CN204011397U - Capacitive fingerprint sensor encapsulating structure - Google Patents
Capacitive fingerprint sensor encapsulating structure Download PDFInfo
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- CN204011397U CN204011397U CN201420484451.2U CN201420484451U CN204011397U CN 204011397 U CN204011397 U CN 204011397U CN 201420484451 U CN201420484451 U CN 201420484451U CN 204011397 U CN204011397 U CN 204011397U
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- fingerprint sensor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
The utility model provides a kind of capacitive fingerprint sensor encapsulating structure, and capacitive fingerprint sensor encapsulating structure comprises: the chip of individual packages; Fingerprint sensing element, is arranged on described chip top and is electrically connected with described chip; Substrate, is arranged on described chip below, and described substrate is electrically connected by tin ball with described fingerprint sensing element, and described substrate is electrically connected with described chip by tin ball and described fingerprint sensing element.According to capacitive fingerprint sensor encapsulating structure of the present utility model, by fingerprint sensing element is separated with chip, then be electrically connected, reduce like this surface area of whole fingerprint sensor encapsulating structure.
Description
Technical field
The utility model relates to bio-identification module packaging technology, relates in particular to a kind of capacitive fingerprint sensor encapsulating structure.
Background technology
Fingerprint identification device has been widely used in various terminal equipments, for example mobile terminal, banking system, attendance checking system etc.
Fingerprint identification device of the prior art comprises fingerprint recognition sensing chip, control chip and substrate, wherein, fingerprint recognition sensing chip and control chip are produced on same substrate, and this has obviously increased the area of substrate, and then have increased the whole surface area of fingerprint identification device.Very unfavorable to the downsizing of terminal equipment like this.
Utility model content
The utility model provides a kind of capacitive fingerprint sensor encapsulating structure, to solve in prior art fingerprint identification device because substrate area causes more greatly the problem that surface area is larger.
First aspect of the utility model provides a kind of capacitive fingerprint sensor encapsulating structure, comprising:
The chip of individual packages;
Fingerprint sensing element, is arranged on described chip top and is electrically connected with described chip;
Substrate, is arranged on described chip below, and described substrate is electrically connected by tin ball with described fingerprint sensing element, and described substrate is electrically connected with described chip by tin ball and described fingerprint sensing element.
Capacitive fingerprint sensor encapsulating structure as above, preferably, described chip and described fingerprint sensing element adopt flip chip to be electrically connected.
Capacitive fingerprint sensor encapsulating structure as above, preferably, also comprises:
Capacitance resistance, described capacitance resistance is arranged on described substrate.
Capacitive fingerprint sensor encapsulating structure as above, preferably, described substrate comprises the flexible circuit board FPC and the printing board PCB that form from below to up.
Capacitive fingerprint sensor encapsulating structure as above, preferably, also comprises thermosetting resin EMC, and described EMC is filled between described chip and described substrate.
Capacitive fingerprint sensor encapsulating structure as above, preferably, described capacitance resistance is arranged on described PCB.
Capacitive fingerprint sensor encapsulating structure as above, preferably, described FPC is longer than described PCB, and described capacitance resistance is arranged on FPC.
Capacitive fingerprint sensor encapsulating structure as above, preferably, also comprises:
Frame, described frame is arranged on described substrate, and described frame is around described chip and described fingerprint sensing element.
Capacitive fingerprint sensor encapsulating structure as above, preferably, also comprises:
Color rete, is arranged on described fingerprint sensing element top;
Protective layer, is arranged on described color rete top.
Capacitive fingerprint sensor encapsulating structure as above, preferably, the thickness of described color rete is 5 microns to 30 microns.
Capacitive fingerprint sensor encapsulating structure as above, preferably, the thickness of described protective layer is 10 microns to 30 microns.
Capacitive fingerprint sensor encapsulating structure as above, preferably, the thickness sum of described color rete and described protective layer is less than or equal to 50 microns.
Capacitive fingerprint sensor encapsulating structure as above, preferably, the evenness of described protective layer is less than or equal to 10 microns.
