CN204946886U - For aluminium matter or the aluminium alloy matter lead-in wire of wire type electronic ceramic component - Google Patents
For aluminium matter or the aluminium alloy matter lead-in wire of wire type electronic ceramic component Download PDFInfo
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- CN204946886U CN204946886U CN201520564340.7U CN201520564340U CN204946886U CN 204946886 U CN204946886 U CN 204946886U CN 201520564340 U CN201520564340 U CN 201520564340U CN 204946886 U CN204946886 U CN 204946886U
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Abstract
The utility model provides a kind of aluminium matter for wire type electronic ceramic component or aluminium alloy matter lead-in wire, and the skin of described aluminium matter or aluminium alloy matter lead-in wire is coated with weld metal layers.Described weld metal layers is nickel dam or tin layers.The thickness of described weld metal layers is 2-10um.The diameter of described aluminium matter or aluminium alloy matter lead-in wire is 0.3-2mm.Described wire type electronic ceramic component is wire type piezo-resistance, thermistor, ceramic condenser, electrochemical capacitor etc.Aluminium matter of the present utility model or aluminium alloy matter lead-in wire conductivity, plasticity, solderability is good, residual voltage is low, in the course of processing die wear little, lightweight, its proportion 2.7 is lighter than CP line proportion 8.7 more than 60%, this means that the aluminium matter of same diameter per kilogram or the line length of aluminium alloy matter lead-in wire increase nearly 2 times than the line length of CP line, thus more polyelectron ceramic component can be made, cost performance is high.
Description
Technical field
The utility model relates to wire type electronic ceramic component technical field, particularly relates to the lead-in wire for wire type electronic ceramic component.
Background technology
Conventional lead type electronic ceramic component is (as piezo-resistance, thermistor, ceramic condenser, electrochemical capacitor) lead-in wire that uses, experienced by cathode copper silver-plated, cathode copper nickel plating, the technological phase that cathode copper is zinc-plated, the feature of above-mentioned lead-in wire is: good conductivity, solderability is good, residual voltage is low, in the course of processing, die wear is little, and weight is large, price is high, therefore, the existing lead-in wire (being commonly called as CP line) by iron core line copper facing nickel plating or zinc-plated making is more again used instead under the market competitive pressure, the feature of this lead-in wire is: though low price, but weight is large, in the course of processing, die wear is large, under heavy current impact, residual voltage is high.
Utility model content
For above-mentioned the deficiencies in the prior art, the utility model provides a kind of conductivity, plasticity, the aluminium matter for wire type electronic ceramic component that solderability is good, residual voltage is low, die wear is little, lightweight, cost performance is high in the course of processing or aluminium alloy matter lead-in wire.
For achieving the above object, technical solution adopted in the utility model is:
A kind of aluminium matter for wire type electronic ceramic component or aluminium alloy matter lead-in wire, the skin of described aluminium matter or aluminium alloy matter lead-in wire is coated with weld metal layers.
Further, described weld metal layers be direct plating in aluminium matter or aluminium alloy matter lead-in wire nickel dam or tin layers.
Further, the thickness of described weld metal layers is 2-10um.
Further, the diameter of described aluminium matter or aluminium alloy matter lead-in wire is 0.3-2mm.
When demand is requirements at the higher level, can first plate a layers of copper in aluminium matter or aluminium alloy matter lead-in wire skin, thickness is 2--8um, and then nickel coating or tin layers.
Described wire type electronic ceramic component is wire type piezo-resistance, thermistor, ceramic condenser, electrochemical capacitor etc.
The beneficial effects of the utility model are: aluminium matter of the present utility model or aluminium alloy matter lead-in wire conductivity, plasticity, solderability is good, residual voltage is low, in the course of processing die wear little, lightweight, its proportion 2.7 is lighter than CP line proportion 8.7 more than 60%, this means that the aluminium matter of same diameter per kilogram or the line length of aluminium alloy matter lead-in wire increase nearly 2 times than the line length of CP line, thus more polyelectron ceramic component can be made, cost performance is high.
Accompanying drawing explanation
Fig. 1 is the first terminal pin schematic shapes of aluminium matter of the present utility model or aluminium alloy matter lead-in wire;
Fig. 2 is the second terminal pin schematic shapes of aluminium matter of the present utility model or aluminium alloy matter lead-in wire;
Fig. 3 is the third terminal pin schematic shapes of aluminium matter of the present utility model or aluminium alloy matter lead-in wire;
Fig. 4 is the circular fork enlarged drawing in upper end of the terminal pin of aluminium matter of the present utility model or aluminium alloy matter lead-in wire;
Fig. 5 is the upper end flat fork enlarged drawing of the terminal pin of aluminium matter of the present utility model or aluminium alloy matter lead-in wire.
Embodiment
Specifically illustrate execution mode of the present utility model below in conjunction with accompanying drawing, accompanying drawing is only for reference and use is described, does not form the restriction to the utility model scope of patent protection.
The present embodiment provides a kind of aluminium matter for wire type electronic ceramic component or aluminium alloy matter lead-in wire 1, and the skin of described aluminium matter or aluminium alloy matter lead-in wire 1 is coated with weld metal layers.
In the present embodiment, described weld metal layers be direct plating in aluminium matter or aluminium alloy matter lead-in wire nickel dam or tin layers etc.
In the present embodiment, the thickness of described weld metal layers is 2-10um.
In the present embodiment, the diameter of described aluminium matter or aluminium alloy matter lead-in wire is 0.3-2mm.
When demand is requirements at the higher level, can first plate one deck copper in aluminium matter or aluminium alloy matter lead-in wire skin, thickness is 2--8um, then nickel coating or tin layers.
Described wire type electronic ceramic component is wire type piezo-resistance, thermistor, ceramic condenser, electrochemical capacitor etc.
Logical peraluminous or the outer weld metal layers be coated with of aluminium alloy matter lead-in wire solve the problem of welding in electronic ceramic component and welding on pcb board, same, go between by same aluminium matter or aluminium alloy matter in the core aluminium pool crimping process manufacturing electrochemical capacitor more suitable.
Implementation process of the present utility model is:
Get and go between 1 with CP line with the aluminium matter of the present utility model of diameter or aluminium alloy matter, directly replace CP line, be placed on wire bonder, through straightening, cut off, bend, form a kind of shape in Fig. 1-3, be pasted onto in braid, for inserted sheet by high temperature gummed tape.The conversion of three kinds of terminal pin shapes in Fig. 1-3 realizes by changing different routing mould on wire bonder.
Fig. 4 is for minor diameter chip (usually
upper end circle (need not flatten) fork 2 enlarged drawing of the terminal pin used below).
Fig. 5 is for major diameter chip ((usually
upper end flat fork 2 enlarged drawing of the terminal pin used above).Routing mould on wire bonder has the function flattened terminal pin upper end, and the bonding area of major diameter chip is increased, and improves soldering reliability.
Above disclosedly be only preferred embodiment of the present utility model, rights protection scope of the present utility model can not be limited with this, therefore according to the equivalent variations that the utility model claim is done, still belong to the scope that the utility model is contained.
Claims (4)
1. the aluminium matter for wire type electronic ceramic component or aluminium alloy matter lead-in wire, is characterized in that: the skin of described aluminium matter or aluminium alloy matter lead-in wire is coated with weld metal layers.
2. the aluminium matter for wire type electronic ceramic component according to claim 1 or aluminium alloy matter lead-in wire, is characterized in that: described weld metal layers is nickel dam or tin layers.
3. the aluminium matter for wire type electronic ceramic component according to claim 2 or aluminium alloy matter lead-in wire, is characterized in that: the thickness of described weld metal layers is 2-10um.
4. the aluminium matter for wire type electronic ceramic component according to claim 1 or aluminium alloy matter lead-in wire, is characterized in that: the diameter of described aluminium matter or aluminium alloy matter lead-in wire is 0.3-2mm.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201520564340.7U CN204946886U (en) | 2015-07-30 | 2015-07-30 | For aluminium matter or the aluminium alloy matter lead-in wire of wire type electronic ceramic component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201520564340.7U CN204946886U (en) | 2015-07-30 | 2015-07-30 | For aluminium matter or the aluminium alloy matter lead-in wire of wire type electronic ceramic component |
Publications (1)
Publication Number | Publication Date |
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CN204946886U true CN204946886U (en) | 2016-01-06 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201520564340.7U Active CN204946886U (en) | 2015-07-30 | 2015-07-30 | For aluminium matter or the aluminium alloy matter lead-in wire of wire type electronic ceramic component |
Country Status (1)
Country | Link |
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CN (1) | CN204946886U (en) |
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2015
- 2015-07-30 CN CN201520564340.7U patent/CN204946886U/en active Active
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