CN106897651A - Fingerprint recognition module and terminal device - Google Patents
Fingerprint recognition module and terminal device Download PDFInfo
- Publication number
- CN106897651A CN106897651A CN201510946073.4A CN201510946073A CN106897651A CN 106897651 A CN106897651 A CN 106897651A CN 201510946073 A CN201510946073 A CN 201510946073A CN 106897651 A CN106897651 A CN 106897651A
- Authority
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- China
- Prior art keywords
- cover plate
- groove
- fingerprint recognition
- induction chip
- recognition module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000006698 induction Effects 0.000 claims abstract description 42
- 229910052751 metal Inorganic materials 0.000 claims abstract description 38
- 239000002184 metal Substances 0.000 claims abstract description 38
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 229910000679 solder Inorganic materials 0.000 claims abstract description 16
- -1 induction chip Substances 0.000 claims abstract description 3
- 239000000084 colloidal system Substances 0.000 claims description 16
- 238000012856 packing Methods 0.000 claims description 16
- 239000003292 glue Substances 0.000 claims description 15
- 239000000919 ceramic Substances 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 4
- 239000012994 photoredox catalyst Substances 0.000 claims description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 3
- 239000004417 polycarbonate Substances 0.000 claims description 3
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 3
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 3
- 239000010453 quartz Substances 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 239000010980 sapphire Substances 0.000 claims description 2
- 229910052594 sapphire Inorganic materials 0.000 claims description 2
- 238000005452 bending Methods 0.000 abstract description 10
- 238000000034 method Methods 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 5
- 230000006870 function Effects 0.000 description 5
- 230000004224 protection Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229920006305 unsaturated polyester Polymers 0.000 description 2
- 229910021365 Al-Mg-Si alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229940106691 bisphenol a Drugs 0.000 description 1
- 210000004556 brain Anatomy 0.000 description 1
- 239000002775 capsule Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000019491 signal transduction Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
Landscapes
- Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Image Input (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
The present invention provides a kind of fingerprint recognition module, including substrate, induction chip, metal wire and cover plate, the induction chip is fixed on the substrate, the substrate is provided with the first solder joint, the induction chip upper surface is provided with the second solder joint, the metal wire electrically connects first solder joint and second solder joint, the cover plate is fixed on the side away from the substrate of the induction chip, the cover plate is provided with groove near the face of the induction chip, and the metal line portions are contained in the groove.The bending section of metal wire is contained in the groove, realizes reducing the function of distance between cover plate and chip, reaches and reduces fingerprint recognition modular volume, the technique effect of lifting identification accuracy.
Description
Technical field
The present invention relates to fingerprint identification technology field, more particularly to a kind of fingerprint with fingerprint identification function
Identification module and terminal device.
Background technology
With the development of science and technology, intelligent terminal such as smart mobile phone and panel computer etc. are widely used to day
Often life, but a large amount of individual's capsule information are stored in intelligent terminal, its security becomes particularly important.
Many protections realized by the way of password is set to intelligent terminal at present, user need to be input into and pre-set
Password could carry out decoding to intelligent terminal and use, there is password leakage or the possibility for being cracked in which.
The fingerprint of people is made up of the rough lines of finger surface skin, is the unique feature of human body,
There is security higher by way of the unblock that the fingerprint to human body is identified realizing intelligent terminal, because
This fingerprint recognition becomes the cipher mode of some terminal devices use.
Existing fingerprint recognition is generally recognized using capacitance type fingerprint, interior when finger is contacted with surface cap
The induction chip in portion begins to the fingerprint of sensitive scanning finger, by the depression of the raised and fingerprint valley of fingerprint ridge
Produced different capacitances are detected and form fingerprint pattern, so as to realize fingerprint identification function.Due to core
Metal wire on piece needs bending and substrate connection, portion of the metal wire between induction chip and the cover plate
Branch forms about 50 μm of camber, causes induction chip and cover plate to need to vacate one intersegmental away from increasing cover plate
Upper finger and the distance of induction chip, reduce penetration depth of the signal in finger, finally cause fingerprint mould
The recognition resolution of group declines.
The content of the invention
Can reduce distance between cover plate and chip it is an object of the invention to provide one kind, improve fingerprint recognition
Resolution ratio fingerprint recognition module.
Another object of the present invention is to provide a kind of terminal device using above-mentioned fingerprint recognition module.
To achieve these goals, embodiment of the present invention provides following technical scheme：
The present invention provides a kind of fingerprint recognition module, including substrate, induction chip, metal wire and cover plate, institute
Induction chip is stated to be fixed on the substrate and be connected with the electrical property of substrate by the metal wire, the base
Plate is provided with the first solder joint, and the induction chip upper surface is provided with the second solder joint, the metal wire electrical connection
First solder joint and second solder joint, the cover plate are fixed on the induction chip away from the substrate
Side, the cover plate is provided with groove near the face of the induction chip, and the metal line portions are contained in institute
In stating groove.
Wherein, the depth bounds of the groove is 50 μm~80 μm.
Wherein, the thickness of the cover plate is at least the twice of the depth of groove.
Wherein, the groove is the annular of closing, and the groove area encompassed is just to the induction chip
Upper surface.
Wherein, the groove is shaped as one or more straightways and/or curved section group in the upper of the cover plate
Into non-close figure, the groove be located at orthographic projection of the induction chip on the cover plate side.
Wherein, also including packing colloid, the packing colloid is filled between the cover plate and the substrate.
Wherein, the packing colloid is formed by high-k glue, and the packing colloid is non-
Bright.
Wherein, the induction chip is pasted on the substrate by glue or DAF.
Wherein, the cover plate material be sapphire, ceramics, quartz, glass, PC, PMMA, PET,
One kind in PI or PA.
The present invention also provides a kind of terminal device, wherein, including the fingerprint recognition mould described in above-mentioned any one
Group.
The embodiment of the present invention has the following advantages that or beneficial effect：
In the present invention by the cover plate of fingerprint recognition module set groove method so that metal wire between
Part (i.e. the bending section of metal wire) between the induction chip and the cover plate can be contained in described
Groove, so as to realize reducing the function of distance between cover plate and chip, reach reduction fingerprint recognition modular volume,
The technique effect of lifting identification accuracy.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to implementing
Example or the accompanying drawing to be used needed for description of the prior art are briefly described, it should be apparent that, describe below
In accompanying drawing be only some embodiments of the present invention, for those of ordinary skill in the art, do not paying
On the premise of going out creative work, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is fingerprint recognition modular structure schematic diagram of the present invention；
Fig. 2 is the first schematic diagram of the cover plate of the fingerprint recognition module shown in Fig. 1；
Fig. 3 is second schematic diagram of cover plate of the fingerprint recognition module shown in Fig. 1；
Fig. 4 is the third schematic diagram of the cover plate of the fingerprint recognition module shown in Fig. 1；
Fig. 5 is the 4th kind of schematic diagram of cover plate of the fingerprint recognition module shown in Fig. 1.
Specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clearly
Chu, it is fully described by, it is clear that described embodiment is only a part of embodiment of the invention, rather than
Whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art are not making creation
Property work under the premise of the every other embodiment that is obtained, belong to the scope of protection of the invention.
Fig. 1 is referred to, fingerprint recognition module of the invention includes：Including substrate 11, induction chip 12, lid
Plate 13 and metal wire 14, the induction chip 12 are fixed on the substrate 11, are set on the substrate 11
There is the first solder joint (not shown), (i.e. away from the substrate on the upper surface 121 of the induction chip 12
On 11 face) the second solder joint (not shown) is provided with, the solder joint on the substrate 11 and the induction chip
Corresponding solder joint is electrically connected by metal wire 14 on 12, and the cover plate 11 is fixed on the sensing
The top of chip 12, i.e., described cover plate 13 be fixed on the induction chip 12 away from the one of the substrate 11
Side.The cover plate 13 includes the first surface 131 and second surface 132 that are oppositely arranged, the first surface
131 second surfaces 132 are provided with recessed closer to the induction chip 12, the first surface 131
Groove 133, that is to say, that the cover plate 13 is provided with groove 133 near the face of the induction chip 12, described
The parabolically shape of metal wire 14, the bending section of metal wire 14 can be contained in the groove 133, i.e.,
The groove 133 is used to house part metals line 14.
In the present invention by the cover plate of fingerprint recognition module set groove method so that metal wire between
Part (i.e. the bending section of metal wire) between the induction chip and the cover plate can be contained in described
Groove, so as to realize reducing the function of distance between cover plate and chip, reach reduction fingerprint recognition modular volume,
The technique effect of lifting identification accuracy.Meanwhile, the difficulty of processing that groove is processed on the cover board is smaller, favorably
In reduction processing cost.
Further, part of the metal wire 14 between the induction chip 12 and the cover plate 13
Vertical height it is general not over 50 μm, in order to ensure that the bending section of metal wire 14 can be housed into described
Groove 133, should ensure that the depth (i.e. length of the groove 133 in the direction of vertical first surface 131) of groove 133
50 μm are not less than, meanwhile, in order to reduce the cover plate 13 in the case of the intensity for being further ensured that cover plate 13
Thickness, so as to reduce the general thickness of fingerprint recognition module, the upper depth limit of groove 133 should also be carried out
Limitation, usual depth of groove not should be greater than 80 μm, that is to say, that the depth bounds of the groove 133 is
50 μm~80 μm.
Further specifically, the shape of 131 upper groove of first surface 133 in cover plate 13 should be by induction chip
What the layout of the metal wire 14 of 12 upper surfaces was determined.For example, Fig. 2 is referred to, when the upper table of induction chip 12
When face surrounding is connected with metal wire 14, the shape of groove 133 should be just the annular of closing.Now, institute
The area encompassed of groove 133 is stated just to the induction chip upper surface 121.Specifically, can be elliptical ring,
The closed figure of triangular loop, eccentric circular ring, square loop or straight-flanked ring.
Fig. 3-Fig. 5 is referred to, when metal wire 14 is connected with the only part side of the upper surface of induction chip 12,
So corresponding groove 133 should be just discontinuous shape, i.e. the shape of groove 133 is non-close-shaped.
Now, the groove 133 is located at the side of orthographic projection of the induction chip 12 on the cover plate 13.
The groove 133 just to the bending section of the metal wire 14, so as to the bending section of the metal wire 14
The groove 133 can be contained in.It is further specifically, when 14 curved arrangement of metal wire, accordingly
Groove 133 with regard to curved segment figure；When metal wire 14 is linearly arranged, corresponding groove 133 is in just
Straight line segment figure is arranged.When the linearly arrangement of the part of metal wire 14, during the curved arrangement of another part, phase
The groove 133 answered just has part linearly segment figure, the curved segment figure of another part.That is groove
133 shape on the first surface 131 of above-mentioned cover plate 13 can also be one or more straightways and/or song
Line segment composition non-close figure, such as exist at least one at be interrupted annulus, triangular loop, eccentric circular ring,
Square loop or straight-flanked ring, or one or more straightway or curved section being parallel to each other, groove 133
Quantity it is identical with the quantity of the metal wire 14 in continuous arrangement.
Understandable preferred scheme is, because the bending section of metal wire 14 is generally curved, therefore groove 133
Section can be arc, in order to metal wire 14 bending section be adapted.
Further, (i.e. cover plate 13 is in the vertical direction of the first surface 131 for the thickness of cover plate 13
Length) 300 μm should be less than or equal to.It is relatively thin that cover plate 10 is designed so that fingerprint is for cover plate 13
Penetration power is stronger, is more prone to obtain finger print information, makes the recognition resolution of fingerprint recognition module higher.With
This in order to ensure that cover plate 13 can have certain structural strength, increases the use of fingerprint recognition module simultaneously
Life-span.The thickness for generally setting cover plate 13 is no less than the twice of the depth of the groove 133.That is cover
The Rational Thickness scope of plate 13 is 100 μm~300 μm, and can both improve intensity under this scope also ensures that
The size of whole fingerprint recognition module is suitable.
Further specifically, the cover plate 13 should use anti abrasive material, cover plate 13 can be using blue precious
One kind in stone, ceramics, quartz, glass, PC, PMMA, PET, PI or PA, it is furthermore preferred that
Cover plate 13 can be using the glass and ceramics of relative low price.
Further, fingerprint recognition module also includes packing colloid 15, and packing colloid 15 is filled in cover plate 13
Between substrate 11, cover plate 13 is bonded with substrate 11 by the packing colloid 15, the He of the chip 12
Metal wire 14 is encapsulated among the packing colloid 15, fingerprint recognition module is more consolidated.
Further, packing colloid 15 can be formed by high-k glue.It should be noted that
Expression way " high-k " used herein refers generally to dielectric constant and is not less than 7.Glue of the invention
The dielectric constant of water can be 15 or so.Some specific examples of the invention, high-k glue can
Think epoxy resin (bisphenol-A system (BISPHENOL-A), NOVOLACEPOXY, annular aliphatic ring
Oxygen tree glue (CYCLICALIPHATICEPOXY), epoxidised butadiene), polyacrylate, epoxy third
Olefin(e) acid ester, urethane acrylate, unsaturated polyester (UP), polyolefin, polymercaptan etc..Thus, packing colloid
With properties such as preferable formability, mechanical strength, heat resistance and electrical apparatus insulations, and be conducive to improving sense
Answer the signal transduction effect of chip 12.In some embodiments of invention, packing colloid 15 can be by routine
Glue and high-k glue are collectively forming, wherein, conventional glue is located at the bottom in encapsulated space, its
Thickness is less than the thickness of induction chip 12, and the conventional glue can be known in the art any glue.Root
According to inventive embodiment, packing colloid 15 can be opaque.
Further, the induction chip 12 can be by glue or DAF (Gumming glue film, Die Attach
Film, DAF) it is bonded and fixed on the substrate 11.
Further, the metal wire can be gold thread, aluminum steel, copper cash, al-mg-si alloy line and aluminium-
One or several combination in copper alloy wire.
Specifically, the substrate 11 can be flexible PCB.Fingerprint recognition module by flexible PCB with
External circuit (for example, process circuit of smart mobile phone or panel computer etc.) is electrically connected.Additionally, flexible electrical
Also include at least one passive element, such as resistance or electric capacity etc. on the plate of road.
The present invention also provides a kind of terminal device, and terminal device is typically configured as including：Display screen,
Touch-screen, cover-plate glass, storage, CPU, GPU, internal memory, Wi-Fi connection, bluetooth connection, USB connect
Connect, one or more in battery, external power supply, computer-readable media and software etc..The terminal sets
Standby also to include above-mentioned any one fingerprint recognition module, the terminal device can be smart mobile phone, flat board electricity
Any device with fingerprint identification function such as brain, notebook computer, videophone.
Embodiments described above, does not constitute the restriction to the technical scheme protection domain.It is any upper
Modification, equivalent and improvement for being made etc. within the spirit and principle of implementation method are stated, this is should be included in
Within the protection domain of technical scheme.
Claims (10)
1. a kind of fingerprint recognition module, it is characterised in that including substrate, induction chip, metal wire and cover plate,
The induction chip is fixed on the substrate and is connected with the electrical property of substrate by the metal wire, described
Substrate is provided with the first solder joint, and the induction chip upper surface is provided with the second solder joint, and the metal wire is electrically connected
First solder joint and second solder joint are connect, the cover plate is fixed on the induction chip away from the substrate
Side, the cover plate is provided with groove near the face of the induction chip, and the metal line portions are contained in
In the groove.
2. fingerprint recognition module as claimed in claim 1, it is characterised in that the depth bounds of the groove is
50 μm~80 μm.
3. fingerprint recognition module as claimed in claim 1 or 2, it is characterised in that the thickness of the cover plate is extremely
It is less the twice of the depth of groove.
4. fingerprint recognition module as claimed in claim 1, it is characterised in that the groove is the annular of closing,
The groove area encompassed is just to the induction chip upper surface.
5. fingerprint recognition module as claimed in claim 1, it is characterised in that the groove is in the cover plate
On be shaped as one or more straightways and/or curved section composition non-close figure, the groove be located at institute
State the side of orthographic projection of the induction chip on the cover plate.
6. fingerprint recognition module as claimed in claim 1, it is characterised in that described also including packing colloid
Packing colloid is filled between the cover plate and the substrate.
7. fingerprint recognition module as claimed in claim 5, it is characterised in that the packing colloid is by Gao Jie
What electric constant glue was formed, and the packing colloid is nontransparent.
8. fingerprint recognition module as claimed in claim 1, it is characterised in that the induction chip passes through glue
Or DAF pastes on the substrate.
9. fingerprint recognition module as claimed in claim 1, it is characterised in that the cover plate material be sapphire,
One kind in ceramics, quartz, glass, PC, PMMA, PET, PI or PA.
10. a kind of terminal device, it is characterised in that know including the fingerprint described in claim 1-9 any one
Other module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510946073.4A CN106897651A (en) | 2015-12-17 | 2015-12-17 | Fingerprint recognition module and terminal device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510946073.4A CN106897651A (en) | 2015-12-17 | 2015-12-17 | Fingerprint recognition module and terminal device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106897651A true CN106897651A (en) | 2017-06-27 |
Family
ID=59188125
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510946073.4A Withdrawn CN106897651A (en) | 2015-12-17 | 2015-12-17 | Fingerprint recognition module and terminal device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106897651A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109165497A (en) * | 2018-10-09 | 2019-01-08 | 深圳市振华通信设备有限公司 | A kind of unlocking method and communicating terminal of bio-identification |
-
2015
- 2015-12-17 CN CN201510946073.4A patent/CN106897651A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109165497A (en) * | 2018-10-09 | 2019-01-08 | 深圳市振华通信设备有限公司 | A kind of unlocking method and communicating terminal of bio-identification |
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| CB02 | Change of applicant information |
Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant after: Jiangxi OMS Microelectronics Co.,Ltd. Applicant after: Nanchang OFilm Tech. Co.,Ltd. Applicant after: Ophiguang Group Co.,Ltd. Applicant after: SUZHOU OFILM TECH Co.,Ltd. Address before: 330096 Jiangxi Nanchang Nanchang hi tech Industrial Development Zone, east of six road, south of Tianxiang Avenue. Applicant before: OFilm Microelectronics Technology Co.,Ltd. Applicant before: Nanchang OFilm Tech. Co.,Ltd. Applicant before: OFilm Tech Co.,Ltd. Applicant before: SUZHOU OFILM TECH Co.,Ltd. Address after: 330096 Jiangxi Nanchang Nanchang hi tech Industrial Development Zone, east of six road, south of Tianxiang Avenue. Applicant after: OFilm Microelectronics Technology Co.,Ltd. Applicant after: Nanchang OFilm Tech. Co.,Ltd. Applicant after: OFilm Tech Co.,Ltd. Applicant after: SUZHOU OFILM TECH Co.,Ltd. Address before: 330029 No. 1189 Jingdong Avenue, Nanchang high tech Zone, Jiangxi Applicant before: NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd. Applicant before: Nanchang OFilm Tech. Co.,Ltd. Applicant before: Shenzhen OFilm Tech Co.,Ltd. Applicant before: SUZHOU OFILM TECH Co.,Ltd. |
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Effective date of registration: 20210705 Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant after: Jiangxi OMS Microelectronics Co.,Ltd. Address before: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant before: Jiangxi OMS Microelectronics Co.,Ltd. Applicant before: Nanchang OFilm Tech. Co.,Ltd. Applicant before: Ophiguang Group Co.,Ltd. Applicant before: SUZHOU OFILM TECH Co.,Ltd. |
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Application publication date: 20170627 |
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