As shown from the above technical solution, the capacitive fingerprint sensor encapsulating structure that the utility model provides, by fingerprint sensing element is separated with chip, then is electrically connected, reduce like this surface area of whole fingerprint sensor encapsulating structure, and then be beneficial to the miniaturization of terminal equipment.
Brief description of the drawings
Figure 1A is according to the schematic diagram of the capacitive fingerprint sensor encapsulating structure of the utility model one embodiment;
Figure 1B is the concrete structure schematic diagram of the fingerprint sensing element in fingerprint sensor encapsulating structure;
Fig. 2 is according to the schematic diagram of the capacitive fingerprint sensor encapsulating structure of another embodiment of the utility model;
Fig. 3 is according to the schematic diagram of the capacitive fingerprint sensor encapsulating structure of the another embodiment of the utility model;
Fig. 4 is according to the utility model schematic diagram of the capacitive fingerprint sensor encapsulating structure of an embodiment again;
Fig. 5 is according to the schematic diagram of the capacitive fingerprint sensor encapsulating structure of another embodiment of the utility model;
Fig. 6 is according to the schematic diagram of the capacitive fingerprint sensor encapsulating structure of the another embodiment of the utility model;
Fig. 7 is according to the utility model schematic diagram of the capacitive fingerprint sensor encapsulating structure of an embodiment again;
Fig. 8 is according to the schematic diagram of the capacitive fingerprint sensor encapsulating structure of another embodiment of the utility model
Fig. 9 is according to the schematic diagram of the capacitive fingerprint sensor encapsulating structure of the another embodiment of the utility model;
Figure 10 is according to the utility model schematic diagram of the capacitive fingerprint sensor encapsulating structure of an embodiment again;
Figure 11 is according to the schematic diagram of the capacitive fingerprint sensor encapsulating structure of another embodiment of the utility model;
Figure 12 is according to the utility model schematic flow sheet of the method for the capacitive fingerprint sensor encapsulation of an embodiment again.
Embodiment
The present embodiment provides a kind of capacitive fingerprint sensor encapsulating structure, and this capacitive fingerprint sensor encapsulating structure specifically can be arranged in fingerprint identification device.This fingerprint identification device is for identifying user's fingerprint.
As shown in Figure 1A, for according to the schematic diagram of the capacitive fingerprint sensor encapsulating structure of the present embodiment.This capacitive fingerprint sensor encapsulating structure 200 comprises chip 201, fingerprint sensing element 202 and the substrate 203 of individual packages.
Wherein, fingerprint sensing element 202 is arranged on chip 201 tops and is electrically connected with chip 201, specifically can adopt upside-down mounting mode to be electrically connected chip 201 and fingerprint sensing element 202; Substrate 203 is arranged on chip 201 belows, and substrate 203 is electrically connected by tin ball 204 with fingerprint sensing element 202, and substrate 203 is electrically connected with chip 201 by tin ball 204 and fingerprint sensing element 202.Wherein, the fingerprint induction zone of fingerprint sensing element 202 for realizing fingerprint recognition, chip 201 is logic IC (Integrated Circuit, integrated circuit), the fingerprint signal fingerprint sensing element 202 being collected carries out computing.As shown in Figure 1B, be 202 concrete structure schematic diagrames of fingerprint sensing element wherein.Wherein, on substrate 2021, be formed with fingerprint sensing element circuit 2022; on substrate 2021, be also formed with sensing element route protection rete 2023; this sensing element route protection rete 2023 covers fingerprint sensing element circuit 2022; for the protection of fingerprint sensing element circuit 2022, to avoid destruction.In the present embodiment, chip 201 is not directly electrically connected with substrate 203, but is connected setting with fingerprint sensing element 202 with chip 201 Indirect Electros by tin ball 204.The main material of the tin ball 204 of the present embodiment comprises that main material comprises tin, lead, silver, copper etc.
Alternatively, the length of this chip 201 is less than the length of fingerprint sensing element 202, and then can reduce to use chip 201, further, saves the cost of whole capacitive fingerprint sensor encapsulating structure 200.
On the chip 201 of the present embodiment, be formed with at least one projection 210, chip 210 is electrically connected with fingerprint sensing element 202 by this projection 210, this projection 210 can be specifically scolding tin, between chip 201 and fingerprint sensing element 202, is electrically connected by controlled collapsible chip connec-tion (Flip Chip Package).In addition, also include underfilling (Underfill) 211 between chip 201 and fingerprint sensing element 202, this underfilling 211 is for chip 210 and the fingerprint sensing element 202 of boning.This underfilling 211 can be specifically epoxy resin (Epoxy), and this bottom filling 211 can effectively improve the mechanical strength of projection 210, thus the life-span of improving whole capacitive fingerprint sensor encapsulating structure 200.
Alternatively, the capacitive fingerprint sensor encapsulating structure 200 of the present embodiment also comprises capacitance resistance 220, and this capacitance resistance 220 is arranged on substrate 203, and this resistance capacitance 220 can play the effect of voltage stabilizing, filtering.This substrate 203 specifically can comprise FPC (the Flexible PrintedCircuit forming from below to up, flexible circuit board) 221 and PCB (Printed Circuit Board, printed circuit board) 222, PCB222 is formed on the top of FPC221.Particularly, this PCB222 can be connected by tin cream 223 with FPC221, and this tin cream 223 is formed between FPC221 and PCB222.Particularly, on FPC221, comprise connector (Connector) 260, for connecting peripheral circuit.This connector 260 can be arranged on any one on FPC221 according to actual needs, and a kind of situation is only shown in Fig. 2.
Alternatively; between chip 201 and substrate 203, be also filled with EMC layer (Epoxy MoldingCompound; thermosetting resin) 241; this EMC layer 241 is for the difference of the thermal coefficient of expansion between compensation chips 201 and substrate 203; prevent that moisture from destroying, and can protect chip 201.Projection 210 is dispersed in EMC layer 241.The surface area of this EMC layer 241 can be greater than the surface area of fingerprint sensing element 202.
Alternatively, as shown in Figure 1A, the capacitive fingerprint sensor encapsulating structure 200 of the present embodiment also comprises frame (Bezel) 240, this frame 240 is arranged on substrate 203, and this frame 240 arranges around chip 201 and fingerprint sensing element 202, particularly, this frame 240 can be arranged on substrate 203, is arranged on PCB222.Alternatively, as shown in Figure 2, the bottom of this frame 240 can also contact FPC221, and this frame 240 is through PCB222 and tin cream 223.This frame 240 can play decoration function to capacitive fingerprint sensor encapsulating structure 200, also can make user's sense of touch better.The material of this frame 240 can be plastics.
Alternatively, as shown in Figure 1A, this capacitive fingerprint sensor encapsulating structure 200 can also comprise color rete 205 and protective layer 206, and this color rete 205 is arranged at the top of fingerprint sensing element 202, and protective layer 206 is arranged at the top of color rete 205.Wherein, protective layer 206 couplings are set on frame 240, this protective layer 206 specifically can be by one or more the making in following material or its equivalent: pottery, DLC (Diamond-like carbon, diamond like carbon), glass, the glass of tempered glass or the chemically treated other types of process, sapphire, pass through chemically treated its at least compound of some feature that has, or the anti-pulverizing substitute of glass, comprise polymethyl methacrylate (PolymethylMethacrylate, PMMA), PETG (Polyethylene Terephthalate, PET), it can also be the ink coating after overcuring.This color rete 205 can be the ink being printed on protective layer 206, or by being sprayed on the ink on protective layer 206.This ink has certain color, can make color rete 205 be translucent or opaque, and like this, the structures such as the fingerprint sensing element 202 of below can not seen by user.Protective layer 206 can further be protected color rete 205, makes it avoid being damaged by user's nail or other sharp-pointed article friction, and same, protective layer 206 also can play the effect of protection chip 201.
Wherein, the thickness of color rete 205 is 5 microns to 30 microns, and the thickness of protective layer 206 is 10 microns to 30 microns.Alternatively, the thickness sum of this color rete 205 and protective layer 206 can be less than or equal to 100 microns, particularly, can be less than or equal to 50 microns.
Mobile terminal and tablet personal computer device use high glaze, the high permeability substrate cover plate as product conventionally, and these substrates are generally glass, sapphire, transparent plastic panel or other any material panel with high-gloss surface, high light transmittance.For above-mentioned capacitive fingerprint sensor encapsulating structure is packed in mobile terminal or panel computer, protective layer 206 also can have high-gloss surface, with the design effect of the ID (Industrlal Design, industrial design) of matching product; Certainly can be also dumb light effect according to its surface of design requirement sometimes.The face of overlooking of this protective layer 206 can be any shape, for example circle, ball shape and other button-shape.Protective layer 206 surfaces can be smooth, or depression, for example meet the depression that user points, can be that user's finger is well positioned like this, so that the fingerprint on identification user finger, or projection.The situation of protective layer 206 surfacings is only shown in following figure.The evenness of this protective layer 206 is less than or equal to 10 microns.
Figure 1A-Figure 11 is the various combinations for the shape of capacitance-resistance putting position and frame.Wherein, the concrete structure of each fingerprint sensing element 202 all as shown in Figure 1B.
Alternatively, as shown in Figure 1A, capacitance resistance 220 can be arranged on PCB222 above and as far as possible close chip 201.It is nearer that capacitance resistance 220 and fingerprint sensing element 202 or chip 201 lean on, and its voltage stabilizing, filter effect are better, and the image effect collecting is better.In Figure 1A, it is upper that frame 240 is arranged on PCB222, and the height of frame 240 is higher than the height of protective layer 206, can make to be with the finger of quoting family to be well placed on protective layer 206.
Alternatively, as shown in Figure 2, be the structural representation of capacitive fingerprint sensor encapsulating structure 300.Capacitance resistance 220 can be arranged on that PCB222 is upper and wrapped up by EMC layer 241, and capacitance resistance 220 can be arranged in frame 240, with chip 201 lean on very near, this just needs the size of capacitance resistance 220 enough little, for example, adopt 0201 package dimension.The length that this 0201 package dimension is specially capacitance resistance 220 is 0.60 ± 0.05mm, and wide is 0.30 ± 0.05mm, and height is 0.23 ± 0.05mm, certainly can also adopt according to actual needs 0402 package dimension etc.Capacitance resistance 220 is arranged and is included in EMC layer 241, make capacitance resistance 220 very near chip 201, therefore very good for the transmission of signal.In Fig. 2, frame 240 is arranged on FPC221.The height of the frame 240 in Fig. 2 is higher than the height of protective layer 206, and the finger that can make band quote family is well placed on protective layer 206.In this Fig. 2, the surface area of EMC layer 241 can be larger than fingerprint sensing element 202, from the generalized section of Fig. 2, can find out, EMC layer 241 is longer than the length of fingerprint sensing element 202, certainly, ECM layer 241 also can be consistent with the length of fingerprint sensing element 202, as shown in Figure 1, do not repeat them here.
Alternatively, as shown in Figure 3, be the structural representation of capacitive fingerprint sensor encapsulating structure 400.FPC221 in Fig. 3 is longer than PCB222, and capacitance resistance 220 is arranged on FPC221.Because in the time of actual assembled, only the size of frame 240 parts exposes, so generally the size in frame 240 scopes need to be limited, and FPC221 is positioned at extraneous other parts of frame and is all hidden in the panel of terminal equipment or casing below, user cannot see, for example, so can adopt the electric capacity of relatively slightly large encapsulation, adopt the capacitance resistance of the package dimension such as 0402 or 0603.The volume of capacitance resistance 220 is larger, and production cost is lower, therefore adopts the capacitance resistance 220 that volume is larger, can further reduce like this production cost of whole capacitive fingerprint sensor encapsulating structure 200.The height of the frame 240 in Fig. 3 is higher than the height of protective layer 206, and the finger that can make band quote family is well placed on protective layer 206, and this frame 240 is arranged on FPC221.
Alternatively, as shown in Figure 4, be the structural representation of capacitive fingerprint sensor encapsulating structure 500.Capacitance resistance 220 can be arranged on PCB222 above and as far as possible close chip 201.It is nearer that capacitance resistance 220 and fingerprint sensing element 202 lean on, and the electric signal transmission between itself and fingerprint sensing element 202 is better.In Fig. 4, the height of frame 240 is identical with the height of protective layer 206, and this frame 240 is arranged on PCB222.
Alternatively, as shown in Figure 5, be the structural representation of capacitive fingerprint sensor encapsulating structure 600.Capacitance resistance 220 can be arranged on PCB222 above and be wrapped up by EMC layer 241.This just needs the size of capacitance resistance 220 enough little, for example adopt 0201 package dimension, the length that this 0201 package dimension is specially capacitance resistance 220 is 0.60 ± 0.05mm, wide is 0.30 ± 0.05mm, height is 0.23 ± 0.05mm, certainly can also adopt according to actual needs 0402 package dimension etc.Capacitance resistance 220 is arranged and is included in EMC layer 241, make capacitance resistance 220 very near chip 201, therefore very good for the transmission of signal.The height of the frame 240 in Fig. 5 is identical with the height of protective layer 206, and this frame 240 is arranged on FPC221.In this Fig. 5, the surface area of EMC layer 241 can be larger than fingerprint sensing element 202, from the generalized section of Fig. 5, can find out, EMC layer 241 is longer than the length of fingerprint sensing element 202, certainly, ECM layer 241 also can be consistent with the length of fingerprint sensing element 202, as shown in Figure 1, do not repeat them here.
Alternatively, as shown in Figure 6, be the structural representation of capacitive fingerprint sensor encapsulating structure 700.FPC221 is longer than PCB222, and capacitance resistance 220 is arranged on FPC221.Because in the time of actual assembled, only the size of frame 240 parts exposes, so generally the size in frame 240 scopes need to be limited, and FPC221 is positioned at extraneous other parts of frame and is all hidden in the panel of terminal equipment or casing below, user cannot see, for example, so can adopt the electric capacity of relatively slightly large encapsulation, adopt the capacitance resistance of the package dimension such as 0402 or 0603.The volume of capacitance resistance 220 is larger, and production cost is lower, therefore adopts the capacitance resistance 220 that volume is larger, can further reduce like this production cost of whole capacitive fingerprint sensor encapsulating structure 200.The height of the frame 240 in Fig. 6 is identical with the height of protective layer 206, and this frame 240 is arranged on FPC221.
Alternatively, as shown in Figure 7, be the structural representation of the capacitive fingerprint sensor encapsulating structure 800 that do not comprise frame.Wherein, capacitance resistance 220 can be arranged on PCB222 above and as far as possible close chip 201.It is nearer that capacitance resistance 220 and fingerprint sensing element 202 lean on, and the electric signal transmission between itself and fingerprint sensing element 202 is better.
Alternatively, as shown in Figure 8, be the structural representation of the capacitive fingerprint sensor encapsulating structure 900 that do not comprise frame.Wherein, capacitance resistance 220 can be arranged on PCB222 above and be wrapped up by EMC layer 241.This just needs the size of capacitance resistance 220 enough little, for example adopt 0201 package dimension, the length that this 0201 package dimension is specially capacitance resistance 220 is 0.60 ± 0.05mm, wide is 0.30 ± 0.05mm, height is 0.23 ± 0.05mm, certainly can also adopt according to actual needs 0402 package dimension etc.Capacitance resistance 220 is arranged and is included in EMC layer 241, make capacitance resistance 220 very near chip 201, therefore very good for the transmission of signal.
Alternatively, as shown in Figure 9, be the structural representation of the capacitive fingerprint sensor encapsulating structure 1000 that do not comprise frame.FPC221 is longer than PCB222, and capacitance resistance 220 is arranged on FPC221.Because in the time of actual assembled, only the size of frame 240 parts exposes, so generally the size in frame 240 scopes need to be limited, and FPC221 is positioned at extraneous other parts of frame and is all hidden in the panel of terminal equipment or casing below, user cannot see, for example, so can adopt the electric capacity of relatively slightly large encapsulation, adopt the capacitance resistance of the package dimension such as 0402 or 0603.The volume of capacitance resistance 220 is larger, and production cost is lower, therefore adopts the capacitance resistance 220 that volume is larger, can further reduce like this production cost of whole capacitive fingerprint sensor encapsulating structure 200.
