual and/or " comprising " time, it indicates existing characteristics, step, work, device, assembly and/or their combination.
The foregoing is only preferred embodiment of the present utility model, be not limited to the utility model, for a person skilled in the art, the utility model can have various modifications and variations.All within spirit of the present utility model and principle, any amendment done, equivalent replacement, improvement etc., all should be included within protection domain of the present utility model.
Claims (13)
1. a buckpot, is characterized in that, comprising:
Pot body (10);
Conductive structure (20), described conductive structure (20) is embedded in the pot wall of described pot body (10), and described conductive structure (20) is concordant with the inner wall surface of described pot body (10) or lower than the described inner wall surface of described pot body (10).
2. buckpot according to claim 1, is characterized in that, described conductive structure is embedded in the sidewall and/or diapire of the described pot wall of described pot body (10).
3. buckpot according to claim 2, it is characterized in that, described conductive structure (20) is positioned at the diapire of described pot body (10), and described conductive structure (20) is positioned at center position or the marginal position place of the described diapire of described pot body (10).
4. buckpot according to any one of claim 1 to 3, is characterized in that, the described pot wall of described pot body (10) offers through hole, and described conductive structure (20) is embedded in described through hole, and described through hole is straight hole or shoulder hole.
5. buckpot according to claim 4, it is characterized in that, described through hole is shoulder hole, and the hole sectional area of the hole section of the described inner wall surface side of the close described pot wall of described shoulder hole is greater than the hole sectional area of the described hole section of the outer wall surface side near described pot wall.
6. buckpot according to claim 4, is characterized in that, the thickness of described conductive structure (20) is less than or equal to the degree of depth of described through hole.
7. buckpot according to any one of claim 1 to 3, is characterized in that, the described pot wall of described pot body (10) offers blind hole, and described conductive structure (20) is embedded in described blind hole.
8. buckpot according to claim 7, is characterized in that, described blind hole is formed by the outer wall surface of described pot wall is recessed to described inner wall surface side, and the distance X between the hole diapire of described blind hole and described inner wall surface is more than or equal to 2 millimeters.
9. buckpot according to claim 1, is characterized in that, described buckpot also comprises protective layer, and described protective layer covers described conductive structure (20) to make described conductive structure (20) and air insulated.
10. buckpot according to claim 1, is characterized in that, described conductive structure (20) is that metal or material with carbon element are made.
11. buckpots according to claim 1, is characterized in that, described conductive structure (20) by embed or pre-buried technique and described pot body (10) combine and with described pot body (10) sinter molding.
12. 1 kinds of cooking apparatus, comprise buckpot and the temperature sensing device for the heating-up temperature that detects described buckpot, it is characterized in that, described buckpot is the buckpot according to any one of claim 1 to 11, and the described conductive structure (20) of described buckpot is corresponding with the position of described temperature sensing device to be arranged.
13. cooking apparatus according to claim 12, is characterized in that, described cooking apparatus is electric cooker or electric cooking pot.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520757293.8U CN205018861U (en) | 2015-09-25 | 2015-09-25 | Buckpot and cooking utensil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520757293.8U CN205018861U (en) | 2015-09-25 | 2015-09-25 | Buckpot and cooking utensil |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205018861U true CN205018861U (en) | 2016-02-10 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520757293.8U Active CN205018861U (en) | 2015-09-25 | 2015-09-25 | Buckpot and cooking utensil |
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| Country | Link |
|---|---|
| CN (1) | CN205018861U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105832129A (en) * | 2016-05-09 | 2016-08-10 | 珠海格力电器股份有限公司 | Pot body and pot |
| CN109380983A (en) * | 2018-07-10 | 2019-02-26 | 浙江苏泊尔家电制造有限公司 | A kind of cooking apparatus |
-
2015
- 2015-09-25 CN CN201520757293.8U patent/CN205018861U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105832129A (en) * | 2016-05-09 | 2016-08-10 | 珠海格力电器股份有限公司 | Pot body and pot |
| CN109380983A (en) * | 2018-07-10 | 2019-02-26 | 浙江苏泊尔家电制造有限公司 | A kind of cooking apparatus |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |