CN204994085U - PCB board interconnect structure and PCB board - Google Patents
PCB board interconnect structure and PCB board Download PDFInfo
- Publication number
- CN204994085U CN204994085U CN201520594320.4U CN201520594320U CN204994085U CN 204994085 U CN204994085 U CN 204994085U CN 201520594320 U CN201520594320 U CN 201520594320U CN 204994085 U CN204994085 U CN 204994085U
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- pcb
- mainboard
- board
- daughter board
- installing hole
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Abstract
The utility model discloses a PCB board interconnect structure and a PCB board, wherein, this PCB board interconnect structure is used for the cartridge at the PCB mainboard, includes at least one PCB daughter board, and its characterized in that still includes at least one electronic components who has the pin, the PCB daughter board is on a parallel with the PCB mainboard, just the electronic components cartridge in the PCB daughter board with on the PCB mainboard, the PCB mainboard with the PCB daughter board passes through the electronic components interconnection. The utility model discloses originally want the electronic components of cartridge to realize between PCB mainboard and the daughter board on utilizing the PCB mainboard to and the interconnection between per two PCB daughter boards, furthest utilizes the inside overall arrangement space of product, has improved the overall arrangement density of product effectively, has avoided extra incremental cost simultaneously.
Description
Technical field
The utility model relates to circuit board technology field, more particularly, relates to a kind of pcb board interconnection structure, and is fitted with the pcb board of this kind of pcb board interconnection structure.
Background technology
Pcb board is requisite device in electronic product.Because the internal layer of pcb board has metal copper foil, the conducting interconnection on plate between relevant components and parts can be realized by this pcb board, thus finally realize the functional characteristic needed for product.Under normal circumstances, pcb board is once after making, and on plate, the number of plies in all regions is on all four, and cannot realize the regional area number of plies on plate increases.But along with electronic product is towards microminiaturized, highdensity future development, the demand increasing the number of plies to regional area on plate in the design phase of PCB is more and more stronger, especially, for the high power module series products of layout density, this trend seems particularly evident.For most of module class product, if do not meet the demand of the increase of the local number of plies on pcb board, veneer layout, placement-and-routing cannot realize at all, product may not designed shaping.
In view of the local number of plies on plate cannot be realized by pcb board self at present, therefore the actual demand that on plate, the regional area number of plies increases can only be met by the mode that technique local is integrated in the processing of PCBA processing procedure.Specific implementation on mainboard respective area superpose one piece of daughter board PCBA (daughter board PCB internal copper layers of foil number can be superimposed to respective regions on mainboard, thus reach the object that on mainboard, the regional area number of plies increases, facilitate the placement-and-routing of Total Product to a great extent), realize conducting interconnection by certain PROCESS FOR TREATMENT mode between the two.Interconnection between current mainboard and daughter board realizes mainly through the contact pin on daughter board, metal pins or tin finger.
There is following shortcoming in above-mentioned three kinds of interconnection modes:
1) need to carry out perforate or slot treatment on mainboard, be unfavorable for the placement-and-routing of mainboard, reduce the local density of veneer entirety to a great extent;
2) when adopting metal pins or tin finger realizes interconnection, needing design metal pins or tin finger on daughter board side plate limit, adding the maximum overall dimension of daughter board to a certain extent, cause the cost of daughter board to increase;
3) when using contact pin, because contact pin is the extra components and parts increased, self needs cost, increases the overall cost of product thus; In addition, because contact pin volume is relatively large, when designing, contact pin will take arrangement space, reduces the layout density of Total Product;
4) usually adopt vertical vertically arranged mode to interconnect between mainboard and daughter board, make daughter board will take motherboard layout space, reduce the integral layout density of product thus.
Utility model content
The technical problems to be solved in the utility model is, for the taking arrangement space, reduce layout density of prior art, can only vertical at right angle setting and increase the defect of overall cost of product between mainboard and daughter board, a kind of pcb board interconnection structure is provided, and is fitted with the pcb board of this kind of pcb board interconnection structure.