Alternatively, as shown in figure 10, be the distortion of frame 240.The top of frame 240 can be skewed; be one side of tilting of frame 240 with protective layer 206 in obtuse angle; and the projection of the upper surface of the projection of frame 240 on substrate 103 and protective layer 206 on substrate 103 is completely not overlapping, the upper surface of not contact protection of one side layer 206 that frame 240 tilts.The shape of this frame 240 can substitute arbitrary frame 240 in Figure 1A to Fig. 9, does not repeat them here.The shape of the frame 240 in Figure 10 can better guide user to point on protective layer 206, makes user's experience better.
Alternatively, as shown in figure 11, be the distortion of frame 240.The top of frame 240 can be skewed; be one side of tilting of frame 240 with the upper surface of protective layer 206 in obtuse angle; and projection and protective layer 206 projection on substrate 103 of frame 240 on substrate 103 has overlapping part, the upper surface of one side contact protection layer 206 that frame 240 tilts.From figure, can find out in 12, frame 240 blocks protective layer 206, makes this capacitive fingerprint sensor encapsulating structure 200 better firmly, can not scatter easily because of external influence power.The shape of this frame 240 can substitute arbitrary frame 240 in Figure 1A to Fig. 9, does not repeat them here.The shape of the frame 240 in Figure 11 can better guide user to point on protective layer 206, makes user's experience better.
Certainly, the shape of frame 240 can also be that other are various, does not repeat them here.
According to the capacitive fingerprint sensor encapsulating structure 200 of the present embodiment, by fingerprint sensing element 202 is separated with chip 201, be electrically connected again, reduced like this surface area of whole capacitive fingerprint sensor encapsulating structure 200, and then be beneficial to the miniaturization of terminal equipment.This surface refers to the surface area of seeing when capacitive fingerprint encapsulating structure 200 is overlooked.Can imagine, very likely reduce the volume of whole terminal equipment.
The fingerprint identification device that comprises above-mentioned capacitive fingerprint sensor encapsulating structure, obtains by fingerprint sensing element 202 and chip 201 the fingerprint characteristic that user points.Fingerprint identification device is divided into push type and slidingtype, push type require user by finger by when the lip-deep protective layer 206 of fingerprint sensing element 202, these fingerprint sensing elements 202 intercept the image of whole fingerprint simultaneously.Slidingtype requires user longitudinally finger to be slipped over to fingerprint sensing element 202, the fragment of access fingerprint image sequentially of fingerprint sensing element 202, and the fragment of these fingerprint images can be used for producing the model of fingerprint.For example, when finger is out-of-date along brushing near the protective layer 206 of this fingerprint sensing element top, the concave point (paddy) of finger sensing and salient point (ridge), thus obtain the relevant information of fingerprint.
As shown in figure 12, be the schematic flow sheet of the method for above-mentioned capacitive fingerprint sensor encapsulation.The method of this capacitive fingerprint sensor encapsulation comprises:
Step 301, welds the chip of individual packages and the welding of fingerprint sensing element by projection, make to be electrically connected between chip and fingerprint sensing element.
Particularly, between this chip and fingerprint sensing element, be being electrically connected of carrying out of mode that adopts flip-chip (Flip Chip).
Step 302, is connected with fingerprint sensing element substrate by soldered ball, so that substrate and the electrical connection of fingerprint sensing element.
Wherein, chip is between fingerprint sensing element and substrate, and substrate is electrically connected with chip by tin ball and fingerprint sensing element.
In the present embodiment, chip is provided with circuit towards a side of substrate.Particularly, there is no the pre-position of a side of circuit at chip, utilize long gold process to form projection, and process of tin on carrying out on projection, recycling flip chip, on the fingerprint sensing element of having made, realizes electrical connection by flip-chip.Next, carry out bottom filling filling process, chip is firmly connected with fingerprint sensing element.
Next, the chip having glued and fingerprint sensing element are received on substrate by tin ball bonding, then filled EMC material between substrate and chip, form EMC layer.
After step 302, the method that the present embodiment is made capacitive fingerprint sensor encapsulating structure also comprises:
A side that deviates from chip at fingerprint sensing element forms color rete;
On color rete, form protective layer.
The formation of color rete and protective layer can be after frame forms.
Alternatively, the thickness sum of color rete and protective layer is less than or equal to 100 microns, more specifically, can be less than or equal to 50 microns.
Alternatively, the thickness of color rete is specifically as follows 10 microns to 30 microns, and alternatively, the thickness of protective layer is specifically as follows 10 microns to 30 microns.
Alternatively, color rete below can also form one deck bed material coating to increase the adhesive force between color rete and fingerprint sensing element.This bed material coating can form after step 302 and before forming color rete.If there is frame, after forming protective layer, on substrate, form again frame.
Protective layer specifically can be by one or more the making in following material or its equivalent: pottery, DLC (Diamond-like carbon, diamond like carbon), glass, tempered glass or the chemically treated glass of process, sapphire, pass through chemically treated its at least compound of some feature that has, or the anti-pulverizing substitute of glass, comprise polymethyl methacrylate (Polymethyl Methacrylate, PMMA), PETG (Polyethylene Terephthalate, PET), it can also be the ink coating after overcuring.
The method of the capacitive fingerprint sensor encapsulating structure of making of the present embodiment, by fingerprint sensing element is separated with chip, then is electrically connected, and has reduced like this surface area of whole fingerprint sensor encapsulating structure, and then is beneficial to the miniaturization of terminal equipment.This surface refers to the surface area of seeing when capacitive fingerprint encapsulating structure is overlooked.Can imagine, very likely reduce the volume of whole terminal equipment.
One of ordinary skill in the art will appreciate that: all or part of step that realizes said method embodiment can complete by the relevant hardware of program command, aforesaid program can be stored in a computer read/write memory medium, this program, in the time carrying out, is carried out the step that comprises said method embodiment; And aforesaid storage medium comprises: various media that can be program code stored such as ROM, RAM, magnetic disc or CDs.
Finally it should be noted that: above embodiment only, in order to the technical solution of the utility model to be described, is not intended to limit; Although the utility model is had been described in detail with reference to previous embodiment, those of ordinary skill in the art is to be understood that: its technical scheme that still can record aforementioned each embodiment is modified, or part technical characterictic is wherein equal to replacement; And these amendments or replacement do not make the essence of appropriate technical solution depart from the scope of the each embodiment technical scheme of the utility model.
Claims (13)
1. a capacitive fingerprint sensor encapsulating structure, is characterized in that, comprising:
The chip of individual packages;
Fingerprint sensing element, is arranged on described chip top and is electrically connected with described chip;
Substrate, is arranged on described chip below, and described substrate is electrically connected by tin ball with described fingerprint sensing element, and described substrate is electrically connected with described chip by tin ball and described fingerprint sensing element.
2. capacitive fingerprint sensor encapsulating structure according to claim 1, is characterized in that, described chip and described fingerprint sensing element adopt flip chip to be electrically connected.
3. capacitive fingerprint sensor encapsulating structure according to claim 1 and 2, is characterized in that, also comprises:
Capacitance resistance, described capacitance resistance is arranged on described substrate.
4. capacitive fingerprint sensor encapsulating structure according to claim 3, is characterized in that, described substrate comprises the flexible circuit board FPC and the printing board PCB that form from below to up.
5. capacitive fingerprint sensor encapsulating structure according to claim 4, is characterized in that, also comprises thermosetting resin EMC, and described EMC is filled between described chip and described substrate.
6. capacitive fingerprint sensor encapsulating structure according to claim 5, is characterized in that, described capacitance resistance is arranged on described PCB.
7. capacitive fingerprint sensor encapsulating structure according to claim 5, is characterized in that, described FPC is longer than described PCB, and described capacitance resistance is arranged on FPC.
8. capacitive fingerprint sensor encapsulating structure according to claim 1, is characterized in that, also comprises:
Frame, described frame is arranged on described substrate, and described frame is around described chip and described fingerprint sensing element.
9. capacitive fingerprint sensor encapsulating structure according to claim 8, is characterized in that, also comprises:
Color rete, is arranged on described fingerprint sensing element top;
Protective layer, is arranged on described color rete top.
10. capacitive fingerprint sensor encapsulating structure according to claim 9, is characterized in that, the thickness of described color rete is 5 microns to 30 microns.
11. according to the capacitive fingerprint sensor encapsulating structure described in claim 9 or 10, it is characterized in that, the thickness of described protective layer is 10 microns to 30 microns.
12. capacitive fingerprint sensor encapsulating structures according to claim 9, is characterized in that, the thickness sum of described color rete and described protective layer is less than or equal to 50 microns.
13. capacitive fingerprint sensor encapsulating structures according to claim 9, is characterized in that, the evenness of described protective layer is less than or equal to 10 microns.
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| CN201420484451.2U CN204011397U (en) | 2014-08-26 | 2014-08-26 | Capacitive fingerprint sensor encapsulating structure |
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| CN201420484451.2U CN204011397U (en) | 2014-08-26 | 2014-08-26 | Capacitive fingerprint sensor encapsulating structure |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104183560A (en) * | 2014-08-26 | 2014-12-03 | 南昌欧菲生物识别技术有限公司 | Capacitance type fingerprint sensor packaging structure and packaging method |
| CN105205470A (en) * | 2015-09-29 | 2015-12-30 | 上海箩箕技术有限公司 | Fingerprint imaging module |
| CN105990160A (en) * | 2015-01-19 | 2016-10-05 | 神盾股份有限公司 | Fingerprint identification device package and method of manufacturing the same |
| CN106897709A (en) * | 2017-03-08 | 2017-06-27 | 广东欧珀移动通信有限公司 | Fingerprint recognition module and electronic installation |
| CN107316847A (en) * | 2016-04-27 | 2017-11-03 | 中芯国际集成电路制造(上海)有限公司 | A kind of package structure of semiconductor device and electronic installation |
| US11183414B2 (en) | 2017-02-13 | 2021-11-23 | Shenzhen GOODIX Technology Co., Ltd. | Secondary packaging method and secondary package of through silicon via chip |
| TWI755640B (en) * | 2015-05-12 | 2022-02-21 | 美商艾馬克科技公司 | Fingerprint sensor and manufacturing method thereof |
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2014
- 2014-08-26 CN CN201420484451.2U patent/CN204011397U/en not_active Expired - Fee Related
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104183560A (en) * | 2014-08-26 | 2014-12-03 | 南昌欧菲生物识别技术有限公司 | Capacitance type fingerprint sensor packaging structure and packaging method |
| CN104183560B (en) * | 2014-08-26 | 2017-09-22 | 南昌欧菲生物识别技术有限公司 | Capacitive fingerprint sensor package structure and the method for encapsulation |
| CN105990160A (en) * | 2015-01-19 | 2016-10-05 | 神盾股份有限公司 | Fingerprint identification device package and method of manufacturing the same |
| CN105990160B (en) * | 2015-01-19 | 2019-06-11 | 神盾股份有限公司 | Fingerprint identification device package and method of manufacturing the same |
| TWI755640B (en) * | 2015-05-12 | 2022-02-21 | 美商艾馬克科技公司 | Fingerprint sensor and manufacturing method thereof |
| US11393734B2 (en) | 2015-05-12 | 2022-07-19 | Amkor Technology Singapore Holding Pte. Ltd. | Fingerprint sensor and manufacturing method thereof |
| US11990435B2 (en) | 2015-05-12 | 2024-05-21 | Amkor Technology Singapore Holding Pte. Ltd. | Fingerprint sensor and manufacturing method thereof |
| CN105205470A (en) * | 2015-09-29 | 2015-12-30 | 上海箩箕技术有限公司 | Fingerprint imaging module |
| CN107316847A (en) * | 2016-04-27 | 2017-11-03 | 中芯国际集成电路制造(上海)有限公司 | A kind of package structure of semiconductor device and electronic installation |
| CN107316847B (en) * | 2016-04-27 | 2019-12-24 | 中芯国际集成电路制造(上海)有限公司 | Semiconductor device packaging structure and electronic device |
| US11183414B2 (en) | 2017-02-13 | 2021-11-23 | Shenzhen GOODIX Technology Co., Ltd. | Secondary packaging method and secondary package of through silicon via chip |
| CN106897709A (en) * | 2017-03-08 | 2017-06-27 | 广东欧珀移动通信有限公司 | Fingerprint recognition module and electronic installation |
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