CN205003690U - Fingerprint recognition sensor encapsulation structure - Google Patents
Fingerprint recognition sensor encapsulation structure Download PDFInfo
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- CN205003690U CN205003690U CN201520657278.6U CN201520657278U CN205003690U CN 205003690 U CN205003690 U CN 205003690U CN 201520657278 U CN201520657278 U CN 201520657278U CN 205003690 U CN205003690 U CN 205003690U
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- fingerprint identification
- encapsulating structure
- identification sensor
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- integrated chip
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Abstract
An embodiment of the utility model provides a fingerprint recognition sensor encapsulation structure, including the base plate, set up in the sensor NULL of the upper surface of base plate and set up in the apron of sensor NULL's upper surface, sensor NULL's upper surface through solid -state glue with cover connection. The embodiment of the utility model provides an in, use solid -state gluey liquid glue the that substitute, at the not gassing of in -process of laminating to and can keep even solid -state gluey thickness, thereby can not influence the fingerprint identification effect.
Description
Technical field
The utility model relates to fingerprint Identification sensor, particularly a kind of fingerprint Identification sensor encapsulating structure.
Background technology
At present, fingerprint Identification sensor is applied to portable equipment more and more, such as smart mobile phone, panel computer etc.The cover plate that fingerprint Identification sensor encapsulating structure generally includes chip body and fits with chip body.Cover plate is fitted in chip body by the liquid glue of main employing at present.Adopt liquid glue usually to have two management and control difficult points: 1, some glue and laminating process easily produce bubble, the bubble of generation directly can affect the effect of fingerprint recognition; 2. the homogeneity of the thickness of glue is difficult to management and control, and glue uneven thickness can affect fingerprint recognition effect.
Utility model content
The utility model embodiment provides a kind of fingerprint Identification sensor encapsulating structure, to solve the problems of the technologies described above.
The fingerprint Identification sensor encapsulating structure that the utility model embodiment provides, comprise substrate, be arranged at the sensor integrated chip of the upper surface of described substrate and be arranged at the cover plate of upper surface of described sensor integrated chip, the upper surface of described sensor integrated chip is connected with described cover plate by solid-state glue.
Wherein, described fingerprint Identification sensor encapsulating structure also comprises the upper surface that is arranged at described substrate and wraps up the potted element of described sensor integrated chip.
Wherein, the upper surface level of described sensor integrated chip is in the upper surface of described potted element.
Wherein, the upper surface of described sensor integrated chip is higher than the upper surface of described potted element.
Wherein, the upper surface of described potted element is connected with described cover plate by described solid-state glue.
Wherein, described solid-state glue is solid state optics glue.
Wherein, described fingerprint Identification sensor encapsulating structure is the fingerprint Identification sensor encapsulating structure with becket.
Wherein, described fingerprint Identification sensor encapsulating structure is the fingerprint Identification sensor encapsulating structure without becket.
Wherein, described cover plate is ceramic cover plate, glass cover-plate or sapphire cover plate.
In the utility model embodiment, use solid-state glue to carry out alternative liquid glue, in laminating process, do not produce bubble, and uniform solid-state glue thickness can be kept, thus fingerprint recognition effect can not be affected.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the utility model embodiment, be briefly described to the accompanying drawing used required in embodiment below, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the sectional structure schematic diagram of fingerprint Identification sensor encapsulating structure in the first embodiment of the utility model.
Fig. 2 is the sectional structure schematic diagram of fingerprint Identification sensor encapsulating structure in the utility model the second embodiment.
Fig. 3 is the sectional structure schematic diagram of fingerprint Identification sensor encapsulating structure in the third embodiment of the utility model.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, be clearly and completely described the technical scheme in the utility model embodiment, obviously, described embodiment is only the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all belong to the scope of the utility model protection.
Below in conjunction with the accompanying drawing in the utility model embodiment, be clearly and completely described the technical scheme in the utility model embodiment, obviously, described embodiment is only the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all belong to the scope of the utility model protection.
With reference to figure 1, the first embodiment of the utility model provides a kind of fingerprint Identification sensor encapsulating structure 100, comprises substrate 11, is arranged at the sensor integrated chip 12 of the upper surface 111 of substrate 11 and is arranged at the cover plate 13 of upper surface 121 of sensor integrated chip.The upper surface 121 of sensor integrated chip 12 is connected with cover plate 13 by solid-state glue 14.Cover plate 13 can be ceramic cover plate, glass cover-plate or sapphire cover plate.Solid-state glue 14 can be the glue for the laminating of mobile phone full screen, can include but not limited to solid state optics glue.At the upper surface 121 of sensor integrated chip 12, solid-state glue 14 can be thin film.
In the present embodiment, use solid-state glue 14 to carry out alternative liquid glue, in laminating process, do not produce bubble, and uniform solid-state glue thickness can be kept, thus fingerprint recognition effect can not be affected.
Fingerprint Identification sensor encapsulating structure 100 also comprises the potted element 15 of the upper surface 111 being arranged at substrate 11.By welding or technology for applying potted element 15 is connected to the upper surface 111 of substrate 11.Potted element 15 wraps up sensor integrated chip 12, to protect sensor integrated chip 12.The upper surface 151 of potted element 15 is connected with cover plate 13 by solid-state glue 14.
In the present embodiment, upper surface 121 level of sensor integrated chip 12 is in the upper surface 151 of potted element 15.So, sensor integrated chip 12 fully contacts with cover plate 13 by solid-state glue 14, thus ensures the accuracy of fingerprint recognition.