The utility model solves the technical scheme that its technical problem adopts: constructing a kind of pcb board interconnection structure, for being inserted into PCB mainboard, comprising at least one PCB daughter board, also comprises at least one electronic devices and components with pin; Described PCB daughter board is parallel to described PCB mainboard, and described electronic devices and components are plugged on described PCB daughter board and described PCB mainboard, and described PCB mainboard and described PCB daughter board are interconnected by described electronic devices and components.
In an embodiment, described PCB mainboard offers the first installing hole, and PCB daughter board described at least one offers the second installing hole corresponding to described first installing hole; The pin of described electronic devices and components is successively through described second installing hole and described first installing hole, and described pin welds with described second installing hole and the first installing hole.
In an embodiment, the aperture of described second installing hole is greater than the aperture of described first installing hole.
In an embodiment, described first installing hole and described second installing hole are metallization installing hole.
In an embodiment, the quantity of described PCB daughter board is multiple; Wherein, every two described PCB daughter board compartment of terrains are distributed on described PCB mainboard, and are plugged on described PCB mainboard by corresponding electronic devices and components; Or
Every two described PCB daughter boards are sequentially laminated on described PCB mainboard, and are plugged on described PCB mainboard by identical electronic devices and components.
In an embodiment, described electronic devices and components are power device, electric capacity or inductance.
In an embodiment, described electronic devices and components comprise body, and described pin is arranged on described body.
In an embodiment, described pin is yi word pattern, and described pin is perpendicular to described PCB mainboard and described PCB daughter board; Or described pin is bent into L shape structure, and described body is parallel to described PCB mainboard and described PCB daughter board when mounted.
In an embodiment, the size of described PCB mainboard is greater than the size of described PCB daughter board.
For technical solution problem, the utility model provides a kind of pcb board further, comprises PCB mainboard, arbitrary pcb board interconnection structure before also comprising; Described pcb board interconnection structure is plugged on described PCB mainboard.
Implement pcb board interconnection structure of the present utility model and pcb board, there is following beneficial effect: make full use of on PCB mainboard and originally want the electronic devices and components of plug-in mounting to realize between PCB mainboard and daughter board, and the interconnection between every two PCB daughter boards;
1) without the need to perforate extraly or fluting on PCB mainboard, and only need on PCB daughter board, offer corresponding hole or groove, save the arrangement space of PCB daughter board on PCB mainboard, improve the layout density of Total Product to greatest extent.
2) without the need to additionally increasing other elements when being interconnected by which, also without the need to additionally increasing the area of PCB daughter board, the saving of mass customization is conducive to a great extent.
3) PCB mainboard and PCB daughter board, and realize assembling and interconnection by parallel mode between two PCB daughter boards, expand assembling mode between the two in prior art, improve Technological adaptability, and the actual demand that the PCB local number of plies that can meet different product increases.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the utility model is described in further detail, in accompanying drawing:
Fig. 1 is the decomposing schematic representation of the pcb board in the utility model one embodiment;
Fig. 2 is the overall structure schematic diagram after the pcb board interconnection in Fig. 1;
Fig. 3 is the structure of the electronic devices and components in another embodiment of the utility model.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the utility model, and be not used in restriction the utility model.
Fig. 1 shows the structural representation of the pcb board in the utility model one embodiment, and this pcb board mainly utilizes PCB mainboard 10 wants the pin of the electronic devices and components of plug-in mounting to realize the interconnection between PCB mainboard and daughter board and every two PCB daughter boards.Specifically as shown in Figure 1, this pcb board comprises PCB mainboard 10 and pcb board interconnection structure.Wherein, this pcb board interconnection structure comprises at least one PCB daughter board 20; When mounted, at least one PCB daughter board 20 is parallel to PCB mainboard 10, and preferably can be close to this PCB mainboard 10.In addition, this pcb board interconnection structure also comprises at least one electronic devices and components 30 with pin, these electronic devices and components 30 are plugged on PCB mainboard 10 and at least one PCB daughter board 20, make PCB mainboard 10 and PCB daughter board 20 realize interconnection by these electronic devices and components 30 thus.
Concrete as shown in Figure 1, in the present embodiment, the platy structure that PCB mainboard 10 and at least one PCB daughter board 20 are square substantially.The size of PCB mainboard 10 is greater than the size of PCB daughter board 20, and PCB mainboard 10 is parallel to PCB daughter board 20.
In the present embodiment, the quantity of this PCB daughter board 20 is one.Now, PCB mainboard 10 offers the first installing hole 11 of supplied for electronic components and parts 30 plug-in mounting, and offer equally on PCB daughter board 20 supplied for electronic components and parts 30 plug-in mounting, with the first installing hole 11 second installing hole 21 one to one.Wherein, the quantity of the first installing hole 11 and the second installing hole 21 is equal with needing pin 32 quantity of the electronic devices and components 30 of plug-in mounting.
The aperture of the first installing hole 11 is suitable with the pin 32 of electronic devices and components 30 substantially; The aperture of the second installing hole 21 is then greater than the aperture of the first installing hole 11, can facilitate tin thus when electronic devices and components 30 are welded on PCB daughter board 20 and PCB mainboard 10.Preferably, in the present embodiment, the aperture of the second installing hole 21 is 1.1 ~ 1.5 times of the first installing hole 11 aperture.
In the embodiment shown in fig. 1, the quantity of this PCB daughter board 20 is one.But according in other embodiments of the present utility model, the quantity of this PCB daughter board 20 also can be multiple.Now, can be distributed on PCB mainboard 10 between every two PCB daughter boards 20, and be plugged on PCB mainboard 10 by the different electronic devices and components 30 corresponded to each other, to realize interconnection respective between two PCB daughter boards 20 and PCB mainboard 10.But, in other embodiments, also can be sequentially laminated on PCB mainboard 10 between every two pcb board 20, and by identical electronic devices and components, two PCB daughter board 20 plug-in mountings are interconnected on PCB mainboard 20.Certainly, also having in some embodiments, the arrangement of multiple PCB daughter board 20 can adopt the combination of above-mentioned two kinds of modes.The utility model does not limit the arrangement between multiple PCB daughter board 20 at this.
In the present embodiment, the first installing hole 11 and the second installing hole 21 preferably metallize installing hole, namely hole wall are coated with metal, to improve the reliability connected between electronic devices and components 30 and PCB mainboard 10 and PCB daughter board 20.
Further as shown in Figure 1, these electronic devices and components 30 comprise the body 31 being substantially rectangular structure, and are arranged at the pin 32 on body 31.In the present embodiment, this pin 32 is provided with multiple, certainly also only can be provided with a pin in other embodiments.
In the present embodiment, these electronic devices and components 30 are preferably power device, such as the power device of TO-220TO-247 model.Certainly, in other embodiments, other electronic devices and components can also be adopted, such as electric capacity, inductance etc., as long as these electronic devices and components belong to components and parts PCB mainboard needing originally plug-in mounting.Therefore, can adopt in the utility model on PCB mainboard and originally need the components and parts of plug-in mounting to realize between PCB mainboard and daughter board, and the interconnection between two PCB daughter boards, can avoid needing additionally to increase other components and parts, the production cost of product can be saved thus.
In the embodiment shown in Fig. 1-2, the pin 32 of these electronic devices and components 30 in yi word pattern, and adopts upright mode to install when mounted, and namely pin 32 is respectively perpendicular to PCB daughter board 20 and PCB mainboard 10.But in other embodiments, as shown in Figure 3, the pin 32 of these electronic devices and components 30 can be bent into L shape structure, and electronic devices and components 30 adopt horizontal mode to install when mounted, and namely the body 31 of electronic devices and components 30 is parallel to PCB daughter board 20 and PCB mainboard 10.The pin shapes of the utility model to electronic devices and components 30 is not specifically limited.
When producing, first by surface mount process, PCB daughter board 20 can be processed into semi-finished product, according to the arrangement mode of setting, PCB daughter board 20 is arranged on PCB mainboard 10 respectively subsequently, and make that PCB daughter board 20 is parallel is close to PCB mainboard 10 or another PCB daughter board, and the second installing hole 21 on PCB daughter board 20 and the first installing hole 11 on PCB mainboard 10 aligned with each other.Subsequently the pin 32 of electronic devices and components 30 is passed the second installing hole 21 and the first installing hole 11 from top to bottom successively, make electronic devices and components 30 be plugged on PCB daughter board 20 and PCB mainboard 10 thus.Finally pin 32 and the second installing hole 21 and the first installing hole 11 are welded, filler is filled in the second installing hole 21 and the first installing hole 11, electronic devices and components 30 reliablely and stablely can be fixed on PCB daughter board 20 and PCB mainboard 10 thus, and then the interconnection between PCB daughter board 20 and PCB mainboard 10 can be realized.In the present embodiment, preferably, adopt the mode of wave soldering to realize between pin 32 and the first installing hole 11 and the second installing hole 21 and fix.
Fig. 2 shows the PCB structure after interconnection.As shown in Figure 2, after realizing the interconnection between two pcb boards, PCB mainboard 10 and PCB daughter board 20 are only fitted with the electronic devices and components 30 originally needing plug-in mounting, and the side of PCB mainboard 10 and PCB daughter board 20 does not arrange the plug-in mounting that extra electronic devices and components (such as contact pin, metallization pin, tin finger etc.) realize between two pcb boards.In addition, the wiring in the accompanying drawings and on not shown PCB mainboard 10 and the second pcb board 20, but can carry out according to actual needs in actual applications connecting up and the layout of electronic devices and components.
Therefore, adopt pcb board interconnection structure of the present utility model and pcb board, making full use of on PCB mainboard wants the electronic devices and components of plug-in mounting to realize PCB mainboard and daughter board originally, and the interconnection between every two PCB daughter boards, realize the increase of the regional area PCB number of plies thus, can maximally utilise the arrangement space of interiors of products, effectively improve the layout density of product, avoid additionally increases cost simultaneously.It mainly has following advantage:
1) without the need to perforate extraly or fluting on PCB mainboard, and only need on PCB daughter board, offer corresponding hole or groove, save the arrangement space of PCB daughter board on PCB mainboard, improve the layout density of Total Product to greatest extent.
2) other elements without the need to additionally increasing when being interconnected by which, also without the need to additionally increasing the area of PCB daughter board, are conducive to the saving of mass customization to a great extent.
3) assembling and interconnection is realized by parallel mode between PCB mainboard and PCB daughter board, to expand in prior art assembling mode between the two (in prior art mainly perpendicular interconnection), improve Technological adaptability, and the actual demand that the PCB local number of plies that can meet different product increases.
By reference to the accompanying drawings embodiment of the present utility model is described above; but the utility model is not limited to above-mentioned embodiment; above-mentioned embodiment is only schematic; instead of it is restrictive; those of ordinary skill in the art is under enlightenment of the present utility model; do not departing under the ambit that the utility model aim and claim protect, also can make a lot of form, these all belong within protection of the present utility model.
Claims (10)
1. a pcb board interconnection structure, for being inserted into PCB mainboard, comprising at least one PCB daughter board, it is characterized in that, also comprises at least one electronic devices and components with pin; Described PCB daughter board is parallel to described PCB mainboard, and described electronic devices and components are plugged on PCB daughter board described at least one and described PCB mainboard, and described PCB mainboard and described PCB daughter board are interconnected by described electronic devices and components.
2. pcb board interconnection structure according to claim 1, is characterized in that, described PCB mainboard offers the first installing hole, and PCB daughter board described at least one offers the second installing hole corresponding to described first installing hole; The pin of described electronic devices and components is successively through described second installing hole and described first installing hole, and described pin welds with described second installing hole and the first installing hole.
3. pcb board interconnection structure according to claim 2, is characterized in that, the aperture of described second installing hole is greater than the aperture of described first installing hole.
4. pcb board interconnection structure according to claim 2, is characterized in that, described first installing hole and described second installing hole are metallization installing hole.
5. pcb board interconnection structure according to claim 1, is characterized in that, the quantity of described PCB daughter board is multiple; Wherein, every two described PCB daughter board compartment of terrains are distributed on described PCB mainboard, and are plugged on described PCB mainboard by corresponding electronic devices and components; Or
Every two described PCB daughter boards are sequentially laminated on described PCB mainboard, and are plugged on described PCB mainboard by identical electronic devices and components.
6. pcb board interconnection structure according to claim 1, is characterized in that, described electronic devices and components are power device, electric capacity or inductance.
7. pcb board interconnection structure according to claim 1, is characterized in that, described electronic devices and components also comprise body, and described pin is arranged on described body.
8. pcb board interconnection structure according to claim 7, is characterized in that, described pin is yi word pattern, and described pin is perpendicular to described PCB mainboard and described PCB daughter board; Or
Described pin is bent into L shape structure, and described body is parallel to described PCB mainboard and described PCB daughter board when mounted.
9. pcb board interconnection structure according to claim 1, is characterized in that, the size of described PCB mainboard is greater than the size of described PCB daughter board.
10. a pcb board, comprises PCB mainboard, it is characterized in that, also comprises pcb board interconnection structure as claimed in any one of claims 1-9 wherein; Described pcb board interconnection structure is plugged on described PCB mainboard.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520594320.4U CN204994085U (en) | 2015-08-07 | 2015-08-07 | PCB board interconnect structure and PCB board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520594320.4U CN204994085U (en) | 2015-08-07 | 2015-08-07 | PCB board interconnect structure and PCB board |
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| Publication Number | Publication Date |
|---|---|
| CN204994085U true CN204994085U (en) | 2016-01-20 |
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| CN201520594320.4U Active CN204994085U (en) | 2015-08-07 | 2015-08-07 | PCB board interconnect structure and PCB board |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106229108A (en) * | 2016-08-31 | 2016-12-14 | 格维电子（惠州）有限公司 | A kind of three foot inductance and the processing technology thereof of pin yi word pattern arrangement |
| CN106851980A (en) * | 2017-03-01 | 2017-06-13 | 汉得利（常州）电子股份有限公司 | A kind of mounting structure for exempting from welding component conversion equipment |
| WO2021115416A1 (en) * | 2019-12-12 | 2021-06-17 | 中兴通讯股份有限公司 | Circuit board assembly and electronic device |
| WO2022268140A1 (en) * | 2021-06-24 | 2022-12-29 | 广州市康珑电子有限公司 | Three-dimensional wiring circuit board structure |
-
2015
- 2015-08-07 CN CN201520594320.4U patent/CN204994085U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106229108A (en) * | 2016-08-31 | 2016-12-14 | 格维电子（惠州）有限公司 | A kind of three foot inductance and the processing technology thereof of pin yi word pattern arrangement |
| CN106851980A (en) * | 2017-03-01 | 2017-06-13 | 汉得利（常州）电子股份有限公司 | A kind of mounting structure for exempting from welding component conversion equipment |
| CN106851980B (en) * | 2017-03-01 | 2023-05-26 | 汉得利（常州）电子股份有限公司 | Mounting structure of welding-free component conversion device |
| WO2021115416A1 (en) * | 2019-12-12 | 2021-06-17 | 中兴通讯股份有限公司 | Circuit board assembly and electronic device |
| WO2022268140A1 (en) * | 2021-06-24 | 2022-12-29 | 广州市康珑电子有限公司 | Three-dimensional wiring circuit board structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: No. 1510, Kansas Avenue, lureen, Ohio, USA Patentee after: Walteff energy systems company Address before: The United States of Ohio city F Lorain Street No. 1122 Patentee before: Emerson Network Power Co., Ltd. |
|
| CP03 | Change of name, title or address | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20211224 Address after: Ohio, USA Patentee after: Dimension Corp. Address before: No. 1510, Kansas Avenue, lureen, Ohio, USA Patentee before: VERTIV ENERGY SYSTEMS, Inc. |
|
| TR01 | Transfer of patent right |