In the present embodiment, fingerprint Identification sensor encapsulating structure 100 is the fingerprint Identification sensor encapsulating structure without becket.
With reference to figure 2, the utility model the second embodiment provides another kind of fingerprint Identification sensor encapsulating structure 200.Similar with the first embodiment, in the present embodiment, fingerprint Identification sensor encapsulating structure 200 comprises substrate 21, be arranged at the sensor integrated chip 22 of the upper surface 211 of substrate 21 and be arranged at the cover plate 23 of upper surface 221 of sensor integrated chip 22.The upper surface 221 of sensor integrated chip 22 is connected with cover plate 23 by solid-state glue 24.Solid-state glue 24 can be the glue for the laminating of mobile phone full screen, can include but not limited to solid state optics glue.At the upper surface 221 of sensor integrated chip 22, solid-state glue 24 can be thin film.Fingerprint Identification sensor encapsulating structure 200 also comprises the potted element 25 of the upper surface 211 being arranged at substrate 21.By welding or technology for applying potted element 25 is connected to the upper surface 211 of substrate 21.Potted element 25 wraps up sensor integrated chip 22, to protect sensor integrated chip 22.The upper surface 251 of potted element 25 is connected with cover plate 23 by solid-state glue 24.
Be with the difference of the first embodiment, in the present embodiment, the upper surface 221 of sensor integrated chip 22 is a little more than the upper surface 251 of potted element 25.Preferably, both differences in height are not more than 0.5mm.So, sensor integrated chip 22 fully contacts with cover plate 23 by solid-state glue 24, thus ensures the accuracy of fingerprint recognition.
With reference to figure 3, the third embodiment of the utility model provides a kind of another kind of fingerprint Identification sensor encapsulating structure 300.Be with the first embodiment difference, in the present embodiment, fingerprint Identification sensor encapsulating structure 300 is for having the fingerprint Identification sensor encapsulating structure of becket 36.
It should be noted that in the utility model, no matter whether fingerprint Identification sensor encapsulating structure has becket, and sensor integrated chip and cover plate are all be connected by solid-state glue.
The above is preferred implementation of the present utility model; it should be pointed out that for those skilled in the art, under the prerequisite not departing from the utility model principle; can also make some improvements and modifications, these improvements and modifications are also considered as protection domain of the present utility model.
Claims (9)
1. a fingerprint Identification sensor encapsulating structure, comprise substrate, be arranged at the sensor integrated chip of the upper surface of described substrate and be arranged at the cover plate of upper surface of described sensor integrated chip, it is characterized in that, the upper surface of described sensor integrated chip is connected with described cover plate by solid-state glue.
2. fingerprint Identification sensor encapsulating structure as claimed in claim 1, is characterized in that, described fingerprint Identification sensor encapsulating structure also comprises the upper surface that is arranged at described substrate and wraps up the potted element of described sensor integrated chip.
3. fingerprint Identification sensor encapsulating structure as claimed in claim 2, it is characterized in that, the upper surface level of described sensor integrated chip is in the upper surface of described potted element.
4. fingerprint Identification sensor encapsulating structure as claimed in claim 2, is characterized in that, the upper surface of described sensor integrated chip is higher than the upper surface of described potted element.
5. fingerprint Identification sensor encapsulating structure as claimed in claim 2, is characterized in that, the upper surface of described potted element is connected with described cover plate by described solid-state glue.
6. the fingerprint Identification sensor encapsulating structure as described in claim 1 to 5 any one, is characterized in that, described solid-state glue is solid state optics glue.
7. the fingerprint Identification sensor encapsulating structure as described in claim 1 to 5 any one, is characterized in that, described fingerprint Identification sensor encapsulating structure is the fingerprint Identification sensor encapsulating structure with becket.
8. the fingerprint Identification sensor encapsulating structure as described in claim 1 to 5 any one, is characterized in that, described fingerprint Identification sensor encapsulating structure is the fingerprint Identification sensor encapsulating structure without becket.
9. the fingerprint Identification sensor encapsulating structure as described in claim 1 to 5 any one, is characterized in that, described cover plate is ceramic cover plate, glass cover-plate or sapphire cover plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520657278.6U CN205003690U (en) | 2015-08-27 | 2015-08-27 | Fingerprint recognition sensor encapsulation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520657278.6U CN205003690U (en) | 2015-08-27 | 2015-08-27 | Fingerprint recognition sensor encapsulation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205003690U true CN205003690U (en) | 2016-01-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520657278.6U Expired - Fee Related CN205003690U (en) | 2015-08-27 | 2015-08-27 | Fingerprint recognition sensor encapsulation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205003690U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108460317A (en) * | 2017-02-22 | 2018-08-28 | 致伸科技股份有限公司 | Fingerprint identification module and its manufacturing method |
| WO2018187963A1 (en) * | 2017-04-12 | 2018-10-18 | 深圳市汇顶科技股份有限公司 | Optical fingerprint sensor and packaging method therefor |
-
2015
- 2015-08-27 CN CN201520657278.6U patent/CN205003690U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108460317A (en) * | 2017-02-22 | 2018-08-28 | 致伸科技股份有限公司 | Fingerprint identification module and its manufacturing method |
| WO2018187963A1 (en) * | 2017-04-12 | 2018-10-18 | 深圳市汇顶科技股份有限公司 | Optical fingerprint sensor and packaging method therefor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160127 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |